Feed gear of semiconductor slicing machine

Abstract

The utility model discloses a feed gear of a semiconductor slicer, which comprises a stepping motor and a driving rod arranged at the lower end of the stepping motor, a blade is arranged inside the outer wall of the lower end of the driving rod, and the outer wall of the front end of the driving rod is fixedly connected with the driving motor to drive the blade to rotate at a high speed. A fixing plate is arranged on the lower side of the blade, clamps are arranged on the positions, close to the left side and the right side, of the outer wall of the upper end of the fixing plate so as to clamp a semiconductor to be cut, and a stepping motor and a driving motor are electrically connected with an external power source. The vertical moving area of the driving rod in the stepping motor is shielded, dust and other small particles in air are prevented from entering the moving area of the driving rod, the abrasion and fault probability of mechanical parts are reduced, under the condition that the transparent cylinder a is used for protection, the cleaning frequency can be reduced, and the cleaning efficiency is improved. Therefore, the maintenance cost and time are saved.

Description

Technical Field

[0001] This utility model belongs to the technical field of slicing machine blades, specifically relating to a feeding device for a semiconductor slicing machine. Background Technology

[0002] The feed mechanism of a semiconductor slicing machine is a crucial component for cutting silicon wafers or other semiconductor materials. Its design and performance directly affect cutting accuracy, efficiency, and material loss. However, during the movement of the feed blade, the drive rod's up-and-down motion can easily trap airborne dust and lubricating oil, which can then enter the motor, causing subsequent jamming and uneven movement of the drive rod. Utility Model Content

[0003] The purpose of this invention is to provide a feeding device for a semiconductor slicing machine, in order to solve the problem mentioned in the background art that when the drive rod moves up and down, dust floating in the air and lubricating oil on the drive rod easily stick together and thus enter the motor.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a feed device for a semiconductor slicing machine, comprising a stepper motor and a drive rod installed at the lower end of the stepper motor;

[0005] A blade is provided inside the lower outer wall of the drive rod;

[0006] A drive motor is fixedly connected to the outer wall of the front end of the drive rod to drive the blade to rotate at high speed;

[0007] A fixing plate is provided on the lower side of the blade. Clamps are provided on the upper outer wall of the fixing plate and near the left and right sides to hold the semiconductor to be cut. The stepper motor and the drive motor are electrically connected to an external power source.

[0008] A transparent cylinder b is sleeved on the outside of the stepper motor, and a transparent cylinder a is provided inside the transparent cylinder b to cover the drive rod.

[0009] Preferably, a fixing ring is provided on the lower side of the transparent cylinder a, and an abutment plate b is fixedly connected to the lower outer wall of the transparent cylinder a.

[0010] Preferably, an abutment plate a is fixedly connected to the upper outer wall of the fixing ring, and a sealing gasket is provided between the abutment plate a and the abutment plate b to fill the gap between the abutment plate a and the abutment plate b.

[0011] Preferably, multiple fixing bolts are provided at equal intervals between the four corners of the upper outer wall of the abutment plate b and the abutment plate a, and each of the multiple fixing bolts includes a fixing screw and a fixing nut.

[0012] Preferably, a brush is fixedly connected to the inner circular wall of the fixing ring to fill the gap between the fixing ring and the drive rod, and the interior of the abutment plate a, the sealing gasket and the abutment plate b are all provided with openings for the fixing screw to pass through.

[0013] Preferably, a control box is provided on the rear side of the fixed plate, and a drive mechanism is fixedly connected to the front outer wall of the control box to drive the fixed plate to move back and forth.

[0014] Preferably, a mounting plate is fixedly connected to the upper side of the front outer wall of the control box to limit the position of the stepper motor, and a base is fixedly connected to the lower outer wall of the control box.

[0015] Preferably, the upper outer wall of the base is provided with a collection hopper to store the cut semiconductor slices, and the rear end of the drive rod is provided with a positioning shaft.

[0016] Compared with the prior art, the present invention provides a feeding device for a semiconductor slicing machine, which has the following advantages:

[0017] By installing transparent cylinders a and b, when the drive rod is driven up and down by the stepper motor, transparent cylinder a can be moved up and down inside transparent cylinder b simultaneously. This blocks the area where the drive rod moves up and down inside the stepper motor, preventing dust and other fine particles in the air from entering the movement area of ​​the drive rod. This reduces wear and tear on mechanical parts and the chance of failure. With transparent cylinder a protecting the drive rod, the cleaning frequency can be reduced, thus saving maintenance costs and time. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the feed device structure of a semiconductor slicing machine according to the present invention.

[0019] Figure 2 This is a side view of the feed device of a semiconductor slicing machine according to the present invention.

[0020] Figure 3 This is a partial structural schematic diagram of the drive rod area from the side.

[0021] Figure 4 This is a partial structural diagram of region a of the transparent cylinder of this utility model.

[0022] In the diagram: 1. Base; 2. Collection hopper; 3. Drive mechanism; 4. Fixing plate; 5. Clamp; 6. Blade; 7. Drive motor; 8. Drive rod; 9. Mounting plate; 10. Stepper motor; 11. Control box; 12. Positioning shaft; 13. Brush; 14. Fixing ring; 15. Abutment plate a; 16. Sealing gasket; 17. Fixing bolt; 18. Abutment plate b; 19. Transparent cylinder a; 20. Transparent cylinder b. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] This utility model provides, for example Figure 1-4 The feeding device of a semiconductor slicing machine shown includes a stepper motor 10 and a drive rod 8 installed at the lower end of the stepper motor 10;

[0025] A blade 6 is provided inside the lower outer wall of the drive rod 8;

[0026] A drive motor 7 is fixedly connected to the outer wall of the front end of the drive rod 8 to drive the blade 6 to rotate at high speed;

[0027] A fixing plate 4 is provided on the lower side of the blade 6. The upper outer wall of the fixing plate 4 and near the left and right sides are respectively provided with clamps 5 to hold the semiconductor to be cut. The stepper motor 10 and the drive motor 7 are electrically connected to the external power supply. When performing semiconductor slicing operation, the semiconductor to be sliced ​​is first fixed in the clamps 5 on the fixing plate 4 to hold the semiconductor. Then, during the cutting process, the stepper motor 10 drives the drive rod 8 to move up and down, and the drive motor 7 drives the blade 6 to rotate at high speed to perform the cutting operation. During the cutting, the drive rod 8 moves down, and by rotating the blade 6 at high speed, the semiconductor is cut into semiconductor slices of the corresponding thickness according to the preset thickness. After a single slice is cut, the drive rod 8 moves up, and the fixing plate 4 moves the semiconductor backward to the distance of the set slice thickness, and then the cutting operation can be performed again.

[0028] A transparent cylinder b20 is sleeved on the outside of the stepper motor 10. A transparent cylinder a19 is set inside the transparent cylinder b20 to cover the drive rod 8. When the drive rod 8 is driven up and down by the stepper motor 10, it will synchronously drive the transparent cylinder a19 to move up and down. When it moves up, the transparent cylinder a19 is pushed up by the drive motor 7. When the drive rod 8 moves down, the transparent cylinder a19 falls naturally. In this way, the active area of ​​the drive rod 8 is covered when it moves up and down, so as to prevent dust from contacting the lubricating oil on the surface of the drive rod 8 and avoid caking, which could cause jamming during the movement.

[0029] like Figure 3 As shown, a fixing ring 14 is provided on the lower side of the transparent cylinder a19. An abutment plate b18 is fixedly connected to the lower outer wall of the transparent cylinder a19. An abutment plate a15 is fixedly connected to the upper outer wall of the fixing ring 14. A sealing gasket 16 is provided between the abutment plate a15 and the abutment plate b18 to fill the gap between the abutment plate a15 and the abutment plate b18. Multiple fixing bolts 17 are provided at equal intervals between the four corners of the upper outer wall of the abutment plate b18 and the abutment plate a15. Each of the multiple fixing bolts 17 includes a fixing screw and a fixing nut.

[0030] When the drive rod 8 moves the transparent cylinder a19 upwards, the brush 13 inside the fixing ring 14 located on the lower side of the transparent cylinder a19 fills the gap between the transparent cylinder a19, the inner wall of the fixing ring 14, and the drive rod 8. Simultaneously, the dense brush 13 completely blocks the gap, preventing dust from entering. If the brush 13 is damaged, the fixing bolt 17 can be removed by unscrewing and pulling out the fixing screw, allowing the fixing ring 14 to be removed and secured. After removing ring 14, brush 13 can be disassembled and replaced. After replacement, the upper end of fixing ring 14 abuts against the lower end of transparent tube a19 abutting plate b18, and a sealing gasket 16 is provided between abutting plate a15 and abutting plate b18 to prevent dust from entering. After abutting, insert fixing screw into the opening between abutting plate a15 and abutting plate b18, and tighten fixing nut on the other end of fixing screw to complete the installation of fixing ring 14.

[0031] like Figure 3 As shown, a brush 13 is fixedly connected to the inner circular wall of the fixing ring 14 to fill the gap between the fixing ring 14 and the drive rod 8. The interior of the abutment plate a15, the sealing gasket 16 and the abutment plate b18 are all provided with openings for the fixing screws to pass through.

[0032] The brush 13 can fill the gap between the fixing ring 14 and the drive rod 8 and prevent dust from entering. The circular inner wall of the transparent tube b20 and the circular outer wall of the stepper motor 10 fit together to prevent dust from entering. The mounting plate 9 also has an opening inside to allow the transparent tube a19, which moves up and down, to pass through.

[0033] like Figure 1 As shown, a control box 11 is provided on the rear side of the fixed plate 4. A drive mechanism 3 is fixedly connected to the front outer wall of the control box 11 to drive the fixed plate 4 to move back and forth. A mounting plate 9 is fixedly connected to the front outer wall of the control box 11 near the upper side to limit the position of the stepper motor 10. A base 1 is fixedly connected to the lower outer wall of the control box 11.

[0034] The control box 11 can drive the fixed plate 4 to move back and forth via the drive mechanism 3, so as to move the semiconductor to be cut a specified distance and wait for cutting. The drive mechanism 3 is equipped with a drive gear, which meshes with the racks at the left and right ends of the fixed plate 4. The rotation of the drive gear drives the fixed plate 4 to move. The control box 11 is equipped with a power supply and control system to provide power to the drive mechanism 3, drive motor 7 and stepper motor 10, and to control the corresponding components to work after receiving external control signals.

[0035] like Figure 1 and Figure 3 As shown, the upper outer wall of the base 1 is provided with a collection hopper 2 to store the cut semiconductor slices, and the rear end of the drive rod 8 is provided with a positioning shaft 12.

[0036] The cut semiconductor wafers fall into the collection hopper 2 for storage. The inside of the collection hopper 2 is equipped with a buffer pad to prevent damage to the falling semiconductor wafers. The clamp 5 and the fixing plate 4 are fixed together by the cooperation of the fastening screw and the fastening nut. The fastening screw at the lower end of the clamp 5 passes through the movable groove opened in the fixing plate 4, and the fastening nut is screwed on the other end of the fastening screw to limit the position of the clamp 5. This allows for clamping and fixing according to different semiconductor sizes.

[0037] The implementation principle of this embodiment is as follows: When performing semiconductor slicing, the semiconductor to be sliced ​​is first fixed in the clamp 5 on the fixing plate 4. The semiconductor is clamped, and then during the cutting process, the stepper motor 10 drives the drive rod 8 to move up and down, and the drive motor 7 drives the blade 6 to rotate at high speed to perform the cutting operation. During the cutting, the drive rod 8 moves down, and the high-speed rotating blade 6 cuts the semiconductor into a semiconductor slice of the corresponding thickness according to the preset thickness. After a single slice is cut, the drive rod 8 moves up, and the fixing plate 4 moves the semiconductor backward to the distance of the set slice thickness. Then the cutting operation can be performed again. When the drive rod 8 is driven up and down by the stepper motor 10, it will synchronously drive the transparent cylinder a19 to move up and down. When it moves up, the transparent cylinder a19 moves up under the upward push of the drive motor 7. When the drive rod 8 moves down, the transparent cylinder a19 falls naturally. Thus, when the drive rod 8 moves up and down, its moving area is blocked, preventing dust from contacting the lubricating oil on the surface of the drive rod 8 and preventing clumping, which could cause jamming during the movement.

[0038] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A feed device for a semiconductor slicing machine, comprising a stepper motor (10) and a drive rod (8) mounted on the lower end of the stepper motor (10). The lower end of the drive rod (8) is provided with a blade (6) inside the outer wall. The front end of the drive rod (8) is fixedly connected to a drive motor (7) to drive the blade (6) to rotate at high speed; A fixing plate (4) is provided on the lower side of the blade (6). A clamp (5) is provided on the upper outer wall of the fixing plate (4) and near the left and right sides respectively to hold the semiconductor to be cut. The stepper motor (10) and the drive motor (7) are electrically connected to the external power supply. Its features are: A transparent tube b (20) is sleeved on the outside of the stepper motor (10), and a transparent tube a (19) is provided inside the transparent tube b (20) to cover the drive rod (8).

2. The feed device of a semiconductor slicing machine according to claim 1, characterized in that: A fixing ring (14) is provided on the lower side of the transparent tube a (19), and an abutment plate b (18) is fixedly connected to the lower outer wall of the transparent tube a (19).

3. The feed device of a semiconductor slicing machine according to claim 2, characterized in that: The upper outer wall of the fixed ring (14) is fixedly connected to the abutment plate a (15), and a sealing gasket (16) is provided between the abutment plate a (15) and the abutment plate b (18) to fill the gap between the abutment plate a (15) and the abutment plate b (18).

4. The feed device of a semiconductor slicing machine according to claim 2, characterized in that: Multiple fixing bolts (17) are provided at equal intervals between the four corners of the upper outer wall of the abutment plate b (18) and the abutment plate a (15). Each of the multiple fixing bolts (17) includes a fixing screw and a fixing nut.

5. The feed device of a semiconductor slicing machine according to claim 3, characterized in that: A brush (13) is fixedly connected to the inner circular wall of the fixing ring (14) to fill the gap between the fixing ring (14) and the drive rod (8). The interior of the abutment plate a (15), the sealing gasket (16) and the abutment plate b (18) are all provided with openings for the fixing screws to pass through.

6. The feed device of a semiconductor slicing machine according to claim 1, characterized in that: A control box (11) is provided on the rear side of the fixed plate (4), and a drive mechanism (3) is fixedly connected to the front outer wall of the control box (11) to drive the fixed plate (4) to move back and forth.

7. The feed device of a semiconductor slicing machine according to claim 6, characterized in that: The front outer wall of the control box (11) is fixedly connected to a mounting plate (9) near the upper side to limit the position of the stepper motor (10), and the lower outer wall of the control box (11) is fixedly connected to a base (1).

8. The feed device of a semiconductor slicing machine according to claim 7, characterized in that: The upper outer wall of the base (1) is provided with a collection hopper (2) to store the cut semiconductor slices, and the rear end of the drive rod (8) is provided with a positioning shaft (12).

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