Golden finger lead structure

Abstract

The utility model provides a gold finger lead structure, which comprises a plurality of gold plating leads and a conductive disc, the first end of each gold plating lead is connected with a gold finger, and the second end of each gold plating lead is connected with the conductive disc in a centralized manner; one end of the gold plating lead is connected with the golden finger, the other end of the gold plating lead is connected with the conductive disc in a concentrated mode to achieve gold plating, the conductive disc is provided with a through hole to cut off the lead after the golden finger is electroplated, the concentrated connecting end of the golden finger is disconnected, and short circuit of the golden finger is avoided. The problems that in the prior art, gold fingers are electroplated by adopting a method of respectively arranging gold plating leads and conductive regions, and after the gold fingers are electroplated, dry film patterns need to be used twice subsequently to remove the conductive regions and cut off the gold plating leads, so that too many processing materials are used, the processing cost is high, and the processing flow is complex are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the gold finger processing field of circuit board especially relates to a gold finger lead structure. BACKGROUND

[0002] The common circuit board design requires to be connected to the conductive area through the gold finger lead wire, so that the gold finger of the circuit board is electrified and plated, and after the gold finger plating is completed, the lead wire is "cut off" or removed to prevent the problem of short circuit of the gold finger.

[0003] The one-time processing and forming circuit board design does not have a conductive area, so it is necessary to re-set the gold lead wire and the conductive area.

[0004] For the above-mentioned gold-plated finger of the circuit board, a manufacturing method of setting a gold lead wire in the circuit board and setting a conductive area at the edge is generally used, but it needs to use twice dry film pattern processing process to remove the conductive area and cut off the gold lead wire, resulting in problems such as too much use of processing materials, high processing cost, and complex processing process.

[0005] Therefore, in view of the above background and problems, a new type of gold finger lead structure is needed. UTILITY MODEL CONTENTS

[0006] The utility model aims at solving the problem that the one-time processing and forming circuit board uses twice dry film pattern processing to re-set the gold lead wire and the conductive area, resulting in complex processing process and high cost, and provides a gold finger lead structure, which comprises a plurality of gold lead wires and a conductive disc, the first end of each gold lead wire is connected with the gold finger, and the second end of each gold lead wire is connected with the conductive disc.

[0007] Further, the plurality of gold lead wires are independently set one by one with the plurality of gold fingers.

[0008] Further, the conductive disc is greater than or equal to 1.

[0009] Further, a copper-free hole pattern is arranged around the conductive disc, the copper-free hole pattern and the conductive disc are concentric circular structures, and the single side of the copper-free hole pattern is greater than the conductive disc.

[0010] Further, the counterbore hole is a counterbore hole, one end of the counterbore hole is the face of the gold lead wire, and the diameter of the counterbore hole is greater than the conductive disc on the single side.

[0011] Further, the diameter of the counterbore end of the counterbore hole is greater than the conductive disc on the single side.

[0012] Further, the diameter of the through hole end of the counterbore hole is greater than the conductive disc on the single side.

[0013] Further, the first end of each of the electric gold lead is connected with the edge center position of the gold finger.

[0014] Further, the gold finger lead structure further comprises an anti-electric gold dry film layer covering other areas except the gold finger and the conductive disc.

[0015] The gold finger lead structure provided by the utility model realizes the electrification of the gold finger by connecting one end of the electric gold lead with the gold finger and connecting the other end with the conductive disc to plate gold, and after the electroplated gold finger is completed, the conductive disc is made to have a through hole to cut off the lead, the concentrated connection end of the gold finger is disconnected, the gold finger is prevented from short circuit, the overall design is simple, the processing cost is low, the gold finger is electroplated by adopting the method of respectively arranging the electric gold lead and the conductive area in the prior art, after the electroplated gold finger is completed, twice dry film patterns are used to remove the conductive area and cut off the electric gold lead, so that the problems of too much use of processing materials, high processing cost and complex processing process are solved. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained from the structure shown in the drawings without creative labor.

[0017] Figure 1 It is a plane schematic view of the gold finger lead structure of the utility model;

[0018] Figure 2 It is a sectional schematic view of the circuit board processed according to the gold finger lead structure of the utility model.

[0019] Explanation of the reference signs:

[0020]

[0021] The realization, functional characteristics and advantages of the utility model will be further explained by combining with the embodiments and referring to the drawings. DETAILED DESCRIPTION

[0022] The technical scheme in the embodiments of the utility model will be clearly and completely described below by combining with the drawings in the embodiments of the utility model, obviously, the described embodiments are only some embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0023] It should be noted that if the embodiment of the utility model has directionality indication (such as up, down, left, right, front, back, etc.), the directionality indication is only used to explain the relative position relationship, movement condition, etc. between components in a certain posture, if the certain posture changes, the directionality indication also changes accordingly.

[0024] In order to better understand the above technical solutions, the above technical solutions will be described in detail below in combination with the drawings.

[0025] Please refer to Figure 1 , Figure 1 It is a sectional view of the gold finger lead structure of the utility model.

[0026] The gold finger lead structure 10 of the embodiment includes a plurality of electric gold leads 200 and a conductive disc 300, the first end of each electric gold lead 200 is connected with the gold finger 100, and the second end of each electric gold lead 200 is connected to the conductive disc 300; by connecting the electric gold lead 200 with the gold finger 100 and the conductive disc 300, the electric effect is realized; after electroplating is completed, the conductive disc 300 is drilled, so that the copper path is cut off, and the problem of short circuit of the gold finger 100 in subsequent processing is avoided.

[0027] Preferably, the plurality of electric gold leads 200 are independently arranged one by one with the plurality of gold fingers 100, which is a common signal transmission mode in circuit board design, this connection mode ensures stable signal transmission, and improves the performance and reliability of the circuit board.

[0028] Preferably, the first end of each electric gold lead 200 is connected with the edge center position of the gold finger 100, the space between adjacent gold fingers 100 can be fully utilized, the electric gold lead 200 is cut off in subsequent drilling when the adjacent electric gold leads 200 are too close in the processing process, which affects the function and reliability of the circuit board, and also affects the appearance quality of the circuit board.

[0029] The conductive disc 300 is provided with a copper-free hole pattern 400, in the embodiment, the copper-free hole pattern 400 is arranged for drilling a copper-free hole 410 in a subsequent process, one side of the copper-free hole pattern 400 is larger than the conductive disc 300, so that the surface copper layer of the conductive disc 300 is drilled out when the copper-free hole 410 is drilled, and the gold finger 100 is ensured not to be short-circuited (in the embodiment, the copper-free hole 410 is a copper-free hole formed by directly drilling a through hole according to the copper-free hole pattern 400, and the hole in this form is not shown in the drawing).

[0030] In the embodiment, the conductive disc 300 is greater than or equal to 1, the position of the conductive disc 300 of the utility model is the through hole position of the original design of the circuit board, the original design of the through hole includes the positioning hole of the circuit board and the like, the positioning hole is usually distributed at four corners of the circuit board, therefore, the conductive disc usually has a plurality of conductive discs, and the plurality of conductive discs 300 can ensure uniform current transmission in the electroplating gold processing process.

[0031] It is worth noting that the copper-free hole 400 drilled on the conductive disc 300 after the electroplating is completed has a double effect, that is, the copper path is cut off to prevent the gold finger 100 from being short-circuited, and the original design of the through hole position is processed, thereby reducing the processing procedure and the material cost of processing, simplifying the processing flow of the circuit board, and making the production more efficient.

[0032] Please refer to Figure 2 , Figure 2 It is a sectional view of the circuit board processed according to the gold finger lead structure of the utility model.

[0033] In the embodiment, the copper-free hole 410 is a counterbore hole 420, the counterbore end 4210 of the counterbore hole is one end of the surface where the gold lead 200 is located, and the diameter of the counterbore hole 420 is greater than that of the conductive disc 300 on one side, that is, it can be ensured that the counterbore hole 420 can cut off the copper path, and it can also be ensured that the subsequent counterbore hole 420 is installed with a screw, so that the head of the screw is lower than the surface of the circuit board and does not affect the appearance or function of the overall structure, thereby avoiding the influence of the protruding screw head on the overall thickness or circuit layout.

[0034] In one embodiment, even if the diameter of the copper-free hole 410 is less than or equal to the diameter of the conductive disc 300, the diameter of the counterbore end 4210 of the counterbore hole is greater than that of the conductive disc 300 on one side, which can also ensure that the copper path is cut off and avoid the problem of short circuit of the gold finger 100.

[0035] In one embodiment, it is only necessary to ensure that the diameter of the through hole end 4220 of the counterbore hole is greater than that of the conductive disc 300 on one side, which can also ensure that the copper path is cut off and has the effect of avoiding short circuit of the gold finger.

[0036] The gold finger lead structure 10 of the utility model further includes an anti-electric gold dry film layer 500, the anti-electric gold dry film layer 500 covers other areas except the gold finger 100 and the conductive disc 300, exposes the area of the gold finger 100, and provides a prerequisite for electroplating for subsequent electroplating procedures.

[0037] The above description is only the preferred embodiment of the utility model, and does not limit the patent range of the utility model embodiment, and any equivalent structural transformation, direct / indirect application in other related technical fields based on the utility model embodiment and the content of the utility model embodiment specification are included in the patent protection range of the utility model embodiment.

Claims

1. A gold finger lead structure, characterized in that, The gold finger lead structure comprises a plurality of electric gold leads and a conductive disc, a first end of each of the electric gold leads is connected with the gold finger, and a second end of each of the electric gold leads is connected with the conductive disc; The plurality of electric gold leads are independently arranged one by one with the plurality of gold fingers; A copper hole pattern is arranged around the conductive disc, the copper hole pattern and the conductive disc are concentric circular structures, and a single side of the copper hole pattern is larger than the conductive disc.

2. A gold finger guide structure as claimed in claim 1, wherein, The conductive disc is greater than or equal to 1.

3. A gold finger guide structure as claimed in claim 1, wherein, The copper hole is a countersunk hole, a countersunk end of the countersunk hole is one end of a surface where the electric gold lead is located, and a diameter of a single side of the countersunk hole is greater than the conductive disc.

4. A gold finger guide structure as claimed in claim 3, wherein, The diameter of the single side of the countersunk end of the countersunk hole is greater than the conductive disc.

5. A gold finger guide structure as claimed in claim 3, wherein, The diameter of the single side of the through hole end of the countersunk hole is greater than the conductive disc.

6. A gold finger guide structure as claimed in claim 1, wherein, The first end of each of the electric gold leads is connected with a center position of an edge of the gold finger.

7. A gold finger guide structure as claimed in claim 1, wherein, The gold finger lead structure further comprises an anti-electric gold dry film layer, and the anti-electric gold dry film layer covers other areas except the gold finger and the conductive disc.

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