Vacuum measurement assembly and semiconductor processing equipment

Abstract

The utility model provides a vacuum measurement assembly and semiconductor processing equipment. The vacuum measurement assembly at least comprises a vacuum gauge; a first vacuum pump; a first pipeline of the three-way pipe is used for being connected with the vacuum chamber, a second pipeline of the three-way pipe is connected with the first vacuum pump, and a third pipeline of the three-way pipe is detachably connected with the vacuum gauge; a first valve is arranged on the first pipeline, the first valve can be in a closed state in the disassembly and assembly process of the vacuum gauge and the third pipeline, and the first vacuum pump can vacuumize the interior of the three-way pipe after the vacuum gauge and the third pipeline are assembled and when the first valve is in the closed state; the first valve can be in an open state after the first vacuum pump vacuumizes the interior of the three-way pipe, and the vacuum gauge can measure the vacuum degree or air pressure in the vacuum chamber after the first valve is in the open state. According to the scheme, when the vacuum gauge is replaced, the product quality is not influenced, the time and the economic cost for replacing the process suite are saved, and the productivity is improved.

Description

Technical Field

[0001] The present disclosure belongs to the field of semiconductor technology, and particularly relates to a vacuum measurement component and a semiconductor processing device. Background Art

[0002] A vacuum gauge (English: Vacuum Gauge) is particularly important for physical vapor deposition technology in semiconductor processes. It is an instrument for measuring the internal vacuum degree or air pressure of a chamber during the production process of equipment. Currently, the installation method of the vacuum gauge is to directly connect it to the chamber wall. When the vacuum gauge is damaged and needs to be replaced, the chamber must be broken vacuum and the PK (Process Kits) in the chamber needs to be replaced, which will increase the economic cost. In addition, when the chamber is broken vacuum, external air will enter the chamber, affecting the cleanliness of the chamber, and then affecting the product processing quality, increasing the chamber maintenance time and reducing the production efficiency. Summary of the Utility Model

[0003] Embodiments of the present disclosure provide a vacuum measurement component and a semiconductor processing device. When replacing the vacuum gauge, it is not necessary to break the vacuum of the vacuum chamber. Therefore, it can effectively isolate the inside of the vacuum chamber from the outside gas, avoid external gas entering the vacuum chamber and affecting the product processing quality and increasing the chamber maintenance requirements, and does not affect the process kit of the vacuum chamber, saving the time cost and economic cost of replacing the process kit and maintaining the chamber, and effectively improving the production capacity.

[0004] The first aspect of the present disclosure provides a vacuum measurement component, which includes:

[0005] A vacuum gauge;

[0006] A first vacuum pump; and

[0007] A three-way pipe, the first pipeline of the three-way pipe is used to connect with a vacuum chamber, the second pipeline of the three-way pipe is connected with the first vacuum pump, and the third pipeline of the three-way pipe is detachably connected with the vacuum gauge;

[0008] Wherein, a first valve is provided on the first pipeline, the first valve can be in a closed state during the disassembly and assembly process of the vacuum gauge and the third pipeline, the first vacuum pump can evacuate the inside of the three-way pipe after the vacuum gauge and the third pipeline are assembled and the first valve is in a closed state, the first valve can be in an open state after the first vacuum pump evacuates the inside of the three-way pipe, and the vacuum gauge can measure the vacuum degree or air pressure in the vacuum chamber after the first valve is in an open state.

[0009] In an exemplary embodiment of the present disclosure, the vacuum measurement assembly further includes a second valve, and the second valve is provided on the second pipeline.

[0010] Wherein, the second valve can be in an open state when the first vacuum pump evacuates the inside of the three-way pipe, and the second valve can be in a closed state when the vacuum gauge measures the vacuum degree or air pressure in the vacuum chamber.

[0011] In an exemplary embodiment of the present disclosure, the vacuum measurement assembly further includes: a leak detection instrument for detecting the sealing state of the connection between the vacuum gauge and the third pipeline after the first vacuum pump evacuates the inside of the three-way pipe.

[0012] Wherein, the first valve can be in a closed state when the leak detection instrument detects that the sealing state of the connection between the vacuum gauge and the third pipeline does not meet the requirements, and the first valve can be in an open state when the leak detection instrument detects that the sealing state of the connection between the vacuum gauge and the third pipeline meets the requirements.

[0013] The second aspect of the present disclosure provides a semiconductor processing apparatus, which includes:

[0014] A vacuum chamber for processing semiconductor materials.

[0015] A three-way pipe, and a first pipeline of the three-way pipe is connected to the vacuum chamber.

[0016] A first vacuum pump, and the first vacuum pump is connected to a second pipeline of the three-way pipe.

[0017] A vacuum gauge, and the vacuum gauge is detachably connected to a third pipeline of the three-way pipe.

[0018] Wherein, a first valve is provided on the first pipeline, the first valve can be in a closed state during the disassembly and assembly process of the vacuum gauge and the third pipeline, the first vacuum pump can evacuate the inside of the three-way pipe after the vacuum gauge and the third pipeline are assembled and the first valve is in a closed state, the first valve can be in an open state after the first vacuum pump evacuates the inside of the three-way pipe, and the vacuum gauge can measure the vacuum degree or air pressure in the vacuum chamber after the first valve is in an open state.

[0019] In an exemplary embodiment of the present disclosure, the semiconductor processing apparatus further includes a second valve, and the second valve is provided on the second pipeline.

[0020] Wherein, the second valve can be in an open state when the first vacuum pump performs a vacuum pumping process on the inside of the three-way pipe, and the second valve can be in a closed state when the vacuum gauge measures the vacuum degree or air pressure inside the vacuum chamber.

[0021] In an exemplary embodiment of the present disclosure, the first vacuum pump is connected to the vacuum chamber through a first suction pipeline and is connected to the second pipeline through a second suction pipeline, wherein,

[0022] The first suction pipeline is provided with a third valve. The first vacuum pump can perform a vacuum pumping process on the vacuum chamber when the third valve is in an open state, and the third valve can be in a closed state when the first vacuum pump pumps the inside of the vacuum chamber to a first vacuum degree.

[0023] In an exemplary embodiment of the present disclosure, the semiconductor processing equipment further includes a second vacuum pump. The second vacuum pump is connected to the vacuum chamber through a third suction pipeline, and the third suction pipeline is provided with a fourth valve;

[0024] Wherein, the fourth valve can be in an open state when the inside of the vacuum chamber reaches the first vacuum degree. The second vacuum pump can pump the inside of the vacuum chamber to a second vacuum degree when the fourth valve is in an open state, and the second vacuum degree is higher than the first vacuum degree.

[0025] In an exemplary embodiment of the present disclosure, the third valve can be in a closed state when the first vacuum pump performs a vacuum pumping process on the inside of the three-way pipe.

[0026] In an exemplary embodiment of the present disclosure, the second suction pipeline is a corrugated pipe.

[0027] In an exemplary embodiment of the present disclosure, the semiconductor processing equipment further includes: a leak detection instrument for detecting the sealing state of the connection between the vacuum gauge and the third pipeline after the first vacuum pump performs a vacuum pumping process on the inside of the three-way pipe;

[0028] Wherein, the first valve can be in a closed state when the leak detection instrument detects that the sealing state of the connection between the vacuum gauge and the third pipeline does not meet the requirements, and the first valve can be in an open state when the leak detection instrument detects that the sealing state of the connection between the vacuum gauge and the third pipeline meets the requirements.

[0029] The technical solution provided by the embodiments of the present disclosure has at least the following advantages:

[0030] After assembling the vacuum measurement component with the vacuum chamber, when it is necessary to disassemble and assemble the vacuum gauge of the vacuum measurement component, the three-way pipe, the first vacuum pump and the first valve can cooperate with each other, and there is no need to break the vacuum of the vacuum chamber. Therefore, it is possible to effectively isolate the inside of the vacuum chamber from the outside gas, avoid the entry of outside gas into the vacuum chamber and affect the processing quality of the product, increase the chamber maintenance requirements, and do not affect the process kit of the vacuum chamber. It can save the time cost and economic cost of replacing the process kit and chamber maintenance, and effectively improve the production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The drawings herein are incorporated into and constitute a part of this specification, showing embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.

[0032] Figure 1 FIG. shows a schematic connection diagram of the vacuum measurement component and the vacuum chamber in Embodiment 1 of the present disclosure.

[0033] Figure 2 FIG. shows a schematic structural diagram of a semiconductor processing device according to an implementation in Embodiment 2 of the present disclosure.

[0034] Figure 3 FIG. shows a schematic structural diagram of a semiconductor processing device according to another implementation in Embodiment 2 of the present disclosure.

[0035] DESCRIPTION OF REFERENCE NUMERALS:

[0036] 10. Vacuum gauge;

[0037] 11. First vacuum pump;

[0038] 12. Three-way pipe; 120. First pipeline; 121. Second pipeline; 122. Third pipeline;

[0039] 13. First valve;

[0040] 14. Vacuum chamber;

[0041] 15. Second valve;

[0042] 16. First exhaust pipeline;

[0043] 17. Second exhaust pipeline;

[0044] 18. Third valve;

[0045] 19. Second vacuum pump;

[0046] 20. The third exhaust pipe

[0047] 21. The fourth valve Detailed implementation manners

[0048] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in various forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more complete and comprehensive, and will fully convey the concept of the exemplary embodiments to those skilled in the art.

[0049] In addition, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of the embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. may be used. In other cases, well-known methods, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of this application.

[0050] The present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted here that the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present application and should not be construed as limiting the present application.

[0051] Embodiment 1

[0052] Embodiment 1 of the present disclosure provides a vacuum measurement assembly. As Figure 1 shown, the vacuum measurement assembly may include a vacuum gauge 10, a first vacuum pump 11, a three-way pipe 12, and a first valve 13.

[0053] In this embodiment, the three-way pipe 12 includes a first pipe 120, a second pipe 121, and a third pipe 122. One ends of the first pipe 120, the second pipe 121, and the third pipe 122 are connected to each other so that the first pipe 120, the second pipe 121, and the third pipe 122 communicate with each other.

[0054] For example, the three-way pipe 12 in this embodiment may be an integral structure to ensure the structural strength of the three-way pipe 12, but it is not limited thereto. The first pipe 120, the second pipe 121, and the third pipe 122 may also be manufactured separately and then spliced together to form the three-way pipe 12, depending on the specific situation.

[0055] In this embodiment, the other ends of the first pipeline 120, the second pipeline 121, and the third pipeline 122 can be respectively connected to corresponding structures to achieve the interconnection between the structures. Specifically, referring to Figure 1 As shown, the first pipeline 120 can be connected to the vacuum chamber 14, the second pipeline 121 can be connected to the first vacuum pump 11, and the third pipeline 122 can be connected to the vacuum gauge 10. That is to say, through the design of the three-way pipe 12, the vacuum gauge 10, the first vacuum pump 11, and the vacuum chamber 14 can be assembled together.

[0056] Among them, referring to Figure 1 As shown, a first valve 13 can be provided on the first pipeline 120 of this embodiment. After the vacuum gauge 10, the first vacuum pump 11, and the vacuum chamber 14 are assembled together by using the three-way pipe 12, if the vacuum gauge 10 is damaged and needs to be replaced, the first valve 13 can be closed first. That is to say, the first valve 13 can be in a closed state during the disassembly and assembly process between the vacuum gauge 10 and the third pipeline 122. In this way, it can be avoided that external air enters the vacuum chamber 14 through the third pipeline 122 and the first pipeline 120 in sequence, thereby affecting the working environment in the vacuum chamber 14 and then affecting the product processing quality.

[0057] It can be understood that in this embodiment, the disassembly and assembly process between the vacuum gauge 10 and the third pipeline 122 refers to the entire process from discovering that the vacuum gauge 10 needs to be replaced to completing the replacement of the vacuum gauge 10 and the state of the entire vacuum measurement assembly meeting the requirements after replacement.

[0058] In addition, after the vacuum gauge 10 and the third pipeline 122 are assembled, that is, after the vacuum gauge 10 is replaced and the first valve 13 is in a closed state, the first vacuum pump 11 can evacuate the inside of the three-way pipe 12. In this way, while not affecting the working environment in the vacuum chamber 14, by evacuating the inside of the three-way pipe 12, it can be ensured that the environment inside the three-way pipe 12 is in a certain vacuum state before the first valve 13 is opened, thereby further reducing the impact on the inside of the vacuum chamber 14 after the first valve 13 is opened and improving the product processing quality in the vacuum chamber 14.

[0059] It can be understood that in this embodiment, the assembly of the vacuum gauge 10 and the third pipeline 122 needs to be a sealed assembly. In other words, the connection between the vacuum gauge 10 and the third pipeline 122 needs to be a sealed connection. For example, structures such as sealing rings can be provided at the connection between the vacuum gauge 10 and the third pipeline 122 to achieve the sealed connection between the two.

[0060] Among them, the first valve 13 is in a closed state before it is found that the vacuum gauge 10 needs to be replaced until the replacement of the vacuum gauge 10 is completed and the three-way pipe 12 has not been evacuated after the replacement. And the first valve 13 can be in an open state after the first vacuum pump 11 evacuates the inside of the three-way pipe 12. The vacuum gauge 10 can measure the vacuum degree or air pressure in the vacuum chamber 14 after the first valve 13 is in an open state. Exemplarily, the first valve 13 can be a manual valve to reduce costs, but is not limited thereto, and can also be an electrically controlled valve, depending on the specific situation.

[0061] In some embodiments of the present disclosure, referring to Figure 1 As shown, a second valve 15 can be provided on the second pipeline 121. This second valve 15 can be in an open state when the first vacuum pump 11 evacuates the inside of the three-way pipe 12, and the second valve 15 can be in a closed state when the vacuum gauge 10 measures the vacuum degree or air pressure in the vacuum chamber 14.

[0062] In this embodiment, by designing the second valve 15 to adjust the on-off state of the first vacuum pump 11 and the inside of the three-way pipe 12, during the entire disassembly and assembly process of the vacuum gauge 10, the first vacuum pump 11 can work without stopping. On the one hand, it can avoid the influence of frequent switching of the first vacuum pump 11 on its service life. On the other hand, it can also enable the first vacuum pump 11 to be applied to other process flows during the disassembly and assembly process of the vacuum gauge 10, so as to reduce the overall equipment cost.

[0063] Exemplarily, before the damaged vacuum gauge 10 is removed from the third pipeline 122, the first valve 13 and the second valve 15 can be closed first. Since the first valve 13 and the second valve 15 are in a closed state, even if the first vacuum pump 11 works without stopping, it will not affect the internal state of the three-way pipe 12, and at the same time, it will not affect the state in the vacuum chamber 14. Then, the damaged vacuum gauge 10 is removed from the third pipeline 122, and the normal vacuum gauge 10 is installed on the third pipeline 122. After that, the second valve 15 is opened. Since the first vacuum pump 11 works without stopping, after the second valve 15 is opened, the first vacuum pump 11 immediately starts to evacuate the inside of the three-way pipe 12. After the first vacuum pump 11 completes the evacuation of the inside of the three-way pipe 12, the second valve 15 is closed. After that, the first valve 13 is opened, so that the replaced normal vacuum gauge 10 can measure the vacuum degree or air pressure in the vacuum chamber 14. Since the second valve 15 is in a closed state, even if the first vacuum pump 11 works without stopping, it will not affect the internal state of the three-way pipe 12, and at the same time, it will not affect the state in the vacuum chamber 14.

[0064] Exemplarily, the second valve 15 may be a manual valve to reduce costs, but is not limited thereto, and may also be an electrically controlled valve, depending on the specific situation.

[0065] In some embodiments of the present disclosure, the vacuum measurement assembly may further include a leak detection instrument (not shown in the figure). The leak detection instrument can be used to detect the sealing state at the connection between the vacuum gauge 10 and the third pipeline 122. Among them, the first valve 13 can be in a closed state when the leak detection instrument detects that the sealing state at the connection between the vacuum gauge 10 and the third pipeline 122 does not meet the requirements, and the first valve 13 can be in an open state when the leak detection instrument detects that the sealing state at the connection between the vacuum gauge 10 and the third pipeline 122 meets the requirements. That is to say, after the vacuum gauge 10 and the third pipeline 122 are assembled, a sealed connection has been formed, but there is still a risk that the seal does not meet the standard. Therefore, it is still necessary to use the leak detection instrument to further detect the sealing state at the connection between the vacuum gauge 10 and the third pipeline 122. If the detection result of the leak detection instrument meets the requirements, after confirming that the inside of the tee 12 has been evacuated, it can be confirmed that the assembly is completed, and then the first valve 13 can be opened so that the vacuum gauge 10 can detect the vacuum degree or air pressure in the vacuum chamber 14. If the detection result of the leak detection instrument does not meet the requirements, it means that there is a problem of poor assembly and air leakage at the connection between the vacuum gauge 10 and the third pipeline 122. After that, the first valve 13 needs to be kept closed, and then the vacuum gauge 10 can be rechecked, repaired or replaced, and the cleanliness and vacuum degree in the vacuum chamber 14 can be protected.

[0066] It can be understood that in this embodiment, after the vacuum gauge 10 and the third pipeline 122 are assembled, the following conditions need to be met: after the vacuum gauge 10 and the third pipeline 122 are assembled, the first vacuum pump 11 evacuates the inside of the tee 12, and the leak detection instrument detects the sealing state at the connection between the vacuum gauge 10 and the third pipeline 122 and the detection result meets the requirements, etc. Only then can the first valve 13 be opened so that the replaced vacuum gauge 10 can normally measure the vacuum degree or air pressure in the vacuum chamber 14.

[0067] It should be understood that the order of evacuating and detecting that the sealing state meets the requirements can be interchanged.

[0068] In this embodiment, using the leak detection instrument to detect the sealing state at the connection between the vacuum gauge 10 and the third pipeline 122 can ensure the subsequent measurement accuracy of the vacuum gauge 10, avoid the influence of air leakage on the working environment in the vacuum chamber 14, and improve the quality of the products in the vacuum chamber 14.

[0069] For example, after the leak detector can evacuate the inside of the three-way pipe 12 with the first vacuum pump 11 and then close the second valve 15, it can detect the sealing state at the connection between the vacuum gauge 10 and the third pipeline 122. In this way, not only can the sealing state at the connection between the vacuum gauge 10 and the third pipeline 122 be detected, but also whether there is air leakage after the second valve 15 is closed can be detected, and the detection result is more accurate.

[0070] In this embodiment, after the vacuum measurement assembly is assembled with the vacuum chamber 14, if it is necessary to disassemble and assemble the vacuum gauge 10 of the vacuum measurement assembly, the three-way pipe 12, the first vacuum pump 11 and the first valve 13 can cooperate with each other, and there is no need to break the vacuum of the vacuum chamber 14. Therefore, the inside of the vacuum chamber 14 can be effectively isolated from the outside gas, preventing the outside gas from entering the vacuum chamber 14 and affecting the processing quality of the product, and not affecting the process kit and chamber maintenance requirements of the vacuum chamber 14. The time cost and economic cost of replacing the process kit and maintaining the chamber can be saved, and the production capacity can be effectively improved.

[0071] Embodiment Two

[0072] Embodiment Two of the present disclosure provides a semiconductor processing device. Refer to Figure 2 As shown, it may include a vacuum chamber 14, which can be used to process semiconductor materials (not shown in the figure). The semiconductor material is, for example, a semiconductor substrate, etc., and the present application does not make specific limitations. For example, processes such as degassing and physical vapor deposition can be performed on the semiconductor to be processed in the vacuum chamber 14.

[0073] Among them, in order to ensure the processing quality of the product in the vacuum chamber 14, it is necessary to measure the vacuum degree or air pressure inside the vacuum chamber 14. Therefore, refer to Figure 2 As shown, in addition to including the vacuum chamber 14, the semiconductor processing device of the present disclosure may further include a vacuum gauge 10, a three-way pipe 12, a first valve 13, and a first vacuum pump 11.

[0074] In this embodiment, the connection relationship and cooperation relationship among the vacuum gauge 10, the three-way pipe 12, the first valve 13, the first vacuum pump 11, and the vacuum chamber 14 may refer to the content described in the foregoing Embodiment One, and will not be repeated here.

[0075] In some embodiments of the present disclosure, a second valve 15 may be provided on the second pipeline 121, and the working state of this second valve 15 may refer to the description in the foregoing Embodiment One and will not be repeated here.

[0076] In some embodiments of the present disclosure, the semiconductor processing equipment further includes a leak detection instrument (not shown in the figure) for detecting the sealing state at the connection between the vacuum gauge 10 and the third pipeline 122. The cooperation relationship between this leak detection instrument and the first valve 13, the vacuum gauge 10, the third pipeline 122, the second valve 15, etc. can refer to the description in the foregoing Embodiment 1 and will not be repeated here.

[0077] In some embodiments of the present disclosure, in addition to evacuating the interior of the tee 12, the first vacuum pump 11 can also evacuate the vacuum chamber 14. By sharing the first vacuum pump 11 for evacuating the vacuum chamber 14 and the tee 12, the use of pumps in the semiconductor processing equipment can be reduced, thereby reducing costs and saving space. Specifically, refer to Figure 2 As shown, the first vacuum pump 11 is connected to the vacuum chamber 14 through the first suction pipeline 16 and is connected to the second pipeline 121 through the second suction pipeline 17. Among them, the third valve 18 is provided on the first suction pipeline 16. The first vacuum pump 11 can evacuate the vacuum chamber 14 when the third valve 18 is in the open state, and the third valve 18 can be in the closed state when the first vacuum pump 11 evacuates the vacuum chamber 14 to the first vacuum level.

[0078] Exemplarily, the third valve 18 can be in the closed state when the first vacuum pump 11 evacuates the interior of the tee 12 to avoid the influence of the first vacuum pump 11 on the working environment in the vacuum chamber 14 during the disassembly and assembly of the vacuum gauge 10.

[0079] Exemplarily, the third valve 18 can be a manual valve to reduce costs, but it is not limited thereto and can also be an electrically controlled valve, depending on the specific situation.

[0080] Among them, during the process of opening the third valve 18 and using the first vacuum pump 11 to evacuate the vacuum chamber 14, the second valve 15 can be in the closed state, but it is not limited thereto. If the interior of the tee 12 also needs to be evacuated at the same time, the second valve 15 can also be in the open state, which can save the time used in the evacuation process of the semiconductor processing equipment and improve production capacity.

[0081] In the embodiments of the present disclosure, the second suction pipeline 17 can be a corrugated pipe, which has good flexibility and sealing performance. In this way, while ensuring the sealing performance, the corrugated pipe can be bent according to the actual working environment to save space.

[0082] In some embodiments of the present disclosure, refer to Figure 3As shown, the semiconductor processing equipment may further include a second vacuum pump 19. The second vacuum pump 19 is connected to the vacuum chamber 14 through a third evacuation pipeline 20, and a fourth valve 21 is provided on the third evacuation pipeline 20. Among them, the fourth valve 21 can be in an open state when the first vacuum degree is reached in the vacuum chamber 14. The second vacuum pump 19 can evacuate the inside of the vacuum chamber 14 to a second vacuum degree when the fourth valve 21 is in an open state. The second vacuum degree is higher than the first vacuum degree. That is to say, the evacuation ability of the second vacuum pump 19 is higher than that of the first vacuum pump 11.

[0083] For example, the first vacuum pump 11 in the semiconductor processing equipment can be a roughing pump, and the second vacuum pump 19 can be a high vacuum pump. A roughing pump is a vacuum pump that starts pumping from atmospheric pressure and reduces the system pressure inside the vacuum chamber 14 to a level at which another vacuum pump (such as a high vacuum pump) can start working. Its main function is to quickly evacuate the gas inside the chamber in the initial stage to reduce the pressure inside the chamber. A high vacuum pump refers to a vacuum pump that operates in the high vacuum range (usually below 10 -3 Pa). A high vacuum pump can provide a stable evacuation ability in a lower pressure range to meet the process requirements with higher vacuum degree requirements.

[0084] Among them, the evacuation rate of the roughing pump is usually large, which can quickly reduce the system pressure; while the high vacuum pump can still maintain a certain evacuation rate in a lower pressure range. And the high vacuum pump can obtain a higher vacuum degree to meet the process requirements with higher vacuum degree requirements; while the roughing pump can also reduce the system pressure, but the obtained vacuum degree is relatively low.

[0085] In this embodiment, by setting two levels of vacuum pumps to evacuate the vacuum chamber 14 of the semiconductor processing equipment in sequence, that is: first, use the first vacuum pump 11 with low evacuation ability to evacuate the vacuum chamber 14 to perform a certain purification and negative pressure treatment on the vacuum chamber 14, and then use the second vacuum pump 19 with high evacuation ability to evacuate the vacuum chamber 14, so that the vacuum environment inside the vacuum chamber 14 meets the working requirements. This can reduce the situation of damage to the second vacuum pump 19, thereby reducing the subsequent maintenance and replacement costs.

[0086] Exemplarily, the fourth valve 21 can be a manual valve to reduce costs, but it is not limited to this, and it can also be an electrically controlled valve, depending on the specific situation.

[0087] In the description of this specification, the terms "first", "second", "third", "fourth", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", "third", "fourth" may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality of" means two or more, unless otherwise specifically defined.

[0088] In the description of this specification, the description referring to terms such as "some embodiments", "exemplarily", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0089] Although the embodiments of this application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be construed as limiting this application. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and the specification of this application shall fall within the scope covered by the patent of this application.

Claims

1. A vacuum measurement component, characterized in that, Comprising: Vacuum gauge; First vacuum pump; And A three-way pipe, the first pipeline of the three-way pipe is used to connect with a vacuum chamber, the second pipeline of the three-way pipe is connected to the first vacuum pump, and the third pipeline of the three-way pipe is detachably connected to the vacuum gauge; Wherein, a first valve is provided on the first pipeline, the first valve can be in a closed state during the disassembly and assembly process of the vacuum gauge and the third pipeline, the first vacuum pump can evacuate the interior of the three-way pipe after the vacuum gauge and the third pipeline are assembled and the first valve is in a closed state, the first valve can be in an open state after the first vacuum pump evacuates the interior of the three-way pipe, and the vacuum gauge can measure the vacuum degree or air pressure in the vacuum chamber after the first valve is in an open state.

2. The vacuum measurement assembly according to claim 1, wherein The vacuum measurement assembly further includes a second valve, and the second valve is provided on the second pipeline. Wherein, the second valve can be in an open state when the first vacuum pump evacuates the interior of the three-way pipe, and the second valve can be in a closed state when the vacuum gauge measures the vacuum degree or air pressure in the vacuum chamber.

3. The vacuum measurement assembly according to claim 1, wherein, The vacuum measurement assembly further includes: a leak detection instrument, which is used to detect the sealing state of the connection between the vacuum gauge and the third pipeline after the first vacuum pump evacuates the interior of the three-way pipe; Wherein, the first valve can be in a closed state when the leak detection instrument detects that the sealing state of the connection between the vacuum gauge and the third pipeline does not meet the requirements, and the first valve can be in an open state when the leak detection instrument detects that the sealing state of the connection between the vacuum gauge and the third pipeline meets the requirements.

4. A semiconductor processing apparatus, characterized in that, Comprising: A vacuum chamber for processing semiconductor materials; A three-way pipe, the first pipeline of the three-way pipe is connected to the vacuum chamber; A first vacuum pump, the first vacuum pump is connected to the second pipeline of the three-way pipe; A vacuum gauge, the vacuum gauge is detachably connected to the third pipeline of the three-way pipe; Wherein, a first valve is provided on the first pipeline, the first valve can be in a closed state during the disassembly and assembly process of the vacuum gauge and the third pipeline, the first vacuum pump can evacuate the interior of the three-way pipe after the vacuum gauge and the third pipeline are assembled and the first valve is in a closed state, the first valve can be in an open state after the first vacuum pump evacuates the interior of the three-way pipe, and the vacuum gauge can measure the vacuum degree or air pressure in the vacuum chamber after the first valve is in an open state.

5. The semiconductor processing equipment according to claim 4, wherein The semiconductor processing equipment further includes a second valve, and the second valve is provided on the second pipeline. Wherein, the second valve can be in an open state when the first vacuum pump evacuates the interior of the three-way pipe, and the second valve can be in a closed state when the vacuum gauge measures the vacuum degree or air pressure in the vacuum chamber.

6. The semiconductor processing apparatus according to claim 5, wherein The first vacuum pump is connected to the vacuum chamber through a first suction pipeline and is connected to the second pipeline through a second suction pipeline, wherein, a third valve is provided on the first suction pipeline, the first vacuum pump can evacuate the vacuum chamber when the third valve is in an open state, and the third valve can be in a closed state when the first vacuum pump evacuates the vacuum chamber to a first vacuum degree.

7. The semiconductor processing equipment according to claim 6, wherein The semiconductor processing equipment further includes a second vacuum pump, the second vacuum pump is connected to the vacuum chamber through a third suction pipeline, and a fourth valve is provided on the third suction pipeline; wherein, the fourth valve can be in an open state when the vacuum degree in the vacuum chamber reaches the first vacuum degree, and the second vacuum pump can evacuate the vacuum chamber to a second vacuum degree when the fourth valve is in an open state, and the second vacuum degree is higher than the first vacuum degree.

8. The semiconductor processing apparatus according to claim 6, wherein The third valve can be in a closed state when the first vacuum pump evacuates the three-way pipe.

9. The semiconductor processing apparatus according to claim 6, wherein The second suction pipeline is a corrugated pipe.

10. The semiconductor processing equipment according to claim 4, wherein, The semiconductor processing equipment further includes: a leak detection instrument for detecting the sealing state of the connection between the vacuum gauge and the third pipeline after the first vacuum pump evacuates the inside of the three-way pipe; wherein, the first valve can be in a closed state when the leak detection instrument detects that the sealing state of the connection between the vacuum gauge and the third pipeline does not meet the requirements, and the first valve can be in an open state when the leak detection instrument detects that the sealing state of the connection between the vacuum gauge and the third pipeline meets the requirements.

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