Retaining ring space ring component for double-sided polishing of mask substrate

Abstract

The utility model provides a retaining ring space ring component for double-sided polishing of a mask substrate, and belongs to the technical field of precision optical device machining. The retaining ring space ring component for double-sided polishing of the mask substrate comprises a main body part, a retaining ring and a retaining ring, and a hollow area suitable for embedding a substrate workpiece is formed on the main body part; and the supporting protrusions are formed on the top surface of the main body part, distributed on the edge of the hollowed-out area and suitable for abutting against the polishing pad in the polishing process of the substrate workpiece. According to the retaining ring space ring component for double-sided polishing of the mask substrate, fold springback of the polishing pad can be restrained, substrate workpiece corner collapse caused by fold of the polishing pad is avoided, and the flatness and polishing precision of the polished surface of the mask substrate are improved.

Description

Technical Field

[0001] This application belongs to the field of precision optical device processing technology, specifically relating to a retaining ring spacer component for double-sided polishing of a mask substrate. Background Technology

[0002] With the rapid development of the semiconductor industry, especially the continuous advancement of domestic semiconductor manufacturing processes, the technical requirements for semiconductor photolithography mask substrates are becoming increasingly stringent. In mask substrate processing, double-sided polishing is widely used due to its advantages such as high efficiency and good surface quality. In the double-sided polishing process, the mask substrate workpiece is placed on the retaining ring spacer of the double-sided polishing planetary wheel, and then pressure is applied to the polishing pad by the polishing disc. The polishing pad contacts the rotating workpiece, achieving polishing.

[0003] Currently, the traditional double-sided polishing planetary wheel retainer ring design is relatively simple, typically using a plastic disc slightly thinner than the workpiece and grooved to fit the workpiece shape. This design has shortcomings in terms of mechanical support and surface machining control. The polishing pad is subjected to pressure, causing stress concentration at the edges and corners, resulting in wrinkles. This leads to over-polishing and removal of the workpiece's edge and corner areas, causing collapse and reducing the flatness of the polished surface, making it difficult to meet the processing requirements of high-precision photomask substrates. Utility Model Content

[0004] In order to solve at least one of the technical problems existing in the background art, this application provides a retaining ring spacer component for double-sided polishing of mask substrate, which can suppress the wrinkle rebound of polishing pad, avoid the collapse of substrate workpiece caused by polishing pad wrinkles, and improve the flatness and polishing accuracy of the polished surface of mask substrate.

[0005] The technical solution adopted in this application is as follows:

[0006] This application provides a retaining ring spacer component for double-sided polishing of a mask substrate, including:

[0007] The main body has a hollow area formed thereon, which is suitable for embedding a substrate workpiece;

[0008] Supporting protrusions are formed on the top surface of the main body and are distributed at the edge of the hollow area. The supporting protrusions are adapted to abut against the polishing pad during the polishing process of the substrate workpiece.

[0009] According to the embodiment of this application, the retaining ring spacer component for double-sided polishing of a mask substrate has a main body that is the core part of the retaining ring spacer. A hollow area suitable for embedding a substrate workpiece is formed on the main body. The hollow area provides a precise positioning and fixing space for the substrate workpiece, ensuring that the workpiece will not be displaced or shifted during the polishing process. The main body serves as a load-bearing component, providing support and protection. During the polishing process, on one side of the top surface, the polishing pad applies pressure to the polishing pad, squeezing it to contact and rub against the surface of the substrate workpiece to achieve polishing. Since the polishing pad is soft, wrinkles will appear on the outer edge of the polishing pad that extends beyond the surface of the substrate workpiece under pressure. Since the support protrusions in this application are formed on the top surface of the main body and distributed at the edge of the hollow area, the support protrusions can directly abut against the outer edge of the polishing pad. By contacting the polishing pad, the support protrusions disperse and adjust the polishing pressure, preventing the polishing pad from wrinkling or deforming at the edge and corner areas of the workpiece. This avoids excessive wear on the substrate workpiece caused by the wrinkles of the polishing pad, protecting the integrity of the edge and corner areas of the substrate workpiece and the flatness of the polished surface. In summary, the retaining ring spacer component for double-sided polishing of mask substrates provided in this application can suppress the springback of polishing pad wrinkles, avoid the collapse of substrate workpiece caused by polishing pad wrinkles, and improve the flatness and polishing accuracy of the polished surface of the mask substrate.

[0010] According to one embodiment of this application, the distance between the support protrusion and the edge of the hollowed-out area ranges from 0.5 mm to 5 mm;

[0011] The width of the support protrusion ranges from 2 mm to 5 mm.

[0012] According to one embodiment of this application, the sum of the height of the support protrusion and the thickness of the main body is 90% to 99% of the thickness of the substrate workpiece.

[0013] According to one embodiment of this application, the hollow area is square, and the supporting protrusions are distributed at the four corners of the hollow area;

[0014] The support protrusion is L-shaped.

[0015] According to one embodiment of this application, the edge of the hollowed-out area is formed with an arc-shaped inner cavity;

[0016] The four corners of the hollowed-out area are provided with clearance holes.

[0017] According to one embodiment of this application, the corner sidewalls of the hollowed-out area are coated with an anti-scratch coating.

[0018] According to one embodiment of this application, a groove channel suitable for discharging polishing liquid is formed on the bottom surface of the main body, and the groove channel extends from the hollow area to the outer edge of the main body.

[0019] According to one embodiment of this application, the width of the groove channel ranges from 1 mm to 5 mm, and the depth of the groove channel ranges from 1 mm to 5 mm.

[0020] According to one embodiment of this application, an information marking groove and a direction positioning groove are formed on the top surface of the main body;

[0021] The depth of the information labeling groove and the orientation positioning groove is 10% to 50% of the thickness of the main body.

[0022] According to one embodiment of this application, a chamfer is formed at the edge of the main body portion. Attached Figure Description

[0023] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0024] Figure 1 This is a schematic diagram of the top surface of the retaining ring spacer component for double-sided polishing of the mask substrate provided in an embodiment of this application.

[0025] Figure 2 This is a front view of the top surface of the retaining ring spacer component for double-sided polishing of the mask substrate provided in an embodiment of this application.

[0026] Figure 3 This is a schematic diagram of the bottom surface of the retaining ring spacer component for double-sided polishing of the mask substrate provided in an embodiment of this application.

[0027] Figure 4 This is a front view of the bottom surface of the retaining ring spacer component for double-sided polishing of the mask substrate provided in an embodiment of this application.

[0028] in,

[0029] 11. Main body; 111. Hollowed-out area; 112. Support protrusion; 113. Arch-shaped inner cavity; 1131. Clearance hole; 114. Groove channel; 115. Information marking groove; 116. Direction positioning groove. Detailed Implementation

[0030] To more clearly illustrate the overall concept of this application, a detailed explanation is provided below with reference to the accompanying drawings.

[0031] Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below. It should be noted that, unless otherwise specified, the embodiments of this application and the features thereof can be combined with each other.

[0032] Furthermore, it should be understood in the description of this application that the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0033] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0034] In this application, unless otherwise expressly specified and limited, the "above" or "below" of the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. In the description of this specification, references to terms such as "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples.

[0035] like Figures 1 to 4 As shown, this application embodiment provides a retaining ring spacer component for double-sided polishing of a mask substrate, including: a main body 11, on which a hollow area 111 suitable for embedding a substrate workpiece is formed; and a support protrusion 112 formed on the top surface of the main body 11, the support protrusion 112 being distributed at the edge of the hollow area 111, and the support protrusion 112 being adapted to abut against a polishing pad during the polishing process of the substrate workpiece.

[0036] The main body 11 is the core part of the retaining ring spacer, and a hollow area 111 suitable for embedding the substrate workpiece is formed thereon. The main body 11 is usually made of a material with self-lubricating properties and high wear resistance (such as polyetheretherketone (PEEK), polyphenylene sulfide (PPS), polyamide (PA), polyetherimide (PEI), polycarbonate (PC), polyoxymethylene (POM), polyvinylidene fluoride (PVDF), etc.). The entire surface is deburred and polished to reduce the risk of friction, impact and scratches between the substrate product and the retaining ring spacer, and to improve the wear resistance of the retaining ring spacer itself.

[0037] The cutout area 111 is a cutout area on the main body 11. The size of the cutout area 111 matches the substrate workpiece to be processed and is used to embed the substrate workpiece. The shape of the cutout area 111 is determined according to the shape of the substrate workpiece, such as a circle, square, polygon or irregular shape.

[0038] The support protrusion 112 is a rib-like structure formed on the top surface of the main body 11. During the polishing process, it directly abuts against the polishing pad and suppresses the wrinkling and rebound effect of the polishing pad by dispersing pressure.

[0039] According to the embodiment of this application, the retaining ring spacer component for double-sided polishing of a mask substrate has a main body 11, which is the core part of the retaining ring spacer. A hollow area 111 suitable for embedding the substrate workpiece is formed on the main body 111. The hollow area 111 provides precise positioning and fixing space for the substrate workpiece, ensuring that the workpiece will not shift or deviate during polishing. The main body 11, as a load-bearing component, provides support and protection. During polishing, on the top surface side, the polishing disc applies pressure to the polishing pad, squeezing the polishing pad to contact and rub against the surface of the substrate workpiece, thus achieving polishing. Since the polishing pad is soft... Therefore, the outer edge of the polishing pad extending beyond the surface of the substrate workpiece will wrinkle under pressure. Since the support protrusions 112 in this application are formed on the top surface of the main body 11 and distributed at the edge of the hollow area 111, the support protrusions 112 can directly abut against the outer edge of the polishing pad. By contacting the polishing pad, the support protrusions 112 disperse and adjust the polishing pressure, preventing wrinkles or deformation of the polishing pad at the edge and corner areas of the workpiece. This avoids excessive wear on the substrate workpiece caused by the wrinkles of the polishing pad, protecting the integrity of the edge and corner areas of the substrate workpiece and the flatness of the polished surface. In summary, the retaining ring spacer component for double-sided polishing of a mask substrate provided in this application can suppress the rebound of wrinkles in the polishing pad, prevent the substrate workpiece from collapsing due to wrinkles in the polishing pad, and improve the flatness and polishing accuracy of the polished surface of the mask substrate.

[0040] In some embodiments of this application, the distance between the support protrusion 112 and the edge of the cutout area 111 ranges from 0.5 mm to 5 mm; the width of the support protrusion 112 ranges from 2 mm to 5 mm. This distance of 0.5 mm to 5 mm is designed to create a buffer zone between the workpiece edge corner area and the polishing pad, ensuring that the support protrusion 112 can accurately act on the polishing pad while avoiding direct interference with the workpiece surface. A smaller distance (e.g., 0.5 mm) is suitable for thin substrate workpieces, allowing for better control of pressure distribution in the edge corner area; a larger distance (e.g., 5 mm) is suitable for thicker substrate workpieces, providing greater operational margin. By optimizing the distance parameters, the pressure of the polishing pad in the corner area can be effectively dispersed, reducing over-removal caused by stress concentration. The reasonable distance design avoids direct contact between the support protrusion 112 and the substrate workpiece surface, preventing surface scratches or damage caused by hard contact.

[0041] The width of the support protrusion 112 is set between 2 mm and 5 mm. The choice of width directly affects the load-bearing capacity and stability of the support protrusion 112. A narrower width (such as 2 mm) is suitable for light load scenarios; a wider width (such as 5 mm) is suitable for high load scenarios, providing stronger support.

[0042] The design of the distance and width range between the supporting protrusion 112 and the edge of the hollow area 111 fully considers the actual processing requirements and mechanical properties, achieving a highly efficient and stable double-sided polishing effect, and providing a reliable guarantee for the manufacturing of high-precision mask substrates.

[0043] In some embodiments of this application, the sum of the height of the support protrusion 112 and the thickness of the main body 11 is 90% to 99% of the thickness of the substrate workpiece. Since the polished surface of the substrate workpiece needs to contact the polishing pad, the thickness of the substrate workpiece embedded in the main body 11 must be greater than the sum of the height of the support protrusion 112 and the thickness of the main body 11. The height design of the support protrusion 112 directly affects its contact area and force with the polishing pad. These parameters ensure that the support protrusion 112 can adequately abut against the polishing pad during polishing, dispersing and adjusting the pressure applied to the edge and corner areas of the workpiece. This design range is compatible with substrate workpieces of various thicknesses, suitable for both thin and thick workpieces, thus improving the versatility and applicability of the retaining ring component.

[0044] like Figures 1 to 2As shown, in some embodiments of this application, the cutout area 111 is square, and the supporting protrusions 112 are distributed at the four corners of the cutout area 111; the supporting protrusions 112 are L-shaped. The square cutout area 111 is suitable for embedding a square substrate workpiece, and its size and shape are precisely matched with the substrate workpiece to be processed, ensuring the stable fixation of the workpiece during the polishing process; the supporting protrusions 112 are distributed at the four corners of the cutout area 111, which can directly act on the polishing pad near the corner area of ​​the workpiece, avoiding wrinkles caused by pressure concentration at the corners of the polishing pad, which could lead to over-removal or collapse of the workpiece. The L-shaped design is particularly close to the geometry of the four corners of the workpiece, enhancing the protection effect on the corner area.

[0045] like Figures 1 to 4 As shown, in some embodiments of this application, an arc-shaped inner cavity 113 is formed at the edge of the hollow area 111; clearance holes 1131 are formed at the four corners of the hollow area 111. The arc-shaped inner cavity 113 acts as a liquid tank during polishing, allowing the polishing liquid supplied from the upper polishing disc to flow quickly to the substrate workpiece, preventing excessive localized removal caused by polishing liquid stagnation in specific areas. Furthermore, the arc-shaped inner cavity 113 reduces the contact area between the main body 11 and the mask substrate contour, decreasing workpiece bounce or damage caused by excessive friction. In addition, the design of the arc-shaped inner cavity 113 makes the insertion and removal of the substrate workpiece more convenient, reducing contamination and mechanical damage caused by frequent loading and unloading.

[0046] The presence of the clearance hole 1131 effectively reduces the direct contact between the four corners of the workpiece and the corners of the hollow area 111, avoiding abnormal collisions at the corners caused by jumping or uneven pressure during the processing.

[0047] Specifically, the diameter of the clearance hole 1131 can be from 0.5 mm to 3 mm.

[0048] In some embodiments of this application, the corner sidewalls of the cutout area 111 are coated with an anti-scratch coating. This anti-scratch coating significantly reduces surface scratches or damage to the substrate workpiece caused by hard contact during installation or removal, protecting the surface quality of the substrate workpiece. Furthermore, the smooth properties of the coating reduce resistance during workpiece insertion and removal, simplifying the loading and unloading process and improving production efficiency. The coating material has a certain coefficient of friction, providing sufficient friction even in a polishing slurry environment to ensure stable engagement of the workpiece within the spacer and avoid processing defects caused by jumping or shaking.

[0049] Specifically, the scratch-resistant coating includes at least one of the following plastic materials: neoprene rubber (EPDM), fluororubber (FKM), fluorosilicone rubber (FVMQ), and perfluororubber (FFKM), which has a high coefficient of friction in chemical and wetted environments.

[0050] like Figures 3 to 4As shown, in some embodiments of this application, a grooved channel 114 suitable for discharging polishing fluid is formed on the bottom surface of the main body 11. The grooved channel 114 extends from the hollowed-out area 111 to the outer edge of the main body 11. The grooved channel 114 is designed to quickly discharge the polishing fluid generated during the polishing process, optimize the fluid flow path, ensure that the polishing fluid is evenly distributed, and avoid stagnation. The grooved channel 114 provides a clear flow path for the polishing fluid, enabling it to flow quickly from the hollowed-out area 111 to the outer edge of the main body 11, preventing fluid accumulation at the bottom of the workpiece, thereby reducing over-removal caused by uneven local pressure.

[0051] Specifically, during the polishing process, the retaining ring spacer component rotates on its own to drive the substrate workpiece to rotate relative to the polishing pad, thereby achieving polishing. At this time, when the spacer rotates, under the action of centrifugal force, the polishing liquid in the arc-shaped inner cavity 113 can be discharged through the groove channel 114, thereby accelerating the flow of polishing liquid from the bottom surface of the main body 11 to the other polishing surface of the substrate workpiece, which facilitates the lower polishing disc and lower polishing pad to polish the substrate workpiece and improves the effect of double-sided polishing.

[0052] Taking the ring spacer component as an example, multiple groove channels 114 on the bottom surface can be opened on both sides and in the middle of the arc-shaped inner cavity 113, and can be evenly spaced in groups around the main body 11. For example, eight to twenty-eight groove channels 114 can be opened according to process requirements. Among them, the groove channels 114 on the outer side of the center line are perpendicular to the arc edge, and the groove channels 114 on both sides are distributed at a 30-degree angle with the intersecting square hollow area 111.

[0053] Furthermore, based on the above technical features, generally speaking, during the polishing process, the L-shaped protrusion on the top surface of the main body 11 can be subjected to the pressure of the upper polishing disc and act on the lower polishing pad, suppressing the inflow of polishing fluid at the corners of the workpiece and the wrinkling and rebound of the polishing pad, thereby providing better polishing rate control at the corners of the workpiece and avoiding corner collapse caused by the polishing pad. This can be used for mask substrate processing with high flatness requirements. The arc-shaped inner cavity 113 and the groove channel 114 on the bottom surface can accelerate the flow of polishing fluid on the surface of the lower polishing disc, improve the removal rate of the lower surface of the workpiece, and reduce the difference in removal amount between the upper and lower surfaces in double-sided polishing. At the same time, the groove channel 114 guides the polishing fluid in the arc-shaped inner cavity 113 to be quickly discharged outward under the action of centrifugal force of the spacer rotation, which can reduce the excessive polishing removal of the substrate edge area caused by the polishing fluid flowing towards the center in the arc-shaped inner cavity 113, thereby maintaining the flatness of the workpiece.

[0054] In some embodiments of this application, the width of the groove channel 114 ranges from 1 mm to 5 mm, and the depth of the groove channel 114 ranges from 1 mm to 5 mm. The design of the width and depth directly affects the flow rate and velocity of the groove channel 114. A width in the range of 1 mm to 5 mm provides sufficient cross-sectional area to accommodate the flow of polishing fluid; a depth also in the range of 1 mm to 5 mm ensures that the channel has sufficient capacity to store and guide the liquid.

[0055] like Figures 1 to 2 As shown, in some embodiments of this application, an information marking groove 115 and a direction positioning groove 116 are formed on the top surface of the main body 11; the depth of the information marking groove 115 and the direction positioning groove 116 is 10% to 50% of the thickness of the main body 11. The information marking groove 115 is designed as a rectangular shallow groove, located outside the arc-shaped inner cavity 113, and is used to mark the substrate workpiece information; the direction positioning groove 116 is designed as two circular shallow grooves, located on both sides of the L-shaped protrusion next to the rectangular shallow groove and symmetrically distributed, and is used for direction positioning during mask substrate processing.

[0056] The information labeling slot 115 can be used to engrave or mark relevant information about the workpiece, such as production batch, model, or processing parameters, facilitating subsequent quality traceability and management. Clear information labeling allows operators to quickly identify the workpiece type or processing technology corresponding to different spacers, improving production efficiency.

[0057] The depth of the information labeling groove 115 and the orientation positioning groove 116 is 10% to 50% of the thickness of the main body 11. This depth range ensures the functionality of the grooves while avoiding any impact on the overall structural strength of the main body 11.

[0058] In some embodiments of this application, the edges of the main body 11 are chamfered. Specifically, the outer circumference, inner circumference, and sharp corners of the square cutout area 111 of the retaining ring are all chamfered and rounded, with a size typically ranging from 0.3 mm to 3 mm, reducing wear on the polishing pad during use. The chamfered design also reduces the risk of scratching the substrate surface when inserting or removing the substrate workpiece, especially during workpiece loading and unloading, avoiding surface scratches or damage caused by hard contact.

[0059] For any parts not mentioned in this application, existing technologies may be used or referenced.

[0060] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0061] The above description is merely an embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A retaining ring spacer component for double-sided polishing of a mask substrate, characterized in that, include: The main body has a hollow area formed thereon, which is suitable for embedding a substrate workpiece; Supporting protrusions are formed on the top surface of the main body and are distributed at the edge of the hollow area. The supporting protrusions are adapted to abut against the polishing pad during the polishing process of the substrate workpiece.

2. The retaining ring spacer component for double-sided polishing of a mask substrate according to claim 1, characterized in that, The distance between the support protrusion and the edge of the hollowed-out area ranges from 0.5 mm to 5 mm; The width of the support protrusion ranges from 2 mm to 5 mm.

3. The retaining ring spacer component for double-sided polishing of a mask substrate according to claim 1, characterized in that, The sum of the height of the support protrusion and the thickness of the main body is 90% to 99% of the thickness of the substrate workpiece.

4. The retaining ring spacer component for double-sided polishing of a mask substrate according to any one of claims 1 to 3, characterized in that, The hollow area is square, and the supporting protrusions are distributed at the four corners of the hollow area; The support protrusion is L-shaped.

5. The retaining ring spacer component for double-sided polishing of a mask substrate according to claim 4, characterized in that, The edge of the hollowed-out area forms an arc-shaped inner cavity; The four corners of the hollowed-out area are provided with clearance holes.

6. The retaining ring spacer component for double-sided polishing of a mask substrate according to claim 4, characterized in that, The corners and sidewalls of the hollowed-out area are coated with an anti-scratch coating.

7. The retaining ring spacer component for double-sided polishing of a mask substrate according to claim 1, characterized in that, A groove channel suitable for discharging polishing liquid is formed on the bottom surface of the main body, and the groove channel extends from the hollow area to the outer edge of the main body.

8. The retaining ring spacer component for double-sided polishing of a mask substrate according to claim 7, characterized in that, The width of the groove channel ranges from 1 mm to 5 mm, and the depth of the groove channel ranges from 1 mm to 5 mm.

9. The retaining ring spacer component for double-sided polishing of a mask substrate according to claim 1, characterized in that, Information marking grooves and direction positioning grooves are formed on the top surface of the main body; The depth of the information labeling groove and the orientation positioning groove is 10% to 50% of the thickness of the main body.

10. The retaining ring spacer component for double-sided polishing of a mask substrate according to claim 1, characterized in that, The edges of the main body are chamfered.

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