Cleaning chamber for tearing gold and removing photoresist

Abstract

The utility model discloses a cleaning chamber for tearing gold and removing photoresist in the field of semiconductor processing equipment, which comprises a bottom plate and a cleaning bin arranged on the bottom plate, a cleaning disc for positioning and placing a silicon wafer is arranged in the cleaning bin, and the cleaning disc is controlled by a spindle motor at the bottom of the bottom plate to rotate. A two-fluid cleaning assembly, a deionized water cleaning assembly and a nitrogen purging assembly are arranged in the circumferential direction of the bottom of the cleaning bin and used for cleaning silicon wafers, a check ring installation base surrounding the cleaning disc is fixed to the bottom of the cleaning bin, and a liftable check ring piece is inserted in the check ring installation base in the circumferential direction. A central opening part for exposing the cleaning disc and a second passing opening are formed in the extending part of the top of the check ring piece, an FFU fan for blowing air to the inside is arranged at the top of the cleaning bin, and a first air outlet communicated with the outside is formed in the inner wall of the cleaning bin. Therefore, pollution caused by backflow of the aerial fog is prevented.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment technology, specifically a cleaning chamber for removing gold and adhesive. Background Technology

[0002] In existing gold-removing and resist-removing processes, the venting slits are typically located on the upper side of the silicon wafer during processing. This upper side venting design has significant drawbacks; due to the high position of the venting slits, turbulence is easily generated in the flow field within the chamber.

[0003] Once turbulence is generated, it creates complex swirling airflows within the chamber. These swirling airflows re-entrain the water mist produced by the chemical solution, forming a backflow of mist. This backflow of mist directly carries the water mist back to the silicon wafer surface, re-contaminating the already cleaned areas—a problem known as secondary contamination. Secondary contamination not only affects the cleaning quality of the silicon wafers, reducing the stability and reliability of the process, but may also lead to a decrease in yield in subsequent production stages, increasing production costs. Utility Model Content

[0004] In order to overcome the shortcomings of existing technical solutions, this utility model provides a cleaning chamber for removing gold and adhesive, which can effectively solve the technical problem that the cleaning chambers currently used for cleaning silicon wafers are prone to causing secondary contamination to the silicon wafers.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] A cleaning chamber for removing gold and adhesive includes a base plate and a cleaning compartment disposed on the base plate. The cleaning compartment is provided with a cleaning tray for positioning and placing silicon wafers. The cleaning tray is controlled to rotate by a spindle motor installed at the bottom of the base plate.

[0007] The bottom of the cleaning chamber is respectively equipped with a two-fluid cleaning component, a deionized water cleaning component, and a nitrogen purging component for cleaning silicon wafers. The two-fluid cleaning component, the deionized water cleaning component, and the nitrogen purging component are arranged circumferentially around the periphery of the cleaning tray.

[0008] The bottom of the cleaning chamber is fixedly provided with a retaining ring mounting base surrounding the cleaning tray. A liftable retaining ring component is inserted into the inner circumference of the retaining ring mounting base. The top of the retaining ring component is provided with a horizontally inwardly extending extension. The extension has a central opening for exposing the cleaning tray. Two second air outlets are provided on the outer side of the retaining ring component. The second air outlets are connected to the bottom of the base plate through an exhaust pipe.

[0009] The top of the cleaning chamber is equipped with an FFU fan that blows air into the cleaning chamber, and the inner wall of the cleaning chamber is equipped with several first air outlets that connect to the outside.

[0010] Furthermore, the two-fluid cleaning assembly includes a two-fluid cleaning nozzle and a two-fluid cleaning swing arm. One end of the two-fluid cleaning swing arm is connected to the two-fluid cleaning nozzle, and the other end of the two-fluid cleaning swing arm is connected to the base plate and is controlled to rotate horizontally by a first rotary motor installed at the bottom of the base plate.

[0011] Furthermore, the deionized water cleaning assembly includes a cleaning liquid pipe and a pipe mounting base for fixing the cleaning liquid pipe to the base plate.

[0012] Furthermore, the nitrogen purging assembly includes a nitrogen purging nozzle and a nitrogen purging swing arm. One end of the nitrogen purging swing arm is connected to the nitrogen purging nozzle, and the other end of the nitrogen purging swing arm is connected to the base plate and is controlled to rotate horizontally by a second rotary motor installed at the bottom of the base plate.

[0013] Furthermore, the base plate is interspersed with several lifting adjustment rods located on one side of the retaining ring. One end of the lifting adjustment rod is fixed to the outside of the retaining ring through a connecting block, and the other end of the lifting adjustment rod is driven and controlled by an adjustment cylinder installed at the bottom of the base plate.

[0014] Furthermore, the base plate is provided with a plurality of drain outlets located inside the retaining ring mounting seat, and the drain outlets are equipped with filter screens.

[0015] Furthermore, a detection lens for inspecting silicon wafers is suspended inside the cleaning chamber, and the detection lens is fixed to the inner wall of the cleaning chamber by a support rod.

[0016] Furthermore, the cleaning chamber has an opening on one side, and a detachable door is installed at the opening. The door is fixed by guide rails installed on both sides of the opening.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] This invention adds a structure that forms an airflow field inside the cleaning chamber. During the cleaning of silicon wafers, a downward-flowing cleaning airflow is generated. This airflow carries the mist generated during the cleaning process downwards from the silicon wafer and discharges it from the cleaning chamber. This reduces turbulence inside the cleaning chamber and prevents the mist generated by the cleaning fluid from flowing back to the surface of the silicon wafer and causing secondary contamination. In addition, the cleaning airflow field also effectively purifies the inner wall and interior of the cleaning chamber, preventing contamination of the cleaning chamber. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model;

[0020] Figure 2 This is a front view of the internal structure of the bottom plate connecting to the cleaning chamber in an embodiment of this utility model;

[0021] Figure 3 This is a rear view of the internal structure of the bottom plate connecting to the cleaning chamber in an embodiment of this utility model;

[0022] Figure 4 This is a front view of the bottom plate surface connection structure in an embodiment of the present invention;

[0023] Figure 5 This is a rear view of the bottom plate surface connection structure according to an embodiment of the present utility model;

[0024] Figure 6 This is a top view of the internal structure of the retaining ring component in an embodiment of the present utility model;

[0025] Numbering on the map:

[0026] 1-Base plate, 2-Cleaning chamber, 3-Cleaning tray, 4-Main spindle motor, 5-Two-fluid cleaning assembly, 6-Deionized water cleaning assembly, 7-Nitrogen purging assembly, 8-Baffle mounting base, 9-Baffle piece, 10-FFU blower, 11-Lifting adjustment rod, 12-Connecting block, 13-Adjusting cylinder, 14-First air outlet, 15-Second air outlet, 16-Detection lens, 17-Support rod, 18-Door leaf, 19-Guide rail, 20-Silicon wafer, 21-Exhaust pipe, 22-Filter screen;

[0027] 101 - Drainage outlet;

[0028] 501-Two-fluid cleaning nozzle, 502-Two-fluid cleaning swing arm, 503-First rotary motor;

[0029] 601 - Cleaning fluid tubing; 602 - Tubing mounting bracket;

[0030] 701-Nitrogen purging nozzle, 702-Nitrogen purging swing arm, 703-Second rotary motor;

[0031] 901 - Extension, 902 - Central opening. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] like Figure 1-6As shown, this utility model provides a cleaning chamber for removing gold and adhesive residue, mainly used for cleaning silicon wafers 20 by removing gold and adhesive residue. The cleaning chamber has a compact overall structure, and all components work together to effectively prevent secondary contamination of the silicon wafers 20 during the cleaning process, while ensuring the cleanliness of the cleaning chamber.

[0034] The cleaning chamber includes a base plate 1 and a cleaning chamber 2 disposed on the base plate 1. The base plate 1 serves as the basic support component for the entire cleaning chamber, providing installation positions for other components. The cleaning chamber 2 is disposed on the base plate 1, forming a relatively enclosed space for accommodating the silicon wafer 20 and related cleaning components during the cleaning process.

[0035] The cleaning chamber 2 has an opening on one side, at which a detachable door 18 is installed. The door 18 is fixed by guide rails 19 installed on both sides of the opening. When it is necessary to clean the silicon wafer 20, the door 18 is opened and the silicon wafer 20 is placed on the cleaning tray 3. After cleaning, the door 18 is opened again to remove the silicon wafer 20. This detachable door design facilitates the handling of the silicon wafer 20.

[0036] A cleaning tray 3 is provided inside the cleaning chamber 2, which is used to position and place the silicon wafers 20. The cleaning tray 3 is controlled to rotate by a spindle motor 4 mounted on the bottom of the base plate 1. When the spindle motor 4 is working, it drives the cleaning tray 3 and the silicon wafers 20 on it to rotate, so that the silicon wafers 20 can be cleaned evenly and the cleaning effect can be improved.

[0037] To better complete the cleaning and drying of silicon wafer 20, a two-fluid cleaning assembly 5, a deionized water cleaning assembly 6, and a nitrogen purging assembly 7 are respectively installed at the bottom of the cleaning chamber 2. The two-fluid cleaning assembly 5, the deionized water cleaning assembly 6, and the nitrogen purging assembly 7 are arranged circumferentially around the periphery of the cleaning tray 3. This layout allows the silicon wafer 20 to be cleaned by different components in sequence during rotation, thereby improving cleaning efficiency and quality.

[0038] The two-fluid cleaning assembly 5 includes a two-fluid cleaning nozzle 501 and a two-fluid cleaning swing arm 502. One end of the two-fluid cleaning swing arm 502 is connected to the two-fluid cleaning nozzle 501, and the other end is connected to the base plate 1. It is controlled to rotate horizontally by a first rotary motor 503 installed at the bottom of the base plate 1. During the cleaning process, the first rotary motor 503 drives the two-fluid cleaning swing arm 502 to rotate horizontally, thereby moving the two-fluid cleaning nozzle 501 and allowing the two-fluid cleaning fluid to be sprayed evenly onto the surface of the silicon wafer 20 for preliminary cleaning.

[0039] The deionized water cleaning assembly 6 includes a cleaning fluid pipe 601 and a pipe mounting base 602 that fixes the cleaning fluid pipe 601 to the base plate 1. Deionized water is delivered to the cleaning chamber 2 through the cleaning fluid pipe 601 to further clean the silicon wafer 20 after the two-fluid cleaning, removing residual cleaning fluid and impurities from the surface of the silicon wafer 20.

[0040] The nitrogen purging assembly 7 includes a nitrogen purging nozzle 701 and a nitrogen purging swing arm 702. One end of the nitrogen purging swing arm 702 is connected to the nitrogen purging nozzle 701, and the other end is connected to the base plate 1. Its horizontal rotation is controlled by a second rotary motor 703 mounted at the bottom of the base plate 1. The second rotary motor 703 drives the nitrogen purging swing arm 702 to rotate horizontally, thereby moving the nitrogen purging nozzle 701. Nitrogen gas is used to purge the surface of the silicon wafer 20, removing moisture from the surface and also helping to blow away any mist generated during the cleaning process.

[0041] To reduce the large-area drift of mist during cleaning, a retaining ring mounting base 8 is fixedly installed at the bottom of the cleaning chamber 2, surrounding the cleaning tray 3. A retractable retaining ring 9 is inserted circumferentially into the retaining ring mounting base 8. The top of the retaining ring 9 has a horizontally inwardly extending extension 901, which has a central opening 902 for exposing the cleaning tray 3. At this time, a space is formed inside the retaining ring 9 for cleaning the silicon wafer 20.

[0042] A number of lifting adjustment rods 11 are inserted into the base plate 1, located on one side of the retaining ring 9. One end of the lifting adjustment rod 11 is fixed to the outside of the retaining ring 9 via a connecting block 12, and the other end is driven and controlled by an adjustment cylinder 13 installed at the bottom of the base plate 1. When it is necessary to place or remove the silicon wafer 20, the adjustment cylinder 13 drives the lifting adjustment rod 11 to rise or fall, thereby causing the retaining ring 9 to rise or fall, so that the extension 901 of the retaining ring 9 does not affect the placement and removal of the silicon wafer 20. During the cleaning process, the extension 901 of the retaining ring can play a certain role in blocking the cleaning liquid and mist, guiding the flow of the cleaning liquid and mist.

[0043] Meanwhile, an FFU fan 10 is installed at the top of the cleaning chamber 2 to blow air into the cleaning chamber 2. When the FFU fan 10 is working, it blows clean air into the cleaning chamber 2, forming a downward-flowing cleaning airflow field inside the cleaning chamber 2. This cleaning airflow field can guide the mist generated by the cleaning liquid out of the cleaning chamber through the airflow.

[0044] The inner wall of the cleaning chamber 2 is provided with several first air outlets 14 that connect to the outside. The first air outlets 14 enable the air inside the cleaning chamber 2 to exchange with the outside air, ensuring air circulation inside the cleaning chamber 2. At the same time, a second air outlet 15 that connects to the bottom of the base plate 1 is provided at the bottom of the baffle ring 9. The second air outlet 15 is connected to the bottom of the base plate 1 through the exhaust pipe 21. The second air outlet 15 can discharge the air carrying mist from the cleaning chamber, further reducing the turbulence generated inside the cleaning chamber and preventing the mist generated by the cleaning fluid from flowing back to the processing surface of the silicon wafer 20.

[0045] The base plate 1 is provided with a drain outlet 101 located inside the retaining ring mounting seat 8. The drain outlet 101 is used to discharge wastewater generated during the cleaning process and is filtered by the filter screen 22 installed on the drain outlet 101.

[0046] A detection lens 16 for inspecting silicon wafers 20 is suspended inside the cleaning chamber 2. The detection lens 16 is fixed to the inner wall of the cleaning chamber 2 by a support rod 17. The detection lens 16 can monitor the status of silicon wafers 20 in real time during the cleaning process, such as the cleanliness of the surface of silicon wafers 20 and whether there are residual impurities, so as to adjust the cleaning parameters in time and ensure the cleaning quality.

[0047] In use, open door 18, place silicon wafer 20 on cleaning tray 3, and close door 18. Adjust cylinder 13 drives lifting adjustment rod 11 to descend, so that retaining ring 9 is in the correct height. Main shaft motor 4 starts, driving cleaning tray 3 and silicon wafer 20 on it to rotate. First rotary motor 503 drives two-fluid cleaning arm 502 to rotate horizontally, and two-fluid cleaning nozzle 501 sprays two-fluid cleaning fluid onto the surface of silicon wafer 20 for preliminary cleaning. Deionized water cleaning assembly 6 delivers deionized water into cleaning chamber 2 through cleaning fluid pipe 601 for further cleaning of silicon wafer 20. Second rotary motor 703 drives nitrogen purging arm 702 to rotate horizontally, and nitrogen purging nozzle 701 blows nitrogen onto the surface of silicon wafer 20 to remove moisture and mist from the surface of silicon wafer 20. FFU fan 10 operates, forming a downward-flowing cleaning airflow field inside cleaning chamber 2, which carries the mist generated by the cleaning fluid downwards to the silicon wafer 20 and discharges it from the cleaning chamber through second air outlet 15. After cleaning, the spindle motor 4, the first rotary motor 503, the second rotary motor 703 and the FFU fan 10 stop working, the regulating cylinder 13 drives the lifting regulating rod 11 to rise, open the door 18 and take out the silicon wafer 20.

[0048] This technical solution adds a structure that forms an airflow field inside the cleaning chamber 2. When cleaning the silicon wafer 20, a downward-flowing cleaning airflow is formed. The airflow carries the mist generated during the cleaning of the silicon wafer 20 downwards and out of the cleaning chamber, thereby reducing the turbulence generated inside the cleaning chamber 2 and preventing the mist generated by the cleaning liquid from flowing back to the surface of the silicon wafer 20 and causing secondary pollution. In addition, the formed cleaning airflow field can also effectively blow away the inner wall and interior of the cleaning chamber 2, preventing the cleaning chamber 2 from being contaminated.

[0049] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this invention, and no reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A cleaning chamber for removing gold plating and adhesive, comprising a base plate and a cleaning compartment disposed on the base plate, characterized in that: The cleaning chamber is equipped with a cleaning tray for positioning and placing silicon wafers. The cleaning tray is rotated by a spindle motor installed at the bottom of the base plate. The bottom of the cleaning chamber is respectively equipped with a two-fluid cleaning assembly, a deionized water cleaning assembly, and a nitrogen purging assembly for cleaning silicon wafers. The two-fluid cleaning assembly, the deionized water cleaning assembly, and the nitrogen purging assembly are arranged circumferentially around the periphery of the cleaning tray. The bottom of the cleaning chamber is fixedly provided with a retaining ring mounting base surrounding the cleaning tray. A liftable retaining ring is inserted into the inner circumference of the retaining ring mounting base. The top of the retaining ring is provided with a horizontally inwardly extending extension. The extension has a central opening for exposing the cleaning tray. Two second air outlets are provided on the outer side of the retaining ring. The second air outlets are connected to the bottom of the base plate through an exhaust pipe. The top of the cleaning chamber is equipped with an FFU fan that blows air into the cleaning chamber, and the inner wall of the cleaning chamber is equipped with several first air outlets that connect to the outside.

2. The cleaning chamber for removing gold plating and adhesive according to claim 1, characterized in that: The two-fluid cleaning assembly includes a two-fluid cleaning nozzle and a two-fluid cleaning swing arm. One end of the two-fluid cleaning swing arm is connected to the two-fluid cleaning nozzle, and the other end of the two-fluid cleaning swing arm is connected to the base plate and is controlled to rotate horizontally by a first rotary motor installed at the bottom of the base plate.

3. A cleaning chamber for removing gold plating and adhesive according to claim 1, characterized in that: The deionized water cleaning assembly includes a cleaning liquid pipe and a pipe mounting base for fixing the cleaning liquid pipe to the base plate.

4. A cleaning chamber for removing gold plating and adhesive according to claim 1, characterized in that: The nitrogen purging assembly includes a nitrogen purging nozzle and a nitrogen purging swing arm. One end of the nitrogen purging swing arm is connected to the nitrogen purging nozzle, and the other end of the nitrogen purging swing arm is connected to the base plate and is controlled to rotate horizontally by a second rotary motor installed at the bottom of the base plate.

5. A cleaning chamber for removing gold plating and adhesive according to claim 1, characterized in that: The base plate has several lifting adjustment rods inserted on one side of the retaining ring. One end of the lifting adjustment rod is fixed to the outside of the retaining ring through a connecting block, and the other end of the lifting adjustment rod is driven and controlled by an adjustment cylinder installed at the bottom of the base plate.

6. A cleaning chamber for removing gold plating and adhesive according to claim 1, characterized in that: The base plate is provided with a number of drain outlets located inside the retaining ring mounting seat, and the drain outlets are equipped with filter screens.

7. A cleaning chamber for removing gold plating and adhesive according to claim 1, characterized in that: The cleaning chamber is equipped with a suspended inspection lens for inspecting silicon wafers, which is fixed to the inner wall of the cleaning chamber by a support rod.

8. A cleaning chamber for removing gold plating and adhesive according to any one of claims 1-7, characterized in that: The cleaning chamber has an opening on one side, and a detachable door is installed at the opening. The door is fixed by guide rails installed on both sides of the opening.

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