PB film packaging device

Abstract

The utility model relates to a PB film packaging device, which belongs to the technical field of MEMS chip packaging, and comprises a positioning tool and a PB film bearing plate, a plurality of PB film components are uniformly arranged on the PB film bearing plate, the plurality of PB film components are arranged in a matrix shape, each PB film component comprises an ePTFE layer, a supporting PI layer is arranged on the ePTFE layer, a first adhesive layer is arranged between the supporting PI layer and the ePTFE layer, and a second adhesive layer is arranged between the supporting PI layer and the ePTFE layer. According to the utility model, gluing is not needed, the efficiency is high, the reliability is high, and the problems of large equipment investment, low production efficiency and insufficient environment resistance of the traditional process are solved.

Description

Technical Field

[0001] This utility model relates to the field of MEMS chip packaging technology, and in particular to a PB film packaging device for bottom packaging of MEMS chips. Background Technology

[0002] Traditional MEMS chip packaging typically employs a single-component silicone coating and die bond PB film mounting process, which has the following drawbacks:

[0003] 1. Using single-component silicone for coating increases the complexity of the process and the cost of materials;

[0004] 2. Specialized adhesive application and mounting equipment is required, resulting in high equipment investment costs;

[0005] 3. Low production efficiency;

[0006] 4. Applying silicone requires refrigeration and auxiliary heating for curing, resulting in high additional costs;

[0007] Therefore, a new type of packaging device is needed that can simplify the process, reduce equipment investment, and improve production efficiency. Summary of the Invention

[0008] The purpose of this invention is to overcome the shortcomings of the above-mentioned traditional technologies and provide a PB film encapsulation device that is glue-free, highly efficient, and highly reliable, solving the problems of high investment, low production efficiency, and insufficient environmental resistance of traditional processes and equipment.

[0009] The purpose of this utility model is achieved through the following technical measures: a PB film encapsulation device, including a positioning fixture and a PB film carrier plate, a plurality of PB film components are uniformly arranged on the PB film carrier plate, the plurality of PB film components are arranged in a matrix, the PB film components include an ePTFE layer, a supporting PI layer is provided on the ePTFE layer, a first adhesive layer is provided between the supporting PI layer and the ePTFE layer, and a second adhesive layer is provided on the side of the supporting PI layer away from the ePTFE layer.

[0010] As an optimization, both the second adhesive layer and the first adhesive layer are made of silicone mesh matrix.

[0011] As an optimization, the center of the supporting PI layer is provided with a circular through hole.

[0012] As an optimization, the ePTFE layer has a square structure.

[0013] As an optimization, the PB film carrier plate is provided with second positioning holes at each of its four corners.

[0014] As an optimization, the positioning fixture is rectangular, and a first positioning post is provided at each of the four corners of the positioning fixture.

[0015] As an optimization, the positioning fixture is provided with several second positioning posts on its upper and lower sides respectively.

[0016] As an optimization, the upper side of the positioning fixture is uniformly provided with several strip-shaped grooves.

[0017] As an optimization, the height of the first positioning post is 3.5~10.0mm, which is greater than the stacking height of the PB film and the PCB.

[0018] As an optimization, the height of the second positioning post is 3.5~10.0mm, which is greater than the stacking height of the PB film and the PCB.

[0019] Due to the adoption of the above technical solution, the advantages of this utility model compared with the prior art are as follows: During operation, the PB film carrier plate is arranged and placed on the positioning fixture, and the second positioning post on the positioning fixture is inserted into the second positioning hole on the PB film carrier plate; the PCB board carrying the MEMS chip to be packaged is placed on the PB film array, and the PCB board has a first positioning hole at each of its four corners. The first positioning post on the positioning fixture is inserted into the first positioning hole, and the PB film component on the PB film carrier plate packages the MEMS chip on the PCB board. The array application of the PB film is achieved through the positioning fixture, saving the equipment investment and maintenance cost of the dispensing machine, resulting in low cost and high efficiency.

[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the positioning tooling in an embodiment of this utility model;

[0022] Figure 2 This is a schematic diagram of the structure of the PB film carrier plate in an embodiment of this utility model;

[0023] Figure 3 This is a schematic diagram of the PB membrane component in an embodiment of this utility model;

[0024] Figure 4 yes Figure 3 Schematic diagram of the cross-sectional structure along the AA direction;

[0025] Figure 5 This is a schematic diagram of the structure of a PB film encapsulation device in use according to an embodiment of this utility model.

[0026] In the figure, 1-positioning fixture, 2-PB film carrier plate, 3-first positioning post, 4-second positioning post, 5-strip groove, 6-PB film component, 7-ePTFE layer, 8-supporting PI layer, 9-circular through hole, 10-first adhesive layer, 11-second adhesive layer, 12-second positioning hole, 13-PCB board, 14-first positioning hole. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified. Example 1

[0030] like Figure 1-5 As shown, a PB film encapsulation device includes a positioning fixture 1 and a PB film carrier plate 2. The positioning fixture 1 is rectangular, and a first positioning post 3 is provided at each of the four corners of the positioning fixture 1. The height of the first positioning post 3 is 3.5mm.

[0031] The positioning fixture 1 has several second positioning posts 4 on its upper and lower sides, and the height of the second positioning posts 4 is 3.5mm. The upper side of the positioning fixture 1 has several strip grooves 5 evenly distributed.

[0032] A plurality of PB membrane components 6 are uniformly arranged on the PB membrane support plate 2, and the plurality of PB membrane components 6 are arranged in a matrix.

[0033] The PB membrane component 6 includes an ePTFE layer 7, which has a square structure. A supporting PI layer 8 is provided on the ePTFE layer 7, and a circular through hole 9 is provided in the center of the supporting PI layer 8.

[0034] A first adhesive layer 10 is provided between the supporting PI layer 8 and the ePTFE layer 7. A second adhesive layer 11 is provided on the side of the supporting PI layer 8 away from the ePTFE layer 7. Both the second adhesive layer 11 and the first adhesive layer 10 are mesh-like substrates made of silicone. The ePTFE layer 7 is placed on the PB film carrier plate 2.

[0035] The PB membrane support plate 2 is provided with second positioning holes 12 at each of its four corners. Example 2

[0036] like Figure 1-5 As shown, a PB film encapsulation device includes a positioning fixture 1 and a PB film carrier plate 2. The positioning fixture 1 is rectangular, and a first positioning post 3 is provided at each of the four corners of the positioning fixture 1. The height of the first positioning post 3 is 10.0 mm.

[0037] The positioning fixture 1 has several second positioning posts 4 on its upper and lower sides, and the height of the second positioning posts 4 is 10.0 mm. The upper side of the positioning fixture 1 has several strip grooves 5 evenly distributed.

[0038] A plurality of PB membrane components 6 are uniformly arranged on the PB membrane support plate 2, and the plurality of PB membrane components 6 are arranged in a matrix.

[0039] The PB membrane component 6 includes an ePTFE layer 7, which has a square structure. A supporting PI layer 8 is provided on the ePTFE layer 7, and a circular through hole 9 is provided in the center of the supporting PI layer 8.

[0040] A first adhesive layer 10 is provided between the supporting PI layer 8 and the ePTFE layer 7. A second adhesive layer 11 is provided on the side of the supporting PI layer 8 away from the ePTFE layer 7. Both the second adhesive layer 11 and the first adhesive layer 10 are mesh-like substrates made of silicone. The ePTFE layer 7 is placed on the PB film carrier plate 2.

[0041] The PB membrane support plate 2 is provided with second positioning holes 12 at each of its four corners. Example 3

[0042] like Figure 1-5 As shown, a PB film encapsulation device includes a positioning fixture 1 and a PB film carrier plate 2. The positioning fixture 1 is rectangular, and a first positioning post 3 is provided at each of the four corners of the positioning fixture 1. The height of the first positioning post 3 is 7.0 mm.

[0043] The positioning fixture 1 has several second positioning posts 4 on its upper and lower sides, and the height of the second positioning posts 4 is 7.0mm. The upper side of the positioning fixture 1 has several strip grooves 5 evenly distributed.

[0044] A plurality of PB membrane components 6 are uniformly arranged on the PB membrane support plate 2, and the plurality of PB membrane components 6 are arranged in a matrix.

[0045] The PB membrane component 6 includes an ePTFE layer 7, which has a square structure. A supporting PI layer 8 is provided on the ePTFE layer 7, and a circular through hole 9 is provided in the center of the supporting PI layer 8.

[0046] A first adhesive layer 10 is provided between the supporting PI layer 8 and the ePTFE layer 7. A second adhesive layer 11 is provided on the side of the supporting PI layer 8 away from the ePTFE layer 7. Both the second adhesive layer 11 and the first adhesive layer 10 are mesh-like substrates made of silicone. The ePTFE layer 7 is placed on the PB film carrier plate 2.

[0047] The PB membrane support plate 2 is provided with second positioning holes 12 at each of its four corners.

[0048] During operation, the PB film carrier plate 2 is arranged and placed on the positioning fixture 1. The second positioning post 4 on the positioning fixture 1 is inserted into the second positioning hole 12 on the PB film carrier plate 2. The strip groove 5 facilitates the placement and removal of the PB film carrier plate 2. The PCB board 13 carrying the MEMS chip to be packaged is placed on the PB film carrier plate 2. The PCB board 13 has a first positioning hole 14 at each of its four corners. The first positioning post 3 on the positioning fixture 1 is inserted into the first positioning hole 14. The PB film component 6 on the PB film carrier plate 2 packages the MEMS chip on the PCB board 13. The array application of the PB film is achieved through the positioning fixture 1, saving the equipment investment and maintenance costs of the dispensing machine. It is low-cost and highly efficient.

[0049] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A PB film encapsulation device, characterized in that: It includes a positioning fixture (1) and a PB membrane support plate (2). A number of PB membrane components (6) are uniformly arranged on the PB membrane support plate (2). The number of PB membrane components (6) are arranged in a matrix. The PB membrane component (6) includes an ePTFE layer (7). A supporting PI layer (8) is provided on the ePTFE layer (7). A first adhesive layer (10) is provided between the supporting PI layer (8) and the ePTFE layer (7). A second adhesive layer (11) is provided on the side of the supporting PI layer (8) away from the ePTFE layer (7).

2. The PB film encapsulation device according to claim 1, characterized in that: The second adhesive layer (11) and the first adhesive layer (10) are both mesh-like substrates made of silicone.

3. A PB film encapsulation device according to claim 1 or 2, characterized in that: The center of the supporting PI layer (8) is provided with a circular through hole (9).

4. The PB film encapsulation device according to claim 3, characterized in that: The ePTFE layer (7) has a square structure.

5. A PB film encapsulation device according to claim 4, characterized in that: The PB film carrier plate (2) is provided with second positioning holes (12) at the four corners respectively.

6. The PB film encapsulation device according to claim 1, characterized in that: The positioning fixture (1) is rectangular, and the four corners of the positioning fixture (1) are respectively provided with first positioning posts (3).

7. A PB film encapsulation device according to claim 6, characterized in that: The positioning fixture (1) is provided with several second positioning posts (4) on its upper and lower sides respectively.

8. A PB film encapsulation device according to claim 7, characterized in that: The upper side of the positioning fixture (1) is uniformly provided with several strip grooves (5).

9. A PB film encapsulation device according to claim 6, characterized in that: The height of the first positioning post (3) is 3.5~10.0mm.

10. A PB film encapsulation device according to claim 7, characterized in that: The height of the second positioning post (4) is 3.5~10.0mm.

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