Second overflow pipeline structure of copper deposition tank
By introducing air inlet joints and pneumatic diaphragm valves into the overflow pipeline, the problem of overflow connection is solved, ensuring the fluidity of the potency and achieving stable operation of the equipment.
Patent Information
- Application Number
- CN202422221810.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-09-11
AI Technical Summary
The liquid in the overflow connection pipe on the existing copper sinker trough is poor, which is prone to copper formation, causing the pipeline to be blocked and lose its overflow function.
Introduce the air inlet joint into the overflow pipeline, stir the potion by filling it with gas, and combine it with the pneumatic diaphragm valve and drainage pipe to ensure the fluidity of the potion and prevent copper formation.
Effectively avoid copper formation in the potion, ensure the normal operation of the equipment, and maintain the overflow function.
Smart Images
Figure CN223087940U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of copper deposition tanks, in particular to a second overflow pipeline structure of a copper deposition tank. Background Art
[0002] Copper deposition refers to attaching a layer of copper with a thickness of 0.3um - 0.5um to the inner wall of the holes of a circuit board, so that the inner wall of the holes of the circuit board has electrical conductivity, facilitating the subsequent electroplating on the board surface and graphic electroplating, and thus completing the electrical interconnection between the circuits of the PCB circuit board. During the copper deposition process of the circuit board, the circuit board needs to be placed inside the copper deposition tank for copper deposition operations. In the horizontal copper deposition step, various potions need to be added for reactions, but the volume of the potions in the copper deposition tank needs to be kept constant, which requires an automatic potion discharging device.
[0003] Therefore, one of the components of the copper deposition tank is the overflow structure. The function of the overflow structure is to adjust the liquid level of the electrolyte in the electrolytic tank. The height of the electrolyte liquid level directly affects the distribution of electrolytic power lines and the electrolyte circulation time, and these two parameters ultimately affect the physical appearance quality and chemical composition of the cathode copper.
[0004] An overflow structure is provided on the copper deposition tank. An overflow connecting pipe is connected to the side wall of the copper deposition tank. One end of the overflow connecting pipe is located inside the copper deposition tank, and the other end of the overflow connecting pipe extends to the outside of the copper deposition tank. The liquidity of the potions in the overflow connecting pipe of this structure is poor, so it is easy to form copper deposits, resulting in pipeline blockage and the overflow connecting pipe losing its overflow function. Summary of the Utility Model
[0005] Therefore, the technical problem to be solved by the utility model is to overcome the problem in the prior art that due to the poor liquidity of the potions in the overflow connecting pipe on the copper deposition tank, it is easy to deposit copper in the overflow connecting pipe, resulting in pipe blockage.
[0006] To solve the above technical problem, the utility model provides a second overflow pipeline structure of a copper deposition tank, including: a main tank of the copper deposition tank, with a secondary tank provided on one side thereof, and the main tank of the copper deposition tank is communicated with the secondary tank; an overflow pipeline, which is arranged on the secondary tank, one end of the overflow pipeline is arranged inside the secondary tank, and the other end of the overflow pipeline extends out of the secondary tank. An air inlet joint is provided at the end of the overflow pipeline extending out of the secondary tank. The air inlet joint is connected to an air inlet end to inflate the overflow pipeline, and the gas filled into the overflow pipeline by the air inlet joint can stir the potions in the overflow pipeline.
[0007] In an embodiment of the utility model, a tee joint is provided at one end of the overflow pipeline extending out of the secondary tank, and the air inlet joint is connected to one end of the tee joint.
[0008] In one embodiment of the present utility model, the overflow pipeline includes a first straight pipe, a second straight pipe, a third straight pipe, and a fourth straight pipe. The first straight pipe, the second straight pipe, the third straight pipe, and the fourth straight pipe are connected in sequence. The first straight pipe is located in the auxiliary tank, the second straight pipe is arranged on the side wall of the auxiliary tank, and the tee joint is arranged between the third straight pipe and the fourth straight pipe.
[0009] In one embodiment of the present utility model, a first right-angle elbow is provided between the first straight pipe and the second straight pipe.
[0010] In one embodiment of the present utility model, a second right-angle elbow is provided between the second straight pipe and the third straight pipe.
[0011] In one embodiment of the present utility model, a third right-angle elbow is provided between the third straight pipe and the tee joint.
[0012] In one embodiment of the present utility model, a ball valve is connected to the third end of the tee joint that connects the air inlet joint and the third right-angle elbow, and the other end of the ball valve is connected to the fourth straight pipe.
[0013] In one embodiment of the present utility model, a pneumatic diaphragm valve is connected to the other end of the fourth straight pipe away from the ball valve.
[0014] In one embodiment of the present utility model, a drain pipe is connected to the pneumatic diaphragm valve, and the drain pipe is connected to the main drain pipeline for discharging the liquid medicine.
[0015] In one embodiment of the present utility model, a reducer adapter is connected between the third straight pipe and the third right-angle elbow.
[0016] The above technical solution of the present utility model has the following beneficial effects compared with the prior art:
[0017] For the second overflow pipeline structure of the copper deposition tank of the present utility model, by adding an air inlet pipeline, the liquid medicine in the pipeline can be continuously stirred, copper deposition in the liquid medicine can be avoided, and the normal operation of the equipment can be ensured. Description of the Drawings
[0018] In order to make the content of the present utility model easier to be clearly understood, the following further details the present utility model according to the specific embodiments of the present utility model in combination with the drawings, where
[0019] Figure 1 is the front view of the second overflow pipeline structure of the copper deposition tank in the preferred embodiment of the present utility model;
[0020] Figure 2 is the side view of the second overflow pipeline structure of the copper deposition tank in the preferred embodiment of the present utility model;
[0021] Figure 3In the preferred embodiment of the present utility model Figure 1 is a partial enlarged view;
[0022] Figure 4 is a schematic structural view of the overflow pipeline in the preferred embodiment of the present utility model.
[0023] Explanation of reference numerals in the drawings of the specification: main tank 1 of the copper deposition tank, secondary tank 2, overflow pipeline 3, tee 31, first straight pipe 32, second straight pipe 33, third straight pipe 34, fourth straight pipe 35, first right-angle elbow 36, second right-angle elbow 37, third right-angle elbow 38, ball valve 39, pneumatic diaphragm valve 310, drain pipe 311, reducer adapter 312, air inlet joint 4. Specific embodiments
[0024] The present utility model will be further described below in conjunction with the drawings and specific embodiments, so that those skilled in the art can better understand the present utility model and be able to implement it, but the embodiments given are not intended to limit the present utility model.
[0025] Referring to Figures 1-4 as shown, the structure of the second overflow pipeline of the copper deposition tank of the present utility model includes: a main tank 1 of the copper deposition tank, with a secondary tank 2 provided on one side thereof, and the main tank 1 of the copper deposition tank is communicated with the secondary tank 2; an overflow pipeline 3, which is arranged on the secondary tank 2, one end of the overflow pipeline 3 is arranged inside the secondary tank 2, and the other end of the overflow pipeline 3 extends out of the secondary tank 2. An air inlet joint 4 is provided at the end of the overflow pipeline 3 extending out of the secondary tank 2, and the air inlet joint 4 is connected to the air inlet end to inflate the overflow pipeline 3, and the gas filled into the overflow pipeline 3 by the air inlet joint 4 can stir the liquid medicine in the overflow pipeline 3.
[0026] In the above structure, a tee 31 is provided at one end of the overflow pipeline 3 extending out of the secondary tank 2, and the air inlet joint 4 is connected to one end of the tee 31.
[0027] In the above structure, the overflow pipeline 3 includes a first straight pipe 32, a second straight pipe 33, a third straight pipe 34 and a fourth straight pipe 35. The first straight pipe 32, the second straight pipe 33, the third straight pipe 34 and the fourth straight pipe 35 are connected in sequence. The first straight pipe 32 is located inside the secondary tank 2, the second straight pipe 33 is arranged on the side wall of the secondary tank 2, and the tee 31 is arranged between the third straight pipe 34 and the fourth straight pipe 35. A first right-angle elbow 36 is provided between the first straight pipe 32 and the second straight pipe 33. A second right-angle elbow 37 is provided between the second straight pipe 33 and the third straight pipe 34. A third right-angle elbow 38 is provided between the third straight pipe 34 and the tee 31.
[0028] In the above structure, in addition to connecting the intake joint 4 and the third end of the third right-angle elbow 38, a ball valve 39 is connected to the tee 31. The other end of the ball valve 39 is connected to the fourth straight pipe 35. The other end of the fourth straight pipe 35 away from the ball valve 39 is connected to a pneumatic diaphragm valve 310. A drain pipe 311 is connected to the pneumatic diaphragm valve 310, and the drain pipe 311 is connected to the main drain pipeline for discharging the liquid medicine.
[0029] In the above structure, a reducer adapter 312 is connected between the third straight pipe 34 and the third right-angle elbow 38.
[0030] During the production of the equipment, liquid medicine is continuously added, resulting in a continuous increase in the liquid medicine in the tank and a gradual rise in the liquid level. When the liquid level rises to the set height, the pneumatic diaphragm valve 310 opens to discharge the liquid medicine in the tank to the height of the overflow pipeline 3, and then the addition of the liquid medicine starts. In this way, the fresh liquid medicine can be fully utilized.
[0031] Obviously, the above embodiments are only examples given for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or variations can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. And the obvious changes or variations derived therefrom are still within the protection scope of the present invention.
Claims
1. A second overflow pipeline structure of a copper deposition tank, characterized in that: including, a main tank of a copper deposition tank, with a secondary tank provided on one side thereof, and the main tank of the copper deposition tank communicating with the secondary tank; an overflow pipeline, which is provided on the secondary tank, one end of the overflow pipeline is arranged inside the secondary tank, and the other end of the overflow pipeline extends out of the secondary tank. An air inlet joint is provided at the end of the overflow pipeline extending out of the secondary tank. The air inlet joint is connected to an air inlet end to inflate the overflow pipeline, and the gas filled into the overflow pipeline by the air inlet joint can agitate the chemical solution in the overflow pipeline.
2. The second overflow pipeline structure of the copper deposition tank according to claim 1, characterized in that: A tee joint is provided at one end of the overflow pipeline extending out of the secondary tank, and the air inlet joint is connected to one end of the tee joint.
3. The second overflow pipeline structure of the electroless copper plating tank according to claim 2, wherein: The overflow pipeline includes a first straight pipe, a second straight pipe, a third straight pipe and a fourth straight pipe. The first straight pipe, the second straight pipe, the third straight pipe and the fourth straight pipe are connected in sequence. The first straight pipe is located inside the secondary tank, the second straight pipe is arranged on the side wall of the secondary tank, and the tee joint is arranged between the third straight pipe and the fourth straight pipe.
4. The second overflow pipeline structure of the electroless copper plating tank according to claim 3, wherein: A first right-angle elbow is provided between the first straight pipe and the second straight pipe.
5. The second overflow pipeline structure of the copper deposition tank according to claim 3, characterized in that: A second right-angle elbow is provided between the second straight pipe and the third straight pipe.
6. The second overflow pipeline structure of the copper deposition tank according to claim 3, characterized in that: A third right-angle elbow is provided between the third straight pipe and the tee joint.
7. The second overflow pipeline structure of the electroless copper plating tank according to claim 6, wherein: A ball valve is connected to the third end of the tee joint except for connecting the air inlet joint and the third right-angle elbow. The other end of the ball valve is connected to the fourth straight pipe.
8. The second overflow pipeline structure of the electroless copper plating tank according to claim 7, characterized in that: The other end of the fourth straight pipe away from the ball valve is connected to a pneumatic diaphragm valve.
9. The second overflow pipeline structure of the electroless copper plating tank according to claim 8, wherein: A drain pipe is connected to the pneumatic diaphragm valve, and the drain pipe is connected to a main drainage pipeline for discharging the chemical solution.
10. The second overflow pipeline structure of the electroless copper plating tank according to claim 7, characterized in that: A reducer adapter is connected between the third straight pipe and the third right-angle elbow.