Packaging structure convenient for heat dissipation

Abstract

The utility model relates to the technical field of semiconductor packaging, and discloses a packaging structure convenient for heat dissipation, which comprises a packaging substrate, a heat dissipation layer and a heat dissipation layer, the first surface of the packaging substrate is provided with a functional area and an edge area surrounding the functional area; a plurality of jacks are formed in the edge area, and the jacks are arranged around the functional area; the heat dissipation cover is located on the first surface and comprises a top cover and a side wall; the side wall is connected with the edge of the top cover and perpendicular to the top cover. The side wall is located between the top cover and the edge area; the top cover, the side walls and the packaging substrate form a heat dissipation cavity; a plurality of contact pins are arranged on the surface of one side, back on to the top cover, of the side wall, are arranged in one-to-one correspondence with the jacks, and are clamped in the jacks; the side wall and the edge area are connected through a pin and a jack. According to the utility model, the binding force between the heat radiation cover and the packaging substrate can be increased, the stability and heat radiation performance of the packaging structure can be improved, the occupied area of the pins can be reduced, and the surface utilization rate of the packaging substrate can be improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and specifically to a packaging structure that facilitates heat dissipation. Background Technology

[0002] With the development of integrated circuit technology and the continuous increase in chip size and complexity, higher requirements are being placed on packaging substrates. While increased substrate size provides more space to integrate more chips and components, it also increases manufacturing difficulty and challenges existing technologies. Whether it's possible to integrate larger and more chips and components by improving substrate surface utilization without exceeding the production limits of PCB / packaging plants has become a significant challenge in packaging technology.

[0003] For large-size packaging substrates, warpage is often more severe, resulting in lower adhesion between the heatsink and the substrate. To ensure a firm bond between the heatsink and the substrate without touching internal components, current packaging technologies often increase the width of the heatsink foot (support foot) to increase the contact area and thus improve adhesion. However, this method results in excessively large support feet, requiring space around the substrate perimeter for the heatsink, limiting the placement of more components on the top layer and significantly reducing substrate surface utilization.

[0004] Therefore, a solution is needed that can increase the bonding force between the heat sink and the substrate while minimizing the area occupied by the support feet of the heat sink. Utility Model Content

[0005] In view of this, the present invention provides a packaging structure that facilitates heat dissipation, in order to solve the problem in the related technology that, due to the low bonding force between the heat sink and the substrate in large-size packaging substrates, the support feet of the heat sink occupy too much area, and the outer area of ​​the substrate needs to be reserved for the heat sink, resulting in the inability to place more devices on the top layer and low utilization of the substrate surface.

[0006] In a first aspect, this utility model provides a packaging structure that facilitates heat dissipation, comprising:

[0007] A packaging substrate; the first surface of the packaging substrate is provided with a functional area and an edge area surrounding the functional area; a plurality of holes are provided in the edge area, and the holes are arranged around the functional area.

[0008] A heat sink is located on the first surface of the packaging substrate. The heat sink includes a top cover and a side wall. The side wall is connected to the edge of the top cover and is perpendicular to the top cover. The side wall is located between the edge area of ​​the top cover and the packaging substrate. The top cover, the side wall and the packaging substrate form a heat dissipation cavity.

[0009] The side surface of the side wall away from the top cover is provided with a plurality of pins, the pins are arranged one-to-one with the sockets, and the pins are clamped in the sockets; the side wall and the edge area are connected through the pins and the sockets.

[0010] The packaging structure provided by the utility model is convenient for heat dissipation, the sockets are arranged around the functional area in the edge area of the packaging substrate, the side surface of the side wall of the heat dissipation cover away from the top cover is provided with a plurality of pins, the pins are arranged one-to-one with the sockets, and the pins are clamped in the sockets, the side wall and the edge area are connected through the pins and the sockets, on the one hand, the contact area between the packaging substrate and the heat dissipation cover can be increased, thereby the bonding force between the heat dissipation cover and the packaging substrate is increased, the influence of the warping of the packaging substrate on the mounting yield of the heat dissipation cover is reduced, the mounting yield between the heat dissipation cover and the packaging substrate is improved, and then the stability and the heat dissipation performance of the packaging structure can be improved; on the other hand, the sockets are only located in the edge area of the packaging substrate, the occupied area of the pins can be reduced as much as possible, more space can be reserved on the surface of the packaging substrate for integrating chips and components, and the surface utilization rate of the packaging substrate is improved.

[0011] In an alternative embodiment, the pin is cylindrical; the socket is cylindrical;

[0012] The depth of the socket is less than or equal to the thickness of the packaging substrate; the depth of the socket is at least 80% of the thickness of the packaging substrate;

[0013] The length of the pin is equal to the depth of the socket;

[0014] The diameter of the pin is less than the diameter of the socket;

[0015] An adhesive layer is arranged between the pin and the socket; the pin is connected to the inner wall of the socket through the adhesive layer and clamped in the socket.

[0016] The packaging structure provided by the utility model is convenient for heat dissipation, the sockets are arranged around the functional area in the edge area of the packaging substrate, the side surface of the side wall of the heat dissipation cover away from the top cover is provided with a plurality of pins, the pins are arranged one-to-one with the sockets, and the pins are clamped in the sockets, the side wall and the edge area are connected through the pins and the sockets, on the one hand, the contact area between the packaging substrate and the heat dissipation cover can be increased, thereby the bonding force between the heat dissipation cover and the packaging substrate is increased, the influence of the warping of the packaging substrate on the mounting yield of the heat dissipation cover is reduced, the mounting yield between the heat dissipation cover and the packaging substrate is improved, and then the stability and the heat dissipation performance of the packaging structure can be improved; on the other hand, the sockets are only located in the edge area of the packaging substrate, the occupied area of the pins can be reduced as much as possible, more space can be reserved on the surface of the packaging substrate for integrating chips and components, and the surface utilization rate of the packaging substrate is improved.

[0017] In an alternative embodiment, the material of the pin is the same as the material of the heat dissipation cover;

[0018] The material of the heat dissipation cover comprises copper, nickel, tin or silver;

[0019] The material of the pin includes copper, nickel, tin or silver;

[0020] The material of the adhesive layer is adhesive glue or indium; the adhesive glue is epoxy resin, polyurethane, amino resin or rubber.

[0021] The packaging structure provided by the utility model is convenient for heat dissipation, the material of the heat dissipation cover and the pin is same and includes copper, nickel, tin or silver, the heat dissipation cover can be integrally formed without other components, the stability of the heat dissipation cover can be improved, the process difficulty is reduced, and the stability of the packaging structure is improved; in addition, the heat dissipation performance of the heat dissipation cover and the packaging structure can be improved due to the high thermal conductivity of copper, nickel, tin or silver.

[0022] In some optional embodiments, the adhesive layer is an indium layer; the indium layer covers the surface of the pin;

[0023] The inner wall of the insertion hole is further covered with a copper layer;

[0024] The pin is connected with the copper layer of the inner wall of the insertion hole through the indium layer and clamped in the insertion hole.

[0025] The packaging structure provided by the utility model is convenient for heat dissipation, the material of the heat dissipation cover and the pin is same and includes copper, nickel, tin or silver, the heat dissipation cover can be integrally formed without other components, the stability of the heat dissipation cover can be improved, the process difficulty is reduced, and the stability of the packaging structure is improved; in addition, the heat dissipation performance of the heat dissipation cover and the packaging structure can be improved due to the high thermal conductivity of copper, nickel, tin or silver.

[0026] In an optional embodiment, the diameter of the pin is 200-500 microns;

[0027] The thickness of the adhesive layer is 20-50 microns;

[0028] The diameter of the insertion hole is 240-600 microns;

[0029] The spacing between adjacent pins is 2-4 mm;

[0030] The center line of the pin is located on the center surface of the thickness direction of the side wall; the center line of the insertion hole is located on the center line of the pin;

[0031] The thickness of the side wall is 500-1000 microns;

[0032] The distance between the side wall edge and the edge of the packaging substrate is 200-500 microns;

[0033] The distance between the center line of the insertion hole and the edge of the packaging substrate is 450-1000 μm.

[0034] The diameter of the insertion hole is 240-600 μm; the distance between the adjacent insertion pins is 2-4 mm; the distance between the insertion hole and the edge of the substrate is 450-1000 μm, which can reduce the area occupied by the insertion hole and the insertion pin on the packaging substrate as much as possible, so that more space can be reserved on the surface of the packaging substrate for integrated chips and components, thereby improving the surface utilization rate of the packaging substrate; meanwhile, the thickness of the adhesive layer is 20-50 μm, which can ensure the bonding and clamping between the insertion pin and the insertion hole, further increase the bonding force between the insertion pin and the insertion hole, thereby increasing the bonding force between the heat dissipation cover and the packaging substrate, reducing the influence of the warping of the packaging substrate on the mounting yield of the heat dissipation cover, improving the mounting yield between the heat dissipation cover and the packaging substrate, and further improving the stability and heat dissipation performance of the packaging structure.

[0035] In an alternative embodiment, the diameter of the insertion pin is 200 μm;

[0036] The thickness of the adhesive layer is 20 μm;

[0037] The diameter of the insertion hole is 240 μm;

[0038] The distance between the adjacent insertion pins is 2 mm;

[0039] The thickness of the side wall is 500 μm;

[0040] The distance between the edge of the side wall and the edge of the packaging substrate is 200 μm;

[0041] The distance between the center line of the insertion hole and the edge of the packaging substrate is 450 μm.

[0042] In an alternative embodiment, the packaging substrate is rectangular, and the edge region is located around the functional region; at least one circle of insertion holes is arranged around the functional region;

[0043] The heat dissipation cover comprises a top cover and four side walls; the top cover is rectangular, and the four side walls are connected to the four edges of the top cover and are connected end to end;

[0044] The top cover, the four side walls and the packaging substrate form a heat dissipation cavity.

[0045] In an alternative embodiment, the packaging structure for heat dissipation further comprises:

[0046] A heat sink is arranged on the side surface of the top cover away from the packaging substrate; the heat sink is connected to the top cover through a first bonding layer; and the side of the heat sink away from the top cover is provided with a plurality of heat dissipation structures.

[0047] A plurality of second pins are located on the second surface of the packaging substrate, and the first surface and the second surface are oppositely arranged.

[0048] The packaging structure provided by the utility model is convenient for heat dissipation, the heat dissipation cover is used for transferring heat to the heat dissipation device, and then the heat dissipation structure is used for reducing the temperature of the packaging structure and improving the heat dissipation performance of the packaging structure; the heat dissipation device and the heat dissipation cover are connected through the first adhesive layer, the bonding strength of the heat dissipation device and the heat dissipation cover is improved, and the stability of the packaging structure is improved.

[0049] In an alternative embodiment, the functional area is provided with a packaging chip and a plurality of capacitors located on the side of the packaging chip;

[0050] The packaging chip and the capacitors are located in the heat dissipation cavity;

[0051] The thickness of the packaging chip is greater than the thickness of the capacitors;

[0052] The height of the heat dissipation cavity is greater than or equal to the thickness of the packaging chip.

[0053] The packaging structure provided by the utility model is convenient for heat dissipation, the heat dissipation cover is used for transferring heat to the heat dissipation device, and then the heat dissipation structure is used for reducing the temperature of the packaging structure and improving the heat dissipation performance of the packaging structure; the heat dissipation device and the heat dissipation cover are connected through the first adhesive layer, the bonding strength of the heat dissipation device and the heat dissipation cover is improved, and the stability of the packaging structure is improved.

[0054] In an alternative embodiment, the heat dissipation cover and the packaging chip are connected through a second adhesive layer;

[0055] The packaging chip further comprises a plurality of first pins connected to the first surface of the packaging substrate.

[0056] The packaging structure provided by the utility model is convenient for heat dissipation, the heat dissipation cover is used for transferring heat to the heat dissipation device, and then the heat dissipation structure is used for reducing the temperature of the packaging structure and improving the heat dissipation performance of the packaging structure; the heat dissipation device and the heat dissipation cover are connected through the first adhesive layer, the bonding strength of the heat dissipation device and the heat dissipation cover is improved, and the stability of the packaging structure is improved. BRIEF DESCRIPTION OF DRAWINGS

[0057] In order to more clearly illustrate the technical solutions in the specific embodiments or the related art of the present application, the accompanying drawings needed to be used in the description of the specific embodiments or the related art will be briefly introduced. Obviously, the accompanying drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort.

[0058] Figure 1 It is a structure schematic view of a packaging structure convenient for heat dissipation according to an embodiment of the present application.

[0059] Figure 2 It is a local structure schematic view of a pin and a jack of a packaging structure convenient for heat dissipation according to an embodiment of the present application.

[0060] Figure 3 It is a top view of a packaging substrate in a packaging structure convenient for heat dissipation according to an embodiment of the present application.

[0061] Figure 4 It is a structure schematic view of a packaging cover of a packaging structure convenient for heat dissipation according to an embodiment of the present application.

[0062] Figure 5 It is a structure schematic view of a packaging cover of another packaging structure convenient for heat dissipation according to an embodiment of the present application.

[0063] Figure 6 It is a structure schematic view of a pin of another packaging structure convenient for heat dissipation according to an embodiment of the present application.

[0064] Figure 7 It is a flow schematic view of a preparation method of another packaging structure convenient for heat dissipation according to an embodiment of the present application.

[0065] Reference signs:

[0066] 100, packaging substrate; 101, functional area; 102, edge area; 10, jack; 11, chip; 12, capacitor; 13, first pin; 14, second pin; 200, heat dissipation cover; 20, pin; 21, top cover; 22, side wall; 23, adhesive layer; 30, heat sink; 40, first adhesive layer; 50, second adhesive layer; 300, heat dissipation cavity. DETAILED DESCRIPTION

[0067] The present application will be further described below in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present application, and not to limit the present application. In addition, it should be noted that, in order to facilitate the description, only the parts related to the present application are shown in the drawings, not all the structures.

[0068] With the development of integrated circuit technology, the chip size and complexity are increasing, which puts higher requirements on the packaging substrate. The increase of the substrate size can provide more space to integrate more chips and components, but at the same time, it also brings the increase of manufacturing difficulty and challenges to the existing technology. Without breaking the production limit of the board factory / packaging factory, whether it is possible to integrate more chips and components by increasing the surface utilization rate of the substrate has become an important problem in packaging technology.

[0069] For large-size packaging substrates, the warping problem is often more serious, resulting in low bonding force between the heat dissipation cover and the substrate. In order to ensure that the heat dissipation cover can be firmly combined with the substrate without touching the internal components, the packaging factory in the prior art will choose to increase the width of the heat dissipation cover foot (supporting foot) to increase the contact area, so as to increase the bonding force. But this method results in that the supporting foot of the heat dissipation cover occupies too much area, and the peripheral area of the substrate needs to be reserved for the heat dissipation cover, so that more devices cannot be placed on the top layer, and the surface utilization rate of the substrate is also greatly reduced.

[0070] Therefore, a scheme is needed to increase the bonding force between the heat dissipation cover and the substrate while minimizing the area occupied by the supporting foot of the heat dissipation cover.

[0071] The utility model provides a kind of packaging structure convenient for heat dissipation to solve the problem of low bonding force between heat dissipation cover and substrate in large-size packaging substrate in relevant technology, so that the supporting foot of heat dissipation cover occupies too much area, and the peripheral area of substrate needs to be reserved for heat dissipation cover, so that more devices cannot be placed on top layer, and the surface utilization rate of substrate is low.

[0072] As shown in Figure 1 The embodiment provides a kind of packaging structure convenient for heat dissipation, comprising:

[0073] Packaging substrate 100;The first surface of packaging substrate 100 is provided with functional area 101 and edge area 102 surrounding functional area 101;Several insertion holes 10 are arranged in edge area 102, and insertion holes 10 are arranged around functional area 101;

[0074] Heat dissipation cover 200 is located on the first surface of packaging substrate 100, and heat dissipation cover 200 includes top cover 21 and side wall 22;Side wall 22 is connected to the edge of top cover 21 and is perpendicular to top cover 21;Side wall 22 is located between top cover 21 and edge area 102 of packaging substrate 100;Top cover 21, side wall 22 and packaging substrate 100 form heat dissipation cavity 300;

[0075] The side surface of the side wall 22 opposite to the top cover 21 is provided with a plurality of pins 20, the pins 20 are arranged one by one with the insertion holes 10, and the pins 20 are clamped in the insertion holes 10; the side wall 22 is connected with the edge area 102 through the pins 20 and the insertion holes 10.

[0076] The packaging structure facilitating heat dissipation provided by the embodiment can increase the contact area between the packaging substrate 100 and the heat dissipation cover 200, thereby increasing the bonding force between the heat dissipation cover 200 and the packaging substrate 100, improving the mounting yield between the heat dissipation cover 200 and the packaging substrate 100, and further improving the stability and heat dissipation performance of the packaging structure; on the other hand, the insertion holes 10 are only located in the edge area 102 of the packaging substrate 100, which can reduce the occupied area of the pins 20 as much as possible, and more space can be reserved on the surface of the packaging substrate 100 for integrating chips and components, thereby improving the surface utilization rate of the packaging substrate 100. Therefore, the packaging structure facilitating heat dissipation provided by the embodiment can improve the bonding force between the heat dissipation cover 200 and the packaging substrate 100, thereby improving the stability and heat dissipation performance of the packaging structure, while reducing the occupied area of the pins 20 and improving the surface utilization rate of the packaging substrate 100.

[0077] In some optional embodiments, as shown in Figure 3 and Figure 4 the pin 20 is cylindrical; the insertion hole 10 is cylindrical;

[0078] The depth of the insertion hole 10 is less than or equal to the thickness of the packaging substrate 100; the depth of the insertion hole 10 is at least 80% of the thickness of the packaging substrate 100;

[0079] The length of the pin 20 is equal to the depth of the insertion hole 10;

[0080] The diameter of the pin 20 is less than the diameter of the insertion hole 10;

[0081] An adhesive layer 23 is arranged between the pin 20 and the insertion hole 10; the pin 20 is connected with the inner wall of the insertion hole 10 through the adhesive layer 23 and is clamped in the insertion hole 10, as shown in Figure 2 .

[0082] In some optional embodiments, the depth of the hole 10 is less than or equal to the thickness of the packaging substrate 100, and the length of the pin 20 is equal to the depth of the hole 10. In Example 1, the hole 10 penetrates the packaging substrate 100 completely, the depth of the hole 10 is equal to the thickness of the packaging substrate 100, and the length of the pin 20 is equal to the thickness of the packaging substrate 100, as shown in FIG. 8A. Figure 1 In Example 2, the hole 10 does not penetrate the packaging substrate 100 completely, the depth of the hole 10 is less than the thickness of the packaging substrate 100, and the length of the pin 20 is less than the thickness of the packaging substrate 100.

[0083] In some optional embodiments, the depth of the hole is at least 80% of the thickness of the packaging substrate, i.e., the depth of the pin 20 is greater than or equal to 80% of the thickness of the packaging substrate 100, which can improve the bonding force between the pin 20 and the hole 10.

[0084] The packaging structure provided by the embodiment can facilitate heat dissipation. The pin 20 is connected to the inner wall of the hole 10 through the adhesive layer 23 and is clamped in the hole 10. The adhesive layer 23 can further increase the bonding force between the pin 20 and the hole 10, thereby increasing the bonding force between the heat dissipation cover 200 and the packaging substrate 100, reducing the influence of the warping of the packaging substrate 100 on the mounting yield of the heat dissipation cover 200, improving the mounting yield between the heat dissipation cover 200 and the packaging substrate 100, and further improving the stability and heat dissipation performance of the packaging structure.

[0085] In some optional embodiments, the material of the heat dissipation cover 200 is metal, and the material of the pin 20 is metal.

[0086] In some optional embodiments, the material of the pin is the same as the material of the heat dissipation cover;

[0087] The material of the heat dissipation cover 200 is one of copper, nickel, tin, and silver.

[0088] The material of the pin 20 is one of copper, nickel, tin, and silver.

[0089] The material of the adhesive layer 23 is adhesive glue or indium, and the adhesive glue is epoxy resin, polyurethane, amino resin, or rubber.

[0090] The material of the heat dissipation cover 200 and the pin 20 is the same and includes copper, nickel, tin, or silver, which can make the heat dissipation cover 200 be integrally formed without other components, improve the stability of the heat dissipation cover 200, reduce the process difficulty, and further improve the stability of the packaging structure. In addition, the heat dissipation performance of the heat dissipation cover 200 and the packaging structure can be improved due to the high thermal conductivity of copper, nickel, tin, or silver.

[0091] In some alternative embodiments, the material of the heat dissipation cover 200 and the material of the pin 20 can also be other metals.

[0092] In some alternative embodiments, the material of the adhesive layer 23 is an adhesive glue, which is an epoxy resin, a polyurethane, an amino resin or a rubber adhesive glue covering the inner wall of the jack 10; the pin 20 is connected to the inner wall of the jack 10 through the adhesive glue and clamped in the jack 10. In some examples, the adhesive glue can be an epoxy resin, a polyurethane, an amino resin or a rubber.

[0093] In some alternative embodiments, as shown in Figure 5 and Figure 6 the adhesive layer 23 is an indium layer 24; the indium layer 24 covers the surface of the pin 20.

[0094] The inner wall of the jack 10 is also covered with a copper layer.

[0095] The pin 20 is connected to the copper layer of the inner wall of the jack 10 through the indium layer 24 and clamped in the jack 10.

[0096] In specific implementation, the copper layer uniformly covers the inner wall of the jack 10, and the indium layer 24 uniformly covers the surface of the pin 20; since the melting point of the indium layer 24 is low, the indium layer 24 can be bonded to the copper layer of the inner wall of the jack 10 at a low temperature.

[0097] The packaging structure provided by the embodiment facilitates heat dissipation. By setting the low-melting-point indium layer 24 as the adhesive layer 23 on the surface of the pin 20, and covering the inner wall of the jack 10 with a copper layer, the pin 20 can be connected to the copper layer of the inner wall of the jack 10 through the indium layer 24 and clamped in the jack 10, which can increase the bonding force between the jack 10 and the pin 20, and further increase the bonding force between the heat dissipation cover 200 and the packaging substrate 100, reduce the influence of the warping of the packaging substrate 100 on the mounting yield of the heat dissipation cover 200, and improve the mounting yield between the heat dissipation cover 200 and the packaging substrate 100, thereby improving the stability and heat dissipation performance of the packaging structure.

[0098] In some alternative embodiments, the diameter of the pin 20 is 200 μm to 500 μm, for example, 200 μm, 300 μm, 350 μm, 400 μm or 500 μm.

[0099] The thickness of the adhesive layer 23 is 20 μm to 50 μm, for example, 20 μm, 30 μm, 35 μm, 40 μm or 50 μm.

[0100] The diameter of the jack 10 is 240 μm to 600 μm, for example, 240 μm, 360 μm, 420 μm, 480 μm or 600 μm.

[0101] The distance between adjacent pins 20 is 2mm-4mm, for example 2mm, 2.5mm, 3mm, 3.5mm or 4mm;

[0102] The center line of the pin 20 is located on the center plane of the thickness direction of the side wall 22; the center line of the socket 10 is located on the center line of the pin 20;

[0103] The thickness of the side wall 22 is 500μm-1000μm, for example 500μm, 600μm, 750μm, 900μm or 1000μm;

[0104] The distance between the side wall 22 edge and the package substrate 100 edge is 200μm-500μm, for example 200μm, 300μm, 350μm, 400μm or 500μm;

[0105] The distance between the center line of the socket 10 and the package substrate 100 edge is 450μm-1000μm, for example 450μm, 600μm, 725μm, 850μm or 1000μm.

[0106] In particular implementation, as shown in the figure, the center line of the socket 10 and the center line of the pin 20 are located on the same straight line, and both are located on the center plane of the thickness direction of the side wall 22. The thickness of the side wall 22 of the heat dissipation cover 200 is A in the figure, A is 500μm-1000μm; the distance between the side wall 22 edge and the package substrate 100 edge is B in the figure, B is 200μm-500μm; the distance between the center line of the socket 10 and the package substrate 100 edge is C in the figure, C is 200μm-500μm. Figure 2 Figure 2 Figure 2 Figure 2

[0107] The package structure provided by the embodiment can reduce the area occupied by the socket 10 and the pin 20 on the package substrate 100 as much as possible, so that more space on the surface of the package substrate 100 can be reserved for integrating chips and components, thereby improving the surface utilization rate of the package substrate 100; at the same time, the thickness of the adhesive layer 23 is 20μm-50μm, which can ensure that the pin 20 and the socket 10 are bonded and clamped, further increasing the bonding force between the pin 20 and the socket 10, thereby increasing the bonding force between the heat dissipation cover 200 and the package substrate 100, reducing the influence of the warping of the package substrate 100 on the mounting yield of the heat dissipation cover 200, improving the mounting yield between the heat dissipation cover 200 and the package substrate 100, and further improving the stability and heat dissipation performance of the package structure. ​​​​

[0108] In some optional embodiments, the diameter of the pin 20 is 200 μm;

[0109] The thickness of the adhesive layer 23 is 20 μm;

[0110] The diameter of the socket 10 is 240 μm;

[0111] The distance between adjacent pins is 2 mm;

[0112] The thickness of the side wall is 500 μm;

[0113] The distance between the side wall edge and the edge of the packaging substrate is 200 μm;

[0114] The distance between the center line of the socket and the edge of the packaging substrate is 450 μm.

[0115] In particular implementation, Figure 2 A in the formula is 500 μm, B is 200 μm, and C is 450 μm.

[0116] In some optional embodiments, the packaging substrate 100 is rectangular, and the edge region 102 is located around the functional region 101; at least one ring of sockets 10 is arranged around the functional region 101 in the edge region 102, as shown in Figure 3 ;

[0117] The heat dissipation cover 200 includes a top cover 21 and four side walls 22; the top cover 21 is rectangular, and the four side walls 22 are respectively connected to the four edges of the top cover 21 and are connected in a loop, as shown in Figure 4 ;

[0118] The top cover 21, the four side walls 22, and the packaging substrate 100 form a heat dissipation cavity 300, as shown in Figure 1 .

[0119] In some optional embodiments, as shown in Figure 1 , the packaging structure for facilitating heat dissipation further includes:

[0120] A heat sink 30, which is located on a side surface of the top cover 21 away from the packaging substrate 100; the heat sink 30 is connected to the top cover 21 through a first adhesive layer 40; the heat sink 30 is provided with a plurality of heat dissipation structures on a side thereof away from the top cover 21;

[0121] A plurality of second pins 14, which are located on a second surface of the packaging substrate 100, the first surface and the second surface being oppositely arranged.

[0122] The packaging structure convenient for heat dissipation provided by the embodiment can transmit heat to the heat sink 30 through the heat dissipation cover 200, and then reduce the temperature of the packaging structure through the heat dissipation structure, thereby improving the heat dissipation performance of the packaging structure; the heat sink 30 and the top cover 21 are connected through the first adhesive layer 40, which can improve the bonding strength of the heat sink 30 and the heat dissipation cover 200, thereby improving the stability of the packaging structure.

[0123] In an alternative embodiment, as shown in Figure 1 The functional area 101 is provided with the packaging chip 11 and the plurality of capacitors 12 located at the side of the packaging chip 11.

[0124] The packaging chip 11 and the capacitors 12 are located in the heat dissipation cavity 300.

[0125] The thickness of the packaging chip 11 is greater than the thickness of the capacitors 12.

[0126] The height of the heat dissipation cavity 300 is greater than or equal to the thickness of the packaging chip 11 and the capacitors 12.

[0127] The packaging structure convenient for heat dissipation provided by the embodiment can prevent the heat dissipation cover 200 from affecting the functional area 101, and improve the surface utilization rate of the packaging substrate 100; meanwhile, the height of the heat dissipation cavity 300 is greater than or equal to the thickness of the packaging chip 11 and the capacitors 12, which can better protect the packaging chip 11 and the capacitors 12, transmit the heat generated by the packaging chip 11 to the outside through the heat dissipation cover 200, and improve the reliability, stability and heat dissipation performance of the packaging structure.

[0128] In some alternative embodiments, as shown in Figure 1 The top cover 21 and the packaging chip 11 are connected through the second adhesive layer 50.

[0129] The packaging chip 11 further includes a plurality of first pins 13 connected to the first surface of the packaging substrate 100.

[0130] In specific implementation, the electrical signals of the packaging chip 11 can be led out through the plurality of first pins 13.

[0131] The packaging structure convenient for heat dissipation provided by the embodiment can better transmit the heat generated by the chip to the outside through the heat dissipation cover 200, improve the heat dissipation performance of the packaging structure, and further improve the support effect on the heat dissipation cover 200, thereby improving the stability and reliability of the packaging structure.

[0132] In some optional embodiments, the material of the first bonding layer 40 and the second bonding layer 50 can be adhesive glue, such as thermal interface material (TIM) or the like; and the material of the first pin 13 and the second pin 14 is conductive metal, such as copper, tin, silver or the like.

[0133] As shown in the drawings, the present embodiment also provides a packaging structure preparation method for facilitating heat dissipation. The method comprises the following steps: Figure 7

[0134] Step S101, a hole 10 corresponding to the pin 20 of the heat dissipation cover 200 is arranged at the edge area 102 of the packaging substrate 100, and a layer of thin copper or glue is coated on the inner wall of the hole 10; wherein the depth of the hole 10 is less than or equal to the thickness of the packaging substrate 100; and the depth of the hole 10 reaches at least 80% of the thickness of the packaging substrate 100.

[0135] Step S102, the heat dissipation cover 200 is integrally formed, and the pin 20 corresponding to the position of the hole 10 is formed at the bottom of the side wall 22 of the heat dissipation cover 200; the length of the pin 20 is equal to the depth of the hole 10, i.e. the length of the pin 20 is less than or equal to the thickness of the packaging substrate 100.

[0136] Step S103, the first pin 13 of the packaging chip 11 and the capacitor 12 are attached to the functional area 101 of the packaging substrate 100.

[0137] Step S104, the pin 20 of the heat dissipation cover 200 is clamped into the hole 10 of the packaging substrate 100, and is heated and solidified to realize the close connection between the pin 20 and the hole 10, and then realize the attachment between the heat dissipation cover 200 and the packaging substrate 100.

[0138] Step S105, the second pin 14 is formed on the second surface of the packaging substrate 100.

[0139] ​In the description of the present specification, the description of the terms "the embodiment", "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or features of the embodiments or examples described in the present specification without contradiction. In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one feature. In the description of the present application, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0140] In the above description, the technical details such as the arrangement of each layer, etching, etc. are not described in detail. However, those skilled in the art should understand that the layers, regions, etc. of the required shape can be formed by various technical means. In addition, those skilled in the art can also design methods that are not exactly the same as the methods described above in order to form the same structure. In addition, although each embodiment is described above, this does not mean that the measures in each embodiment cannot be used advantageously in combination.

[0141] The above is only the preferred embodiment of the present application and the technical principle applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described above, and those skilled in the art can make various obvious changes, re-adjustments, mutual combinations and substitutions without departing from the scope of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application. The protection scope of the present application is determined by the scope of the appended claims.

Claims

1. A packaging structure facilitating heat dissipation, characterized by, The packaging structure for facilitating heat dissipation comprises: a packaging substrate; a first surface of the packaging substrate is provided with a functional area and an edge area surrounding the functional area; a plurality of insertion holes are arranged in the edge area and arranged around the functional area; a heat dissipation cover located on the first surface of the packaging substrate, the heat dissipation cover comprising a top cover and a side wall; the side wall is connected to the edge of the top cover and is perpendicular to the top cover; the side wall is located between the top cover and the edge area of the packaging substrate; the top cover, the side wall and the packaging substrate form a heat dissipation cavity; a plurality of insertion pins are arranged on the side surface of the side wall away from the top cover, the insertion pins are arranged one by one corresponding to the insertion holes, and the insertion pins are clamped in the insertion holes; the side wall and the edge area are connected through the insertion pins and the insertion holes.

2. The packaging structure for facilitating heat dissipation according to claim 1, wherein the insertion pin is cylindrical; the insertion hole is cylindrical; the depth of the insertion hole is less than or equal to the thickness of the packaging substrate; the depth of the insertion hole reaches at least 80% of the thickness of the packaging substrate; the length of the insertion pin is equal to the depth of the insertion hole; the diameter of the insertion pin is less than the diameter of the insertion hole; an adhesive layer is arranged between the insertion pin and the insertion hole; the insertion pin is connected to the inner wall of the insertion hole through the adhesive layer and is clamped in the insertion hole.

3. The packaging structure for facilitating heat dissipation according to claim 2, wherein the material of the insertion pin is the same as the material of the heat dissipation cover; the material of the heat dissipation cover comprises copper, nickel, tin or silver; the material of the insertion pin comprises copper, nickel, tin or silver; the material of the adhesive layer is adhesive or indium; the adhesive is epoxy resin, polyurethane, amino resin or rubber.

4. The packaging structure for facilitating heat dissipation according to claim 3, wherein the adhesive layer is an indium layer; the indium layer covers the surface of the insertion pin; the inner wall of the insertion hole is covered with a copper layer; the insertion pin is connected to the copper layer of the inner wall of the insertion hole through the indium layer and is clamped in the insertion hole.

5. The packaging structure for facilitating heat dissipation according to claim 2, wherein the diameter of the insertion pin is 200-500 μm; the thickness of the adhesive layer is 20-50 μm; the diameter of the insertion hole is 240-600 μm; the distance between adjacent insertion pins is 2-4 mm; the center line of the insertion pin is located on the center surface of the thickness direction of the side wall; the center line of the insertion hole is located on the center line of the insertion pin; the thickness of the side wall is 500-1000 μm; the distance between the edge of the side wall and the edge of the packaging substrate is 200-500 μm; the distance between the center line of the insertion hole and the edge of the packaging substrate is 450-1000 μm.

6. The packaging structure for facilitating heat dissipation according to claim 5, wherein the diameter of the insertion pin is 200 μm; the thickness of the adhesive layer is 20 μm; the diameter of the insertion hole is 240 μm; the distance between adjacent insertion pins is 2 mm; The thickness of the side wall is 500 μm; The distance between the side wall edge and the package substrate edge is 200 μm; The distance between the center line of the insertion hole and the package substrate edge is 450 μm.

7. The package structure of claim 1, wherein, The package substrate is rectangular, and the edge region is located around the functional region; at least one insertion hole is arranged around the functional region in the edge region; The heat dissipation cover comprises the top cover and four side walls; the top cover is rectangular, and the four side walls are connected to the four edges of the top cover and connected in a head-to-tail manner; The top cover, the four side walls and the package substrate form a heat dissipation cavity.

8. The package structure of claim 1, wherein, The package structure further comprises: a heat sink located on the side surface of the top cover away from the package substrate; the heat sink is connected to the top cover through a first adhesive layer; the heat sink is provided with a plurality of heat dissipation structures on the side away from the top cover; a plurality of second pins located on the second surface of the package substrate, and the first surface and the second surface are arranged oppositely.

9. The package structure of claim 1, wherein, The functional region is provided with a package chip and a plurality of capacitors located on the side of the package chip; The package chip and the capacitors are located in the heat dissipation cavity; The thickness of the package chip is greater than the thickness of the capacitors; The height of the heat dissipation cavity is greater than or equal to the thickness of the package chip.

10. The package structure of claim 9, wherein, The top cover is connected to the package chip through a second adhesive layer; The package chip further comprises a plurality of first pins connected to the first surface of the package substrate.

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