Power adapter rubber shell with efficient heat dissipation

By employing a heat sink partition chamber and dust filter structure within the power adapter housing, combined with heat sink fins and a fan, the balance between heat dissipation and dust prevention in traditional power adapter housings is resolved. This achieves dual optimization of efficient heat dissipation and dust prevention, extending the service life of the equipment.

CN224069018UActive Publication Date: 2026-03-31DONGGUAN JINYUAN ELECTRONIC CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-22
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

Traditional power adapter housings struggle to balance efficient heat dissipation and dust protection within limited space, leading to excessively high component temperatures, performance degradation, and short-circuit risks.

Method used

The casing is divided into independent chambers by a heat sink, and forced air cooling circulation is achieved by combining heat sink fins and a fan. Dust prevention is achieved by dust filter and magnetic strip. The sealed circuit chamber isolates dust, and the heat dissipation holes dissipate heat.

Benefits of technology

It achieves dual optimization of efficient heat dissipation and dust protection, reduces the risk of short circuits, extends equipment life, and is suitable for high-power electronic equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a power adapter rubber shell with efficient heat dissipation, which comprises an upper shell and a lower shell which are buckled with each other, a heat dissipation plate is arranged between the upper shell and the lower shell, heat dissipation fins are arranged on the heat dissipation plate, a heat dissipation fan is arranged at one end of each heat dissipation fin, an air inlet hole is arranged on the upper shell at a position corresponding to an air inlet of the heat dissipation fan, and the air inlet hole is communicated with the heat dissipation fan. Heat dissipation holes are formed in the position, away from an air outlet of the heat dissipation fan, of the upper shell, the shell is divided into two independent cavities through the heat dissipation plate, and double optimization of efficient heat dissipation and dustproof protection is achieved in combination with forced air cooling circulation of the heat dissipation fins and the heat dissipation fan. The closed circuit cavity is used for thoroughly isolating dust from invading, the short circuit risk is reduced, meanwhile, heat is rapidly discharged through active flow guiding of the heat dissipation cavity, and stable work of elements is guaranteed.
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Description

Technical Field

[0001] This utility model relates to the field of power adapter technology, specifically to a power adapter housing with high-efficiency heat dissipation. Background Technology

[0002] With the continuous increase in the power density of electronic devices, the heat generation problem of internal circuit components in power adapters, as core components of energy conversion, is becoming increasingly prominent. Traditional power adapter housings typically employ a closed structure, relying on natural heat dissipation or simple heat sinks for passive cooling. However, due to the limited internal space and poor airflow, heat easily accumulates within the cavity, leading to excessively high temperatures in core components, resulting in performance degradation, shortened lifespan, or even failure. Furthermore, some designs attempt to enhance heat dissipation by adding ventilation holes to the housing or directly using external cooling fans, but these solutions have significant drawbacks: open structures allow dust and impurities to enter the housing, adhering to the circuit board surface and posing a short-circuit risk; while fans directly exposed near the circuit board, although accelerating airflow, struggle to guide airflow efficiently for heat exchange, exacerbating dust accumulation. Therefore, achieving a balance between efficient heat dissipation and dust protection within a limited space has become a technical challenge in power adapter structural design. Existing technologies urgently require an innovative solution that can rapidly dissipate heat through active cooling while preventing dust intrusion through physical isolation, to meet the stringent requirements of high-power, long-life electronic devices for power adapters. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a power adapter housing with high-efficiency heat dissipation.

[0004] The purpose of this utility model can be achieved through the following technical solution: a power adapter housing with high heat dissipation, including an upper shell and a lower shell that are interlocked, a heat dissipation plate is provided between the upper shell and the lower shell, heat dissipation fins are provided on the heat dissipation plate, a cooling fan is installed at one end of the heat dissipation fins, an air inlet is provided on the upper shell at the position corresponding to the air inlet of the cooling fan, and a heat dissipation hole is provided on the upper shell at the position away from the air outlet of the cooling fan.

[0005] Preferably, the air inlet is equipped with a dustproof screen.

[0006] Preferably, a groove is provided on the upper shell at the position corresponding to the dustproof mesh.

[0007] Preferably, the dustproof mesh is equipped with magnetic strips, and magnetic strips are installed in the grooves corresponding to the positions of the magnetic strips.

[0008] Preferably, the inner sidewall of the lower shell is provided with a step, and a threaded hole is provided on the step. A mounting hole is provided on the heat sink plate at the position corresponding to the threaded hole.

[0009] Preferably, the bottom of the heat sink is provided with an insulating heat conductor.

[0010] The beneficial effects of this invention are as follows: This invention forms two independent chambers by separating the housing with a heat sink, and combines the forced air cooling circulation of the heat sink fins and cooling fan to achieve dual optimization of efficient heat dissipation and dust protection. It not only completely isolates dust intrusion and reduces the risk of short circuits by utilizing the sealed circuit chamber, but also actively guides heat away from the heat dissipation chamber to ensure stable component operation. Furthermore, the compact integrated layout balances heat dissipation efficiency and structural reliability within a limited space, significantly extending the service life of the equipment, and is suitable for the diverse heat dissipation needs of high-power, high-density electronic equipment. Attached Figure Description

[0011] The present invention will be further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the present invention. For those skilled in the art, other drawings can be obtained based on the following drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of the structure of a power adapter housing with high-efficiency heat dissipation according to the present invention.

[0013] Figure 2 This is an exploded view of the housing of a power adapter with high-efficiency heat dissipation according to this utility model.

[0014] Figure 3 This is a schematic diagram of the structure of a heat sink for a power adapter housing with high-efficiency heat dissipation according to the present invention.

[0015] Figure 4 This is a schematic diagram of the dustproof mesh structure of a power adapter housing with high-efficiency heat dissipation according to the present invention.

[0016] Figure 5 for Figure 2 A partial schematic diagram of point A in the middle.

[0017] Figure 6 for Figure 2 A partial schematic diagram of point B in the middle.

[0018] The labels in the diagram represent: 1. Upper shell; 101. Air inlet; 102. Heat dissipation hole; 103. Groove; 104. Magnetic strip; 2. Lower shell; 3. Heat sink; 301. Heat dissipation fins; 302. Mounting hole; 303. Insulating heat conductor; 4. Cooling fan; 5. Dust filter; 501. Magnetic strip; 6. Step; 601. Threaded hole. Detailed Implementation

[0019] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0020] Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0021] The technical solution of this utility model will be clearly and completely described below with reference to specific embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0022] See Figures 1 to 6 As shown, the structure of this utility model is as follows: a power adapter housing with high-efficiency heat dissipation, including an upper shell 1 and a lower shell 2 that are interlocked. A heat dissipation plate 3 is provided between the upper shell 1 and the lower shell 2. Heat dissipation fins 301 are provided on the heat dissipation plate 3. A cooling fan 4 is installed at one end of the heat dissipation fins 301. An air inlet 101 is provided on the upper shell 1 at the position corresponding to the air inlet of the cooling fan 4. A heat dissipation hole 102 is provided on the upper shell 1 at the position away from the air outlet of the cooling fan 4. Specifically, the upper shell 1 and the lower shell 2 are interlocked to form a closed main body, the interior of which... The circuit board is divided into an independent circuit chamber and a heat dissipation chamber by the heat sink 3. The heat generated by the circuit board is conducted to the heat dissipation fins 301 through the heat sink 3. After the cooling fan 4 is started, the external cold air is drawn into the heat dissipation chamber through the air inlet 101 and flows through the heat dissipation fins 301 to accelerate heat exchange. The hot air is finally discharged from the heat dissipation hole 102, which achieves dual optimization of efficient heat dissipation and dust protection. It not only uses the sealed circuit chamber to completely isolate dust intrusion and reduce the risk of short circuit, but also actively guides the heat dissipation chamber to quickly dissipate heat and ensure the stable operation of the components.

[0023] like Figure 1 , Figure 2 As shown, a dustproof net 5 is provided on the air inlet 101. The dustproof net 5 filters dust, hair and other particulate matter in the air through fine mesh to prevent them from entering the equipment.

[0024] like Figure 5 As shown, a groove 103 is provided on the upper shell 1 at the position corresponding to the dustproof net 5, which is used to accommodate the dustproof net 5 and to position the dustproof net 5.

[0025] like Figure 4 As shown, the dustproof net 5 is provided with a magnetic strip 501, and a magnetic strip 104 is installed in the groove 103 at the position corresponding to the magnetic strip 501. The dustproof net 5 is attracted together by the magnetic strip 501 and the magnetic strip 104 fixedly set in the groove 103, so that the dustproof net 5 can be removed for cleaning more conveniently.

[0026] like Figure 6 As shown, the inner wall of the lower shell 2 is provided with a step 6, and a threaded hole 601 is provided on the step 6. A mounting hole 302 is provided on the heat sink 3 at the position corresponding to the threaded hole 601. Specifically, the heat sink 3 is clipped on the step 6, and the heat sink 3 is firmly fixed on the step 6 by passing a screw through the mounting hole 302 and threading it with the threaded hole 601, so as to ensure that the heat sink 3 is installed stably.

[0027] like Figure 3 As shown, the bottom of the heat sink 3 is provided with an insulating thermal conductor 303. The insulating thermal conductor 303, such as a thermally conductive silicone pad or a thermally conductive potting compound, fills the micro gap between the electronic components and the heat sink 3, significantly increasing the effective contact area and reducing the interface thermal resistance. At the same time, its excellent electrical insulation can prevent current leakage or short circuit risks.

[0028] In practical use, when the power adapter is powered on, the electronic components on the internal circuit board, such as transformers and power transistors, begin to generate heat. This heat is conducted to the heat sink 3, making it the main area of ​​concentrated heat. After absorbing heat, the multiple heat dissipation fins 301 distributed on the surface of the heat sink 3, through the high thermal conductivity of the metal material, evenly diffuse the heat to the entire fin structure. The three-dimensional arrangement of the fins expands the original planar heat dissipation area into a multi-layered three-dimensional heat dissipation surface. At the same time, the cooling fan 4 generates directional airflow, drawing in ambient temperature air from the air inlet 101 on the upper shell 1. The airflow direction is consistent with the fin orientation. The parallel airflow forms a channel that runs through the gaps between the fins. When the high-speed airflow passes through the gaps between the densely arranged heat dissipation fins 301, it directly washes the surface of the fins. Forced convection heat exchange occurs between the air and the high-temperature fins. The heat stored in the fins is quickly transferred to the flowing air, forming an efficient heat exchange process. At this time, the cooling efficiency of the heat dissipation plate 3 is several times higher than that of simple natural heat dissipation. The high-temperature air that has absorbed heat is driven by the fan and discharged from the heat dissipation hole 102 along the preset airflow channel. The staggered layout of the air inlet hole 101 and the heat dissipation hole 102 forms a unidirectional airflow path, which avoids the hot air backflow and at the same time continuously introduces new cold air to maintain the heat dissipation efficiency.

[0029] The present invention has been further described above with reference to specific embodiments. However, it should be understood that the specific description herein should not be construed as limiting the substance and scope of the present invention. Various modifications made by those skilled in the art to the above embodiments after reading this specification are all within the scope of protection of the present invention.

Claims

1. A power adapter housing with high-efficiency heat dissipation, characterized in that: The utility model relates to a heat dissipation device, including mutually interlocked upper shell (1) and lower shell (2), be equipped with heat dissipation plate (3) between upper shell (1) and lower shell (2), be equipped with heat dissipation fin (301) on heat dissipation plate (3), one end of heat dissipation fin (301) is equipped with heat dissipation fan (4), the position of corresponding heat dissipation fan (4) air inlet of upper shell (1) is equipped with air inlet hole (101), the position of being away from heat dissipation fan (4) air outlet of upper shell (1) is equipped with heat dissipation hole (102).

2. The power adapter plastic shell with high heat dissipation efficiency according to claim 1, characterized in that: The air inlet hole (101) is equipped with a dust screen (5).

3. The power adapter plastic shell with high heat dissipation efficiency according to claim 2, characterized in that: The upper shell (1) is equipped with a groove (103) corresponding to the dust screen (5).

4. The power adapter plastic shell with high heat dissipation efficiency according to claim 3, characterized in that: The dust screen (5) is equipped with a magnetic strip (501), and the groove (103) is equipped with a magnetic strip (501) corresponding to the magnetic strip (501).

5. The power adapter housing with high-efficiency heat dissipation according to claim 1, characterized in that: The inner side wall of the lower shell (2) is equipped with a step (6), and the step (6) is equipped with a threaded hole (601), and the heat dissipation plate (3) is equipped with a mounting hole (302) corresponding to the threaded hole (601).

6. The power adapter with high heat dissipation according to claim 1, wherein: The bottom of the heat dissipation plate (3) is equipped with an insulating heat conductor (303).