Wafer edge metal residue removing device

Abstract

The utility model relates to the technical field of wafer processing, and discloses a wafer edge metal residue removing device which comprises a first connecting plate, a second connecting plate is fixedly connected to the middle of the rear side of the first connecting plate, and a first rotating plate is fixedly connected to the top of the second connecting plate. A first clamp is rotationally connected to the front side of the top of the first rotating plate, lantern rings are fixedly connected to the left side and the right side of the rear side of the top of the first rotating plate, a second servo motor is fixedly connected to the left side of the lantern ring on the left side, and the output end of the second servo motor penetrates through and is fixedly connected with a rotating plate; and the top of the rotating plate is fixedly connected with a second rotating plate. According to the wafer polishing device, after polishing is completed, the second servo motor drives the rotating plate and the second rotating plate to rotate, the surface of a wafer can be exposed, then the exhaust fan is started, scraps on the surface of the wafer can be sucked into the filter box, and the scraps can be filtered out by the filter plate.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a device for removing metal residues at the edge of a wafer. Background Art

[0002] Wafer edge metal residue removal equipment is used in the field of semiconductor manufacturing to remove residual metal materials on the edge of the wafer. During the wafer manufacturing process, metal residue may affect the electrical and mechanical properties of the wafer, so it needs to be removed during the processing.

[0003] After searching, the existing Chinese patent publication number is: CN220614565U, which provides a device for removing metal residues from the edge of a wafer. This patent cuts off the edge of the wafer body through the mutual cooperation of subsequent annular cutting moving blocks and other components, and at the same time removes the metal attached to the surface, avoiding the situation where residual metal during cutting causes grain collapse and leads to failure of the wafer body.

[0004] Although the above patent can remove the metal attached to the surface, the above-mentioned wafer edge metal residue removal device still has the following problem: after the edge metal residue is removed, the debris cannot be quickly removed.

[0005] In order to solve the above problems, a device for removing metal residue from the edge of a wafer is proposed. Utility Model Content

[0006] The purpose of the utility model is to provide a device for removing metal residues from wafer edges, which solves the problem in the background art that debris cannot be quickly removed after the metal residues at the edges are removed.

[0007] To achieve the above object, the utility model provides the following technical solution: A device for removing metal residues on the edge of a wafer, including a first connecting plate, a second connecting plate is fixedly connected to the middle of the rear side of the first connecting plate, a first rotating plate is fixedly connected to the top of the second connecting plate, a first clamp is rotatably connected to the front side of the top of the first rotating plate, collar rings are fixedly connected to both the left and right sides of the rear side of the top of the first rotating plate, a second servo motor is fixedly connected to the left side of the left collar ring, the output end of the second servo motor penetrates and is fixedly connected to a rotating plate, a second rotating plate is fixedly connected to the top of the rotating plate, a third servo motor is fixedly connected to the front side of the top of the second rotating plate, the output end of the third servo motor penetrates and is fixedly connected to a second clamp, a wafer is arranged at the bottom of the second clamp, a third connecting plate is fixedly connected to the middle of the front side of the first connecting plate, a filter box is fixedly connected to the rear side of the top of the third connecting plate, a box cover is arranged at the top of the filter box, a second pipe penetrates and is fixedly connected to the middle of the rear side of the filter box, a filter plate is fixedly connected to the middle of the inner wall of the filter box, a first pipe penetrates and is fixedly connected to the middle of the front side of the filter box, an exhaust fan is arranged at one end of the first pipe, fixing plates are fixedly connected to both the left and right sides of the top of the first connecting plate, a rotating assembly is arranged in the middle of the left side of the left fixing plate, a nut pair is arranged on the outer ring of the rotating assembly, a table board is fixedly connected to the inner bottom of the fixing plate, a slide rail is arranged in the middle of the top of the table board, a U-shaped plate is fixedly connected to the top of the nut pair, a fourth servo motor is fixedly connected to the inner side of the top of the U-shaped plate, the output end of the fourth servo motor penetrates and is fixedly connected to a first rotating rod, and a grinding wheel for edge grinding is fixedly connected to the outer ring of the first rotating rod.

[0008] By adopting the above technical solution, after grinding is completed, the second servo motor drives the rotating plate and the second rotating plate to rotate, so that the surface of the wafer can be exposed, and then the exhaust fan is turned on, and the debris on the surface of the wafer can be sucked into the filter box, and the debris can be filtered out by the filter plate.

[0009] As a further description of the above technical solution: The rotating assembly includes a first servo motor and a bidirectional threaded rod, the first servo motor is fixedly connected to the left side of the fixing plate, and the output end of the first servo motor penetrates and is fixedly connected to the bidirectional threaded rod.

[0010] By adopting the above technical solution, the third servo motor drives the second clamp, the wafer and the first clamp to rotate, the fourth servo motor drives the first rotating rod and the grinding wheel for edge grinding to rotate, and the first servo motor drives the bidirectional threaded rod to rotate to drive the nut pair and the U-shaped plate to move towards the middle along the slide rail, and the metal residues on the edge are ground according to the diameter of the wafer.

[0011] As a further description of the above technical solution: The outer ring of the bidirectional threaded rod is threadedly connected to the nut pair.

[0012] By adopting the above technical solution, the bidirectional threaded rod rotates to drive the nut pair to move.

[0013] As a further description of the above technical solution: The nut pair is slidably connected to the inner wall of the slide rail.

[0014] By adopting the above technical solution, the nut pair can slide along the inner wall of the slide rail.

[0015] As a further description of the above technical solution: The first connecting plate is fixedly connected to the bottom of the table board.

[0016] By adopting the above technical solution, the table board is fixed through the first connecting plate.

[0017] As a further description of the above technical solution: The exhaust fan is fixedly connected to the top of the third connecting plate.

[0018] By adopting the above technical solution, the exhaust fan is fixed through the third connecting plate.

[0019] As a further description of the above technical solution: The bottom of the wafer is in contact with the first fixture.

[0020] By adopting the above technical solution, the wafer is fixed by the first fixture and the second fixture.

[0021] As a further description of the above technical solution: The top of the filter plate is in contact with the box cover.

[0022] By adopting the above technical solution, the top of the filter plate is in contact with the box cover, which can make the sealing effect better.

[0023] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0024] 1. A device for removing metal residues on the edge of a wafer provided by the present utility model drives the second fixture, the wafer and the first fixture to rotate through the third servo motor, drives the first rotating rod and the grinding wheel to rotate through the fourth servo motor, and drives the bidirectional threaded rod to rotate through the first servo motor to drive the nut pair and the U-shaped plate to move towards the middle along the slide rail, and grinds the metal residues on the edge according to the diameter of the wafer.

[0025] 2. A device for removing metal residues on the edge of a wafer provided by the present utility model, after grinding is completed, drives the rotating plate and the second rotating plate to rotate through the second servo motor, then the surface of the wafer can be exposed, and then the exhaust fan is turned on, and the debris on the surface of the wafer can be sucked into the filter box, and the debris can be filtered by the filter plate. Description of the Drawings

[0026] Figure 1Isometric view of the present utility model;

[0027] Figure 2 Front isometric view of the present utility model;

[0028] Figure 3 Top isometric view of the present utility model.

[0029] In the figure: 1. First rotating rod; 2. U-shaped plate; 3. First servo motor; 4. Edge grinding wheel; 5. Fixed plate; 6. First connecting plate; 7. Nut pair; 8. Bidirectional threaded rod; 9. Slide rail; 10. Table board; 11. Second connecting plate; 12. First fixture; 13. Second servo motor; 14. First rotating plate; 15. Collar; 16. Rotating plate; 17. Wafer; 18. Second rotating plate; 19. Second fixture; 20. Third servo motor; 21. Fourth servo motor; 22. Exhaust fan; 23. First pipeline; 24. Third connecting plate; 25. Filter box; 26. Second pipeline; 27. Box cover; 28. Filter plate. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0031] For a further understanding of the content of the present utility model, the present utility model will be described in detail in conjunction with the accompanying drawings.

[0032] Combined with Figures 1-3, a device for removing metal residues on the edge of a wafer according to the present utility model, includes a first connecting plate 6. A second connecting plate 11 is fixedly connected to the middle of the rear side of the first connecting plate 6. A first rotating plate 14 is fixedly connected to the top of the second connecting plate 11. A first fixture 12 is rotatably connected to the front side of the top of the first rotating plate 14. Collar rings 15 are fixedly connected to both the left and right sides of the rear side of the top of the first rotating plate 14. A second servo motor 13 is fixedly connected to the left side of the left collar ring 15. The output end of the second servo motor 13 penetrates and is fixedly connected to a rotating plate 16. A second rotating plate 18 is fixedly connected to the top of the rotating plate 16. A third servo motor 20 is fixedly connected to the front side of the top of the second rotating plate 18. The output end of the third servo motor 20 penetrates and is fixedly connected to a second fixture 19. A wafer 17 is arranged at the bottom of the second fixture 19. A third connecting plate 24 is fixedly connected to the middle of the front side of the first connecting plate 6. A nut pair 7 is slidably connected to the inner wall of a slide rail 9. The first connecting plate 6 is fixedly connected to the bottom of a table board 10. An exhaust fan 22 is fixedly connected to the top of the third connecting plate 24. The bottom of the wafer 17 is in contact with the first fixture 12. The top of a filter plate 28 is in contact with a box cover 27.

[0033] Combined with Figure 1 and Figure 3 , fixing plates 5 are fixedly connected to both the left and right sides of the top of the first connecting plate 6. A rotating component is arranged in the middle of the left side of the left fixing plate 5. A nut pair 7 is arranged on the outer ring of the rotating component. The inner bottom of the fixing plate 5 is fixedly connected to a table board 10. A slide rail 9 is formed in the middle of the top of the table board 10. A U-shaped plate 2 is fixedly connected to the top of the nut pair 7. A fourth servo motor 21 is fixedly connected to the inner top of the U-shaped plate 2. The output end of the fourth servo motor 21 penetrates and is fixedly connected to a first rotating rod 1. A grinding wheel 4 is penetrated and fixedly connected to the outer ring of the first rotating rod 1. The rotating component includes a first servo motor 3 and a bidirectional threaded rod 8. The first servo motor 3 is fixedly connected to the left side of the fixing plate 5. The output end of the first servo motor 3 penetrates and is fixedly connected to the bidirectional threaded rod 8. The outer ring of the bidirectional threaded rod 8 is threadedly connected to the nut pair 7. The second fixture 19, the wafer 17 and the first fixture 12 are driven to rotate by the third servo motor 20. The first rotating rod 1 and the grinding wheel 4 are driven to rotate by the fourth servo motor 21. The bidirectional threaded rod 8 is driven to rotate by the first servo motor 3 to drive the nut pair 7 and the U-shaped plate 2 to move towards the middle along the slide rail 9, and the metal residues on the edge are polished according to the diameter of the wafer 17.

[0034] Combined with Figures 1-3, a filter box 25 is fixedly connected to the rear side of the top of the third connecting plate 24. A box cover 27 is arranged on the top of the filter box 25. A second pipe 26 penetrates and is fixedly connected to the middle of the rear side of the filter box 25. A filter plate 28 is fixedly connected to the middle of the inner wall of the filter box 25. A first pipe 23 penetrates and is fixedly connected to the middle of the front side of the filter box 25. One end of the first pipe 23 is provided with an exhaust fan 22. After the polishing is completed, the second servo motor 13 drives the rotating plate 16 and the second rotating plate 18 to rotate, so that the surface of the wafer 17 can be exposed. Then, the exhaust fan 22 is turned on, and the debris on the surface of the wafer 17 can be sucked into the filter box 25, and the debris can be filtered out by the filter plate 28.

[0035] Working principle: Turn on the third servo motor 20. The output end of the third servo motor 20 rotates to drive the second fixture 19, the wafer 17 and the first fixture 12 to rotate. Turn on the fourth servo motor 21. The output end of the fourth servo motor 21 rotates to drive the first rotating rod 1 and the edge grinding wheel 4 to rotate. Then, turn on the first servo motor 3. The output end of the first servo motor 3 rotates to drive the bidirectional threaded rod 8 to rotate, driving the nut pair 7 and the U-shaped plate 2 to move towards the middle along the slide rail 9, and the residual metal on the edge is polished according to the diameter of the wafer 17. After the polishing is completed, turn on the second servo motor 13. The output end of the second servo motor 13 rotates to drive the rotating plate 16 and the second rotating plate 18 to rotate, so that the surface of the wafer 17 can be exposed. Then, turn on the exhaust fan 22, and the debris on the surface of the wafer 17 can be sucked into the filter box 25, and the debris can be filtered out by the filter plate 28.

[0036] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0037] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer edge metal residue removal device, including a first connecting plate (6), characterized in that: A second connecting plate (11) is fixedly connected to the middle of the rear side of the first connecting plate (6). A first rotating plate (14) is fixedly connected to the top of the second connecting plate (11). A first clamp (12) is rotatably connected to the front side of the top of the first rotating plate (14). Collar rings (15) are fixedly connected to both the left and right sides of the rear side of the top of the first rotating plate (14). A second servo motor (13) is fixedly connected to the left side of the left collar ring (15). The output end of the second servo motor (13) penetrates and is fixedly connected to a rotating plate (16). A second rotating plate (18) is fixedly connected to the top of the rotating plate (16). A third servo motor (20) is fixedly connected to the front side of the top of the second rotating plate (18). The output end of the third servo motor (20) penetrates and is fixedly connected to a second clamp (19). A wafer (17) is arranged at the bottom of the second clamp (19). A third connecting plate (24) is fixedly connected to the middle of the front side of the first connecting plate (6). A filter box (25) is fixedly connected to the rear side of the top of the third connecting plate (24). A box cover (27) is arranged on the top of the filter box (25). A second pipe (26) penetrates and is fixedly connected to the middle of the rear side of the filter box (25). A filter plate (28) is fixedly connected to the middle of the inner wall of the filter box (25). A first pipe (23) penetrates and is fixedly connected to the middle of the front side of the filter box (25). An air extractor (22) is arranged at one end of the first pipe (23). Fixed plates (5) are fixedly connected to both the left and right sides of the top of the first connecting plate (6). A rotating assembly is arranged in the middle of the left side of the left fixed plate (5). A nut pair (7) is arranged on the outer ring of the rotating assembly. A table board (10) is fixedly connected to the inner bottom of the fixed plate (5). A slide rail (9) is formed in the middle of the top of the table board (10). A U-shaped plate (2) is fixedly connected to the top of the nut pair (7). A fourth servo motor (21) is fixedly connected to the inner top of the U-shaped plate (2). The output end of the fourth servo motor (21) penetrates and is fixedly connected to a first rotating rod (1). A grinding wheel (4) is penetrated and fixedly connected to the outer ring of the first rotating rod (1).

2. The wafer edge metal residue removing device according to claim 1, characterized in that: The rotating assembly includes a first servo motor (3) and a bidirectional threaded rod (8). The first servo motor (3) is fixedly connected to the left side of the fixed plate (5). The output end of the first servo motor (3) penetrates and is fixedly connected to the bidirectional threaded rod (8).

3. The wafer edge metal residue removal device according to claim 2, characterized in that: The outer ring of the bidirectional threaded rod (8) is in threaded connection with the nut pair (7).

4. A wafer edge metal residue removal device according to claim 1, characterized in that: The nut pair (7) is slidably connected to the inner wall of the slide rail (9).

5. A wafer edge metal residue removal device according to claim 1, characterized in that: The first connecting plate (6) is fixedly connected to the bottom of the table board (10).

6. The wafer edge metal residue removing device according to claim 1, wherein: The air extractor (22) is fixedly connected to the top of the third connecting plate (24).

7. A wafer edge metal residue removal device according to claim 1, characterized in that: The bottom of the wafer (17) is in contact with the first clamp (12).

8. A wafer edge metal residue removal device according to claim 1, characterized in that: The top of the filter plate (28) is in contact with the box cover (27).

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