Copper-aluminum siphon radiator capable of improving radiating effect
Through the design of siphon radiator combined with copper and aluminum, the problem of slow refrigerant reflow speed is solved, and efficient refrigerant circulation and heat dissipation effect is achieved, reducing production costs and improving reliability.
Patent Information
- Application Number
- CN202422403539.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-09-30
AI Technical Summary
In the heat dissipation of high-power server chips, the refrigerant evaporation speed is fast and the refrigerant reflow speed is slow, resulting in a reduced refrigerant circulation speed and poor heat dissipation effect.
Using a copper-aluminum-combined design, copper evaporators improve thermal conductivity and evaporation speed, aluminum condenser reduces costs, and optimizes refrigerant circulation through copper powder sintered layer and aluminum fin structure, enhances refrigerant reflux, and uses copper brazing and aluminum brazing processes to improve reliability.
While reducing costs, the refrigerant circulation speed and heat dissipation effect are improved, and the reliability and stability of the radiator are enhanced.
Smart Images

Figure CN223168586U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of radiators, in particular to a copper-aluminum siphon radiator with improved heat dissipation effect. Background Art
[0002] A radiator is a device used to dissipate heat from electronic components such as chips on a server, while a siphon radiator utilizes the phase change of a refrigerant to dissipate heat through gravity circulation. Traditional siphon radiators are mostly made of aluminum, and because they circulate through gravity, they do not require an internal capillary structure. A siphon radiator includes an evaporation end and a condensation end, connected by an air pipe and a liquid pipe. Because the chips on the server are high-powered and generate a lot of heat, the refrigerant on the evaporation end evaporates faster, while the condensed liquid refrigerant relies solely on gravity to return, resulting in a slow return rate. The refrigerant's return rate is easily lower than its evaporation rate, resulting in a reduction in the refrigerant's evaporation rate, which in turn reduces the refrigerant's circulation speed and the cooling effect. Therefore, improvements are necessary. Utility Model Content
[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a copper-aluminum siphon radiator with improved heat dissipation effect. The combination of copper and aluminum reduces costs while increasing the circulation speed of the refrigerant and improving the heat dissipation effect.
[0004] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a copper-aluminum siphon radiator with improved heat dissipation effect, comprising an evaporator, a condenser, an air supply pipe group and a liquid return pipe group, the air supply pipe group and the liquid return pipe group are respectively connected between the evaporator and the condenser, the air supply pipe group is located above the liquid return pipe group, the evaporator comprises a fixed bracket, an upper evaporation copper cover and a lower evaporation copper box, the lower evaporation copper box is fixedly mounted on the fixed bracket, the lower evaporation copper box is provided with an evaporation tank with an opening facing upward, the upper evaporation copper cover is fixedly mounted on the upper part of the lower evaporation copper box, the upper evaporation copper cover and the evaporation tank form a sealed evaporation chamber, a plurality of copper fins are arranged in the evaporation chamber, and a copper powder sintered layer is provided at the bottom of the evaporation tank;
[0005] The condenser includes at least one condensing aluminum box, a condensing chamber is arranged inside the condensing aluminum box, an aluminum fin assembly is arranged outside the condensing aluminum box, a plurality of aluminum fins are arranged in the condensing chamber, one end of the air supply pipe group and the liquid return pipe group are connected to the condensing chamber, and the other end is connected to the evaporation chamber.
[0006] In a further technical solution, an outer connection platform extends outward from the upper edge of the lower evaporation copper box. A lower connection groove is provided on the lower connection platform, and a connection plate is embedded in the lower connection groove. The lower part of the connection plate is fixedly welded to the lower evaporation copper box. The connection plate is provided with an air outlet hole and a liquid inlet hole. The upper evaporation copper cover is provided with a gas transmission channel and a reflux channel. One end of the gas transmission channel is connected to the air outlet hole, and the other end is connected to a gas transmission pipe group. One end of the reflux channel is connected to the liquid inlet hole, and the other end is connected to a liquid return pipe group. The upper evaporation copper cover is fixedly welded to the upper part of the connection plate.
[0007] In a further technical solution, the gas transmission pipe group includes a gas transmission copper pipe and a gas transmission aluminum pipe. The first end of the gas transmission aluminum pipe is connected to the condensation aluminum box. The second end of the gas transmission aluminum pipe is inserted and fixedly welded to the first end of the gas transmission copper pipe. The second end of the gas transmission copper pipe is connected to the gas transmission channel;
[0008] The liquid return pipe group includes a liquid return copper pipe and a liquid return aluminum pipe. The first end of the liquid return aluminum pipe is connected to the condensation aluminum box. The second end of the liquid return aluminum pipe is inserted and fixedly welded to the first end of the liquid return copper pipe. The second end of the liquid return copper pipe is connected to the reflux channel.
[0009] In a further technical solution, the lower end of the copper fin is formed on the lower evaporation copper box. The upper end of the copper fin abuts against the connection plate. Each copper fin is arranged at intervals, and a vertical flow channel is formed between two adjacent copper fins. The thickness of the copper powder sintered layer is 0.3 - 0.8 mm;
[0010] The aluminum fins are arranged along the length direction of the condensation aluminum box. A horizontal flow channel is formed between two adjacent aluminum fins. Both ends of each horizontal flow channel are respectively communicated with the gas transmission pipe group and the liquid return pipe group. The upper and lower parts of the aluminum fin are respectively bent to form an abutting part, and the two abutting parts respectively abut against the upper wall and the lower wall of the condensation chamber.
[0011] In a further technical solution, the fixing bracket includes a fixing plate and a plurality of fixing screws. A fixing groove is formed in the middle of the fixing plate, and a fixing hole penetrating through the fixing bracket is formed at the bottom of the fixing groove. The lower evaporation copper box is inserted into the fixing hole, and the lower connection platform is embedded in the fixing groove. The lower part of the lower evaporation copper box protrudes from the lower end surface of the fixing bracket. Threaded holes are respectively formed on both sides of the lower connection platform, and through holes are formed in the corresponding fixing grooves. Each fixing screw respectively passes through the corresponding through hole and is threadedly connected to the corresponding threaded hole. Locking holes are respectively formed at the four corners of the fixing plate.
[0012] In a further technical solution, the condenser includes two condensation aluminum boxes. There are two liquid return pipe groups connected between the two condensation aluminum boxes and the upper evaporation copper cover. The upper evaporation copper cover is provided with two reflux channels. An air inlet is respectively opened at the upper part of the inner end of each of the two condensation aluminum boxes, and a liquid outlet is respectively opened at the lower part of the outer end of each of the two condensation aluminum boxes. An air inlet tee is connected between the two air inlets. One end of the gas transmission pipe group is connected to the air inlet tee and the other end is connected to the gas transmission channel. Each of the two liquid outlets is connected with a liquid outlet connector. One end of each of the two liquid return pipe groups is respectively connected to the two liquid outlet connectors, and the other end of each of the two liquid return pipe groups is respectively connected to the two reflux channels.
[0013] In a further technical solution, an upwardly protruding upper connection convex part is provided on the upper part of the upper evaporation copper cover.
[0014] The gas transmission channel includes a gas transmission hole and two downwardly open gas transmission grooves. The gas transmission hole is opened at the upper part of the upper connection convex part. The two gas transmission grooves are respectively arranged on both sides of the gas transmission hole. The upper parts of the two gas transmission grooves are respectively communicated with the gas transmission hole. Two air outlet holes are spaced apart in the middle of the connecting plate. The lower ends of the two gas transmission grooves are respectively communicated with the two air outlet holes. One end of the gas transmission hole is connected to the gas transmission pipe group.
[0015] The reflux channel includes a reflux hole and an L-shaped reflux groove with a downward opening. The reflux hole is opened at the lower part of the upper connection convex part. The L-shaped reflux groove is opened on the upper evaporation copper cover. One end of the reflux hole is connected to the end of the L-shaped reflux groove and the other end is connected to the liquid return pipe group. The two reflux channels are symmetrically arranged. The two L-shaped reflux grooves are respectively located on both sides of the gas transmission groove. One liquid inlet hole is respectively opened at the four corners of the connecting plate, and each liquid inlet hole is respectively located below the two L-shaped reflux grooves.
[0016] In a further technical solution, the aluminum fin assembly includes an upper substrate, a lower substrate, a plurality of upper fins arranged at intervals and a plurality of lower fins arranged at intervals. The upper parts of the respective upper fins are respectively welded and fixed to the lower part of the upper substrate. The upper parts of the two condensation aluminum boxes and the air inlet tee are respectively welded and fixed to the lower parts of the corresponding upper fins. The lower parts of the respective lower fins are respectively pasted and fixed to the upper part of the lower substrate through heat-conducting glue. The lower parts of the two condensation aluminum boxes and the two liquid outlet connectors are respectively welded and fixed to the upper parts of the corresponding lower fins.
[0017] In a further technical solution, the gas transmission hole penetrates the upper connection convex part in the horizontal direction. One end of the gas transmission hole is connected to the gas transmission pipe group and the other end is connected with a liquid injection pipe for vacuum pumping and refrigerant injection. A one-way valve is arranged on the liquid injection pipe.
[0018] In a further technical solution, two positioning holes are opened on the connecting plate, and two positioning columns are correspondingly arranged at the lower part of the upper evaporation copper cover. The two positioning holes and the two positioning columns are in plug-in fit.
[0019] The diameter of the gas transmission pipe group is larger than that of the liquid return pipe group, and the lower base plate is provided with a plurality of fixing holes.
[0020] After adopting the above structure, the advantages of the present utility model compared with the prior art are as follows: the heat conduction performance is increased by the copper evaporator, the evaporation speed and evaporation amount are improved, and the cost is reduced by the aluminum condenser. The combination of copper and aluminum improves the heat dissipation effect while reducing the cost; the circulation speed of the refrigerant is increased by the copper powder sintering layer in the lower evaporation copper box, preventing the refrigerant from flowing back urgently and improving the heat dissipation effect; the evaporator is connected to two condensation aluminum boxes through two liquid return pipe groups respectively, improving the condensation speed and the flow rate of the refrigerant return, and further improving the heat dissipation effect; the evaporator is welded by the copper brazing process, the condenser is welded by the aluminum brazing process, and the liquid return copper pipe and the liquid return aluminum pipe and the gas transmission copper pipe and the gas transmission aluminum pipe are respectively welded by the high-frequency welding process. The manufacturing process is simple, the production cost is reduced, and the reliability and stability are improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The present utility model will be further described below in conjunction with the drawings and embodiments.
[0022] Figure 1 is a schematic structural diagram of the present utility model;
[0023] Figure 2 is an exploded view of the evaporator of the present utility model;
[0024] Figure 3 is a cross-sectional view of the evaporator of the present utility model;
[0025] Figure 4 is an exploded view of the condenser of the present utility model;
[0026] Figure 5 is a cross-sectional view of the condenser of the present utility model;
[0027] Figure 6 is a schematic structural diagram of the upper evaporation copper cover of the present utility model.
[0028] In the figure:
[0029] 1 fixing bracket, 11 fixing plate, 111 fixing groove, 112 fixing port, 113 perforation, 114 lock hole, 12 fixing screw;
[0030] 2 upper evaporation copper cover, 21 upper connection convex part, 22 positioning column, 231 gas transmission hole, 232 gas transmission groove, 241 return hole, 242 L-shaped return groove, 25 liquid injection pipe, 251 one-way valve;
[0031] 3 lower evaporation copper box, 31 evaporation groove, 32 copper fins, 33 vertical flow channel, 34 copper powder sintering layer, 35 lower connection platform, 36 lower connection groove, 37 threaded hole;
[0032] 4 connecting plate, 41 air outlet hole, 42 liquid inlet hole, 43 positioning hole;
[0033] 5 condensation aluminum box, 51 aluminum fins, 52 horizontal flow channel, 53 air inlet, 54 liquid outlet, 55 air inlet tee, 56 liquid outlet connector;
[0034] 61 upper substrate, 62 lower substrate, 621 fixing hole, 63 upper fins, 64 lower fins;
[0035] 7 gas transmission pipe group, 71 gas transmission copper pipe, 72 gas transmission aluminum pipe;
[0036] 8 liquid return pipe group, 81 liquid return copper pipe, 82 liquid return aluminum pipe. Specific embodiments
[0037] The following are only the preferred embodiments of the present invention, and do not limit the protection scope of the present invention accordingly.
[0038] A copper-aluminum siphon radiator for improving heat dissipation effect, as Figures 1 to 6 shown, including an evaporator, a condenser, a gas transmission pipe group 7 and a liquid return pipe group 8. The gas transmission pipe group 7 and the liquid return pipe group 8 are respectively connected between the evaporator and the condenser. The gas transmission pipe group 7 is located above the liquid return pipe group 8. The evaporator includes a fixing bracket 1, an upper evaporation copper cover 2 and a lower evaporation copper box 3. The lower evaporation copper box 3 is fixedly installed on the fixing bracket 1. The lower evaporation copper box 3 is provided with an evaporation groove 31 with an upward opening. The upper evaporation copper cover 2 is fixedly installed on the upper part of the lower evaporation copper box 3. The upper evaporation copper cover 2 and the evaporation groove 31 form a sealed evaporation chamber. A plurality of copper fins 32 are arranged in the evaporation chamber. A copper powder sintered layer 34 is arranged at the bottom of the evaporation groove 31; The condenser includes at least one condensation aluminum box 5. A condensation chamber is arranged inside the condensation aluminum box 5. An aluminum fin assembly is arranged outside the condensation aluminum box 5. A plurality of aluminum fins 51 are arranged in the condensation chamber. One end of the gas transmission pipe group 7 and the liquid return pipe group 8 is communicated with the condensation chamber, and the other end is communicated with the evaporation chamber. Most traditional siphon radiators are made of aluminum, with poor thermal conductivity. The refrigerant only returns by gravity. At high evaporation rates, the refrigerant cannot return in time, resulting in a slow circulation speed of the refrigerant and poor heat dissipation effect. However, the present invention increases the thermal conductivity through the copper-made evaporator, improves the evaporation speed and evaporation amount, and reduces the cost through the aluminum-made condenser. The combination of copper and aluminum improves the heat dissipation effect while reducing the cost; The copper powder sintered layer 34 in the lower evaporation copper box 3 improves the circulation speed of the refrigerant, prevents the refrigerant from not returning in time, and improves the heat dissipation effect.
[0039] Specifically, the upper edge of the lower evaporation copper box 3 extends outward to form a lower connecting platform 35. The lower connecting platform 35 is provided with a lower connecting groove 36, and a connecting plate 4 is embedded in the lower connecting groove 36. The lower part of the connecting plate 4 is fixedly welded to the lower evaporation copper box 3. The connecting plate 4 is provided with an air outlet hole 41 and a liquid inlet hole 42. The upper evaporation copper cover 2 is provided with a gas transmission channel and a reflux channel. One end of the gas transmission channel is connected to the air outlet hole 41 and the other end is connected to the gas transmission pipe group 7. One end of the reflux channel is connected to the liquid inlet hole 42 and the other end is connected to the liquid return pipe group 8. The upper evaporation copper cover 2 is fixedly welded to the upper part of the connecting plate 4. The upper evaporation copper cover 2 and the lower evaporation copper box 3 are fixedly welded through the connecting plate 4 using the copper brazing process. The gaseous refrigerant and the liquid refrigerant in the gas transmission channel and the reflux channel are respectively shunted through the air outlet hole 41 and the liquid inlet hole 42 of the connecting plate 4, reducing the impact between the gaseous refrigerant and the liquid refrigerant, reducing the circulation resistance, and further improving the refrigerant circulation speed.
[0040] Specifically, the gas transmission pipe group 7 includes a gas transmission copper pipe 71 and a gas transmission aluminum pipe 72. The first end of the gas transmission aluminum pipe 72 is connected to the condensation aluminum box 5. The second end of the gas transmission aluminum pipe 72 is inserted and fixedly welded to the first end of the gas transmission copper pipe 71. The second end of the gas transmission copper pipe 71 is connected to the gas transmission channel. The liquid return pipe group 8 includes a liquid return copper pipe 81 and a liquid return aluminum pipe 82. The first end of the liquid return aluminum pipe 82 is connected to the condensation aluminum box 5. The second end of the liquid return aluminum pipe 82 is inserted and fixedly welded to the first end of the liquid return copper pipe 81. The second end of the liquid return copper pipe 81 is connected to the reflux channel. The evaporator is welded by the copper brazing process, the condenser is welded by the aluminum brazing process, the liquid return copper pipe 81 and the liquid return aluminum pipe 82 are welded by the high-frequency welding process, and the gas transmission copper pipe 71 and the gas transmission aluminum pipe 72 are welded by the high-frequency welding process. The connection and combination between copper and aluminum are realized through the gas transmission pipe group 7 and the liquid return pipe group 8. The manufacturing process is simple, the production cost is reduced, and the reliability and stability are improved.
[0041] Specifically, the lower end portion of the copper fin 32 is formed on the lower evaporation copper box 3. The upper end portion of the copper fin 32 abuts and cooperates with the connecting plate 4. The copper fins 32 are arranged at intervals, and a vertical flow channel 33 is formed between two adjacent copper fins 32. The thickness of the copper powder sintered layer 34 is 0.3 - 0.8 mm. The aluminum fins 51 are arranged along the length direction of the condensation aluminum box 5, and a horizontal flow channel 52 is formed between two adjacent aluminum fins 51. The two ends of each horizontal flow channel 52 are respectively communicated with the gas delivery pipe group 7 and the liquid return pipe group 8. The upper and lower parts of the aluminum fin 51 are respectively bent to form an abutting portion, and the two abutting portions respectively abut the upper wall and the lower wall of the condensation chamber. The copper powder sintered layer 34 is sintered from 300-mesh copper powder. The copper fins 32 play a supporting role in the evaporation chamber, improving the pressure-bearing capacity, and forming a plurality of vertical flow channels 33 to guide the gaseous refrigerant upward, controlling the flow direction of the refrigerant, preventing the gaseous refrigerant from flowing horizontally and doing useless work, and further improving the refrigerant circulation speed. The aluminum fins 51 play a supporting role in the condensation chamber, improving the pressure-bearing capacity, and forming a plurality of horizontal flow channels 52. The horizontal flow channels 52 guide the refrigerant entering from the gas delivery aluminum pipe 72 to the liquid return aluminum pipe 82, preventing the refrigerant from flowing longitudinally and doing useless work, and further improving the refrigerant circulation speed.
[0042] Specifically, the fixing bracket 1 includes a fixing plate 11 and a plurality of fixing screws 12. A fixing groove 111 is formed in the middle of the fixing plate 11, and a fixing hole 112 penetrating the fixing bracket 1 is formed at the bottom of the fixing groove 111. The lower evaporation copper box 3 is inserted into the fixing hole 112, and the lower connecting table 35 is embedded in the fixing groove 111. The lower part of the lower evaporation copper box 3 protrudes from the lower end surface of the fixing bracket 1. Threaded holes 37 are respectively formed on both sides of the lower connecting table 35, and through holes 113 are formed in the corresponding fixing grooves 111. Each fixing screw 12 respectively passes through the corresponding through hole 113 and is threadedly connected with the corresponding threaded hole 37. Locking holes 114 are respectively formed at the four corners of the fixing plate 11. The lower part of the lower evaporation copper box 3 protrudes from the fixing plate 11, and the lower evaporation copper box 3 is directly attached to the heat source, improving the heat conduction efficiency. The fixing plate 11 and the lower evaporation copper box 3 are connected by the fixing screws 12. The connection structure is simple, facilitating the replacement of the fixing plate 11 with different specifications according to different usage scenarios, enhancing flexibility and improving the applicable range. The locking holes 114 on the fixing plate 11 are used to connect with the server main board through fasteners.
[0043] Specifically, the condenser includes two condensation aluminum boxes 5. There are two liquid return pipe groups 8 connected between the two condensation aluminum boxes 5 and the upper evaporation copper cover 2. The upper evaporation copper cover 2 is provided with two reflux channels. An air inlet 53 is respectively opened at the upper part of the inner end of each of the two condensation aluminum boxes 5, and a liquid outlet 54 is respectively opened at the lower part of the outer end of each of the two condensation aluminum boxes 5. An air inlet tee 55 is connected between the two air inlets 53. One end of the gas transmission pipe group 7 is connected to the air inlet tee 55 and the other end is connected to the gas transmission channel. Each of the two liquid outlets 54 is connected with a liquid outlet connecting part 56. One end of each of the two liquid return pipe groups 8 is respectively connected to the two liquid outlet connecting parts 56, and the other end of each of the two liquid return pipe groups 8 is respectively connected to the two reflux channels. The evaporator is respectively connected to the two condensation aluminum boxes 5 through the two liquid return pipe groups 8, which improves the condensation speed and the flow rate of the refrigerant reflux, and further improves the heat dissipation effect.
[0044] Specifically, as Figure 6 shown, an upward convex upper connection convex part 21 is provided on the upper part of the upper evaporation copper cover 2. The gas transmission channel includes a gas transmission hole 231 and two gas transmission grooves 232 with openings facing downwards. The gas transmission hole 231 is opened at the upper part of the upper connection convex part 21. The two gas transmission grooves 232 are respectively arranged on both sides of the gas transmission hole 231. The upper parts of the two gas transmission grooves 232 are respectively communicated with the gas transmission hole 231. Two air outlet holes 41 are spaced apart in the middle of the connecting plate 4. The lower ends of the two gas transmission grooves 232 are respectively communicated with the two air outlet holes 41. One end of the gas transmission hole 231 is connected to the gas transmission pipe group 7; the reflux channel includes a reflux hole 241 and an L-shaped reflux groove 242 with an opening facing downwards. The reflux hole 241 is opened at the lower part of the upper connection convex part 21. The L-shaped reflux groove 242 is opened on the upper evaporation copper cover 2. One end of the reflux hole 241 is connected to the end of the L-shaped reflux groove 242 and the other end is connected to the liquid return pipe group 8. The two reflux channels are symmetrically arranged. The two L-shaped reflux grooves 242 are respectively located on both sides of the gas transmission groove 232. One liquid inlet hole 42 is respectively opened at the four corners of the connecting plate 4, and each liquid inlet hole 42 is respectively located below the two L-shaped reflux grooves 242. During operation, the liquid refrigerant in the evaporation chamber is vaporized by heat, passes through the two air outlet holes 41 along the vertical flow channel 33 and enters the two gas transmission grooves 232 respectively, then converges in the gas transmission hole 231 and enters the air inlet tee 55 through the gas transmission pipe group 7. The gaseous refrigerant is branched in the air inlet tee 55 and flows into the condensation chambers of the two condensation aluminum boxes 5 respectively. The gaseous refrigerant flows along the horizontal flow channel 52 and gradually liquefies to form liquid refrigerant. The liquid refrigerant enters the two reflux holes 241 through the two liquid outlet connecting parts 56 and the two liquid return pipe groups 8 respectively. The refrigerant in the two reflux holes 241 enters the evaporation chamber from the four corners of the evaporation chamber through the corresponding liquid inlet holes 42 through the L-shaped reflux groove 242, thus forming a cycle.
[0045] Specifically, as Figure 4 and Figure 5As shown, the aluminum fin assembly includes an upper substrate 61, a lower substrate 62, a plurality of upper fins 63 arranged at intervals, and a plurality of lower fins 64 arranged at intervals. The upper parts of the respective upper fins 63 are welded and fixed to the lower part of the upper substrate 61. The upper parts of the two condensation aluminum boxes 5 and the intake three-way pipe 55 are respectively welded and fixed to the lower parts of the corresponding upper fins 63. The lower parts of the respective lower fins 64 are adhesively fixed to the upper part of the lower substrate 62 with a heat-conducting adhesive. The lower parts of the two condensation aluminum boxes 5 and the two liquid outlet connectors 56 are respectively welded and fixed to the upper parts of the corresponding lower fins 64. An upper fin 63 and a lower fin 64 are respectively arranged above and below the condensation aluminum box 5, increasing the number of fins and enhancing the heat dissipation effect. The condenser is fixed in the air duct of the server through the lower substrate 62. The lower parts of the lower fins 64 and the lower substrate 62 are adhesively fixed with a heat-conducting adhesive to increase the heat conduction performance between the lower fins 64 and the lower substrate 62, thereby helping to conduct heat to the chassis through the lower substrate 62 and further improving the heat dissipation effect.
[0046] Specifically, the air injection hole 231 penetrates the upper connecting convex part 21 in the horizontal direction. One end of the air injection hole 231 is connected to the air injection pipe group 7, and the other end is connected to a liquid injection pipe 25 for evacuating and injecting refrigerant. A one-way valve 251 is arranged on the liquid injection pipe 25. The evaporation chamber and the condensation chamber are evacuated through the liquid injection pipe 25, and then refrigerant is injected. The refrigerant used is R134a refrigerant. The one-way valve 251 adopts a valve core, which has a simple structure, low cost, and is convenient for subsequent replenishment or replacement of the refrigerant.
[0047] Specifically, two positioning holes 43 are formed on the connecting plate 4. Correspondingly, two positioning columns 22 are arranged at the lower part of the upper evaporation copper cover 2. The two positioning holes 43 and the two positioning columns 22 are inserted and matched; the diameter of the air injection pipe group 7 is larger than that of the liquid return pipe group 8, and a plurality of fixing holes 621 are formed on the lower substrate 62. The upper evaporation copper cover 2 can be positioned during production through the positioning holes 43 and the positioning columns 22, improving production efficiency. By increasing the diameter of the air injection pipe group 7, one air injection pipe group 7 can be simultaneously connected to two condensation chambers, simplifying the structure and reducing costs. The lower substrate 62 is fixed through the fixing holes 621 to prevent the condenser from shaking.
[0048] The above content is only the preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. The content of this specification should not be construed as a limitation to the present invention.
Claims
1. A copper-aluminum siphon radiator for improving heat dissipation effect, comprising an evaporator, a condenser, an air delivery pipe group (7) and a liquid return pipe group (8). The air delivery pipe group (7) and the liquid return pipe group (8) are respectively connected between the evaporator and the condenser, and the air delivery pipe group (7) is located above the liquid return pipe group (8), and is characterized in that: The evaporator includes a fixed bracket (1), an upper evaporation copper cover (2), and a lower evaporation copper box (3). The lower evaporation copper box (3) is fixedly installed on the fixed bracket (1). The lower evaporation copper box (3) is provided with an evaporation groove (31) with an upward opening. The upper evaporation copper cover (2) is fixedly installed on the upper part of the lower evaporation copper box (3). The upper evaporation copper cover (2) and the evaporation groove (31) form a sealed evaporation chamber. A plurality of copper fins (32) are arranged in the evaporation chamber. A copper powder sintered layer (34) is arranged at the bottom of the evaporation groove (31). The condenser includes at least one condensation aluminum box (5). A condensation chamber is arranged inside the condensation aluminum box (5). An aluminum fin assembly is arranged outside the condensation aluminum box (5). A plurality of aluminum fins (51) are arranged in the condensation chamber. One end of the gas transmission pipe group (7) and the liquid return pipe group (8) is communicated with the condensation chamber, and the other end is communicated with the evaporation chamber.
2. The copper-aluminum siphon radiator for improving heat dissipation effect according to claim 1, characterized in that: An upper connecting platform (35) extends outward from the upper edge of the lower evaporation copper box (3). A lower connecting groove (36) is arranged on the lower connecting platform (35). A connecting plate (4) is embedded in the lower connecting groove (36). The lower part of the connecting plate (4) is fixedly welded to the lower evaporation copper box (3). The connecting plate (4) is provided with an air outlet hole (41) and a liquid inlet hole (42). The upper evaporation copper cover (2) is provided with a gas transmission channel and a reflux channel. One end of the gas transmission channel is connected to the air outlet hole (41), and the other end is connected to the gas transmission pipe group (7). One end of the reflux channel is connected to the liquid inlet hole (42), and the other end is connected to the liquid return pipe group (8). The upper evaporation copper cover (2) is fixedly welded to the upper part of the connecting plate (4).
3. The copper-aluminum siphon radiator for improving heat dissipation effect according to claim 2, wherein: The gas transmission pipe group (7) includes a gas transmission copper pipe (71) and a gas transmission aluminum pipe (72). The first end of the gas transmission aluminum pipe (72) is connected to the condensation aluminum box (5). The second end of the gas transmission aluminum pipe (72) is inserted and fixedly welded to the first end of the gas transmission copper pipe (71). The second end of the gas transmission copper pipe (71) is connected to the gas transmission channel. The liquid return pipe group (8) includes a liquid return copper pipe (81) and a liquid return aluminum pipe (82). The first end of the liquid return aluminum pipe (82) is connected to the condensation aluminum box (5). The second end of the liquid return aluminum pipe (82) is inserted and fixedly welded to the first end of the liquid return copper pipe (81). The second end of the liquid return copper pipe (81) is connected to the reflux channel.
4. The copper-aluminum siphon radiator for improving heat dissipation effect according to claim 2, wherein: The lower end of the copper fin (32) is formed on the lower evaporation copper box (3). The upper end of the copper fin (32) abuts against the connecting plate (4). The copper fins (32) are arranged at intervals. A vertical flow channel (33) is formed between two adjacent copper fins (32). The thickness of the copper powder sintered layer (34) is 0.3 - 0.8 mm. The aluminum fins (51) are arranged along the length direction of the condensation aluminum box (5). A horizontal flow channel (52) is formed between two adjacent aluminum fins (51). Both ends of each horizontal flow channel (52) are respectively communicated with the gas transmission pipe group (7) and the liquid return pipe group (8). The upper and lower parts of the aluminum fin (51) are respectively bent to form an abutting part. The two abutting parts respectively abut against the upper wall and the lower wall of the condensation chamber.
5. The copper-aluminum siphon radiator for improving heat dissipation effect according to claim 2, characterized in that: The fixed bracket (1) includes a fixed plate (11) and a plurality of fixing screws (12). A fixing groove (111) is formed in the middle of the fixed plate (11), and a fixing hole (112) penetrating through the fixed bracket (1) is formed at the bottom of the fixing groove (111). The lower evaporation copper box (3) is inserted into the fixing hole (112), the lower connecting platform (35) is embedded in the fixing groove (111), the lower part of the lower evaporation copper box (3) protrudes from the lower end face of the fixed bracket (1), threaded holes (37) are respectively formed on both sides of the lower connecting platform (35), corresponding perforations (113) are formed in the fixing groove (111), and each fixing screw (12) passes through the corresponding perforation (113) and is threadedly connected to the corresponding threaded hole (37). Locking holes (114) are respectively formed at the four corners of the fixed plate (11).
6. The copper-aluminum siphon radiator for improving heat dissipation effect according to any one of claims 2 to 5, characterized in that: The condenser includes two condensation aluminum boxes (5). Two return liquid pipe groups (8) are connected between the two condensation aluminum boxes (5) and the upper evaporation copper cover (2). The upper evaporation copper cover (2) is provided with two return flow channels. An air inlet (53) is respectively formed in the upper part of the inner end of each of the two condensation aluminum boxes (5), and a liquid outlet (54) is respectively formed in the lower part of the outer end of each of the two condensation aluminum boxes (5). An air inlet tee (55) is connected between the two air inlets (53). One end of the gas transmission pipe group (7) is connected to the air inlet tee (55) and the other end is connected to the gas transmission channel. Liquid outlet connectors (56) are respectively connected to the two liquid outlets (54). One end of each of the two return liquid pipe groups (8) is respectively connected to the two liquid outlet connectors (56), and the other end of each of the two return liquid pipe groups (8) is respectively connected to the two return flow channels.
7. The copper-aluminum siphon radiator for improving heat dissipation effect according to claim 6, wherein: The upper part of the upper evaporation copper cover (2) is provided with an upward protruding upper connecting convex part (21). The gas transmission channel includes a gas transmission hole (231) and two downward-opening gas transmission grooves (232). The gas transmission hole (231) is formed in the upper part of the upper connecting convex part (21). The two gas transmission grooves (232) are respectively arranged on both sides of the gas transmission hole (231). The upper parts of the two gas transmission grooves (232) are respectively communicated with the gas transmission hole (231). Two air outlet holes (41) are spaced apart in the middle of the connecting plate (4). The lower ends of the two gas transmission grooves (232) are respectively communicated with the two air outlet holes (41). One end of the gas transmission hole (231) is connected to the gas transmission pipe group (7). The return flow channel includes a return flow hole (241) and an L-shaped return flow groove (242) with a downward opening. The return flow hole (241) is formed in the lower part of the upper connecting convex part (21). The L-shaped return flow groove (242) is formed in the upper evaporation copper cover (2). One end of the return flow hole (241) is connected to the end of the L-shaped return flow groove (242), and the other end is connected to the return liquid pipe group (8). The two return flow channels are symmetrically arranged. The two L-shaped return flow grooves (242) are respectively located on both sides of the gas transmission groove (232). Liquid inlet holes (42) are respectively formed at the four corners of the connecting plate (4), and each liquid inlet hole (42) is respectively located below the two L-shaped return flow grooves (242).
8. The copper-aluminum siphon radiator for improving heat dissipation effect according to claim 7, wherein: The aluminum fin assembly includes an upper substrate (61), a lower substrate (62), a plurality of upper fins (63) arranged at intervals, and a plurality of lower fins (64) arranged at intervals. The upper parts of the respective upper fins (63) are welded and fixed to the lower part of the upper substrate (61). The upper parts of the two condensation aluminum boxes (5) and the intake three-way pipe (55) are respectively welded and fixed to the lower parts of the corresponding upper fins (63). The lower parts of the respective lower fins (64) are adhesively fixed to the upper part of the lower substrate (62) through a heat-conducting adhesive. The lower parts of the two condensation aluminum boxes (5) and the two liquid outlet connectors (56) are respectively welded and fixed to the upper parts of the corresponding lower fins (64).
9. The copper-aluminum siphon radiator for improving heat dissipation effect according to claim 8, characterized in that: The air injection hole (231) penetrates through the upper connecting convex part (21) in the horizontal direction. One end of the air injection hole (231) is connected to the air injection pipe group (7), and the other end is connected to a liquid injection pipe (25) for vacuum pumping and refrigerant injection. A one-way valve (251) is arranged on the liquid injection pipe (25).
10. The copper-aluminum siphon radiator for improving heat dissipation effect according to claim 9, characterized in that: Two positioning holes (43) are formed in the connecting plate (4). Corresponding two positioning columns (22) are arranged at the lower part of the upper evaporation copper cover (2). The two positioning holes (43) and the two positioning columns (22) are inserted and matched with each other; The diameter of the air injection pipe group (7) is larger than the diameter of the liquid return pipe group (8). A plurality of fixing holes (621) are formed in the lower substrate (62).