Chip moving device

Abstract

The utility model provides a chip moving device. The chip moving device comprises a bottom plate, a lifting module arranged on one side of the bottom plate, a vacuum module and a variable pitch module, the lifting module comprises a lifting motor and a lifting screw rod, the lifting screw rod is fixedly connected to one side of the bottom plate, and the lifting motor is arranged at the top of the lifting screw rod and used for controlling the lifting screw rod to drive the whole moving device to move in the vertical direction; the variable-pitch module is fixedly connected to the lifting module through the lifting screw rod and comprises a variable-pitch motor and a variable-pitch screw rod, and the variable-pitch motor is arranged at the top of the variable-pitch screw rod and used for controlling the variable-pitch screw rod to change pitch in the horizontal direction; the vacuum module is arranged at the top of the variable-pitch module through an outer frame and comprises a plurality of vacuum generators located in the outer frame and a plurality of air cylinders connected with the vacuum generators through air pipes, and the multiple air cylinders are connected with the variable-pitch module through the variable-pitch lead screws.

Description

Technical Field

[0001] The present application relates to the field of semiconductor chip testing, and in particular to a chip moving device. Background Art

[0002] Chip testing is the back-end process of integrated circuits and an important finishing work in the chip manufacturing process. It is to test the functions and performance of the chip to ensure that the quality of the chip product meets the design requirements. Chip testing equipment is often divided into silicon wafer testing and terminal testing according to different processes. Terminal testing is also called Final Test, abbreviated as FT. Terminal testing is a complete performance test of the packaged chips one by one. Terminal testing is the last barrier of chip testing, and its importance is self-evident. During the chip testing process, moving the chip takes a lot of time. Improving the efficiency of chip moving is one of the effective means to reduce the cost of chip testing.

[0003] Because the package size of MEMS (Micro Electro Mechanical Systems) gyroscopes and accelerometer chips is small, the distance between the tray where the chips are stored and the test bench where the chips are tested is inconsistent, so it is difficult to ensure fast and efficient chip placement during chip transportation. Large-scale general-purpose test equipment in related technologies has a complex structure and redundant functions. It requires professional personnel who have undergone rigorous training to operate, and the cost of use and maintenance is expensive. Summary of the invention

[0004] Based on this, the utility model provides a chip transporting device, which has the advantages of simple structure, easy control, simple and convenient operation, and adaptability to chips of various packages.

[0005] The chip moving device provided in the embodiment of the present application includes: a base plate, a lifting module, a vacuum module and a variable pitch module arranged on one side of the base plate; the lifting module includes a lifting motor and a lifting screw, the lifting screw is fixedly connected to one side of the base plate, the lifting motor is arranged at the top of the lifting screw, and is used to control the lifting screw to drive the moving device as a whole to move in a vertical direction; the variable pitch module is fixedly connected to the lifting module through the lifting screw, and includes a variable pitch motor and a variable pitch screw, the variable pitch motor is arranged at the top of the variable pitch screw, and is used to control the variable pitch screw to change the pitch in the horizontal direction; the vacuum module is arranged at the top of the variable pitch module through an outer frame, and includes a plurality of vacuum generators located in the outer frame, and a plurality of cylinders connected to each of the vacuum generators through an air pipe, and a plurality of the cylinders are connected to the variable pitch module through the variable pitch screw.

[0006] In some embodiments, the vacuum module further includes: a suction nozzle disposed at the bottom of each of the cylinders, and the suction nozzle is used to suck the chip.

[0007] In some embodiments, the vacuum module controls the nozzle to pick up and place the chip by switching between a vacuum state and a non-vacuum state.

[0008] In some embodiments, the cylinder can reciprocate in a vertical direction.

[0009] In some embodiments, the lifting module further includes: a limit switch, which is arranged on the side of the outer frame and is used to control the upper limit and the lower limit of the lifting module.

[0010] In some embodiments, the vacuum module further includes: a conduit, one end of which is connected to the vacuum generator, and the other end of which is connected to an external air source.

[0011] In some embodiments, the variable distance module includes a loading state and a unloading state, including: in the loading state, a first distance is maintained between adjacent cylinders; in the unloading state, a second distance is maintained between adjacent cylinders.

[0012] In some embodiments, the number of the suction nozzles is preferably 7.

[0013] The utility model designs a chip moving device which realizes simple control and convenient operation by arranging a vacuum module and adopting automatic variable distance technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of the structure of a chip moving device provided in an embodiment of the present application;

[0015] Figure 2 A schematic diagram of the structure of the handling device provided in an embodiment of the present application in a loading state;

[0016] Figure 3 A schematic structural diagram of the handling device provided in an embodiment of the present application in a unloading state.

[0017] Figure markings: 100-chip moving device, 10-bottom plate, 20-lifting module, 210-lifting screw, 220-lifting motor, 230-limit switch, 30-variable pitch module, 310-variable pitch motor, 320-variable pitch screw, 40-vacuum module, 410-outer frame, 420-vacuum generator, 430-trachea, 440-cylinder, 450-nozzle, 460-catheter. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by ordinary persons in this field without creative work are within the scope of protection of the present application. The preferred embodiments of the present application will be described in more detail below with reference to the drawings. Although the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described here. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0019] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0020] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0021] In the description of the present application, it should be understood that the terms "thickness", "up", "down", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0022] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0023] The technical solution of the embodiments of the present application is described in detail below with reference to the accompanying drawings.

[0024] See also Figures 1 to 3 The present application provides a chip moving device 100, comprising:

[0025] The bottom plate 10 is provided with a lifting module 20, a variable pitch module 30 and a vacuum module 40 on one side of the bottom plate. The lifting module 20 includes a lifting motor 220 and a lifting screw 210, the lifting screw 210 is fixedly connected to one side of the bottom plate 10, and the lifting motor 220 is provided on the top of the lifting screw 210 to control the lifting screw 210 to move in a vertical direction.

[0026] The pitch-changing module 30 is fixedly connected to the lifting module 20 through the lifting screw 210, and can move in the vertical direction with the movement of the lifting module 20. The pitch-changing module 30 includes a pitch-changing motor 310 and a pitch-changing screw 320. The pitch-changing motor 310 is arranged on the top of the pitch-changing screw 320, and is used to control the pitch-changing screw 320 to change the pitch in the horizontal direction.

[0027] The vacuum module 40 is disposed on the top of the pitch-changing module 30 through an outer frame 410, and can move vertically with the pitch-changing module as a whole along with the lifting screw 210. The vacuum module 40 includes a plurality of vacuum generators 420 located in the outer frame 410, and a plurality of cylinders 440 connected to each of the vacuum generators 420 through an air pipe 430, wherein each cylinder can reciprocate in the vertical direction, and a plurality of the cylinders 440 are connected to the pitch-changing module 30 through the pitch-changing screw 320. The cylinder 440 is connected to the pitch-changing screw 320, and the pitch-changing screw 320 moves in the horizontal direction to drive the cylinder 440 to move in the horizontal direction, thereby controlling the spacing between the plurality of cylinders 440.

[0028] In the embodiment of the present application, the vacuum module 40 further includes: a suction nozzle 450 disposed at the bottom of each of the cylinders 440, and the suction nozzle 450 is used to suck the chip. The vacuum generator 420 here is used in conjunction with the suction nozzle 450, and the vacuum module 40 controls the suction nozzle 450 to suck and place the chip by switching between the vacuum state and the non-vacuum state. When it is necessary to suck the chip, the vacuum generator 420 generates a vacuum, the vacuum module 40 is in a vacuum state, and the cylinder 440 controls the suction nozzle 450 to move to a suitable position in the vertical direction to suck the chip; then the chip can be moved, and when it is moved to a suitable position and the chip needs to be released, the cylinder controls the suction nozzle to move to a release height in the vertical direction, the vacuum module 40 switches to a non-vacuum state, and the suction nozzle 450 releases the chip. Here, the number of suction nozzles and cylinders is the same, and can be freely set according to actual needs. The number of suction nozzles used in the vacuum module is generally an integer multiple of half of the number of chips that can be placed in each row in the tray, which is both economical and efficient. Preferably, the vacuum module in this solution uses 7 suction nozzles, because each row in the tray can hold 14 chips. On the test bench, each row can hold 7 chips, so during the loading process, after the 7 suction nozzles have sucked the chips, they only need to perform a distance change operation once to adjust the distance of each suction nozzle to the same distance as the chip on the test board.

[0029] In the embodiment of the present application, the lifting screw 210 and the cylinder 440 can both move in the vertical direction. Generally speaking, the lifting screw is used for long-distance lifting and the cylinder is used for micro-distance control. Therefore, the lifting screw and the cylinder are used in combination to enable the moving device to accurately absorb the chip.

[0030] In some embodiments, the lifting module 20 further includes: a limit switch 230, which is disposed on the side of the outer frame 410 and is used to control the upper limit and lower limit of the lifting module 20. The transmission mechanism (i.e., the lifting module) composed of the lifting motor and the lifting screw is used to lift the moving device as a whole, ensuring that the chip moving device does not collide with other components of the test equipment during movement, and the upper limit and lower limit of the overall lifting are guaranteed by the limit switch.

[0031] In some embodiments, the vacuum module 40 further includes a conduit 460, one end of which is connected to the vacuum generator 420, and the other end of which is connected to an external gas source, for sucking gas from the external gas source to switch the vacuum module to a non-vacuum state.

[0032] In some embodiments, the variable pitch module 30 includes a loading state and a unloading state. Figure 2The present invention provides a structural schematic diagram of a transport device in a loading state. In the loading state, the variable pitch motor 310 is controlled to reverse and drive the variable pitch screw 320 to reduce the spacing between the cylinders 440, so that a first spacing D1 is maintained between adjacent cylinders 440. Here, the first spacing D1 is the placement spacing of the chips to be moved on the sample table. Figure 3 The schematic diagram of the structure of the handling device provided in the embodiment of the present application in the unloading state, in the unloading state, by controlling the variable pitch motor 310 to rotate forward, driving the variable pitch screw 320, driving the distance between the cylinders 440 to expand, so that the second spacing D2 is maintained between the adjacent cylinders 440, and the second spacing D2 is the placement spacing between the chips on the test bench. The chip handling device provided in the embodiment of the present application not only realizes the automatic pick-up and placement and automatic variable pitch handling process by setting a vacuum module, especially a suction nozzle, and adopting automatic variable pitch technology, but also has the advantages of simple control, convenient operation, low cost and high efficiency.

[0033] Combine the following Figure 1-3 The operation process of the chip moving device provided in the embodiment of the present application is described as follows: first, the loading process is carried out, the lifting motor 220 is started, and the lifting screw 210 is controlled to move in the vertical direction, so that the moving device as a whole is located above the chip to be moved. At this time, the variable pitch motor 310 is controlled to reverse, thereby driving the variable pitch screw 320 to drive the cylinder 440 to move in the horizontal direction, so that the cylinder 440 is at the first distance D1, and then, the suction nozzle 450 is controlled by the cylinder 440 to move downward in the vertical direction, so that the suction nozzle 450 contacts the top of the chip. The vacuum state is started by the vacuum generator 420, and the air in the air pipe and the suction nozzle is extracted through the conduit 460 to form a vacuum state, so that the suction nozzle 450 generates suction to suck up the chip, and then the cylinder 440 is controlled to move the suction nozzle 450 with the chip upward in the vertical direction. Then the moving device is moved as a whole to the top of the test bench for unloading, and the cylinder 440 is controlled to lower the suction nozzle 450 with the chip to a specified height. The variable pitch motor 310 rotates forward to control the variable pitch screw 320 to drive the cylinder to change the cylinder spacing to D2 in the horizontal direction, and air is introduced from an external air source through the conduit 460, and the vacuum generator 420 is controlled to switch from the vacuum state to the non-vacuum state. At this time, the suction of the suction nozzle 450 disappears, thereby placing the chip in the test position.

[0034] The above description is only the preferred embodiment of the present invention and is not intended to limit the present invention. Any technician familiar with the profession can make various changes, modifications, substitutions and variations to these embodiments without departing from the principle and purpose of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A chip moving device, characterized in that: The device comprises: A bottom plate, a lifting module, a vacuum module and a variable pitch module arranged on one side of the bottom plate; The lifting module includes a lifting motor and a lifting screw, wherein the lifting screw is fixedly connected to one side of the bottom plate, and the lifting motor is arranged on the top of the lifting screw to control the lifting screw to drive the moving device to move in a vertical direction as a whole; The pitch-changing module is fixedly connected to the lifting module through the lifting screw, and comprises a pitch-changing motor and a pitch-changing screw. The pitch-changing motor is arranged at the top of the pitch-changing screw and is used to control the pitch-changing screw to change in the horizontal direction. The vacuum module is arranged on the top of the variable pitch module through an outer frame, and includes a plurality of vacuum generators located in the outer frame, and a plurality of cylinders connected to each of the vacuum generators through an air pipe. The plurality of cylinders are connected to the variable pitch module through the variable pitch screw.

2. The device according to claim 1, characterized in that The vacuum module also includes: A suction nozzle is arranged at the bottom of each cylinder, and the suction nozzle is used to suck the chip.

3. The device according to claim 2, characterized in that The vacuum module controls the nozzle to pick up and place the chip by switching between the vacuum state and the non-vacuum state.

4. The device according to claim 3, characterized in that The cylinder can perform reciprocating motion in a vertical direction.

5. The device according to claim 4, characterized in that The lifting module also includes: The limit switch is arranged on the side of the outer frame and is used to control the upper limit and the lower limit of the lifting module.

6. The device according to claim 5, characterized in that The vacuum module also includes: A conduit, one end of which is connected to the vacuum generator, and the other end of which is connected to an external gas source.

7. The device according to claim 6, characterized in that The variable pitch module includes a loading state and a unloading state, including: in the loading state, a first spacing is maintained between adjacent cylinders; In the unloading state, a second distance is maintained between adjacent cylinders.

8. The device according to any one of claims 2 to 7, characterized in that: The number of the suction nozzles is 7.

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