Wafer chamfering equipment
By using the relative rotation between the grinding module and the wafer, and the cooling and lubrication of the cooling and lubrication module, the chipping problem during the wafer chamfering process was solved, thus improving the wafer yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-14
- Publication Date
- 2026-04-07
AI Technical Summary
In existing technologies, chipping is prone to occur during the wafer chamfering process, resulting in a low wafer yield.
The grinding module rotates relative to the wafer to perform chamfering, and a cooling and lubrication module sprays the contact area between the grinding module and the wafer. A reservoir provides cooling and lubricating fluid to reduce the grinding force.
This reduces edge chipping during the wafer chamfering process and improves the wafer yield.
Smart Images
Figure CN224088644U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor substrate processing, and more particularly to a wafer chamfering device. BACKGROUND
[0002] In the process of semiconductor substrate wafer processing, it is usually necessary to chamfer the edge of the wafer to enhance the mechanical strength of the wafer and improve the service life of the wafer. In the prior art, the wafer is usually chamfered by a grinding wheel. However, the grinding force of the grinding wheel is strong, which makes the wafer prone to edge collapse during the chamfering process, resulting in a low wafer yield.
[0003] To sum up, how to reduce the edge collapse phenomenon in the wafer chamfering process to improve the wafer yield is a problem to be solved by the technical personnel in the field at present. CONTENT OF THE UTILITY MODEL
[0004] Therefore, the purpose of the present application is to provide a wafer chamfering device to reduce the edge collapse phenomenon in the wafer chamfering process and improve the wafer yield.
[0005] In order to achieve the above purpose, the present application provides the following technical solutions:
[0006] A wafer chamfering device for chamfering a wafer, comprising: a grinding module for relative rotation with the wafer to chamfer the edge of the wafer; and a cooling and lubricating module for spraying the contact position between the grinding module and the wafer, wherein the cooling and lubricating module comprises a liquid storage tank for providing spraying liquid.
[0007] In some embodiments, the grinding module comprises: a grinding table for driving connection with the wafer to rotate synchronously with the wafer; and a grinding wheel having an axis parallel to the axis of the wafer, wherein the grinding groove of the grinding wheel is used to contact the edge of the wafer, and the grinding wheel rotates in the opposite direction to the wafer.
[0008] In some embodiments, the grinding wheel comprises a fixing member for fixing the grinding wheel.
[0009] In some embodiments, the cooling and lubricating module comprises: a spray head corresponding to the contact position between the grinding wheel and the wafer, so that the spray head can spray the contact position between the grinding wheel and the wafer; and a liquid outlet pipeline, wherein the spray head is arranged on the liquid outlet pipeline, and the liquid outlet pipeline supplies spraying liquid through the spray head.
[0010] In some embodiments, a control valve is arranged on the liquid outlet pipeline.
[0011] In some embodiments, the outlet pipe is connected to a cooling lubricant pipe, the cooling lubricant pipe is connected to the storage tank, the storage tank is used to store the cooling lubricant, and the spray liquid is the cooling lubricant.
[0012] In some embodiments, the storage tank is equipped with a stirring pump, which is used to stir the cooling lubricant and pump the cooling lubricant into the cooling lubricant pipeline.
[0013] In some embodiments, the liquid outlet pipeline is further connected to a pure water pipeline, which is used to supply pure water; the pure water pipeline is connected in parallel with the cooling lubricant pipeline.
[0014] In some embodiments, the cooling lubricant line is provided with a first valve;
[0015] And / or, the pure water pipeline is equipped with a second valve.
[0016] In some embodiments, a drive module is also included, wherein both the grinding module and the cooling and lubrication module are connected to the drive module.
[0017] The wafer chamfering equipment provided in this application is used to chamfer the edges of wafers. The chamfering is achieved through the relative rotation between the grinding module and the wafer. A cooling and lubrication module sprays water onto the contact area between the grinding module and the wafer during the chamfering process, reducing the grinding force on the wafer edges. A storage tank ensures continuous spraying, guaranteeing cooling and lubrication throughout the entire wafer chamfering process. This reduces edge chipping during chamfering and improves the wafer yield. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of wafer chamfering in the prior art;
[0020] Figure 2 This is a schematic diagram of the structure of the wafer chamfering device provided in an embodiment of this application.
[0021] Explanation of reference numerals in the attached figures:
[0022] 100 - Grinding module, 110 - Grinding table, 120 - Grinding wheel, 121 - Fixing component;
[0023] 200-Cooling and lubrication module, 210-Spray head, 220-Control valve, 230-Liquid outlet pipeline, 240-Pure water pipeline, 250-Cooling and lubricating fluid pipeline, 260-Storage tank, 261-Agitator pump;
[0024] 300-chip. Detailed Implementation
[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The terminology used in the following embodiments is for the purpose of describing specific embodiments only and is not intended to be a limitation of this application. As used in the specification and appended claims of this application, the singular expressions "a," "an," "the," "the," "the," and "this" are intended to also include expressions such as "one or more," unless the context clearly indicates otherwise. It should also be understood that in the embodiments of this application, "one or more" refers to one, two, or more; "and / or" describes the relationship between related objects, indicating that three relationships may exist; for example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.
[0027] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.
[0028] The "multiple" mentioned in the embodiments of this application refers to two or more. It should be noted that in the description of the embodiments of this application, terms such as "first" and "second" are used only for the purpose of distinguishing descriptions and should not be construed as indicating or implying relative importance, nor should they be construed as indicating or implying order.
[0029] The terms "parallel" and "perpendicular" used in this application refer to "basically parallel" and "basically perpendicular" in practical operation. "Basically parallel" can be understood as parallelism with a certain degree of error, and similarly, "basically perpendicular" can be understood as perpendicularity with a certain degree of error.
[0030] like Figure 1 As shown, in the prior art, a grinding wheel is used to chamfer the wafer set on the grinding table. However, the grinding force of the grinding wheel is strong, which makes it easy for chipping to occur during the wafer chamfering process, resulting in a low wafer yield.
[0031] This application provides a wafer chamfering device that reduces edge chipping during the wafer chamfering process and improves wafer yield.
[0032] like Figure 2 As shown, the wafer chamfering device provided in this application embodiment is used to chamfer a wafer 300, and includes a grinding module 100 and a cooling and lubrication module 200. The grinding module 100 is used to rotate relative to the wafer 300 so that the grinding module 100 can chamfer the edge of the wafer 300. The cooling and lubrication module 200 is used to spray the contact area between the grinding module 100 and the wafer 300 so that during the chamfering process of the grinding module 100, the contact area between the grinding module 100 and the wafer 300 is cooled and lubricated by the cooling and lubrication module 200, reducing the grinding force on the edge of the wafer 300. The cooling and lubrication module 200 includes a liquid storage tank 260 for providing spray liquid. The liquid storage tank 260 enables the cooling and lubrication module 200 to continuously spray the contact area between the grinding module 100 and the wafer 300, so as to ensure that cooling and lubrication can be carried out throughout the chamfering process of the wafer 300, reducing the edge chipping phenomenon during the chamfering process of the wafer 300 and improving the yield of the wafer 300.
[0033] like Figure 2 As shown, the grinding module 100 includes a grinding table 110 and a grinding wheel 120; wherein, the grinding table 110 is used for transmission connection with the wafer 300, and the wafer 300 is connected to the grinding table 110 so that the grinding table 110 can drive the wafer 300 to rotate synchronously.
[0034] The axis of the grinding wheel 120 is set parallel to the axis of the wafer 300, and the grinding groove of the grinding wheel 120 contacts the edge of the wafer 300 so as to achieve chamfering of the edge of the wafer 300 through the grinding wheel 120;
[0035] To improve the chamfering effect on the wafer 300, the wafer 300 and the grinding wheel 120 rotate in opposite directions. Under the force of relative rotation, the chamfering effect on the wafer 300 is improved.
[0036] To improve the stability of the 300 chamfering process on wafers, such as Figure 2 As shown, the grinding wheel 120 includes a fixing member 121 for fixing the grinding wheel 120. The grinding wheel 120 is fixed in a designated position by the fixing member 121 to achieve chamfering of the wafer 300.
[0037] It should be noted that the grinding table 110 is also fixed in a designated position by a fixing device so that the wafer 300 can rotate in the designated position to improve the stability of the wafer 300 chamfering process; the grinding table 110 can be fixed in a position such as the worktable surface, and this application embodiment does not limit this.
[0038] like Figure 2 As shown, the cooling and lubrication module 200 includes a spray head 210 and a liquid outlet pipe 230; wherein, the spray head 210 corresponds to the contact position between the grinding wheel 120 and the wafer 300, so that the spray head 210 can spray the spray liquid to the contact position between the grinding wheel 120 and the wafer 300, thereby reducing the grinding force of the grinding wheel 120 on the wafer 300 during the chamfering process and reducing the chipping phenomenon of the wafer 300;
[0039] The spray head 210 is installed on the liquid outlet pipe 230, and the liquid outlet pipe 230 provides spray liquid through the spray head 210.
[0040] like Figure 2 As shown, a control valve 220 is provided on the liquid outlet pipeline 230 to achieve spraying of the spray head 210 by opening and closing the control valve 220.
[0041] like Figure 2 As shown, the outlet pipe 230 is connected to the cooling lubricant pipe 250, and the cooling lubricant pipe 250 is connected to the storage tank 260. The storage tank 260 is used to store the cooling lubricant so that the cooling lubricant can be sprayed from the storage tank 260, through the cooling lubricant pipe 250 and the outlet pipe 230, and then through the spray head 210 to the contact area between the grinding wheel 120 and the wafer 300. The cooling lubricant further improves the cooling and lubrication effect on the contact area between the grinding wheel 120 and the wafer 300.
[0042] In some embodiments, the cooling lubricant can be an aqueous chamfering fluid, extreme pressure emulsion, water-soluble cooling lubricant, etc., which can cool and lubricate the grinding process. This application does not limit this embodiment.
[0043] like Figure 2As shown, a stirring pump 261 is installed inside the storage tank 260. Starting the stirring pump 261 can stir the cooling lubricant and pump the cooling lubricant into the cooling lubricant pipeline 250, so as to spray the cooling lubricant onto the contact position between the grinding wheel 120 and the wafer 300.
[0044] In some embodiments, a first valve is provided on the cooling lubricant line 250, and the cooling lubricant is delivered into the outlet line 230 by opening and closing the first valve.
[0045] To further ensure the cooling and lubrication effect during the 300 chamfering process of the wafer, such as Figure 2 As shown, the liquid outlet pipe 230 is also connected to a pure water pipe 240, which is used to introduce pure water. The pure water pipe 240 is connected in parallel with the cooling and lubricating fluid pipe 250, and a second valve is provided on the pure water pipe 240. In this way, if the cooling and lubricating fluid in the storage tank 260 is insufficient, the second valve can be opened in time to spray pure water, so as to ensure that the wafer 300 can be cooled and lubricated throughout the chamfering process. The pure water pipe 240 can also be used to clean the grinding module 100 after the chamfering is completed, thereby improving the work efficiency.
[0046] The wafer chamfering device provided in this application embodiment also includes a drive module, which drives the grinding module 100 and the cooling and lubrication module 200. The drive module may include multiple drive components, which are used to drive the grinding table 110, the grinding wheel 120 and the stirring pump 261, etc., so as to achieve the chamfering of the wafer 300 through the drive module.
[0047] When the wafer chamfering equipment provided in this application embodiment is in operation, the first valve on the cooling and lubrication pipeline 250 and the control valve 220 on the liquid outlet pipeline 230 are opened, and the stirring pump 261 is started so that the cooling and lubrication liquid is sprayed through the spray head 210 to the contact position between the grinding wheel 120 and the wafer 300, thereby achieving cooling and lubrication during the wafer 300 chamfering process, reducing the edge chipping phenomenon during the wafer 300 chamfering process, and improving the yield of the wafer 300.
[0048] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A wafer chamfering apparatus for chamfering wafers (300), characterized in that, include: A grinding module (100) is configured to rotate relative to the wafer (300) to chamfer the edges of the wafer (300); A cooling and lubrication module (200) is used to spray the contact area between the grinding module (100) and the wafer (300), and the cooling and lubrication module (200) includes a reservoir (260) for providing spray liquid.
2. The wafer chamfering apparatus according to claim 1, characterized in that, The grinding module (100) includes: A grinding table (110) is used to drive the wafer (300) so that the grinding table (110) drives the wafer (300) to rotate synchronously; A grinding wheel (120) is provided, the axis of which is parallel to the axis of the wafer (300), and the grinding groove of the grinding wheel (120) is used to contact the edge of the wafer (300); The grinding wheel (120) rotates in the opposite direction to the wafer (300).
3. The wafer chamfering apparatus according to claim 2, characterized in that, The grinding wheel (120) includes a fastener (121) for securing the grinding wheel (120).
4. The wafer chamfering apparatus according to claim 2, characterized in that, The cooling and lubrication module (200) includes: A spray head (210) is provided, which corresponds to the contact point between the grinding wheel (120) and the wafer (300) so that the spray head (210) can spray the contact point between the grinding wheel (120) and the wafer (300); The liquid outlet pipe (230) is provided with the spray head (210) and the liquid outlet pipe (230) supplies spray liquid through the spray head (210).
5. The wafer chamfering apparatus according to claim 4, characterized in that, A control valve (220) is installed on the liquid outlet pipeline (230).
6. The wafer chamfering apparatus according to claim 4, characterized in that, The outlet pipe (230) is connected to a cooling lubricant pipe (250), which is connected to the storage tank (260). The storage tank (260) is used to store the cooling lubricant, and the spray liquid is the cooling lubricant.
7. The wafer chamfering apparatus according to claim 6, characterized in that, The storage tank (260) is equipped with a stirring pump (261), which is used to stir the cooling lubricant and pump the cooling lubricant into the cooling lubricant pipeline (250).
8. The wafer chamfering apparatus according to claim 6, characterized in that, The liquid outlet pipeline (230) is also connected to a pure water pipeline (240), which is used to introduce pure water; The pure water pipeline (240) is connected in parallel with the cooling lubricant pipeline (250).
9. The wafer chamfering apparatus according to claim 8, characterized in that, The cooling lubricant line (250) is equipped with a first valve; And / or, the pure water pipeline (240) is equipped with a second valve.
10. The wafer chamfering apparatus according to any one of claims 1-9, characterized in that, It also includes a drive module, and both the grinding module (100) and the cooling and lubrication module (200) are connected to the drive module.