Metal plate micro resistor

Abstract

A metal plate micro resistor comprises an alloy resistor block, two heat dissipation layers attached to the alloy resistor block, and two electrode blocks formed on the alloy resistor block and the heat dissipation layers. The alloy resistance block comprises a first surface and a second surface which are respectively positioned on two sides, and two side surfaces which are connected with the first surface and the second surface; the heat dissipation layer is attached to the first surface. The electrode blocks are respectively formed on the side surface, the second surface and the heat dissipation layer. Each electrode block comprises a side connecting part formed on the side face and a first part which is bent and extends from the side connecting part and is attached to the heat dissipation layer on the same side. The heat dissipation layer is directly attached to the alloy resistance block, so that the heat dissipation area of the alloy resistance block is increased, and the heat conduction efficiency is improved.

Description

Technical Field

[0001] This utility model relates to a metal plate microresistor, and more particularly to a metal plate microresistor for a passive component. Background Technology

[0002] See Figure 1 A conventional resistive device includes a substrate 6, an insulating layer 7 formed on the substrate 6, two heat dissipation layers 8 formed at intervals on the insulating layer 7, and two electrode blocks 9 attached to the substrate 6 and adjacent heat dissipation layers 8. The substrate 6 includes a first surface 61 and a second surface 62 located on opposite sides, and two side surfaces 63 respectively connected to opposite sides of the first surface 61 and the second surface 62. The electrode blocks 9 include side attachment portions 91 attached to individual side surfaces 63, a first portion 92 bent from the side attachment portions 91 and extending to the first surface 61, and a second portion 93 bent from the side attachment portions 91 and extending to the second surface 62.

[0003] When the resistor device operates, the substrate 6 generates heat, causing its temperature to rise. As the temperature of the substrate 6 rises, the resistance value of the resistor device also changes, thus affecting the operation of the device on which the resistor device is mounted. The heat dissipation mechanism of the resistor device mainly involves the electrode block 9 guiding the heat to the heat dissipation layer 8, and then the heat dissipation layer 8 dissipating the heat to the outside. However, in actual operation, the current structural design has a small heat dissipation area, which makes it difficult to guide and dissipate heat smoothly and effectively. As a result, the resistor device is still prone to accumulating heat and failing to operate normally, so improvements are necessary. Utility Model Content

[0004] The purpose of this invention is to provide a metal plate micro-resistor with excellent heat dissipation.

[0005] The present invention relates to a metal plate micro resistor, comprising an alloy resistor block, two heat dissipation layers attached to a first surface of the alloy resistor block at intervals, two insulating layers attached to the first surface and located between the heat dissipation layers, and two electrode blocks respectively formed on the side surface, the second surface, and the heat dissipation layers.

[0006] The alloy resistor block includes a first surface and a second surface located on opposite sides, and two side surfaces connected to the opposite sides of the first surface and the second surface.

[0007] One end of each of the heat dissipation layers is aligned with the adjacent side surface. Each of the electrode blocks includes a side connection portion attached to the individual side surface, a first portion extending from the side connection portion and attached to the heat dissipation layer on the same side, and a second portion extending from the side connection portion to the second surface.

[0008] The metal plate microresistor of this utility model includes a main body portion attached to the first surface and one end aligned with the adjacent side surface, and an extension portion extending from the main body portion to the outside of the insulating layer.

[0009] In the metal plate microresistor of this invention, each of the first parts is formed above the main body part.

[0010] In the metal plate micro-resistor of this invention, the top surface of each of the first portions is flush with the top surface of the adjacent extension portion.

[0011] The metal plate microresistor of this invention has a main body attachment area that accounts for 20-30% of the first surface.

[0012] In the metal plate microresistor of this invention, the area of ​​the insulating layer attached accounts for 70-80% of the first surface.

[0013] The beneficial effects of this utility model are as follows: the heat dissipation layer is directly attached to the alloy resistor block, which can increase the heat dissipation area of ​​the alloy resistor block. At the same time, the electrode block is used to broaden the path of heat energy conduction to the heat dissipation layer, so that heat energy can be directly or indirectly conducted to the heat dissipation layer and then discharged. Therefore, compared with the existing approach, this utility model can maintain stable operation by improving the heat dissipation efficiency of the alloy resistor block. Attached Figure Description

[0014] Figure 1 This is a schematic diagram illustrating an existing resistive device;

[0015] Figure 2 This is a schematic diagram illustrating an embodiment of the metal plate microresistor of this utility model; and

[0016] Figure 3 It is similar to Figure 2 The diagram illustrates the heat conduction path of the embodiment. Detailed Implementation

[0017] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0018] See Figure 2One embodiment of the metal plate microresistor of this utility model includes an alloy resistor block 1, two heat dissipation layers 2 attached to the alloy resistor block 1 at intervals, an insulating layer 3 attached to the alloy resistor block 1 and located between the heat dissipation layers 2, and two electrode blocks 4 respectively formed on the alloy resistor block 1 and the heat dissipation layers 2. This embodiment is suitable for installation in power supplies, measuring instruments, mobile phones, tablets, and other devices, thereby providing the specific resistance value required for circuit operation.

[0019] The alloy resistor block 1 includes a first surface 11 and a second surface 12 located on opposite sides, and two side surfaces 13 respectively connected to the opposite sides of the first surface 11 and the second surface 12. The alloy resistor block 1 is preferably made of an alloy of metals such as manganese copper nickel, manganese copper tin, iron chromium aluminum, or nickel chromium aluminum, so that the alloy resistor block 1 has the required resistance value and a low temperature coefficient of resistance (TCR), minimizing the impact of temperature changes on the resistance value.

[0020] The heat dissipation layers 2 are attached to the first surface 11 of the alloy resistor block 1 at intervals, with one end of each heat dissipation layer 2 aligned with the adjacent side surface 13. Each heat dissipation layer 2 includes a main body portion 21 attached to the first surface 11 with one end aligned with the adjacent side surface 13, and an extension portion 22 extending from the main body portion 21 to the outside of the insulating layer 3. It should be noted that the main material of each heat dissipation layer 2 is copper, and the area of ​​the main body portion 21 occupies 20-30% of the first surface 11. Copper has a high thermal conductivity, allowing the heat generated by the alloy resistor block 1 when energized to be quickly dissipated by the heat dissipation layer 2.

[0021] The insulating layer 3 is attached to the first surface 11 and located between the heat dissipation layers 2, and the attachment area of ​​the insulating layer 3 accounts for 70-80% of the first surface 11. The insulating layer 3 is preferably made of rubber, plastic, ceramic or other materials, thereby preventing the alloy resistor block 1 from contacting the external environment and thus protecting the alloy resistor block 1.

[0022] The electrode blocks 4 are respectively formed on the side surface 13, the second surface 12, and the heat dissipation layer 2. Each electrode block 4 includes a side connection portion 41 formed on a particular side surface 13, a first portion 42 extending from the side connection portion 41 and forming on the same side of the heat dissipation layer 2, and a second portion 43 extending from the side connection portion 41 to the second surface 12. In this embodiment, the electrode blocks 4 are preferably made of copper metal to achieve better thermal conductivity. Furthermore, the copper metal is coated with nickel and tin metals, so that the electrode blocks 4 have the functions of circuit conduction connection and connecting the heat dissipation layer 2 for heat conduction.

[0023] It is worth mentioning that the first part 42 of the electrode block 4 is formed above the main body part 21, and the top surface of the first part 42 is flush with the top surface of the adjacent extension part 22, which increases the exposed area of ​​the heat dissipation layer 2, allowing heat energy to be smoothly discharged from the heat dissipation layer 2. In addition, this design also makes the appearance of this embodiment flat, giving users more options for the layout and installation of other parts when assembling the device equipped with this embodiment.

[0024] See Figure 3 It should be noted that, in this embodiment, the alloy resistor block 1 generates heat when energized. This heat can be guided through the electrode block 4 and the heat dissipation layer 2 and dissipated from the alloy resistor block 1. Furthermore, in this embodiment, the heat dissipation layer 2 is directly attached to the alloy resistor block 1, and one end of the main body 21 is aligned with the adjacent side surface 13, thereby increasing the heat dissipation area of ​​the alloy resistor block 1 and allowing heat to be quickly dissipated from the alloy resistor block 1.

[0025] In summary, in the embodiments of the metal plate microresistor of this utility model, the heat generated by the alloy resistor block 1 when energized is guided and dissipated through the electrode block 4 and the heat dissipation layer 2. The heat dissipation layer 2 is directly attached to the alloy resistor block 1, and one end of the main body 21 is aligned with the adjacent side surface 13, thereby increasing the heat dissipation area and improving the heat dissipation efficiency compared to the prior art. Therefore, the purpose of this utility model is indeed achieved.

Claims

1. A metal plate microresistor comprising an alloy resistor block, the alloy resistor block including a first surface and a second surface located on opposite sides, respectively, and two side surfaces each connected to the first surface and the second surface on opposite sides, respectively; characterized in that: The metal plate micro-resistor further comprises two heat dissipation layers attached to the first surface of the alloy resistor block at intervals, two insulating layers attached to the first surface and located between the heat dissipation layers, and two electrode blocks respectively formed on the side surface, the second surface, and the heat dissipation layers; one end of each of the heat dissipation layers is aligned with the adjacent side surface, and each of the electrode blocks comprises a side joint part attached to the respective side surface, a first part extending from the side joint part and attached to the same side heat dissipation layer, and a second part extending from the side joint part to the second surface.

2. The metal plate microresistor according to claim 1, wherein: Each of the heat dissipation layers comprises a main part attached to the first surface and having one end aligned with the adjacent side surface, and an extension part extending from the main part to the outside of the insulating layer.

3. The metal plate microresistor of claim 2, wherein: Each of the first parts is formed above the main part.

4. The metal plate microresistor of claim 3, wherein: The top surface of each of the first parts is flush with the top surface of the adjacent extension part.

5. The micro-resistor of claim 2, wherein: The attached area of the main part accounts for 20-30% of the first surface.

6. The metal plate microresistor of claim 5, wherein: The attached area of the insulating layer accounts for 70-80% of the first surface.

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