Mask for deposition and mask assembly including same

Abstract

The utility model provides a mask for deposition and a mask assembly comprising the mask for deposition. The mask for deposition includes: a mask unit region having a plurality of pixel openings; and the edge areas are respectively arranged on two sides of the mask unit area along the first direction. Each of the pixel openings extends in a second direction that intersects the first direction. Each of the pixel opening portions has a first width in the first direction at both side edge portions in the second direction, and each of the pixel opening portions has a second width in the first direction smaller than the first width at a center portion in the second direction.

Description

Technical Field

[0001] This utility model relates to a deposition mask and a mask assembly including the deposition mask. Background Technology

[0002] Organic light emitting display devices (OLEDs) used as flat panel displays have advantages such as low power consumption, high brightness, wide viewing angle, and fast response speed, and are therefore widely used as display devices for portable electronic devices.

[0003] Organic light-emitting display devices may include organic light-emitting diodes (OLEDs) comprising pixel electrodes, an emissive layer, and a common electrode. The emissive layer can be formed by a deposition process, in which a deposition mask such as a fine metal mask (FMM) can be used. For example, a mask assembly can be arranged between a deposition source and a substrate, and material evaporated from the deposition source can be deposited on the substrate through the pixel openings of the mask assembly.

[0004] The mask assembly may include multiple deposition masks used as shadow masks. The deposition masks may have multiple pixel openings and may be mounted on a mask frame having a generally rectangular ring shape. In particular, the deposition masks may be mounted on the mask frame in a stretched state along their length to prevent warping due to their own weight.

[0005] For example, the deposition mask can be fixed to a mask frame by welding while a tensile force is applied along its length, thereby preventing warping of the deposition mask during the deposition process. However, applying a tensile force along the length of the deposition mask may cause deformation of the pixel openings, potentially leading to a decrease in the uniformity of the position, size, and shape of the deposited material layer formed by the deposition process. Reducing the tensile force to address these issues may increase warping of the deposition mask during the deposition process. Utility Model Content

[0006] Technical issues

[0007] The problem to be solved by this invention is to provide an improved deposition mask for reducing deformation of pixel openings and a mask assembly including the deposition mask.

[0008] The technical problems of this utility model are not limited to those mentioned above. Those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0009] Technical solution

[0010] A deposition mask according to an embodiment for solving the above-mentioned technical problem may include: a mask unit region having a plurality of pixel openings; and an edge region respectively arranged on both sides of the mask unit region along a first direction. Specifically, each of the pixel openings may extend along a second direction intersecting the first direction, each of the pixel openings may have a first width along the first direction at its two side edge portions in the second direction, and each of the pixel openings may have a second width along the first direction at its central portion in the second direction, which is smaller than the first width.

[0011] According to one embodiment, the pixel openings can be arranged in a Z-shape along the first direction and can be arranged linearly along the second direction.

[0012] According to one embodiment, the ratio of the second width to the first width can be from 0.3 to 0.9.

[0013] According to one embodiment, the pixel opening may be defined by a lip region extending in a Z-shape along the second direction and a bridging region connecting the lip regions along the first direction.

[0014] According to one embodiment, the first width may be greater than the thickness of the mask unit region and less than twice the width of the lip region along the first direction.

[0015] According to one embodiment, the width of the lip region along the first direction may be the same as the width of the bridging region along the second direction.

[0016] According to one embodiment, the deposition mask may further include: a dummy region surrounding the mask unit region, and the dummy region may have a plurality of dummy openings.

[0017] According to one embodiment, the deposition mask may further include: a peripheral region surrounding the dummy region, and the edge regions may be arranged on both sides of the peripheral region along the first direction.

[0018] According to one embodiment, each of the dummy openings may have the same shape as each of the pixel openings.

[0019] According to one embodiment, the dummy openings can be arranged in the same shape as the pixel openings.

[0020] A mask assembly according to an embodiment for solving the above-mentioned problems may include: a mask frame having a frame opening; and a deposition mask disposed on the mask frame. The deposition mask may include a mask unit region having a plurality of pixel openings and edge regions disposed on both sides of the mask unit region along a first direction. Each of the pixel openings may extend along a second direction intersecting the first direction, each of the pixel openings may have a first width along the first direction at its two side edge portions in the second direction, and each of the pixel openings may have a second width along the first direction at its central portion in the second direction, which is smaller than the first width.

[0021] According to one embodiment, in the mask assembly, the pixel openings can be arranged in a Z-shape along the first direction and can be arranged linearly along the second direction.

[0022] According to one embodiment, in the mask assembly, the ratio of the second width to the first width can be from 0.3 to 0.9.

[0023] According to one embodiment, in the mask assembly, the pixel opening may be defined by a lip region extending in a Z-shape along the second direction and a bridging region connecting the lip regions along the first direction.

[0024] According to one embodiment, in the mask assembly, the first width may be greater than the thickness of the mask unit region and less than twice the width of the lip region along the first direction.

[0025] According to one embodiment, in the mask assembly, the width of the lip region along the first direction may be the same as the width of the bridging region along the second direction.

[0026] According to one embodiment, in the mask assembly, the deposition mask may further include: a dummy region surrounding the mask unit region, and the dummy region may have a plurality of dummy openings.

[0027] According to one embodiment, in the mask assembly, the deposition mask may further include: a peripheral region surrounding the dummy region, and the edge regions may be respectively arranged on both sides of the peripheral region along the first direction.

[0028] According to one embodiment, in the mask assembly, each of the dummy openings may have the same shape as each of the pixel openings, and the dummy openings may be arranged in the same form as the pixel openings.

[0029] According to one embodiment, in the mask assembly, the edge region of the deposition mask can be fixed to the mask frame while being stretched along a first direction.

[0030] Specific details of other embodiments are included in the detailed description and accompanying drawings.

[0031] Technical effect

[0032] According to the embodiments of the present invention described above, when a tensile force is applied to the deposition mask, the tensile strain rate of the deposition mask can be reduced, thereby reducing deformation of the pixel opening. Furthermore, a greater tensile force can be applied to the deposition mask, thus reducing warping of the deposition mask.

[0033] The effects of the embodiments are not limited to the content of the above examples, and more diverse effects are included in this specification. Attached Figure Description

[0034] Figure 1 This is a schematic plan view used to illustrate a display device according to an embodiment.

[0035] Figure 2 It is used for explanation Figure 1 The diagram shows a schematic side view of the curved area of ​​the display panel in a bent state.

[0036] Figure 3 It is used for explanation Figure 1 A schematic enlarged plan view of an example of the display area shown.

[0037] Figure 4 It is used for explanation Figure 1 A schematic enlarged plan view of another example of the display area shown.

[0038] Figure 5 It is used to illustrate along Figure 3 A schematic cross-sectional view of an example display panel obtained by the I-I' line.

[0039] Figure 6 This is a schematic diagram illustrating a deposition apparatus according to one embodiment.

[0040] Figure 7 This is a perspective view illustrating a deposition mask and mask assembly according to an embodiment.

[0041] Figure 8It is used for explanation Figure 7 A schematic three-dimensional view of the mask frame shown.

[0042] Figure 9 It is used for explanation Figure 7 The diagram shows a schematic plan view of the deposition mask.

[0043] Figure 10 It is used for explanation Figure 7 A schematic enlarged plan view of the pixel opening shown.

[0044] Figure 11 It is used to illustrate the use of Figure 8 A schematic enlarged plan view of the light-emitting layer formed by the deposition process of the mask assembly shown.

[0045] Explanation of reference numerals in the attached figures

[0046] Detailed Implementation

[0047] The advantages, features, and methods of achieving these advantages and features of the present invention will become clear from the detailed embodiments described below in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but is implemented in various different forms. These embodiments are provided only to complete the disclosure of the present invention and to fully inform those skilled in the art of the invention of its scope, which is defined only by the scope of the claims.

[0048] When an element or layer is referred to as being "on" another element or layer, this includes all cases where another layer or other element is sandwiched directly above or in the middle of another element or layer. Throughout this specification, the same reference numerals refer to the same constituent elements. The shapes, sizes, ratios, angles, quantities, etc., disclosed in the drawings used to illustrate embodiments are exemplary, and therefore, this invention is not limited to the matters illustrated.

[0049] Although terms like "first," "second," etc., are used to describe multiple constituent elements, these constituent elements are clearly not limited by these terms. These terms are only used to distinguish one constituent element from another. Therefore, the first constituent element mentioned below can obviously also be a second constituent element within the technical concept of this utility model.

[0050] The various features of the various embodiments of this utility model can be partially or entirely combined or integrated with each other, and can be linked and driven in various ways. The various embodiments can be implemented independently of each other, or they can be implemented together through association.

[0051] The specific embodiments will now be described with reference to the accompanying drawings.

[0052] Figure 1 This is a schematic plan view used to illustrate a display device according to an embodiment. Figure 2 It is used for explanation Figure 1 The diagram shows a schematic side view of the curved area of ​​the display panel in a bent state.

[0053] Reference Figure 1 and Figure 2 According to one embodiment, the display device 10 can be a device for displaying moving or still images. For example, the display device 10 can be applied to portable electronic devices such as mobile phones, smartphones, tablet PCs, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigators, and ultra-portable PCs (UMPCs). The display device 10 can be used as a display unit for televisions, laptop computers, monitors, billboards, or Internet of Things (IoT) devices. The display device 10 can be applied to wearable devices such as smartwatches, watch phones, glasses displays, and head-mounted displays (HMDs). In addition, the display device 10 can be applied to the dashboard, the center console, the instrument panel, the room mirror display (in place of the rearview mirror), or the back of the front seat as an entertainment device for the rear seats of the vehicle.

[0054] In this specification, for example, the first direction DR1, which is the direction of the long side of the display device 10, can be the longitudinal direction of the display device 10. For example, the second direction DR2, which is the direction of the short side of the display device 10, can be the transverse direction of the display device 10. The third direction DR3 can be the thickness direction of the display device 10.

[0055] The display device 10 can be formed into a planar shape similar to a quadrilateral. For example, as Figure 1As shown, the display device 10 can be a quadrilateral with a long side in the first direction DR1 and a short side in the second direction DR2. The corners where the long side in the first direction DR1 and the short side in the second direction DR2 intersect can be smoothly formed with a predetermined curvature or formed as right angles. The planar shape of the display device 10 is not limited to a quadrilateral, and can be formed similarly to other polygons, circles, or ellipses.

[0056] The display device 10 may include a display panel 100. The display panel 100 may include a rigid substrate such as a glass substrate or a flexible substrate that is bending, folding, or rolling. For example, the display panel 100 may include a polymer resin substrate such as a polyimide substrate.

[0057] Display panel 100 can be a light-emitting display panel that includes a light-emitting element. For example, display panel 100 can be an organic light-emitting display panel using an organic light-emitting diode (OLED) including an organic light-emitting layer, a micro light-emitting diode display panel using a micro LED, a quantum dot light-emitting display panel using a quantum dot light-emitting diode including a quantum dot light-emitting layer, or an inorganic light-emitting display panel using an inorganic light-emitting element including an inorganic semiconductor. Hereinafter, the case where display panel 100 is an organic light-emitting display panel will be described as an example. However, the scope of this invention is not limited thereto.

[0058] The display panel 100 may include a main region MR, a curved region BR extending from one side of the main region MR, and a sub-region SR extending from one side of the curved region BR. The curved region BR may be a region disposed between the main region MR and the sub-region SR, and may be curved with a preset curvature. When the curved region BR is curved, the sub-region SR may be arranged to overlap with the main region MR on a third-direction DR3.

[0059] The main region MR may include a display area DA and a non-display area NDA. The display area DA may be a pixel region including pixels for displaying an image, and the non-display area NDA may be arranged to surround the display area DA. Signal wiring or driving circuitry for applying signals to the display area DA may be arranged in the non-display area NDA.

[0060] The curved region BR can be connected to one end of the main region MR. The width of the curved region BR can be smaller than the width of the main region MR. In the curved region BR, the display panel 100 can be bent towards the rear surface of the display device with a preset curvature.

[0061] The sub-region SR can extend from one end of the curved region BR in a direction parallel to the main region MR. For example... Figure 2 As shown, the sub-region SR can overlap with the main region MR in the thickness direction of the display panel 100. The sub-region SR can overlap with a portion of the non-display region NDA and a portion of the display region DA.

[0062] A driver chip 110 may be disposed on a sub-region SR of the display panel 100. The driver chip 110 may include an integrated circuit for driving the display panel 100. The driver chip 110 may be mounted onto the display panel 100 in the sub-region SR. For example, the driver chip 110 may be attached to the display panel 100 by means of an anisotropic conductive film, or by means of ultrasonic bonding.

[0063] A pad portion (not shown) may be arranged at the end of the sub-region SR of the display panel 100. The display panel 100 can be connected to the display driving substrate 120 through the pad portion. The display driving substrate 120 may be a flexible printed circuit board or a thin film.

[0064] Multiple signal traces can be arranged in the sub-region SR, the curved region BR, and the main region MR. The signal traces can extend from the main region MR through the curved region BR to the pads of the sub-region SR.

[0065] Figure 3 It is used for explanation Figure 1 A schematic enlarged plan view of an example of the display area shown. Figure 4 It is used for explanation Figure 1 A schematic enlarged plan view of another example of the display area shown.

[0066] Reference Figure 3 Each of the multiple pixels PX may include a first sub-pixel SP1, a second sub-pixel SP2, and a third sub-pixel SP3. The first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 may each include a light-emitting region EA1, EA2, and EA3, respectively. For example, the first sub-pixel SP1 may include a first light-emitting region EA1, the second sub-pixel SP2 may include a second light-emitting region EA2, and the third sub-pixel SP3 may include a third light-emitting region EA3.

[0067] Each of the first light-emitting region EA1, the second light-emitting region EA2, and the third light-emitting region EA3 can be defined by a pixel-defined film (PDL, see [link]). Figure 5 The area is defined by the direction DR2. For example, in each pixel PX, the first light-emitting area EA1 and the second light-emitting area EA2 can be adjacent to each other along the second direction DR2, and the third light-emitting area EA3 can be adjacent to the first light-emitting area EA1 and the second light-emitting area EA2 along the first direction DR1. In this case, the third light-emitting area EA3 of pixel PX can be adjacent to each other along the second direction DR2.

[0068] The length of the third light-emitting region EA3 in the first direction DR1 can be greater than the length of the first light-emitting region EA1 in the first direction DR1 and the length of the second light-emitting region EA2 in the first direction DR1, and the length of the third light-emitting region EA3 in the second direction DR2 can be greater than the length of the first light-emitting region EA1 in the second direction DR2 and the length of the second light-emitting region EA2 in the second direction DR2.

[0069] Furthermore, the lengths of the first luminous region EA1 along the first direction DR1 and the second luminous region EA2 along the first direction DR1 can be substantially the same, and the lengths of the first luminous region EA1 along the second direction DR2 and the second luminous region EA2 along the second direction DR2 can also be substantially the same. That is, the area of ​​the third luminous region EA3 can be larger than the areas of the first luminous region EA1 and the second luminous region EA2, and the areas of the first luminous region EA1 and the second luminous region EA2 can be substantially the same. However, unlike the above, the areas of the first luminous region EA1 and the second luminous region EA2 can also be different from each other.

[0070] The first emitting region EA1 can emit light of a first color, the second emitting region EA2 can emit light of a second color, and the third emitting region EA3 can emit light of a third color. The first color of light can be red, the second color can be green, and the third color can be blue. For example, blue can refer to light whose peak wavelength is approximately 370nm to 460nm, green can refer to light whose peak wavelength is approximately 480nm to 560nm, and red can refer to light whose peak wavelength is approximately 600nm to 750nm. As another example... Figure 4 As shown, the third light-emitting area EA3 of pixel PX can be arranged along the second direction DR2, and the third light-emitting areas EA3 of two pixels PX that are adjacent to each other along the second direction DR2 can be arranged to be adjacent to each other.

[0071] Figure 5 It is used to illustrate along Figure 3 A schematic cross-sectional view of an example display panel obtained by the I-I' line.

[0072] Reference Figure 5 The display panel 100 may include a base substrate SUB. For example, the display panel 100 may include a flexible substrate such as a polyimide substrate. According to one embodiment, the base substrate SUB of the display panel 100 may include a first base substrate SUB1, a barrier film BR1 disposed on the first base substrate SUB1, and a second base substrate SUB2 disposed on the barrier film BR1. The first base substrate SUB1 and the second base substrate SUB2 may be constructed using a flexible material such as polyimide.

[0073] The barrier film BR1 is a thin film used to prevent moisture from penetrating through the first base substrate SUB1 and the second base substrate SUB2 into the transistor of the thin-film transistor layer TFTL and the light-emitting layer 172 of the light-emitting element layer EML. Although not shown, the barrier film BR1 may include multiple inorganic films. For example, the barrier film BR1 may be a multilayer film stacked with inorganic films such as silicon nitride film, silicon oxynitride film, silicon oxide film, titanium oxide film, aluminum oxide film, etc.

[0074] On the second base substrate SUB2, a thin-film transistor layer (TFTL) including thin-film transistors, a light-emitting element layer (EML) including light-emitting elements (LEs), a packaging layer (TFEL) encapsulating the light-emitting elements (LEs), and a touch sensing unit (TDU) can be stacked sequentially. Although not shown, Figure 5 At least some of the layers shown may not be arranged in the non-display area NDA of the display panel 100. The thin-film transistor layer TFTL, the light-emitting element layer EML, and the encapsulation layer TFEL perform the function of displaying images and may be named the display unit DU, but its name is not limited thereto.

[0075] Thin-film transistors used to drive pixel driving circuits for each pixel PX are arranged on the second base substrate SUB2. Figure 5 The diagram illustrates any first thin-film transistor (TFT1) in a pixel driving circuit. For example, the first TFT1 can function as a driving transistor in the pixel driving circuit.

[0076] The first thin-film transistor TFT1 may include a first active layer ACT1 and a first gate electrode G1. The first active layer ACT1 may include polycrystalline silicon, monocrystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, or oxide semiconductor.

[0077] The first active layer ACT1 may include a first source region S1, a first channel region CHA1, and a first drain region D1. The first channel region CHA1 may be a region that overlaps with the first gate electrode G1 in the thickness direction (i.e., the third direction DR3) of the base substrate SUB, and may be disposed between the first source region S1 and the first drain region D1. That is, the first gate electrode G1 may be disposed on the first channel region CHA1. The first source region S1 and the first drain region D1 may be regions that are conductive by doping ions or impurities in silicon semiconductor or oxide semiconductor.

[0078] A gate insulating film 130 may be disposed on the second base substrate SUB2 and the first active layer ACT1 of the first thin film transistor TFT1. The gate insulating film 130 may be composed of inorganic materials such as silicon nitride (SiN), silicon oxynitride (SiON), silicon oxide (SiOx), titanium oxide (TiOx), aluminum oxide (AlOx), tantalum oxide (TaOx), hafnium oxide (HfOx).

[0079] A first gate electrode G1 and a first capacitor electrode CAE1 of a first thin-film transistor TFT1 can be disposed on the gate insulating film 130. The first gate electrode G1 can overlap with the first active layer ACT1 on the third-direction DR3. Figure 5 The diagram shows the first gate electrode G1 and the first capacitor electrode CAE1 arranged separately from each other, but the first gate electrode G1 and the first capacitor electrode CAE1 can also be connected to each other. The first gate electrode G1 and the first capacitor electrode CAE1 can be formed as a single layer or multiple layers using one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or alloys thereof.

[0080] An interlayer insulating film 140 may be disposed on the first gate electrode G1 and the first capacitor electrode CAE1 of the first thin-film transistor TFT1. Specifically, a first interlayer insulating film 141 may be disposed on the first gate electrode G1 and the first capacitor electrode CAE1 of the first thin-film transistor TFT1. The first interlayer insulating film 141 may be composed of inorganic materials such as silicon nitride (SiN), silicon oxynitride (SiON), silicon oxide (SiOx), titanium oxide (TiOx), aluminum oxide (AlOx), tantalum oxide (TaOx), hafnium oxide (HfOx), etc.

[0081] A second capacitor electrode CAE2 can be disposed on the first interlayer insulating film 141. The second capacitor electrode CAE2 can overlap with the first capacitor electrode CAE1 on the third-direction DR3. When the first capacitor electrode CAE1 is connected to the first gate electrode G1, the second capacitor electrode CAE2 can overlap with the first gate electrode G1 on the third-direction DR3. Since the first interlayer insulating film 141 has a predetermined dielectric constant, a capacitor can be formed by the first capacitor electrode CAE1, the second capacitor electrode CAE2, and the first interlayer insulating film 141 disposed between them. The second capacitor electrode CAE2 can be formed as a single layer or multiple layers made of one or an alloy of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu).

[0082] A second interlayer insulating film 142 can be disposed on the first interlayer insulating film 141 and the second capacitor electrode CAE2. The second interlayer insulating film 142 can be made of materials such as silicon nitride (SiN), silicon oxynitride (SiON), or silicon oxide (SiO). x Titanium oxide (TiO) x ), aluminum oxide (AlO) x ), tantalum oxide (TaO) x ), hafnium oxide (HfO) x It is composed of inorganic substances such as .

[0083] A first anode connection electrode ANDE1 can be disposed on the second interlayer insulating film 142. The first anode connection electrode ANDE1 can be connected to the first drain region D1 of the first thin-film transistor TFT1 through a first connection contact hole ANCT1 that penetrates the gate insulating film 130, the first interlayer insulating film 141, and the second interlayer insulating film 142. The first anode connection electrode ANDE1 can be formed as a single layer or multiple layers made of one or an alloy of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu).

[0084] A first planarization film 160 for planarizing the step difference caused by the first thin-film transistor TFT1 can be disposed on the second interlayer insulating film 142 and the first anode connection electrode ANDE1. The first planarization film 160 can be made of organic materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0085] A second anode connection electrode ANDE2 can be disposed on the first planarization film 160. The second anode connection electrode ANDE2 can be connected to the first anode connection electrode ANDE1 through a second connection contact hole ANCT2 penetrating the first planarization film 160. The second anode connection electrode ANDE2 can be formed as a single layer or multiple layers using one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0086] A second planarization film 180 may be disposed on the first planarization film 160 and the second anode connection electrode ANDE2. The second planarization film 180 may be composed of organic materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0087] Light-emitting elements (LEs) and pixel definition films (PDLs) can be arranged on the second planarization film 180. Each of the light-emitting elements (LEs) may include a pixel electrode 171, a light-emitting layer 172, and a common electrode 173.

[0088] Pixel electrode 171 can be disposed on the second planarization film 180. Pixel electrode 171 can be connected to the second anode connection electrode ANDE2 through the third connection contact hole ANCT3 penetrating the second planarization film 180, and can be used as the anode electrode of the light-emitting element LE. For example, for a top emission structure that emits light towards the common electrode 173 with reference to the light-emitting layer 172, pixel electrode 171 can have a structure that can improve reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and indium tin oxide (ITO) (ITO / Al / ITO), or a stacked structure of APC alloy and ITO (ITO / APC / ITO). Alternatively, pixel electrode 171 can also be made of APC alloy. APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0089] The pixel definition film (PDL) can be used to define the light-emitting regions EA1, EA2, and EA3 of sub-pixels SP1, SP2, and SP3. The light-emitting regions EA1, EA2, and EA3 represent the regions that emit light by sequentially stacking the pixel electrode 171, the light-emitting layer 172, and the common electrode 173, so that holes from the pixel electrode 171 and electrons from the common electrode 173 recombine in the light-emitting layer 172.

[0090] The pixel definition film (PDL) can be arranged to cover the edge portion of the pixel electrode 171. That is, the pixel definition film (PDL) can have multiple openings that partially expose the pixel electrode 171. The pixel definition film (PDL) can be made of organic materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0091] A light-emitting layer 172 may be disposed on the pixel electrode 171 and the pixel definition film PDL. The light-emitting layer 172 may comprise a polymer or low-molecular-weight organic material that emits light of a predetermined color. Alternatively, the light-emitting layer 172 may comprise an inorganic light-emitting material or quantum dots.

[0092] The light-emitting layer 172 in the light-emitting regions EA1, EA2, and EA3 can be formed by a deposition process using a deposition mask. For example, the light-emitting layer 172 in the first light-emitting region EA1 can be formed by a deposition process using a deposition mask that exposes the pixel electrode 171 of the first light-emitting region EA1; the light-emitting layer 172 in the second light-emitting region EA2 can be formed by a deposition process using a deposition mask that exposes the pixel electrode 171 of the second light-emitting region EA2; and the light-emitting layer 172 in the third light-emitting region EA3 can be formed by a deposition process using a deposition mask that exposes the pixel electrode 171 of the third light-emitting region EA3. In this case, the deposition mask can have a pixel opening that exposes the pixel electrode 171 in the light-emitting regions EA1, EA2, and EA3, and in the deposition process, vapor-phase light-emitting material can be deposited on the pixel electrode 171 through the pixel opening.

[0093] In particular, such as Figure 4 As shown, when the two third light-emitting regions EA3 are arranged adjacent to each other, each of the pixel openings of the deposition mask can correspond to the two adjacent third light-emitting regions EA3 respectively. That is, in the deposition process, the gas-phase light-emitting material can be deposited on the two pixel electrodes 171 through one pixel opening.

[0094] Although Figure 5While not shown in the diagram, a first functional layer (not shown) may be disposed on the pixel electrode 171 and the pixel definition film PDL, and a second functional layer (not shown) may be disposed on the first functional layer and the light-emitting layer 172. For example, the first functional layer may include a hole transport layer (HTL), or a hole transport layer and a hole injection layer (HIL). The second functional layer may include an electron transport layer (ETL) and / or an electron injection layer (EIL). The first functional layer and / or the second functional layer are the same as the common electrode 173 described later, and may be a common layer formed in a manner that covers the entire lower layer.

[0095] The common electrode 173 can be disposed on the light-emitting layer 172. The common electrode 173 can be disposed to cover the light-emitting layer 172. The common electrode 173 can be disposed together in a common layer of the first light-emitting region EA1, the second light-emitting region EA2, and the third light-emitting region EA3.

[0096] In the top light-emitting structure, the common electrode 173 can be formed using a transparent conductive material (TCM) such as indium tin oxide (ITO) or indium zinc oxide (IZO), which are capable of transmitting light, or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). When the common electrode 173 is formed using a semi-transmissive conductive material, the light extraction efficiency of the common electrode 173 can be improved by means of a microcavity.

[0097] Spacers 190 may be arranged on the pixel definition film (PDL). Spacers 190 can be used to maintain a constant spacing between the base substrate (SUB) and the deposition mask during the deposition process of forming the light-emitting layer 172. Spacers 190 can be formed using organic materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0098] An encapsulation layer TFEL may be disposed on the common electrode 173. The encapsulation layer TFEL may include at least one inorganic film for preventing oxygen or moisture from penetrating into the light-emitting element layer EML. In addition, the encapsulation layer TFEL may include at least one organic film for protecting the light-emitting element layer EML from foreign matter such as dust. For example, the encapsulation layer TFEL may include a first encapsulation inorganic film TFE1, an encapsulation organic film TFE2, and a second encapsulation inorganic film TFE3.

[0099] The first encapsulating inorganic film TFE1 can be disposed on the common electrode 173, the encapsulating organic film TFE2 can be disposed on the first encapsulating inorganic film TFE1, and the second encapsulating inorganic film TFE3 can be disposed on the encapsulating organic film TFE2. The first encapsulating inorganic film TFE1 and the second encapsulating inorganic film TFE3 can be made of materials such as silicon nitride (SiN), silicon oxynitride (SiON), and silicon oxide (SiO). x Titanium oxide (TiO) x ), aluminum oxide (AlO) x ), tantalum oxide (TaO) x ), hafnium oxide (HfO) x It is composed of inorganic materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. The encapsulating organic film TFE2 can be composed of organic materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0100] A touch sensing unit (TDU) can be arranged on the TFEL packaging layer. The touch sensing unit (TDU) can be a mutual capacitance type touch sensor or a self-capacitance type touch sensor. Figure 5 A mutual capacitance type touch sensor is shown, but the present invention is not limited thereto. The touch sensing unit (TDU) may include a first touch insulating film (TINS1), a connecting electrode (BE1), a second touch insulating film (TINS2), a driving electrode (TE), a sensing electrode (RE), and a third touch insulating film (TINS3).

[0101] The first touch insulating film TINS1 can be made of inorganic materials such as silicon nitride (SiN), silicon oxynitride (SiON), silicon oxide (SiOx), titanium oxide (TiOx), aluminum oxide (AlOx), tantalum oxide (TaOx), hafnium oxide (HfOx).

[0102] A connecting electrode BE1 may be arranged on the first touch insulating film TINS1. The connecting electrode BE1 may be formed as a single layer or multiple layers of one or an alloy of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu).

[0103] A second touch insulating film TINS2 is disposed on the connecting electrode BE1. The second touch insulating film TINS2 can be made of materials such as silicon nitride (SiN), silicon oxynitride (SiON), or silicon oxide (SiO). x Titanium oxide (TiO) x ), aluminum oxide (AlO) x ), tantalum oxide (TaO) x ), hafnium oxide (HfO) x It can be composed of inorganic materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. Alternatively, the second touch insulating film TINS2 can be composed of organic materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0104] A driving electrode TE and a sensing electrode RE can be arranged on the second touch insulating film TINS2. The driving electrode TE and the sensing electrode RE can be formed as a single layer or multiple layers using one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys.

[0105] The driving electrode TE and the sensing electrode RE can overlap with the connecting electrode BE1 on the third-direction DR3. The driving electrode TE can be connected to the connecting electrode BE1 through the touch contact hole TCNT1 that passes through the second touch insulating film TINS2.

[0106] A third touch insulating film TINS3 is formed on the driving electrode TE and the sensing electrode RE. The third touch insulating film TINS3 can flatten the step difference formed by the driving electrode TE, the sensing electrode RE and the connecting electrode BE1. The third touch insulating film TINS3 can be formed using organic materials such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0107] Figure 6 This is a schematic diagram illustrating a deposition apparatus according to one embodiment.

[0108] Reference Figure 6 The deposition apparatus 200 can be used to form a deposited material layer on the substrate 202. For example, such as... Figure 5 As shown, a pixel electrode 171 and a pixel definition film (PDL) exposing the pixel electrode 171 can be disposed on the substrate 202. The deposition apparatus 200 can be used to form a light-emitting layer 172 on the pixel electrode 171. The deposition apparatus 200 includes a deposition source 220 for providing a vapor-phase deposition material on the substrate 202, a mask assembly 300 disposed on the upper part of the deposition source 220, a first support portion 230 for supporting the mask assembly 300, and a second support portion 240 disposed on the upper part of the first support portion 230 for supporting the substrate 202.

[0109] Deposition source 220, mask assembly 300, first support 230, and second support 240 can be arranged within process chamber 210. Process chamber 210 can be equipped with an internal space, and a deposition process for forming a deposited material layer on substrate 202 can be performed within the internal space of process chamber 210. Although not shown, process chamber 210 can be connected to a vacuum pump (not shown), and the internal space of process chamber 210 can be created into a vacuum atmosphere by means of the vacuum pump. An opening (not shown) for entry and exit of substrate 202 can be provided on one side wall of process chamber 210, and the opening can be opened and closed by means of a gate valve (not shown).

[0110] The deposition source 220 can contain deposited material. The deposition source 220 can evaporate or sublimate deposited material such as organic, inorganic, or conductive materials, and the gaseous deposited material provided by the deposition source 220 can be deposited on the substrate 202 through the mask assembly 300. For example, the deposition source 220 can evaporate organic material used to form the light-emitting layer 172 on the substrate 202, and the evaporated organic material can be deposited on the pixel electrode 171 on the substrate 202 through the mask assembly 300.

[0111] The mask assembly 300 may include a mask frame 400 and a deposition mask 500 disposed on the mask frame 400. The deposition mask 500 may have multiple pixel openings, and vapor-phase deposited material provided by the deposition source 220 can be deposited on the substrate 202 through the pixel openings. The mask assembly 300 will be described later.

[0112] The first support portion 230 can support the edge portion of the mask assembly 300. For example, the first support portion 230 can support the mask frame 400 and can hold the mask frame 400 using electrostatic force. As another example, the first support portion 230 can be equipped with a clamp for fixing the mask frame 400. Although not shown, the first support portion 230 can be configured to be movable in the vertical direction (i.e., the third direction) by means of a first drive portion (not shown).

[0113] The second support portion 240 can support the substrate 202 and can orient the pixel electrode 171 formed on the front surface of the substrate 202 (i.e., on the substrate 202) toward the mask assembly 300. For example, the second support portion 240 may include an electrostatic chuck that uses electrostatic force to hold the rear surface of the substrate 202. Although not shown, the second support portion 240 may be configured to be movable in the vertical direction by a second drive portion (not shown), and may also be configured to be movable and rotated in the horizontal direction to adjust the position of the substrate 202. For example, the second support portion 240 may include a UVW platform.

[0114] A magnetic supply source 250 may be arranged on the upper part of the second support portion 240. The magnetic supply source 250 may include a plurality of magnets and may use magnetic force to tightly adhere the deposition mask 500 to the substrate 202. For example, the magnetic supply source 250 may be configured to be able to move in a vertical direction by means of a third drive portion (not shown). In this case, after the substrate 202 is loaded onto the second support portion 240, the magnetic supply source 250 may be lowered adjacent to the second support portion 240, thereby allowing the deposition mask 500 to be tightly adhered to the front surface of the substrate 202 by the magnetic force provided by the magnetic supply source 250.

[0115] Figure 7 This is a perspective view illustrating a deposition mask and mask assembly according to one embodiment. Figure 8 It is used for explanation Figure 7 A schematic three-dimensional view of the mask frame shown.

[0116] Reference Figure 7 and Figure 8 The mask assembly 300 may include a mask frame 400 and a deposition mask 500 disposed on the mask frame 400.

[0117] For example, the mask frame 400 may have a generally rectangular ring shape including a frame opening 450, and may include a plurality of sub-frames forming the frame opening 450. The mask frame 400 may include a first sub-frame 410 and a second sub-frame 420 extending parallel to a first direction DR1, and a third sub-frame 430 and a fourth sub-frame 440 extending parallel to a second direction DR2. The first sub-frame 410 and the second sub-frame 420 may be spaced apart from each other along the second direction DR2, and the third sub-frame 430 and the fourth sub-frame 440 may be spaced apart from each other along the first direction DR1. In this case, the second direction DR2 may be a direction perpendicular to the first direction DR1.

[0118] like Figure 7 As shown, although the mask frame 400 has a roughly rectangular ring shape, unlike other shapes, the mask frame 400 can have various shapes such as polygons (triangles, pentagons, etc.) and circles, ellipses, etc. Furthermore, as... Figure 7 As shown, the frame opening 450 can have a shape that is roughly rectangular on the plane, but unlike this, the frame opening 450 can have a variety of shapes such as polygons such as triangles and pentagons, as well as circles and ellipses.

[0119] The first subframe 410, second subframe 420, third subframe 430, and fourth subframe 440 can have a thickness that is thin relative to their width and length. If the thickness is too thick, it may restrict the deposition material from passing through the deposition mask 500 during the deposition process using the mask assembly 300; conversely, if the thickness is too thin, it may be difficult to ensure the rigidity used to support the deposition mask 500. Therefore, considering the above points, the mask frame 400 can have an appropriate thickness.

[0120] The mask frame 400 can be constructed using metallic materials. For example, the mask frame 400 can be constructed using stainless steel.

[0121] The mask frame 400 can support the deposition mask 500. For example, the deposition mask 500 can be fixed to the mask frame 400 while stretched along a first direction DR1 (i.e., the length direction of the deposition mask 500). For example, the deposition mask 500 can have a thickness of about 20 μm to about 40 μm and can be made of a metallic material such as stainless steel, invar, nickel, cobalt, nickel alloy, nickel-cobalt alloy, etc. The metallic material can have a low coefficient of thermal expansion, thereby reducing the deformation of the deposition mask 500 caused by heat in the manufacturing process of the mask assembly 300 and the deposition process for forming a deposition material layer on the substrate 202.

[0122] The width of the deposition mask 500 can be smaller than the width of the frame opening 450. For example, as Figure 7As shown, multiple deposition masks 500 can be arranged on the mask frame 400. However, since the number of deposition masks 500 can be varied in various ways, the scope of this embodiment is not limited thereto.

[0123] The mask frame 400 may include support rods 460, 470 for supporting the deposition mask 500. For example, as Figure 8 As shown, the mask frame 400 may include a plurality of first support rods 460 extending parallel to a first direction DR1 and arranged along a second direction DR2, and a plurality of second support rods 470 extending parallel to the second direction DR2 and arranged along the first direction DR1. In this case, the deposition mask 500 can be supported by the second support rods 470, and the second support rods 470 can be supported by the first support rods 460. That is, the second support rods 470 can be arranged on the first support rods 460, and the deposition mask 500 can be arranged on the second support rods 470.

[0124] Furthermore, the mask frame 400 may have multiple recesses 412, 422, 432, and 442 for the insertion of the first support rod 460 and the second support rod 470. For example, the first sub-frame 410 and the second sub-frame 420 may each have a first recess 412 and a second recess 422, respectively, and the third sub-frame 430 and the fourth sub-frame 440 may each have a third recess 432 and a fourth recess 442, respectively. In this case, the first support rod 460 can be inserted into the third recess 432 and the fourth recess 442, and the second support rod 470 can be inserted into the first recess 412 and the second recess 422. In particular, the third recess 432 and the fourth recess 442 may be formed to be deeper than the first recess 412 and the second recess 422, so that the second support rod 470 can be arranged on the first support rod 460.

[0125] Figure 9 It is used for explanation Figure 7 The diagram shows a schematic plan view of the deposition mask. Figure 10 It is used for explanation Figure 7 A schematic enlarged plan view of the pixel opening shown. Figure 11 It is used to illustrate the use of Figure 7 A schematic enlarged plan view of the light-emitting layer formed by the deposition process of the mask assembly shown.

[0126] Reference Figures 9 to 11The deposition mask 500 may have a generally rectangular plate shape extending along the first direction DR1. For example, the deposition mask 500 may include a mask unit region 510 having a plurality of pixel openings 512 and edge regions 540 respectively arranged on both sides of the mask unit region 510 along the first direction DR1 (i.e., the length direction of the deposition mask 500). In addition, although not shown, a plurality of display unit regions (not shown) may be arranged on the substrate 202, and after the display manufacturing process is completed, each display unit region may be individually divided into a plurality of display panels 100 by a cutting process.

[0127] The mask unit region 510 of the deposition mask 500 can be arranged on the frame opening 450 of the mask frame 400, and the edge region 540 of the deposition mask 500 can be arranged on the sub-frames of the mask frame 400. For example, the edge region 540 of the deposition mask 500 can be arranged on the third sub-frame 430 and the fourth sub-frame 440, respectively. For example, as Figure 7 and Figure 8 As shown, multiple deposition masks 500 can be arranged on a mask frame 400. The deposition masks 500 can extend parallel to a first direction DR1 and be arranged along a second direction DR2. In this case, the deposition masks 500 can be supported by a first support rod 460 and a second support rod 470, and the edge regions 540 of the deposition masks 500 can be arranged on a third subframe 430 and a fourth subframe 440.

[0128] The deposition mask 500 may include mask unit regions 510 corresponding to display unit regions. For example, the mask unit regions 510 may be divided by second support rods 470 of the mask frame 400. That is, the mask unit regions 510 may be arranged between the third sub-frame 430, the second support rods 470, and the fourth sub-frame 440, and the number of second support rods 470 may vary depending on the number of display unit regions. In other words, the dimensions of the mask frame 400 and the mask unit regions 510, as well as the number of first support rods 460 and second support rods 470, may be adjusted according to the dimensions of the substrate 202 and the display unit regions, and the number of display unit regions. Specifically, the second support rods 470 may support the deposition mask 500 between the mask unit regions, and the first support rods 460 may be arranged to overlap the gap between the deposition mask 500 in the third direction DR3.

[0129] The deposition mask 500 can be fixed to the mask frame 400 while being stretched along its length (i.e., the first direction DR1). That is, as... Figure 7As shown, a tensile force can be applied to both sides of the deposition mask 500 in the first direction DR1, and the edge region 540 of the deposition mask 500 can be a region held by a jig or chuck for applying the tensile force. Furthermore, the edge region 540 of the deposition mask 500 can be fixed to the mask frame 400 by welding. For example, the edge region 540 of the deposition mask 500 can be fixed to the mask frame 400 by resistance welding such as laser welding or spot welding.

[0130] The mask unit region 510 may have a plurality of pixel openings 512. According to one embodiment, each of the pixel openings 512 may extend along a second direction DR2 that intersects the first direction DR1. For example, the second direction DR2 may be a direction perpendicular to the first direction DR1. Furthermore, the pixel openings 512 may be arranged in a zigzag pattern along the first direction DR1 and may be arranged linearly along the second direction DR2.

[0131] Specifically, such as Figure 10 As shown, the pixel opening 512 can be defined by a rib region 514 extending in a Z-shape along the second direction DR2 and a bridge region 516 connecting the rib regions 514 along the first direction DR1. That is, the pixel openings 512 can be spaced apart by the rib regions 514 along the first direction DR1 and can be spaced apart by the bridge regions 516 along the second direction DR2. In particular, as Figure 10 As shown, the pixel openings 512 can be arranged adjacent to each other along the first diagonal direction DD1 and the second diagonal direction DD2. That is, the pixel openings 512 can be arranged along the first diagonal direction DD1 and the second diagonal direction DD2. In this case, the width d3 of the lip region 514 can be the same as the width d4 of the bridging region 516.

[0132] According to one embodiment, the two side edge portions of each of the pixel openings 512 may have a first width d1, and the central portion of each of the pixel openings 512 may have a second width d2 that is smaller than the first width d1. That is, as Figure 10 As shown, each of the pixel openings 512 can have an approximate butterfly shape. For example, the pixel openings 512 can be formed by an etching process or a laser cutting process, and in order to stably form the pixel openings 512, preferably, the first width d1 is greater than the thickness of the mask unit region 510 (i.e., the thickness of the deposition mask 500) and less than twice the width d3 of the lip region 514. In this case, the width direction of the pixel opening 512 is the first direction DR1, and the length direction of the pixel opening 512 is the second direction DR2.

[0133] As described above, when the second width d2 is smaller than the first width d1, the distance d5 between the center portions of adjacent pixel openings 512 along the first direction DR1 can be increased. Therefore, when a tensile force is applied to the deposition mask 500 along the first direction DR1, the tensile strain rate of the deposition mask 500 along the first direction DR1 can be reduced. Ultimately, when a tensile force is applied to the deposition mask 500 along the first direction DR1, the deformation of the pixel openings 512 can be reduced, thereby improving the light-emitting layer 172 (refer to...) formed by the deposition process. Figure 11 The position, size, and shape of ( ) can become uniform.

[0134] According to one embodiment, the ratio of the second width d2 to the first width d1 can be in the range of about 0.3 to about 0.9. For example, when the ratio of the second width d2 to the first width d1 is about 0.67 and a tensile force of about 0.25 kgf is applied to both sides of the deposition mask 500 along the first direction DR1, the tensile strain rate of the deposition mask 500 along the first direction DR1 can be about 0.024%. However, when the first width d1 and the second width d2 are the same and a tensile force of about 0.25 kgf is applied to both sides of the deposition mask 500 along the first direction DR1, the tensile strain rate of the deposition mask 500 along the first direction DR1 can be about 0.038%. The tensile strain rate of the deposition mask 500 can decrease as the ratio of the second width d2 to the first width d1 decreases. Therefore, the ratio of the second width d2 to the first width d1 can be appropriately adjusted according to the area of ​​the light-emitting layer 172 to be formed. Furthermore, as described above, when the tensile strain rate of the deposition mask 500 decreases, a greater tensile force can be applied to the deposition mask 500, thereby reducing the warpage of the deposition mask 500 during the deposition process.

[0135] According to one embodiment, such as Figure 9 As shown, the deposition mask 500 may include a dummy region 520 surrounding the mask unit region 510 and a peripheral region 530 surrounding the dummy region 520. For example, the dummy region 520 may have a shape that surrounds multiple mask unit regions 510. That is, multiple mask unit regions 510 may be arranged within the dummy region 520, and the peripheral region 530 may have a ring shape surrounding the dummy region 520. In this case, the edge regions 540 of the deposition mask 500 may be arranged on both sides of the peripheral region 530.

[0136] In particular, the dummy region 520 between the mask unit regions 510 can be supported by the second support rod 470, and the two sides of the deposition mask 500 along the second direction (i.e., the two sides of the peripheral region 530) can be arranged on the upper part of the first support rod 460. Therefore, the gaseous deposit material provided by the deposition source 220 can be blocked by the first support rod 460 and the second support rod 470.

[0137] The dummy region 520 may have multiple dummy openings 522. In particular, such as... Figure 9 As shown, the dummy opening 522 can have the same shape as the pixel opening 512 and be arranged in the same manner. Therefore, even if the pixel opening 512 is deformed to a certain extent due to the application of a tensile force to the deposition mask 500, the dimensional deviation of the pixel opening 512 can be reduced by means of the dummy opening 522.

[0138] like Figure 11 As shown, when two third light-emitting regions EA3 are arranged adjacent to each other, a mask assembly 300 according to one embodiment can be used to form a light-emitting layer 172 (e.g., a blue light-emitting layer) on the pixel electrode 171 of the third light-emitting region EA3. In this case, each of the pixel openings 512 can correspond to the pixel electrode 171 of the two adjacent third light-emitting regions EA3, and during the deposition process, each of the pixel openings 512 can expose the pixel electrode 171 of the two adjacent third light-emitting regions EA3. Finally, as Figure 11 As shown, a trapezoidal light-emitting layer 172 can be formed on the substrate 202. That is, an approximately butterfly-shaped light-emitting layer 172 can be formed on the two pixel electrodes 171 and the pixel definition film PDL between them.

[0139] The embodiments of this utility model have been described above with reference to the accompanying drawings. However, those skilled in the art will understand that it can be implemented in other specific forms without changing the technical concept or essential features of this utility model. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims

1. A deposition mask, characterized by, comprises: a mask unit region having a plurality of pixel opening portions; and an edge region arranged on both sides of the mask unit region in a first direction, respectively, wherein each of the pixel opening portions extends in a second direction intersecting the first direction, each of the pixel opening portions has a first width in the first direction at both side edge portions in the second direction, and each of the pixel opening portions has a second width in the first direction at a central portion in the second direction, which is smaller than the first width.

2. The deposition mask according to claim 1, wherein the pixel opening portions are arranged in a zigzag pattern along the first direction and linearly along the second direction.

3. The deposition mask according to claim 1, wherein a ratio of the second width to the first width is 0.3 to 0.

9.

4. The deposition mask according to claim 1, wherein the pixel opening portions are defined by a lip region extending in a zigzag pattern along the second direction and a bridge region connecting between the lip regions along the first direction.

5. The deposition mask according to claim 4, wherein the first width is larger than a thickness of the mask unit region and smaller than twice a width of the lip region in the first direction.

6. The deposition mask according to claim 4, wherein a width of the lip region in the first direction and a width of the bridge region in the second direction are the same as each other.

7. The deposition mask of claim 1, wherein further comprising: a dummy region surrounding the mask unit region, wherein the dummy region has a plurality of dummy opening portions.

8. The deposition mask according to claim 7, wherein further comprising: a peripheral region surrounding the dummy region, the edge region is arranged on both sides of the peripheral region in the first direction, respectively.

9. The deposition mask according to claim 7, wherein each of the dummy opening portions has the same shape as that of each of the pixel opening portions, the dummy opening portions are arranged in the same pattern as that of the pixel opening portions.

10. A mask assembly, characterized by comprises: a mask frame having a frame opening portion; and a deposition mask arranged on the mask frame, wherein the deposition mask comprises a mask unit region having a plurality of pixel opening portions and an edge region arranged on both sides of the mask unit region in a first direction, respectively, each of the pixel opening portions extends in a second direction intersecting the first direction, each of the pixel opening portions has a first width in the first direction at both side edge portions in the second direction, and each of the pixel opening portions has a second width in the first direction at a central portion in the second direction, which is smaller than the first width. ​

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