Cross-equipment docking device

Abstract

The utility model relates to a cross-equipment docking device. The device comprises a first material receiving mechanism, a second material receiving mechanism and a transfer material taking and placing mechanism, the first material receiving mechanism comprises a first material receiving driving piece and a first carrier plate structure connected with the first material receiving driving piece; the second material receiving mechanism comprises a second material receiving driving piece and a second carrier plate structure connected with the second material receiving driving piece; the transfer material taking and placing mechanism comprises a transfer translation mechanism arranged on second equipment, a transfer lifting mechanism arranged on the material taking and placing translation mechanism, a material taking and placing plate structure arranged on the transfer lifting mechanism and a material taking and placing positioning structure. According to the utility model, the problems in the prior art that the bending equipment and the electrical testing equipment work independently, so that products need to be turned over manually, the manpower is wasted, the production efficiency is reduced, and the automation degree of production is influenced can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a cross-equipment docking device. Background Art

[0002] During the production process of flexible circuit boards, the flexible circuit boards need to be bent and their electrical performance tested. In traditional technology, when bending and electrically testing flexible circuit boards, the flexible circuit boards need to be placed in a bending device for bending first, and the bent products are automatically unloaded into a turntable. Then, the unloaded turntable is manually placed in an electrical measuring device, and the electrical performance of the flexible circuit boards in the turntable is tested by the electrical measuring device, and then the tested products are unloaded. During the bending and electrical testing of flexible circuit boards, since the bending equipment and the electrical measuring equipment work independently, the products need to be turned over manually, which wastes manpower, reduces production efficiency, and affects the degree of automation of production. Utility Model Content

[0003] The utility model provides a cross-equipment docking device, which can solve the technical problem in traditional technology that because the bending equipment and the electrical measuring equipment work independently, the products need to be turned over manually, which wastes manpower, reduces production efficiency and affects the degree of production automation.

[0004] In order to solve the above technical problems, the utility model provides a cross-device docking device, including:

[0005] A first material receiving mechanism, comprising a first material receiving driving member and a first carrier plate structure connected to the first material receiving driving member, wherein the first material receiving driving member is used to drive the first carrier plate structure to move between adjacent first equipment and second equipment;

[0006] A second material receiving mechanism, comprising a second material receiving driving member, and a second carrier plate structure connected to the second material receiving driving member, wherein the second material receiving driving member is used to drive the second carrier plate structure to move between the adjacent second device and the third device; and

[0007] The transfer material picking and unloading mechanism includes a transfer translation mechanism for being arranged on the second device, a transfer lifting mechanism arranged on the material picking and unloading translation mechanism, and a material picking and unloading plate structure and a material picking and unloading positioning structure arranged on the transfer lifting mechanism, wherein the material picking and unloading plate structure and the material picking and unloading positioning structure are both located above the first carrier plate structure and the second carrier plate structure.

[0008] Optionally, the first carrier plate structure includes a first material receiving base connected to the first material receiving drive member, a first connecting plate suspended on the first material receiving base, and a first material receiving carrier plate detachably connected to the suspended end of the first connecting plate, and a first limiting groove is provided on the first material receiving carrier plate.

[0009] Optionally, the first material receiving driving member includes a first driving base for being installed on the second device or between the first device and the second device, and a first linear driving module provided on the first driving base;

[0010] The first material receiving base is slidably connected to the first linear drive module, the first connecting plate is extended along the length direction of the first linear drive module, and the first material receiving carrier is extended from the suspended end of the first connecting plate along the length direction of the first linear drive module.

[0011] Optionally, the first carrier plate structure includes a carrier plate telescopic driving component connected to the first material receiving base or the first connecting plate, and the first connecting plate or the first material receiving carrier plate is connected to the carrier plate telescopic driving component.

[0012] Optionally, the first carrier plate structure includes a carrier plate rotation driving member connected to the first material receiving base or the first connecting plate, and the first connecting plate or the first material receiving carrier plate is connected to the carrier plate rotation driving member.

[0013] Optionally, the second carrier structure comprises a second material receiving base connected to the second material receiving driving member, a second connecting plate suspended on the second material receiving base, and a second material receiving carrier detachably connected to the suspended end of the second connecting plate, and a second limiting groove is provided on the second material receiving carrier;

[0014] The second material receiving drive member includes a second drive base for being installed on the second device or between the second device and the third device, and a second linear drive module arranged on the second drive base, and the second material receiving base is slidably connected to the second linear drive module.

[0015] Optionally, the cross-device docking device includes a flexible plate transfer table and / or a flexible plate sample comparison table for installation on the second device, and the flexible plate transfer table and / or the flexible plate sample comparison table are located between the first material receiving mechanism and the second material receiving mechanism.

[0016] Optionally, the flex plate transfer station or the flex plate sample comparison station includes a flex plate bracket for being mounted on the second device, and a flex plate carrier plate disposed on the flex plate bracket, wherein at least one flex plate positioning groove is disposed on the flex plate carrier plate.

[0017] Optionally, the material picking and placing plate structure includes a material picking and placing rotating drive member connected to the transfer lifting mechanism, a material picking and placing connecting seat connected to the material picking and placing rotating drive member, two material picking and placing telescopic drive members arranged side by side at the bottom of the material picking and placing connecting seat, and a material picking and placing adsorption plate detachably connected to each of the material picking and placing telescopic drive members.

[0018] Optionally, the material picking and placing adsorption plate includes an adsorption plate body connected to the material picking and placing telescopic drive member, and a plurality of vacuum suction nozzles protruding from the bottom of the adsorption plate body, and the arrangement shape of the plurality of vacuum suction nozzles is used to correspond to the shape of the circuit board material to be adsorbed and placed.

[0019] The beneficial effects brought by the technical solution provided by the utility model include:

[0020] The first material receiving driving member of the first material receiving mechanism drives the first carrier structure to move between the adjacent first device (such as a bending device) and the second device (such as an electrical testing device), so that the first carrier structure can receive the circuit board material bent by the bending device when it moves into the bending device, and the first carrier structure and the circuit board material it receives can be transferred to the electrical testing device under the drive of the first material receiving driving member; then, the material taking and unloading plate structure can be moved by the transfer translation mechanism and the transfer lifting mechanism of the transfer material taking and unloading mechanism, so that the material taking and unloading plate structure can move the first carrier structure to the first carrier structure. The circuit board material carried on the structure is taken out and the material is transferred to the testing mechanism of the electrical measuring equipment for testing. After the testing is completed, the material is taken out and transferred to the second carrier structure of the second material receiving mechanism; and the second material receiving driving member of the second material receiving mechanism drives the second carrier structure and the circuit board material thereon to move between the adjacent second equipment (such as the electrical measuring equipment) and the third equipment (such as the unloading equipment), so that the second carrier structure, driven by the second material receiving driving member, moves the circuit board material received in the electrical measuring equipment to the unloading equipment for unloading.

[0021] Through the cross-device docking device provided by the utility model, multiple devices that were originally independently set up (such as bending equipment, electrical testing equipment, unloading equipment, etc.) can be connected, and the circuit board materials bent by the bending equipment can be automatically connected, and the received circuit board materials can be automatically transferred to the electrical testing equipment for electrical testing, and after the electrical testing is completed, the circuit board materials are automatically transferred to the unloading equipment for processing and unloading. In this way, the traditional bending equipment, electrical testing equipment, unloading equipment, etc. can be connected and modified through the cross-device docking device, and the automatic turnover of products can be realized without redesigning the production line, saving labor costs, improving production efficiency, and improving the degree of automation of production. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 The three-dimensional structure of the cross-device docking device according to the embodiment of the utility model is shown in FIG. Figure 1 ;

[0024] Figure 2 The three-dimensional structure of the cross-device docking device according to the embodiment of the utility model is shown in FIG. Figure 2 ;

[0025] Figure 3 The three-dimensional structure diagram of the first material receiving mechanism of the cross-device docking device according to the embodiment of the utility model Figure 1 ;

[0026] Figure 4 The three-dimensional structure diagram of the first material receiving mechanism of the cross-device docking device according to the embodiment of the utility model Figure 2 ;

[0027] Figure 5 It is a schematic diagram of the three-dimensional structure of the second material receiving mechanism of the cross-device docking device according to an embodiment of the utility model;

[0028] Figure 6 It is a three-dimensional structural schematic diagram of the transfer material discharging mechanism of the cross-device docking device according to an embodiment of the utility model;

[0029] Figure 7 It is a partial three-dimensional structural schematic diagram of the transfer material discharging mechanism of the cross-device docking device described in an embodiment of the utility model.

[0030] In the figure: 10, cross-device docking device; 20, circuit board material; 100, device base; 200, first material receiving mechanism; 210, first material receiving drive member; 212, first drive base; 214, first linear drive module; 220, first carrier structure; 222, first material receiving base; 224, first connecting plate; 226, first material receiving carrier; 2262, first limiting groove; 300, second material receiving mechanism; 310, second material receiving drive member; 312, second drive base; 314, second linear drive module; 320, second carrier structure; 322, second material receiving base; 324, second connecting plate Connecting plate; 326, second material receiving carrier plate; 3262, second limiting groove; 400, transfer material picking and unloading mechanism; 410, transfer translation mechanism; 412, horizontal linear drive module; 414, longitudinal linear drive module; 420, transfer lifting mechanism; 430, material picking and unloading plate structure; 432, material picking and unloading rotating drive member; 434, material picking and unloading connecting seat; 436, material picking and unloading telescopic drive member; 438, material picking and unloading adsorption plate; 4382, adsorption plate body; 4384, vacuum suction nozzle; 440, transfer rack; 500, flexible plate transfer table (flexible plate sample comparison table); 510, flexible plate bracket; 520, flexible plate carrier. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] like Figure 1 to Figure 2 As shown, the utility model proposes a cross-device docking device 10, including a first material receiving mechanism 200, a second material receiving mechanism 300, and a transfer material taking and unloading mechanism 400 corresponding to the first material receiving mechanism 200 and the second material receiving mechanism 300. The first material receiving mechanism 200 can transfer materials on a first device (such as a bending device) and a second device (such as an electrical measuring device) that are independent of each other, and the second material receiving mechanism 300 can transfer materials on a second device (such as an electrical measuring device) and a third device (such as a feeding device) that are independent of each other, and the transfer material taking and unloading mechanism 400 can not only take and unload materials from the second device, but also transfer materials on the first material receiving mechanism 200 and the second material receiving mechanism 300, so that multiple traditional independently arranged devices can be docked to form a complete automated production line.

[0033] Specifically, the first material receiving mechanism 200 may include a first material receiving driving member 210, and a first carrier structure 220 connected to the first material receiving driving member 210, and the first material receiving driving member 210 is used to drive the first carrier structure 220 to move between the adjacent first device (such as a bending device) and the second device (such as an electrical testing device). The first material receiving driving member 210 of the first material receiving mechanism 200 drives the first carrier structure 220 to move between the adjacent first device (such as a bending device) and the second device (such as an electrical testing device), so that the first carrier structure 220 can receive the circuit board material 20 bent by the bending device when it moves into the bending device, and the first carrier structure 220 and the circuit board material 20 it receives can be transferred to the electrical testing device under the drive of the first material receiving driving member 210.

[0034] Moreover, the second material receiving mechanism 300 may include a second material receiving drive 310 and a second carrier structure 320 connected to the second material receiving drive 310, and the second material receiving drive 310 is used to drive the second carrier structure 320 to move between the adjacent second device (such as the electrical measuring device) and the third device (such as the unloading device). Similarly, the second material receiving drive 310 of the second material receiving mechanism 300 drives the second carrier structure 320 and the circuit board material 20 thereon to move between the adjacent second device (such as the electrical measuring device) and the third device (such as the unloading device), so that the second carrier structure 320, driven by the second material receiving drive 310, moves the circuit board material 20 received in the electrical measuring device to the unloading device for unloading.

[0035] Moreover, the transfer material discharging and unloading mechanism 400 may include a transfer translation mechanism 410 for being arranged on the second device, a transfer lifting mechanism 420 arranged on the material discharging and unloading translation mechanism, and a material discharging and unloading plate structure 430 and a material discharging and unloading positioning structure arranged on the transfer lifting mechanism 420, and the material discharging and unloading plate structure 430 and the material discharging and unloading positioning structure are both located above the first carrier plate structure 220 and the second carrier plate structure 320. The material discharging and unloading plate structure 430 is moved by the transfer translation mechanism 410 and the transfer lifting mechanism 420 of the transfer material discharging and unloading mechanism 400, so that the material discharging and unloading plate structure 430 can pick up the circuit board material 20 carried on the first carrier plate structure 220, and transfer the material to the testing mechanism of the electrical measuring equipment for testing, and after the testing is completed, the material is picked up and transferred to the second carrier plate structure 320 of the second material receiving mechanism 300.

[0036] Through the cross-device docking device 10 provided by the utility model, multiple devices (such as bending equipment, electrical testing equipment, unloading equipment, etc.) that were originally set up independently can be connected, and the circuit board material 20 bent by the bending equipment can be automatically connected, and the received circuit board material 20 can be automatically transferred to the electrical testing equipment for electrical testing, and after the electrical testing is completed, the circuit board material 20 can be automatically transferred to the unloading equipment for processing and unloading. In this way, the traditional bending equipment, electrical testing equipment, unloading equipment, etc. can be connected and modified through the cross-device docking device 10, and the automatic turnover of products can be realized without redesigning the production line, saving labor costs, improving production efficiency, and improving the degree of automation of production.

[0037] Furthermore, if Figure 1 to Figure 2 As shown, the cross-device docking device 10 may include a device base 100, and the first material receiving mechanism 200, the second material receiving mechanism 300 and the transfer material taking and releasing mechanism 400 may all be arranged on the device base 100. Moreover, the device base 100 may be an equipment rack of the second device (electrical measuring device), that is, the first material receiving mechanism 200, the second material receiving mechanism 300 and the transfer material taking and releasing mechanism 400 may be partially or completely arranged on the second device.

[0038] In addition, if Figures 2 to 4 As shown, the first carrier structure 220 of the first material receiving mechanism 200 may include a first material receiving base 222 connected to the first material receiving driving member 210, a first connecting plate 224 suspended on the first material receiving base 222, and a first material receiving carrier 226 detachably connected to the suspended end of the first connecting plate 224, and a first limiting groove 2262 is provided on the first material receiving carrier 226. The first material receiving driving member 210 can drive the first material receiving base 222 to move, thereby driving the first connecting plate 224 and the first material receiving carrier 226 to move, so that the first material receiving carrier 226 can reciprocate between the first device and the second device, so as to facilitate the use of the first limiting groove 2262 provided on the first material receiving carrier 226 to receive and position the circuit board material 20, and transfer the circuit board material 20 from the first device to the second device. Moreover, by connecting the first material receiving carrier 226 through the first connecting plate 224, the material receiving distance of the first material receiving carrier 226 can be extended; and by connecting one end of the first connecting plate 224 to the first material receiving base 222 and suspending the other end of the first connecting plate 224, and connecting one end of the first material receiving carrier 226 to the suspended end of the first connecting plate 224 and suspending the other end of the first material receiving carrier 226, the material receiving distance of the first material receiving carrier 226 can be further extended. In addition, by detachably arranging the first material receiving carrier 226 on the first connecting plate 224, the first material receiving carrier 226 of different sizes can be replaced according to the size of the circuit board material 20.

[0039] Furthermore, the first material receiving driving member 210 may include a first driving base 212 for being installed on the second device or between the first device and the second device (i.e., the first driving base 212 may be partially or completely installed on the device base 100), and a first linear driving module 214 installed on the first driving base 212, and the first material receiving base 222 is slidably connected to the first linear driving module 214. The first material receiving driving member 210 and the first carrier structure 220 may be fixed and supported by the first driving base 212, and the first carrier structure 220 may be driven by the first linear driving module 214. Furthermore, the first linear driving module 214 may be set as a linear motor module, or may be set as a motor linear driving structure (such as a motor-driven screw nut transmission structure), which may drive the first carrier structure 220 to move linearly.

[0040] Moreover, the first connecting plate 224 is extended along the length direction of the first linear drive module 214, and the first receiving carrier plate 226 is extended along the length direction of the first linear drive module 214 from the suspension end of the first connecting plate 224. That is, the first connecting plate 224 and the first receiving carrier plate 226 of the first carrier structure 220 are both extended along the length direction of the first linear drive module 214, and the receiving distance of the first receiving carrier plate 226 is increased as much as possible. In addition, the first receiving drive member 210 can be set on the electrical measuring device (i.e., the second device), or on the bending device (i.e., the first device), or part of it can be set on the electrical measuring device and the other part can be set on the bending device, so as to facilitate the receiving and transportation of the circuit board material 20 on the bending device. In addition, the bottom of the first limiting groove 2262 of the first receiving carrier plate 226 can be provided with a suction nozzle structure or an adsorption hole structure, which can further adsorb and position the circuit board material 20 in the first limiting groove 2262.

[0041] In addition, the first carrier structure 220 may include a carrier telescopic driving member connected to the first material receiving base 222 or the first connecting plate 224, and the first connecting plate 224 or the first material receiving carrier 226 is connected to the carrier telescopic driving member. That is, the carrier telescopic driving member may be connected between the first material receiving base 222 and the first connecting plate 224, or may be connected between the first connecting plate 224 and the first material receiving carrier 226. The first material receiving carrier 226 may be telescopically driven by the carrier telescopic driving member, and the material receiving distance of the first material receiving carrier 226 may be further increased, so that when the first material receiving driving member 210 is arranged on the electrical measuring device, the first material receiving carrier 226 may also be driven to receive the circuit board material 20 in the bending device. In addition, the carrier telescopic driving member may be set as a cylinder driving structure.

[0042] In addition, the first carrier structure 220 may include a carrier rotation driving member connected to the first material receiving base 222 or the first connecting plate 224, and the first connecting plate 224 or the first material receiving carrier 226 is connected to the carrier rotation driving member. That is, the carrier rotation driving member may be connected between the first material receiving base 222 and the first connecting plate 224, or may be connected between the first connecting plate 224 and the first material receiving carrier 226. The first material receiving carrier 226 may be rotationally driven by the carrier rotation driving member, so that the first material receiving carrier 226 is rotated to different angle positions, so as to facilitate receiving circuit board materials 20 in different orientations. In addition, the carrier rotation driving member may also be set as a cylinder driving structure. In addition, the carrier rotation driving member and the carrier telescopic driving member may be set at the same time, or only one of them may be set.

[0043] In addition, if Figure 2 and Figure 5 As shown, the second carrier structure 320 of the second material receiving mechanism 300 may include a second material receiving base 322 connected to the second material receiving driving member 310, a second connecting plate 324 suspended on the second material receiving base 322, and a second material receiving carrier 326 detachably connected to the suspended end of the second connecting plate 324, and a second limiting groove 3262 is provided on the second material receiving carrier 326. Similarly, the second material receiving driving member 310 can drive the second material receiving base 322 to move, thereby driving the second connecting plate 324 and the second material receiving carrier 326 to move, so that the second material receiving carrier 326 can reciprocate between the second device and the third device, so as to facilitate the use of the second limiting groove 3262 provided on the second material receiving carrier 326 to receive and position the circuit board material 20, and transfer the circuit board material 20 from the second device to the third device.

[0044] Furthermore, the second material receiving drive member 310 may include a second drive base 312 for installation on the second device or between the second device and the third device, and a second linear drive module 314 provided on the second drive base 312, and the second material receiving base 322 is slidably connected to the second linear drive module 314. Similarly, the second material receiving drive member 310 and the second carrier plate structure 320 may be fixed and supported by the second drive base 312, and the second carrier plate structure 320 may be driven by the second linear drive module 314. Furthermore, the second linear drive module 314 may also be set as a linear motor module, or a motor linear drive structure (such as a motor-driven screw nut transmission structure).

[0045] In addition, the second material receiving mechanism 300 may also include a carrier plate rotation driving member and / or a carrier plate telescopic driving member. The specific structure of the second material receiving mechanism 300 is similar to that of the first material receiving mechanism 200, and will not be described in detail herein.

[0046] In addition, if Figure 1 to Figure 2As shown, the cross-device docking device 10 may include a flexible plate transfer table 500 or / and a flexible plate sample comparison table for installation on the second device, and the flexible plate transfer table 500 or / and the flexible plate sample comparison table are located between the first material receiving mechanism 200 and the first material receiving mechanism 200. The flexible plate transfer table 500 can cooperate with the transfer material taking and unloading mechanism 400 to temporarily store the circuit board material 20; the flexible plate sample comparison table can also cooperate with the transfer material taking and unloading mechanism 400, and when the electrical testing device detects the circuit board material 20 received by the first material receiving mechanism 200, it can be used to place the circuit board sample for comparison with the circuit board material 20.

[0047] Furthermore, the flexible plate transfer station 500 or the flexible plate sample control station may include a flexible plate bracket 510 for mounting on the second device (electrical measuring device), and a flexible plate carrier 520 disposed on the flexible plate bracket 510, and at least one flexible plate positioning groove is disposed on the flexible plate carrier 520. The flexible plate bracket 510 may be disposed on the side of the first material receiving driving member 210 of the first material receiving mechanism 200, and may be disposed corresponding to the first carrier structure 220, so that the flexible plate carrier 520 on the flexible plate bracket 510 corresponds side by side with the first material receiving carrier 226 of the first carrier structure 220. Moreover, the height of the flexible plate carrier 520 may be the same as that of the first material receiving carrier 226, so as to facilitate receiving the circuit board material 20 or positioning the circuit board sample.

[0048] In addition, if Figure 1 , Figure 2 , Figure 6 , Figure 7 As shown, the transfer translation mechanism 410 of the transfer material picking and unloading mechanism 400 may include a transfer frame 440 (which may be an equipment frame of the second device (electrical measuring device)) disposed on the device base 100, a horizontal linear drive module 412 disposed on the transfer frame 440, and a longitudinal linear drive module 414 disposed on the horizontal linear drive module 412. The transfer lifting mechanism 420 may be disposed on the longitudinal linear drive module 414, and is used to move the material picking and unloading plate structure 430 horizontally, longitudinally and vertically, so as to facilitate the material picking and unloading plate structure 430 to pick up and unload materials from the first material receiving mechanism 200, the second material receiving mechanism 300 and the flexible plate transfer table 500. In addition, the transfer lifting mechanism 420 may be set as a cylinder lifting drive structure or a motor lifting drive structure.

[0049] Moreover, the material picking and placing plate structure 430 may include a material picking and placing rotating driving member 432 connected to the transfer lifting mechanism 420, a material picking and placing connecting seat 434 connected to the material picking and placing rotating driving member 432, two material picking and placing telescopic driving members 436 arranged side by side at the bottom of the material picking and placing connecting seat 434, and a material picking and placing adsorption plate 438 detachably connected to each material picking and placing telescopic driving member 436. The material picking and placing adsorption plate 438 may be driven to rotate by the material picking and placing rotating driving member 432, so that the orientation of the material picking and placing adsorption plate 438 corresponds to the circuit board material 20 to be grabbed, or corresponds to the required orientation of the material to be placed, and the material picking and placing telescopic driving member 436 may further drive the material picking and placing adsorption plate 438 to move up and down, so that the material picking and placing adsorption plate 438 can accurately adsorb or place down the circuit board material 20.

[0050] Furthermore, the pick-up and place material adsorption plate 438 may include an adsorption plate body 4382 connected to the pick-up and place material telescopic driving member 436, and a plurality of vacuum suction nozzles 4384 protruding from the bottom of the adsorption plate body 4382, and the arrangement shape of the plurality of vacuum suction nozzles 4384 is used to correspond to the shape of the circuit board material 20 to be adsorbed and placed. By providing the plurality of vacuum suction nozzles 4384 corresponding to the shape of the circuit board material 20, the circuit board material 20 can be adsorbed and grasped from multiple positions, which is stable and reliable. In addition, the pick-up and place material telescopic driving member 436 can be set as a cylinder drive structure.

[0051] In addition, the material placement positioning structure may include a visual positioning structure disposed on the transfer lifting mechanism 420, which can perform visual positioning when the circuit board material 20 is placed and placed using the material placement plate structure 430. Moreover, the visual positioning structure can be set as an industrial camera module. In addition, the material placement positioning structure can also be set on the device base 100, and is arranged correspondingly to the material placement plate structure 430 above and below.

[0052] In the description of the present utility model, it should be noted that the terms "upper", "lower", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present utility model. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to the specific circumstances.

[0053] It should be noted that, in the present utility model, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0054] The above description is only a specific embodiment of the utility model, so that those skilled in the art can understand or implement the utility model. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the utility model. Therefore, the utility model will not be limited to the embodiments shown herein, but should conform to the widest scope consistent with the principles and novel features of the utility model described herein.

Claims

1. A cross-device docking device, characterized in that: include: A first material receiving mechanism, comprising a first material receiving driving member and a first carrier plate structure connected to the first material receiving driving member, wherein the first material receiving driving member is used to drive the first carrier plate structure to move between adjacent first equipment and second equipment; A second material receiving mechanism, comprising a second material receiving driving member, and a second carrier plate structure connected to the second material receiving driving member, wherein the second material receiving driving member is used to drive the second carrier plate structure to move between the adjacent second device and the third device; and The transfer material picking and unloading mechanism includes a transfer translation mechanism for being arranged on the second device, a transfer lifting mechanism arranged on the material picking and unloading translation mechanism, and a material picking and unloading plate structure and a material picking and unloading positioning structure arranged on the transfer lifting mechanism, wherein the material picking and unloading plate structure and the material picking and unloading positioning structure are both located above the first carrier plate structure and the second carrier plate structure.

2. The cross-device docking device according to claim 1, characterized in that: The first carrier structure includes a first material receiving base connected to the first material receiving driving member, a first connecting plate suspended on the first material receiving base, and a first material receiving carrier detachably connected to the suspended end of the first connecting plate, and a first limiting groove is provided on the first material receiving carrier.

3. The cross-device docking device according to claim 2, characterized in that: The first material receiving driving member includes a first driving base for being installed on the second device or between the first device and the second device, and a first linear driving module arranged on the first driving base; The first material receiving base is slidably connected to the first linear drive module, the first connecting plate is extended along the length direction of the first linear drive module, and the first material receiving carrier is extended from the suspended end of the first connecting plate along the length direction of the first linear drive module.

4. The cross-device docking device according to claim 2, characterized in that: The first carrier plate structure includes a carrier plate telescopic driving component connected to the first material receiving base or the first connecting plate, and the first connecting plate or the first material receiving carrier plate is connected to the carrier plate telescopic driving component.

5. The cross-device docking device according to claim 2, characterized in that: The first carrier plate structure includes a carrier plate rotation driving member connected to the first material receiving base or the first connecting plate, and the first connecting plate or the first material receiving carrier plate is connected to the carrier plate rotation driving member.

6. The cross-device docking device according to any one of claims 1 to 5, characterized in that: The second carrier structure comprises a second material receiving base connected to the second material receiving driving member, a second connecting plate suspended on the second material receiving base, and a second material receiving carrier detachably connected to the suspended end of the second connecting plate, wherein a second limiting groove is provided on the second material receiving carrier; The second material receiving drive member includes a second drive base for being installed on the second device or between the second device and the third device, and a second linear drive module arranged on the second drive base, and the second material receiving base is slidably connected to the second linear drive module.

7. The cross-device docking device according to any one of claims 1 to 5, characterized in that: The cross-device docking device includes a flexible plate transfer table and / or a flexible plate sample comparison table for installation on the second device, and the flexible plate transfer table and / or the flexible plate sample comparison table are located between the first material receiving mechanism and the second material receiving mechanism.

8. The cross-device docking device according to claim 7, characterized in that: The flexible plate transfer station or the flexible plate sample comparison station comprises a flexible plate bracket for being mounted on the second device, and a flexible plate carrier plate arranged on the flexible plate bracket, wherein at least one flexible plate positioning groove is arranged on the flexible plate carrier plate.

9. The cross-device docking device according to any one of claims 1 to 5, characterized in that: The material picking and unloading plate structure includes a material picking and unloading rotating drive member connected to the transfer lifting mechanism, a material picking and unloading connecting seat connected to the material picking and unloading rotating drive member, two material picking and unloading telescopic drive members arranged side by side at the bottom of the material picking and unloading connecting seat, and a material picking and unloading adsorption plate detachably connected to each of the material picking and unloading telescopic drive members.

10. The cross-device docking device according to claim 9, characterized in that: The material picking and placing adsorption plate includes an adsorption plate body connected to the material picking and placing telescopic drive member, and a plurality of vacuum suction nozzles protruding from the bottom of the adsorption plate body. The arrangement shape of the plurality of vacuum suction nozzles is used to correspond to the shape of the circuit board material to be adsorbed and placed.

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