Integrally produced electronic component

Abstract

The utility model discloses an integrally produced electronic component, which comprises a PCB (Printed Circuit Board) and an FPC (Flexible Printed Circuit) which are connected with each other, a plurality of bonding pads are respectively arranged at the joint of the PCB and the FPC, and component pins on the bonding pads are connected with a conductive layer of the circuit board through soldering tin. According to the mode, the FPC board and the PCB are integrally produced, the connector is optimized, the manufacturing cost is reduced, the production efficiency is improved, and the requirement of the market for a longer circuit board is met.

Description

Technical Field

[0001] The present application relates to the field of electronic components, and in particular to an integrated electronic component. Background Art

[0002] PCB (Printed Circuit Board), also known as printed circuit board, is a circuit board formed by coating conductive material on an insulating substrate. It is used to connect electronic components together to form a circuit.

[0003] FPC (Flexible Printed Circuit) board, also known as flexible circuit board, is a printed circuit made of polyimide or polyester film as the substrate with high reliability and excellent flexibility. It is usually used in applications that require repeated flexing and the connection of some small components.

[0004] In the prior art, the FPC board and the PCB board must be connected through a connector. At the same time, due to the limitation of the connection method, the FPC is usually directly made in the interlayer of the PCB, but this also limits the overall size structure and cannot fully meet the market demand. Utility Model Content

[0005] The present application mainly provides an integrated electronic component to solve the problem in the prior art that a PCB board and an FPC board must be connected through a connector.

[0006] In order to solve the above technical problems, a technical solution adopted in this application is to provide a PCB and FPC integrated production method, comprising the following steps:

[0007] S10: Paste the FPC board and the PCB board together and load them into the carrier;

[0008] S20: placing the carrier on a solder paste printer to perform solder paste printing;

[0009] S30: placing the carrier on a chip mounter for surface mounting;

[0010] S40: placing the carrier in a reflow soldering device to melt and solidify the solder paste;

[0011] S50: performing glue dispensing treatment on the joint between the FPC board and the PCB board, and performing curing.

[0012] The step of pasting the FPC board to the PCB board and loading them into the carrier includes:

[0013] S11: Fix the PCB board in the carrier, and stick the FPC board to the PCB board by adhesive.

[0014] Wherein, after the step of placing the carrier on a chip mounter for surface mounting, the following steps are included:

[0015] S31: placing the carrier on an optical inspection device to perform a mounting effect inspection.

[0016] Wherein, the optical inspection equipment includes an AOI inspection station.

[0017] The step of placing the carrier in a reflow soldering device to melt and solidify the solder paste includes:

[0018] S41: placing the carrier in a non-destructive testing device to perform welding reliability testing.

[0019] Another technical solution adopted in the present application is: to provide an electronic component manufactured by the above production method, including a connected PCB board and an FPC board, wherein a plurality of solder pads are respectively provided at the joints between the PCB board and the FPC board.

[0020] Among them, the spacing between adjacent pads along the first direction is greater than 2mm, the spacing between adjacent pads along the second direction is greater than 1mm, the second direction is set at an angle to the first direction; the spacing between the pad and the edge of the electronic component is greater than 5mm.

[0021] Wherein, the pads on the PCB board are lead-free tin-sprayed.

[0022] Wherein, the pad on the FPC board is a single-sided double-contact board.

[0023] Wherein, the pads on the FPC board are made of chemically etched gold.

[0024] The beneficial effects of the present application are as follows: Different from the prior art, the present application discloses a method for integrated production of PCB and FPC, which uses an integrated reflow soldering process to integrate the FPC board and the PCB board into one production, optimizes the connector, reduces manufacturing costs, improves production efficiency, and meets the market demand for longer specification circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0026] Figure 1 This is a flowchart of the steps of the integrated production method of PCB and FPC in one embodiment of the present application;

[0027] Figure 2 is a schematic diagram of the structure of an electronic component in an embodiment of the present application;

[0028] Figure 3 It is a schematic diagram of the distribution of pads on a PCB board in one embodiment of the present application.

[0029] Description of main component symbols:

[0030] 10-PCB board; 20-FPC board; 30-carrier; 40-soldering pad; 50-reinforcement pin. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0032] The terms "first", "second", "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0033] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0034] See also Figure 1 The present application discloses a method for producing an integrated PCB and FPC, comprising the following steps:

[0035] S10: Paste the FPC board 20 and the PCB board 10 together and load them into the carrier 30;

[0036] S20: placing the carrier 30 on a solder paste printer to perform solder paste printing;

[0037] S30: placing the carrier 30 on a chip mounter for surface mounting;

[0038] S40: placing the carrier 30 in a reflow soldering device to melt and solidify the solder paste;

[0039] S50: performing glue dispensing treatment on the joint between the FPC board 20 and the PCB board 10, and curing the joint to obtain an integrated circuit board.

[0040] In this embodiment, step S10 can be to first place and fix the PCB board 10 in the carrier 30, then stick the FPC board 20 to the PCB board 10, and finally press the upper cover on the carrier 30 tightly onto the FPC board 20. The upper cover on the carrier 30 is used to fix the circuit board on the carrier 30.

[0041] The solder paste printer, chip mounter and reflow soldering equipment in steps S20 to S40 are arranged in sequence, and the equipment is connected in sequence through guide rails, and the carrier 30 can be set on the guide rails for sliding. In the process of steps S20 to S40, the carrier 30 transports the PCB board 10 and the FPC board 20 to the solder paste printer, the chip mounter, and the reflow soldering equipment in sequence for corresponding processing, thereby improving the transportation efficiency in the production process, thereby improving the production efficiency.

[0042] In step S50, after the glue dispensing process, the circuit board enters the glue curing furnace through a preset guide rail for curing to complete the production of the product.

[0043] Through the above steps, the PCB board 10 and the FPC board 20 can be directly connected, which optimizes the pain point of the prior art that the connection must be achieved through a connector, reduces production costs, improves production efficiency, and at the same time expands the size of the finished circuit board to meet the market's demand for large-size circuit boards.

[0044] In one embodiment, the steps of pasting the FPC board 20 and the PCB board 10 together and loading them into the carrier 30 include:

[0045] S11: Fix the PCB board 10 in the carrier 30, and stick the FPC board 20 on the PCB board 10 by adhesive.

[0046] The adhesive has the characteristics of strong adhesion, strong permeability, good weather resistance, simple usage, non-toxic and environmentally friendly, so the use of adhesive can effectively improve production efficiency. The use of adhesive for pasting in this embodiment does not mean a limitation on the adhesive, and other adhesives that can also meet the above characteristics can be replaced in the same position.

[0047] In one embodiment, after placing the carrier 30 in a chip mounter and performing the surface mounting step, the following steps are performed:

[0048] S31: placing the carrier 30 on an optical inspection device to perform a mounting effect inspection.

[0049] Immediately after surface mounting, the mounting effect test is carried out, and timely adjustments are made if the mounting effect is not as expected, so as to avoid the reduction of yield due to untimely detection of problems, which affects production efficiency and production stability.

[0050] In one embodiment, the optical inspection equipment includes an AOI inspection station.

[0051] The carrier 30 is placed in a reflow soldering device to perform the steps of melting and solidifying the solder paste, including:

[0052] S41: placing the carrier 30 in a non-destructive testing device to perform welding reliability testing.

[0053] Specifically, the nondestructive flaw detection equipment used in this embodiment is an X-ray detection equipment, which is used to detect the internal structure without destroying the object being tested, and to detect the quality of welding in a timely manner to ensure the reliability of production.

[0054] See also Figure 2 , is a schematic diagram of the structure of an electronic component manufactured by the above-mentioned production method in an embodiment of the present application, including a connected PCB board 10 and an FPC board 20, and a plurality of solder pads 40 are respectively provided at the joints between the PCB board and the FPC board 20.

[0055] The pad 40 is a basic component of the surface mount assembly. On the pad 40, the component pin is connected to the conductive layer of the circuit board through solder to form a stable electrical connection.

[0056] Furthermore, in order to improve the mounting accuracy between the PCB board 10 and the FPC board 20 , PSA and TSA materials with good bonding performance are selected in this embodiment, and positioning holes and positioning pins are provided on the PCB board 10 and the FPC board 20 .

[0057] Please continue reading Figure 3 , is a schematic diagram of the distribution of pads on a PCB board in an embodiment of the present application, wherein the spacing between adjacent pads 40 along a first direction is greater than 2 mm, the spacing between adjacent pads 40 along a second direction is greater than 1 mm, and the second direction is arranged at an angle to the first direction; the spacing between the pads 40 and the edge of the electronic component is greater than 5 mm.

[0058] See also Figure 3 In this embodiment, the first direction is as follows Figure 3 The horizontal direction X shown, the second direction is as follows Figure 3In the vertical direction Y shown, the first direction and the second direction are basically arranged perpendicularly. Specifically, in this embodiment, the pads 40 are arranged in horizontal rows. In other embodiments, the pads can also be one row or multiple rows, and the distance and position relationship between them is the same as that in this embodiment. Along the first direction X, the spacing between adjacent pads 40 is a, and in this embodiment, a takes a value greater than 2 mm. Along the second direction Y, the spacing between the pads 40 and the nearest outer edge is b, and the value of b is greater than 5 mm. Along the second direction Y, the row spacing between each row of pads 40 is c, and the value of c is greater than 1 mm. Along the first direction X, the outer ends of the outermost pads 40 are also provided with reinforcing pin feet 50, and the reinforcing pin feet are used to strengthen the holding force between the PCB board 10 and the FPC board 20.

[0059] Figure 3 This is only a schematic diagram of the distribution of pads on the PCB board 10. This side of the PCB board 10 is opposite to the FPC board 20, and the distribution of pads on the FPC board 20 is the same as that on the FPC board 20. Figure 3 The distribution on the PCB board 10 is relatively arranged to facilitate the fixation of the PCB board 10 and the FPC board 20.

[0060] The pad 40 near the edge of the electronic component is provided with a board edge extending outward, and its function is to better fix the FPC board 20 and prevent the FPC board 20 from warping due to force during printing.

[0061] This design increases the tin contact area between the FPC board 20 and the PCB board 10 during reflow soldering, reduces product defects caused by flux or small-sized tin beads during reflow soldering, and enhances the holding force between the FPC board 20 and the PCB.

[0062] In one embodiment, the pads 40 on the PCB board 10 are made of lead-free tin-spraying, which has a higher melting point, environmental protection and health safety.

[0063] In one embodiment, the pad 40 on the FPC board 20 is a single-sided double-contact board, which has the characteristics of simple structure, good contact effect, high reliability, and wide application range.

[0064] In one embodiment, the pads 40 on the FPC board 20 are made of chemical gold, which has the advantage of forming a uniform, dense and smooth metal layer on the surface of the circuit board. The metal layer has good corrosion resistance and conductivity, and can improve the reliability and stability of the circuit board.

[0065] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An integrated electronic component, characterized in that: It comprises a connected PCB board and an FPC board, wherein a plurality of soldering pads are respectively arranged at the joints between the PCB board and the FPC board; the spacing between adjacent soldering pads along a first direction is greater than 2 mm, the spacing between adjacent soldering pads along a second direction is greater than 1 mm, and the second direction is arranged at an angle to the first direction; and the spacing between the soldering pads and the edge of the electronic component is greater than 5 mm.

2. The electronic component produced in an integrated manner according to claim 1, characterized in that: The pads on the PCB board are made of lead-free tin-spraying.

3. The electronic component produced in an integrated manner according to claim 1, characterized in that: The pads on the FPC board are single-sided double-contact boards.

4. The electronic component produced in an integrated manner according to claim 1, characterized in that: The pads on the FPC board are made of chemically etched gold.

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