Thinning diamond grinding wheel assembly suitable for processing silicon carbide wafer

Abstract

The utility model discloses a thinning diamond grinding wheel assembly suitable for machining a silicon carbide wafer, belongs to the technical field of grinding equipment components, and aims to provide a thinning diamond grinding wheel assembly capable of effectively pushing grinding particles away from the wafer, the thinning diamond grinding wheel assembly comprises a diamond particle grinding disc and a grinding disc seat, and the main body part of the grinding disc seat is a supporting ring; one end of the supporting ring is provided with a connecting disc, the other end of the supporting ring is provided with an embedded ring, a matching hole is formed in the center of the diamond particle grinding disc, the diamond particle grinding disc is fixedly connected with one end face of the supporting ring, and fins are arranged between the outer side face of the connecting disc and the other end face of the supporting ring. The fin structures are uniformly arranged on the side, back to the diamond particle grinding disc, of the grinding disc seat, air is driven to generate airflow away from the rotation center during rotation, fine particles of grinding parameters are pushed away from the silicon carbide wafer, the probability that the fine particles fall on the surface of the wafer is effectively reduced, and the grinding efficiency is improved. And the cleanliness of the surface of the polished silicon carbide wafer is improved, and then the quality of a finished wafer product is improved.

Description

Technical Field

[0001] This application relates to the field of grinding equipment components, and more particularly to a thinned diamond grinding wheel assembly suitable for processing silicon carbide wafers. Background Technology

[0002] After silicon carbide material is cut, it needs to be polished to achieve the required size of the wafer. During the silicon carbide polishing and thinning process, many fine particles are generated. Because the rotating grinding wheel will slightly agitate the air and create turbulence, the particles will spread into the air and affect the processing environment. When the grinding wheel is removed from the wafer surface, these fine particles are likely to fall onto the wafer surface, affecting the cleanliness of the wafer surface. If not wiped properly, they may also scratch the smooth wafer surface. Summary of the Invention

[0003] The purpose of this application is to provide a thinned diamond grinding wheel assembly that can effectively push grinding particles away from the wafer.

[0004] To achieve the above objectives, this application provides a thinning diamond grinding wheel assembly suitable for processing silicon carbide wafers: including a diamond particle grinding disc and a grinding disc base. The main body of the grinding disc base is a support ring. One end of the support ring has a connecting disc and the other end has an embedded ring. The diamond particle grinding disc has a mating hole in its center, suitable for mating with the embedded ring. The diamond particle grinding disc is fixedly connected to one end face of the support ring. Fins are provided between the outer side of the connecting disc and the other end face of the support ring. The connecting disc also has a through hole for bolts or other connecting parts to pass through and fix the grinding disc base to the output end of the drive mechanism.

[0005] As a preferred embodiment, the fins extend along an arc from the outer side of the connecting disc to the edge of the support ring, thereby driving air to generate an airflow away from the rotation center of the grinding disc.

[0006] As a preferred embodiment, there are several fins, which are equidistantly arranged around the axis of the connecting disc to ensure that the center of gravity of the entire grinding wheel assembly falls on its own axis and to avoid polarization during high-speed rotation.

[0007] As a preferred embodiment, there are also several through holes, which are equidistantly arranged around the axis of the connecting disc, also to ensure that the center of gravity of the grinding wheel assembly falls on the axis.

[0008] As a preferred embodiment, the end face of the connecting disc also has a coaxial rear convex ring to improve the structural strength of the connecting disc.

[0009] As a preferred embodiment, the diamond grinding disc is coaxial with the support ring, the diameter of the diamond grinding disc is larger than that of the support ring, and the edge of the diamond grinding disc can also participate in the grinding operation.

[0010] As a preferred embodiment, the diamond grinding disc is fixedly connected to the support ring and the inner ring by a curing adhesive, ensuring the connection stability between the diamond grinding disc and the grinding disc base.

[0011] As a preferred option, the grinding disc holder is an integral structure, made of plastic through injection molding. While ensuring structural strength, it reduces sealing and weight. Moreover, the plastic grinding disc holder has better elasticity and toughness, which can provide good cushioning for the high-speed rotating diamond particle grinding disc. It also has lower operating costs. The grinding disc holder can be separated from the diamond particle grinding disc by using high temperature, so it is also easy to recycle.

[0012] Compared with the prior art, the beneficial effects of this application are as follows:

[0013] (1) By using the fin structure evenly arranged on the side of the grinding pad facing away from the diamond particle grinding pad, the air is driven to generate an airflow away from the center of rotation when rotating, which pushes the fine particles of the grinding parameters away from the silicon carbide wafer, effectively reducing the probability of fine particles falling onto the wafer surface, improving the cleanliness of the silicon carbide wafer surface after grinding, and thus improving the quality of the finished wafer.

[0014] (2) As the rotating fins will form a negative pressure zone behind the connecting plate, the airflow will blow on the output end of the drive mechanism, which can blow away the fine particles attached to the output shaft of the driver, thereby reducing the wear of the particles on the output shaft of the driver, and thus ensuring the working stability and service life of the driver. Attached Figure Description

[0015] Figure 1 This is a three-dimensional schematic diagram of the overall structure of the thinning diamond grinding wheel assembly suitable for processing silicon carbide wafers.

[0016] Figure 2 This is a first perspective sectional view of the overall structure of the thinning diamond grinding wheel assembly suitable for processing silicon carbide wafers.

[0017] Figure 3 This is a second perspective sectional view of the overall structure of the thinned diamond grinding wheel assembly suitable for processing silicon carbide wafers.

[0018] Figure 4 This is a third perspective sectional view of the overall structure of the thinning diamond grinding wheel assembly suitable for processing silicon carbide wafers.

[0019] Figure 5 This is a three-dimensional cross-sectional view of the grinding wheel holder of the thinned diamond grinding wheel assembly suitable for processing silicon carbide wafers.

[0020] In the diagram: 1. Diamond grinding disc; 101. Mating hole; 2. Grinding disc base; 201. Support ring; 202. Connecting disc; 203. Through hole; 204. Rear convex ring; 205. Embedded ring; 206. Fin. Detailed Implementation

[0021] The present application will be further described below with reference to specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0022] In the description of this application, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this application.

[0023] It should be noted that the terms "first," "second," etc., in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0024] The terms “comprising” and “having”, and any variations thereof, in the specification and claims of this application are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0025] like Figure 1-5 The thinning diamond grinding wheel assembly shown is suitable for processing silicon carbide wafers. It includes a diamond grinding disc 1 and a grinding disc base 2 that can be mated with each other. The grinding disc base 2 is an integral structure, which is integrally molded from plastic by injection molding. The main body of the grinding disc base 2 is a circular support ring 201. One end of the support ring 201 has a coaxial connecting disc 202 and the other end has a coaxial inner ring 205. The connecting disc 202 also has through holes 203. There are several through holes 203. These through holes 203 are equidistantly arranged around the axis of the connecting disc 202. The through holes 203 can be used for bolts and other connecting parts to pass through and fix the entire grinding disc base 2 to the output end of the rotary drive mechanism. The end face of the connecting disc 202 also has a coaxial rear convex ring 204, which is used to improve the structural strength of the connecting disc 202 and suppress the deformation of the connecting disc 202.

[0026] A mating hole 101 is provided in the center of the diamond grinding disc 1. The inner diameter of the mating hole 101 is equal to the outer diameter of the embedded ring 205. The mating hole 101 fits perfectly with the embedded ring 205. The diamond grinding disc 1 is fixedly connected to one end face of the support ring 201. In fact, the diamond grinding disc 1 is fixedly connected to the support ring 201 and the embedded ring 205 by a curing adhesive. Due to the restrictive effect of the embedded ring 205, the diamond grinding disc 1 and the support ring 201 are coaxial. Moreover, the diameter of the diamond grinding disc 1 is larger than that of the support ring 201. Therefore, the edge of the diamond grinding disc 1 will protrude from the support ring 201. Thus, the edge of the diamond grinding disc 1 can also participate in the grinding operation of silicon carbide wafers.

[0027] A fin 206 is provided between the outer side of the connecting disk 202 and the other end face of the support ring 201. The fin 206 extends along an arc from the outer side of the connecting disk 202 to the edge of the support ring 201. As the fin 206 extends outward along the support ring 201, the thickness of the fin 206 gradually decreases from the back of the support ring 201 until it reaches the edge of the support ring 201, at which point the thickness becomes zero. There are several fins 206, which are equidistantly arranged around the axis of the connecting disk 202, so that the center of the entire grinding disk seat 2 falls on its own axis, which can effectively avoid polarization when the entire grinding wheel assembly rotates at high speed.

[0028] Working principle: The diamond particle grinding disc 1 is formed into a disc shape by solidifying fine diamond particles with an adhesive. When the diamond particle grinding disc 1 contacts and grinds the silicon carbide wafer, it generates a lot of fine powder. The fins 206 behind the grinding disc seat 2 will drive the air to generate an airflow towards the center of the diamond particle grinding disc. This airflow can not only carry away the powder on the wafer surface to maintain the smoothness of the wafer surface, but also prevent the dust from contacting the output shaft of the drive mechanism that drives the grinding wheel, thereby preventing the wear speed of the drive mechanism output shaft from accelerating.

[0029] The basic principles, main features, and advantages of this application have been described above. Those skilled in the art should understand that this application is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this application. Various changes and modifications can be made to this application without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection claimed by this application is defined by the appended claims and their equivalents.

Claims

1. A thinning diamond grinding wheel assembly suitable for processing silicon carbide wafers, characterized by: The device includes a diamond grinding disc (1) and a grinding disc base (2). The main body of the grinding disc base (2) is a support ring (201). One end of the support ring (201) has a connecting disc (202) and the other end has an embedded ring (205). The diamond grinding disc (1) has a mating hole (101) in the center, which is suitable for mating with the embedded ring (205). The diamond grinding disc (1) is fixedly connected to one end face of the support ring (201). The outer side of the connecting disc (202) and the other end face of the support ring (201) have fins (206). The connecting disc (202) also has a through hole (203).

2. The thinning diamond grinding wheel assembly suitable for processing silicon carbide wafers of claim 1, wherein: The fin (206) extends along an arc from the outer side of the connecting disc (202) to the edge of the support ring (201).

3. The diamond grinding wheel assembly adapted for thinning silicon carbide wafers of claim 2, wherein: There are a plurality of fins (206), which are arranged at equal intervals around the axis of the connecting disk (202).

4. The thinning diamond grinding wheel assembly suitable for processing silicon carbide wafers as described in claim 3, characterized in that: There are also a number of through holes (203), which are equidistantly arranged around the axis of the connecting disk (202).

5. The diamond grinding wheel assembly adapted for thinning silicon carbide wafers of claim 4, wherein: The end face of the connecting disc (202) also has a coaxial rear convex ring (204).

6. The thinning diamond grinding wheel assembly suitable for processing silicon carbide wafers of any one of claims 1-5, wherein: The diamond grinding disc (1) is coaxial with the support ring (201), and the diameter of the diamond grinding disc (1) is larger than that of the support ring (201).

7. The diamond grinding wheel assembly adapted for thinning silicon carbide wafers of claim 6, wherein: The diamond grinding disc (1) is fixedly connected to the support ring (201) and the inner ring (205) by a curing adhesive.

8. The thinning diamond grinding wheel assembly suitable for processing silicon carbide wafers of any one of claims 1-5, wherein: The grinding disc base (2) is an integral structure, which is made of plastic through injection molding.

Images