Enclosure dam ceramic substrate packaging structure

Abstract

The utility model provides a box dam ceramic substrate packaging structure comprising a ceramic substrate, the top of the ceramic substrate is fixedly provided with a box dam body, and the top of the box dam body is provided with a metal housing through a clamping mechanism. The clamping rods are arranged at the bottom of the metal outer ring, the protrusions are arranged at the bottom ends of the clamping rods, the metal shell can be fixedly installed on the top of the box dam body through cooperation of the clamping rods, the protrusions and the clamping grooves, operation is easy, and practicability is high; according to the packaging structure, the annular clamping groove is arranged, so that the bonding layer and the like can be prevented from flowing into the first circuit layer to influence the use of the ceramic substrate during high-temperature sintering, and the stability of the packaging structure can be improved through the cooperation of the metal outer ring, the bulge and the box dam body; light emitted by the LED chip can be reflected through the metal inner ring.

Description

Technical Field

[0001] The utility model relates to the technical field of dammed ceramic substrate packaging, in particular to a dammed ceramic substrate packaging structure. Background Art

[0002] Ceramic substrates have the advantages of high heat dissipation, low thermal resistance, long service life, high voltage resistance, etc. They are the most commonly used substrate materials in the electronics industry, and ceramic substrates have become the basic materials for power electronic circuit structure technology and interconnection technology.

[0003] The Chinese utility model patent with the publication number CN216597627U proposes a dammed snap - on packaging structure, which includes a ceramic substrate and a lens. An upper circuit layer and a lower circuit layer are arranged on the ceramic substrate. The upper circuit layer and the lower circuit layer are respectively arranged on the upper and lower surfaces of the ceramic substrate. A dam is arranged on the upper surface of the upper circuit layer. Among the dam and the lens, one is provided with a clamping block, and the other is provided with a clamping groove. The dam is connected to the lens, and the clamping block is adapted to be arranged in the clamping groove.

[0004] The above - mentioned technical solution makes the dam more firm and not easy to fall off after packaging through the cooperation of the clamping block and the clamping groove. However, both the dam and the lens have high hardness, which is not convenient to engage the clamping block and the clamping groove with each other. The operation is inconvenient and the practicability is low.

[0005] Therefore, the utility model provides a dammed ceramic substrate packaging structure. Summary of the Utility Model

[0006] Aiming at the deficiencies of the existing technology, the purpose of the utility model is to provide a dammed ceramic substrate packaging structure to solve the problems put forward in the above - mentioned background art. The utility model can fixedly install the metal shell on the top of the dam body through the cooperation of the arranged clamping rod and the protrusion with the clamping groove, with simple operation and high practicability.

[0007] To achieve the above purpose, the utility model is realized through the following technical solutions: A dammed ceramic substrate packaging structure includes a ceramic substrate. A dam body is fixedly arranged on the top of the ceramic substrate. A metal shell is installed on the top of the dam body through a clamping mechanism. A lens is fixedly arranged inside the top end of the metal shell. The clamping mechanism includes a clamping groove, which is symmetrically opened inside the top end of the dam body. The shape of the clamping groove is annular. The metal shell includes a metal outer ring and a metal inner ring.

[0008] Furthermore, the shape of the metal inner ring is frustum - shaped, and the metal inner ring fits with the inner wall of the dam body.

[0009] Furthermore, clamping rods are fixedly arranged on the four sides of the bottom of the metal outer ring, and a protrusion is arranged on one side of the bottom end of the clamping rod.

[0010] Further, the card rod is snap-fitted and installed inside the card slot, and an adhesive layer is provided between the bottom of the metal outer ring and the dam body.

[0011] Further, grooves are provided on the outer walls of the four sides of the dam body, and protrusions are provided at positions corresponding to the grooves on the inner wall of the bottom end of the metal outer ring, and the protrusions are snap-fitted inside the grooves.

[0012] Further, a first circuit layer is provided on the top of the ceramic substrate corresponding to the inner side of the dam body, and an LED chip is welded and fixed on the top of the first circuit layer.

[0013] Further, a second circuit layer is provided at the bottom of the ceramic substrate, and the second circuit layer is electrically connected to the first circuit layer.

[0014] Further, the LED chip is arranged inside the dam body and the metal inner ring, and the inner wall of the metal inner ring is a smooth wall surface.

[0015] The beneficial effects of the present utility model: A dam ceramic substrate packaging structure of the present utility model can fixedly install the metal housing on the top of the dam body through the cooperation of the card rod, the protrusion and the card slot by arranging a card rod at the bottom of the metal outer ring and a protrusion at the bottom end of the card rod. The operation is simple and the practicability is high; by arranging an annular card slot, it can prevent the adhesive layer, etc. from flowing onto the first circuit layer during high-temperature sintering, affecting the use of the ceramic substrate. The cooperation of the metal outer ring, the protrusion and the dam body can improve the stability of the packaging structure; the metal inner ring can reflect the light emitted by the LED chip. Description of the Drawings

[0016] Figure 1 is a structural diagram of a dam ceramic substrate packaging structure of the present utility model;

[0017] Figure 2 is a front sectional view of a dam ceramic substrate packaging structure of the present utility model;

[0018] Figure 3 is a dam ceramic substrate packaging structure of the present utility model Figure 2 magnified view of part A;

[0019] Figure 4 is a structural diagram of the metal housing of a dam ceramic substrate packaging structure of the present utility model;

[0020] In the figure: 1, ceramic substrate; 2, dam body; 3, metal housing; 4, lens; 5, LED chip; 6, first circuit layer; 7, second circuit layer; 8, metal inner ring; 9, metal outer ring; 10, card slot; 11, card rod; 12, adhesive layer. Detailed implementation mode

[0021] In order to make the technical means, creative features, achieved purposes and effects realized by the present utility model easy to understand, the present utility model will be further described below in conjunction with specific implementation modes.

[0022] Please refer to Figures 1 to 4 , the present utility model provides a technical solution: a dammed ceramic substrate packaging structure, including a ceramic substrate 1, a dam body 2 is fixedly arranged on the top of the ceramic substrate 1, a metal shell 3 is installed on the top of the dam body 2 through a clamping mechanism, a lens 4 is fixedly arranged inside the top end of the metal shell 3, the clamping mechanism includes a clamping groove 10, the clamping groove 10 is symmetrically opened inside the top end of the dam body 2, the shape of the clamping groove 10 is annular, the metal shell 3 includes a metal outer ring 9 and a metal inner ring 8, four sides of the bottom of the metal outer ring 9 are fixedly provided with clamping rods 11, a protrusion is arranged on one side of the bottom end of the clamping rod 11, the clamping rod 11 is clamped and installed inside the clamping groove 10 through the protrusion, a bonding layer 12 is arranged between the bottom of the metal outer ring 9 and the dam body 2, grooves are arranged on four sides of the outer wall of the dam body 2, protrusions are arranged at positions corresponding to the grooves on the inner wall of the bottom end of the metal outer ring 9, and the protrusions are clamped inside the grooves. By clamping the clamping rod 11 and the clamping groove 10 through the protrusion, it is convenient to quickly install the metal shell 3 and the lens 4, the operation is simple, and the practicability is high. By arranging the clamping groove 10, it can prevent the bonding layer 12 from melting due to high temperature and entering the inside of the dam body 2, avoiding affecting the use of the packaging structure.

[0023] In this embodiment, the shape of the metal inner ring 8 is frustum-shaped, the metal inner ring 8 fits with the inner wall of the dam body 2, and the inner wall of the metal inner ring 8 is a smooth wall surface. The metal inner ring 8 can reflect the light emitted by the LED chip 5, thereby improving its brightness, and at the same time can prevent the light from affecting the bonding layer 12.

[0024] In this embodiment, a first circuit layer 6 is arranged on the top of the ceramic substrate 1 corresponding to the inside of the dam body 2, an LED chip 5 is welded and fixed on the top of the first circuit layer 6, a second circuit layer 7 is arranged at the bottom of the ceramic substrate 1, the second circuit layer 7 is electrically connected to the first circuit layer 6, and the LED chip 5 is arranged inside the dam body 2 and the metal inner ring 8. The second circuit layer 7 and the first circuit layer 6 can supply power to the LED chip 5, so as to supply power to the LED chip 5, and the metal inner ring 8 reflects the light.

[0025] When using this dam ceramic substrate packaging structure, the metal housing 3 is installed on the top of the dam body 2. At the same time, the clamping rod 11 is inserted into the internal of the clamping groove 10. The clamping rod 11 has elasticity. The inner wall of the clamping groove 10 squeezes the protrusion, causing the clamping rod 11 to bend and enter the internal of the clamping groove 10. The mutual clamping of the protrusion and the clamping groove 10 can fix the metal housing 3. At the same time, the protrusions on the inner wall of the metal outer ring 9 are stuck in the internal of the groove, which can improve the stability of the metal housing 3. The operation is simple and the practicability is high. By setting the annular clamping groove 10, it can prevent the adhesive layer 12 etc. from flowing onto the first circuit layer 6 during high-temperature sintering, affecting the use of the ceramic substrate 1. When the LED chip 5 works, the light generated irradiates on the inner wall of the metal inner ring 8, and the light emitted by the LED chip 5 can be reflected through the internal of the metal inner ring 8, thereby improving its brightness.

[0026] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A dammed ceramic substrate packaging structure, comprising a ceramic substrate (1), characterized in that: A dam body (2) is fixedly arranged on the top of the ceramic substrate (1), a metal shell (3) is mounted on the top of the dam body (2) via a clamping mechanism, a lens (4) is fixedly arranged inside the top of the metal shell (3), the clamping mechanism comprises a clamping slot (10), the clamping slot (10) is symmetrically arranged inside the top of the dam body (2), the clamping slot (10) is annular in shape, the metal shell (3) comprises a metal outer ring (9) and a metal inner ring (8), and clamping rods (11) are fixedly arranged on four sides of the bottom of the metal outer ring (9).

2. The dam ceramic substrate packaging structure according to claim 1, characterized in that: The metal inner ring (8) is in the shape of a truncated cone, and the metal inner ring (8) fits closely to the inner wall of the dam body (2).

3. The dam ceramic substrate packaging structure according to claim 1, characterized in that: A protrusion is provided on one side of the bottom end of the clamping rod (11).

4. The dammed ceramic substrate packaging structure according to claim 3, characterized in that: The clamping rod (11) is mounted inside the clamping groove (10) by means of a protruding clamping connection, and an adhesive layer (12) is provided between the bottom of the metal outer ring (9) and the dam body (2).

5. The dammed ceramic substrate packaging structure according to claim 4, characterized in that: Grooves are arranged on four sides of the outer wall of the dam body (2), and protrusions are arranged on the inner wall of the bottom end of the metal outer ring (9) at positions corresponding to the grooves, and the protrusions are clamped in the interior of the grooves.

6. The dammed ceramic substrate packaging structure according to claim 1, characterized in that: A first circuit layer (6) is arranged on the top of the ceramic substrate (1) corresponding to the inner side of the dam body (2), and an LED chip (5) is welded and fixed on the top of the first circuit layer (6).

7. The dammed ceramic substrate packaging structure according to claim 6, characterized in that: A second circuit layer (7) is provided at the bottom of the ceramic substrate (1), and the second circuit layer (7) is electrically connected to the first circuit layer (6).

8. The dammed ceramic substrate packaging structure according to claim 7, characterized in that: The LED chip (5) is arranged on the inner side of the dam body (2) and the metal inner ring (8), and the inner wall of the metal inner ring (8) is a smooth wall surface.

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