Vertical wafer rotating corrosion mechanism
By using a 15° angle design and quick-release block structure in the vertical wafer rotation etching mechanism, the problems of uneven wafer etching and difficult equipment maintenance are solved, achieving efficient and safe wafer production and improving capacity and yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-29
- Publication Date
- 2026-03-20
AI Technical Summary
Existing technologies for wet chemical etching of 3215 wafers suffer from problems such as the contradiction between angle sensitivity and yield, low wafer handling efficiency, and difficulties in equipment corrosion and maintenance, especially in balancing flow field distribution and mechanical impact force control.
The vertical wafer rotation etching mechanism utilizes a preset angle design of 15°±0.5° and a quick-release block structure to achieve optimized flow field at an angle and a two-stage quick-release structure. The rotating drum is driven by a motor to avoid direct immersion in the etching solution, ensuring safe and efficient production.
It improved wafer production capacity and yield, achieved a etching depth uniformity of over 98%, reduced changeover time to 1 minute, reduced equipment failure rate by 90%, and avoided wafer damage and corrosion of motors by etching solution.
Smart Images
Figure CN224021703U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of crystal vibration preparation, especially relates to a vertical wafer rotary etching mechanism. BACKGROUND
[0002] In the wet chemical etching process of 3215 type wafers (such as quartz crystal resonator), in order to obtain accurate frequency and surface finish, it is necessary to strictly control the flow field distribution and mechanical impact force of the etching liquid. The existing technology has the following bottlenecks:
[0003] Angle sensitivity and yield conflict: traditional clamps are mostly placed in parallel (0°) or vertically (90°). When placed in parallel, laminar boundary layers are easily formed on the wafer surface, the etching liquid is slow to update, and the etching is not complete; when placed vertically, the liquid flow impact force acts vertically on the thin and brittle wafer, which is easy to cause wafer cracking or edge collapse.
[0004] Low wafer extraction efficiency: each set of clamp contains more than 20 wafers, and the traditional structure needs to be disassembled one by one to extract the screws or pull out the pins, which not only consumes time, but also easily damages the wafer surface during operation.
[0005] Equipment corrosion and maintenance difficulty: the etching liquid (hydrofluoric acid, strong alkali, etc.) has strong volatility. If the motor is directly connected and immersed in the liquid, the sealing ring is easy to age and leak; if the belt pulley is driven externally, the area is large and the speed is unstable. The existing equipment is difficult to balance between batch soaking and motor safety.
[0006] Therefore, it is the key to improve the production capacity and yield of 3215 wafers to develop an etching mechanism integrating inclined angle flow field optimization, two-stage quick release structure and double-state corrosion prevention driving. INVENTION CONTENTS
[0007] The technical problem to be solved by the embodiment of the utility model lies in providing a vertical wafer rotary etching mechanism to improve the production capacity and yield of 3215 wafers.
[0008] In order to solve the above technical problems, the embodiment of the utility model provides a vertical wafer rotary etching mechanism, which comprises a motor, a rotating shaft, a rotating drum, a rotating drum fixing piece, the output shaft of the motor is connected with the rotating shaft, the rotating drum is fixed on the rotating shaft through the rotating drum fixing piece, the rotating drum is provided with a clamp and a quick release block, the clamp is provided with a plurality of placement grooves for placing wafers, the quick release block is used for pressing the wafers in the placement grooves, and the wafers in the placement grooves and the rotating drum are at a preset angle of the tangent direction.
[0009] Further, the clamp has a plurality of and is uniformly and interval arranged around the rotating shaft.
[0010] Further, the rotating drum fixing piece is a locking nut, the locking nut is screwed on the end of the rotating shaft, and the rotating drum is fixed on the rotating shaft.
[0011] Further, the placing slots on the clamp are arranged side by side along the axial direction.
[0012] Further, the rotary drum comprises two clamp side plates, and the rotating shaft passes through the centers of the two clamp side plates.
[0013] Further, one end of the quick-release block is arranged on one clamp side plate through a rotating shaft, and the other end of the quick-release block is provided with a clamping groove, and the other clamp side plate is provided with a clamping pin in correspondence.
[0014] Further, the clamp is composed of a wafer supporting block and two wafer side plates arranged on the two sides of the wafer supporting block.
[0015] Further, the wafer side plates are hollowed in the middle.
[0016] Further, the preset angle is 15°±0.5°.
[0017] The utility model discloses the beneficial effects are:
[0018] 1) the yield of the utility model is greatly improved: 15° inclined angle is the balance point of fluid mechanics and material mechanics, and the defects of parallel non-corrosion and vertical fragile piece are completely eliminated, and the corrosion depth uniformity is improved to more than 98% through testing.
[0019] 2) the efficiency of the utility model is doubled: the utility model shortens the model changing time from 30 minutes to 1 minute, and the quick-release block shortens the time of taking 20 wafer pieces at a time from 5 minutes to 10 seconds, and avoids single piece scratch.
[0020] 3) the equipment full life cycle protection: the motor of the utility model is always in the dry area, and the corrosion of expensive servo motor by corrosive liquid vapor is completely solved, and the equipment failure rate is reduced by 90%.
[0021] 4) process flexibility: the same set of equipment can adapt to the production demand of small batch and multiple varieties by switching the posture. DRAWINGS
[0022] Fig. 1 is the structure diagram of the vertical wafer rotary etching mechanism of the utility model embodiment.
[0023] Fig. 2 is the three-dimensional structure diagram of the rotary drum of the utility model embodiment.
[0024] Fig. 3 is the three-dimensional structure diagram of the clamp of the utility model embodiment.
[0025] Fig. 4 is the angle structure schematic diagram of the wafer and the rotary tangent direction of the utility model embodiment.
[0026] BRIEF DESCRIPTION OF DRAWINGS
[0027] 1, wafer, 2, rotating tangent direction, 3, included angle of preset angle, 4, etching tank, 5, etching liquid area, 10, rotating drum, 11, clamp side plate, 12, quick release block, 13, rotating shaft, 14, bayonet, 15, bayonet slot, 20, motor, 21, coupling, 22, rotating shaft, 23, locking nut, 30, clamp, 31, wafer support block, 32, wafer side plate. DETAILED DESCRIPTION
[0028] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict, and the present application will be further described in detail below in combination with the drawings and specific embodiments.
[0029] In the embodiments of the present application, if there is a directional indication (such as up, down, left, right, front, back, etc.), it is only used to explain the relative position relationship, movement condition, etc. between the components in a certain specific posture (as shown in the drawings), and if the specific posture changes, the directional indication will also change accordingly.
[0030] In addition, in the present application, the description of "first", "second", etc. is only for the purpose of description, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features.
[0031] Please refer to Figs. 1-4 The vertical wafer rotating etching mechanism in the embodiments of the present application comprises a motor, a rotating shaft, a rotating drum and a rotating drum fixing member.
[0032] The output shaft of the motor is connected to the rotating shaft through a coupling. The rotating drum is fixed to the rotating shaft through the rotating drum fixing member. The rotating drum and the rotating drum fixing member are detachable, the center of the rotating drum in the present application adopts a plug-in type + knob locking structure, and the second-level separation of the rotating drum and the rotating shaft is realized. When working, the rotating drum is vertically inserted into the liquid tank, the motor faces upward, and only the rotating drum is immersed. The motor is directly fixed at the top end of the rotating shaft, and drives the rotating shaft to rotate the rotating drum vertically. In specific implementation, the middle part of the rotating drum is provided with a shaft sleeve, and after the rotating drum is sleeved on the rotating shaft through the shaft sleeve, it is axially fixed through the radial locking nut on the side. The axial quick locking structure of the rotating shaft + locking nut of the present application can separate the rotating drum and the rotating shaft without tools.
[0033] The rotary drum comprises two clamp side plates, and the clamps are arranged between the two clamp side plates. The rotary shaft passes through the center of the two clamp side plates of the rotary drum, and the clamps are multiple and uniformly arranged around the rotary shaft. The clamp side plates are preferably circular and arranged in a vertical manner, and six vertical columns are arranged in the middle to form a cage structure. The clamps are preferably six sets, and the six sets of clamps are fixed between the two plates in a circumferential distribution manner. The locking nut is arranged on the rotary shaft to fix the rotary drum on the rotary shaft. The placing grooves on the clamps are arranged in parallel along the axial direction.
[0034] The rotary drum is provided with clamps and quick release blocks, and the quick release blocks correspond to the clamps one by one. That is, a rotary quick release block is arranged above each set of clamps. The operator only needs to rotate the quick release block by an angle (such as 90°), so that the wafer is released from the compression, and the whole stack (20 or more wafers) can be taken out at one time without the need of separating the wafers one by one. The clamps are provided with a plurality of placing grooves for placing wafers, and the quick release blocks are used for compressing the wafers in the placing grooves.
[0035] One end of the quick release block is arranged on one side of the clamp side plate through a rotating shaft, and the other end of the quick release block is provided with a clamping groove, and the other side of the clamp side plate is provided with a clamping pin in correspondence. In specific implementation, the quick release block can also be installed on the clamp base through a hinge or a sliding groove, and the wafer is quickly taken out by rotating the quick release block. The clamp is composed of a wafer supporting block and two wafer side plates arranged on the two sides of the wafer supporting block in correspondence, and the middle part of the wafer side plate is hollowed out, so that the wafers in the clamp can fully contact with the etching liquid. The wafer side plates on the two sides are provided with placing grooves.
[0036] The wafers in the placing grooves form an angle with the rotary direction of the rotary drum at a preset angle. The preset angle is 15°±0.5°. Preferably, the wafers keep an angle of 15° with the tangential direction of rotation. The Coriolis force effect generated by the oblique rotation of the utility model makes the etching liquid form a micro-turbulent flow on the surface of the wafer, which not only destroys the stagnant boundary layer (solves the problem of not being etched), but also decomposes the normal impact force into a tangential component (solves the problem of wafer cracking).
[0037] The working process of the utility model is as follows:
[0038] Assembly: Fix six sets of clamps filled with wafers on the circumference of the rotary drum. Insert the rotary drum center hole into the rotary shaft, and tighten the locking nut to lock.
[0039] Layout: Hoist the whole mechanism and put it into the etching tank, inject etching liquid, and ensure that the liquid level is 80% of the height of the rotary drum, but ensure that the liquid level is lower than the connecting flange of the rotary shaft and the motor.
[0040] Etching: Start the motor, and set the rotation speed to 40 rpm. Due to the 15° inclination, the wafers form an oblique cutting liquid in rotation, and the surface is constantly updated.
[0041] Unloading: After the end of the corrosion, the whole drum does not need to be disassembled. The operator stands at the tank side, rotates the quick release block above a certain set of clamps by 90 degrees, the quick release block is loosened, and the whole stack of wafers is directly taken out with tweezers. If the drum needs to be cleaned, loosen the bottom locking nut, lift the shaft, and the whole drum is taken out of the liquid surface for cleaning.
[0042] The 15° inclined angle flow field and stress verification test of the utility model:
[0043] Method: Use transparent PMMA material to make a simulation drum, inject tracer fluid with the same viscosity and density as the actual corrosion liquid. Paste micro strain gauges on the wafer surface.
[0044] Process: Test the flow field velocity vector diagram and wafer stress waveform under four angles of 0°, 15°, 30° and 90° respectively.
[0045] Determination standard: Under the condition of 15°, the wafer surface should show obvious "attached vortex shedding" phenomenon (proving high mass transfer efficiency), and the normal impact stress peak value should be less than 20% of the wafer flexural strength (such as 50MPa of quartz), and the tangential component should be greater than 0.5N / cm² to take away the bubbles.
[0046] The utility model's quick release block durability and wafer taking efficiency test:
[0047] Method: Select a set of clamps and load 20 dummy wafers (simulate weight).
[0048] Process: Perform 1000 times of "locking-rotating unlocking-taking-wafer-putting-into-locking" cycle operation. Record the operation time each time, and use a microscope to observe the wear of the quick release block latch.
[0049] Determination standard: Single wafer taking time should be <5 seconds (compared with traditional screw structure >60 seconds); after 1000 cycles, the quick release block latch tongue gap increment should be <0.1mm, and there should be no jamming phenomenon.
[0050] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalent scope.
Claims
1. A vertical wafer rotation etching mechanism, characterized in that, It includes a motor, a rotating shaft, a rotating drum, and a rotating drum fixing component. The output shaft of the motor is connected to the rotating shaft. The rotating drum is fixed to the rotating shaft by the rotating drum fixing component. The rotating drum is equipped with a clamp and a quick-release block. The clamp is equipped with several placement slots for placing wafers. The quick-release block is used to press the wafers in the placement slots. The wafers in the placement slots form a preset angle with the rotation tangent direction of the rotating drum.
2. The vertical wafer rotation etching mechanism as described in claim 1, characterized in that, The clamps are multiple and evenly spaced around the axis of rotation.
3. The vertical wafer rotation etching mechanism as described in claim 1, characterized in that, The rotating drum is fixed by a lock nut, which is screwed onto the end of the rotating shaft to fix the rotating drum onto the rotating shaft.
4. The vertical wafer rotation etching mechanism as described in claim 1, characterized in that, The placement slots on the fixture are arranged side by side along the axial direction.
5. The vertical wafer rotation etching mechanism as described in claim 1, characterized in that, The rotating drum includes two clamping side plates, and the rotating shaft passes through the center of the two clamping side plates of the rotating drum. The clamps are located between the two clamping side plates.
6. The vertical wafer rotation etching mechanism as described in claim 5, characterized in that, One end of the quick-release block is mounted on one side of the clamping plate via a rotating shaft, and the other end of the quick-release block is provided with a slot, and a corresponding locking pin is provided on the other side of the clamping plate.
7. The vertical wafer rotation etching mechanism as described in claim 1, characterized in that, The fixture consists of a wafer support block and two wafer side plates located on both sides of the wafer support block.
8. The vertical wafer rotation etching mechanism as described in claim 7, characterized in that, The middle of the chip's side plate is hollowed out.
9. The vertical wafer rotation etching mechanism as described in claim 1, characterized in that, The preset angle is 15°±0.5°.