Small-size patch common-mode inductor

Abstract

The utility model relates to the technical field of patch common-mode inductors, and discloses a small-size patch common-mode inductor which comprises a coil framework, heat dissipation mechanisms are arranged at the opposite ends of the inner side of the coil framework, and each heat dissipation mechanism comprises an arc-shaped heat flow guide plate, a base and a copper layer plate. The left side of the base and the left end of the inner side of the coil framework are fixedly installed. According to the small-size patch common-mode inductor, heat generated when the coil is used can be guided through the arc-shaped heat flow guide plate and the through groove, the efficient heat dissipation effect is achieved, heat can be dissipated from multiple faces when heat is generated through the base, the copper layer plate, the first heat dissipation holes and the second heat dissipation holes, and the heat dissipation efficiency is improved. And the influence of heat concentration on the coil is avoided, so that the problem of heat dissipation is solved, the effect of more efficient heat dissipation can be achieved, heat dissipation is linked with the environment, and damage to the coil due to excessive heat is avoided.

Description

Technical Field

[0001] This utility model relates to the field of surface mount common mode inductor technology, specifically a small-volume surface mount common mode inductor. Background Technology

[0002] Small-volume surface-mount (SMD) common-mode inductors are surface-mount (SMD) electronic components primarily used to suppress common-mode noise in circuits. They are widely used in high-frequency signal processing and power supply filtering. They consist of two symmetrical windings wound on the same magnetic core, forming a common-mode choke. The surface-mount design uses a flat package, suitable for automated mounting. They present high impedance to common-mode noise (interference currents in the same direction on two wires), suppressing noise propagation; while their impedance to differential-mode signals (useful signals) is extremely low, having almost no effect.

[0003] According to a surface mount common mode inductor with application number CN202122537490.7, this solution achieves miniaturization of common mode inductor products. At the same time, by setting L-shaped pins, the inductor can be connected to the circuit board in a surface mount form during installation, thereby eliminating the need for precise machining of the board's insertion holes, reducing the board's processing cost, and improving the inductor's applicability.

[0004] However, the following problems still exist in actual use:

[0005] (1) When in use, the surface mount common mode inductor is used as a whole. Due to its compact package and small heat dissipation area, it is easy to accumulate heat in high current or high temperature environments, which leads to an increase in the temperature of the magnetic core and winding. Excessive temperature will reduce the inductance performance (such as a decrease in impedance and a decrease in saturation current), affecting the actual use effect. Although it can dissipate heat during operation, it cannot link heat dissipation with the environment to further improve the heat dissipation effect in practice.

[0006] (2) When in use, it can only be soldered at a fixed position on the surface mount common mode inductor. It cannot be soldered at different positions on the surface mount common mode inductor according to different actual installation environments. This will reduce the applicability of the surface mount common mode inductor in practice and is not conducive to its promotion and use in practice.

[0007] Therefore, this utility model introduces a small-volume surface mount common mode inductor. Utility Model Content

[0008] To address the shortcomings of existing technologies, this invention provides a small-volume surface-mount common-mode inductor that offers advantages such as efficient heat dissipation during use and the ability to be soldered at different locations within the surface-mount common-mode inductor, thus solving the problems mentioned in the background art.

[0009] This utility model provides the following technical solution: a small-volume surface-mount common-mode inductor, including a coil frame, with heat dissipation mechanisms provided at opposite ends of the inner side of the coil frame. The heat dissipation mechanism includes an arc-shaped heat flow guiding plate, a base, and a copper layer plate. The left side of the base is fixedly installed to the left end of the inner side of the coil frame, the left side of the arc-shaped heat flow guiding plate is fixedly installed to the right side of the base, the left side of the copper layer plate is fixedly connected to the left side of the inside of the base, and through slots are provided on both sides of the inside of the coil frame.

[0010] Preferably, welding mechanisms are provided on both sides of the coil frame. The welding mechanism includes a mounting plate, mounting pins, connecting strips, and welding strips. The right side of the mounting plate is fixedly installed to the left side of the coil frame. A movable groove is opened inside the mounting plate. The outer surface of the mounting pins is slidably connected to the inner wall of the movable groove. The right side of the connecting strip is fixedly installed to the left side of the coil frame. Both sides of the welding strip are engaged with the mounting pins and the connecting strips.

[0011] Preferably, a heat dissipation hole one is provided at the bottom of the base, and a heat dissipation hole two is provided on the upper surface of the base.

[0012] Preferably, the arc-shaped heat flow guide plate is located directly below the coil, and the height of the arc-shaped heat flow guide plate is higher than the height of the base.

[0013] Preferably, the number of heat dissipation holes one is equal to the number of heat dissipation holes two, and the positions of heat dissipation holes one and two are aligned.

[0014] Preferably, coils are fixedly installed at opposite ends of the inner side of the coil frame.

[0015] Preferably, the length of the mounting plate is equal to the length of the connecting strip, and the lower surface of the mounting pin is set on the same plane as the lower surface of the base.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. This type of small-volume surface-mount common-mode inductor, through the use of an arc-shaped heat flow guiding plate and through slots, can guide the heat generated by the coil during use, achieving a highly efficient heat dissipation effect. Through the use of the base, copper layer plate, heat dissipation hole one, and heat dissipation hole two, heat can be dissipated from multiple sides when it is generated, avoiding the impact of heat concentration on the coil, thus solving the problem of how to dissipate heat, achieving a more efficient heat dissipation effect, and linking heat dissipation with the environment to avoid damage to the coil due to excessive heat.

[0018] 2. This type of small-volume surface-mount common-mode inductor, using a mounting plate, movable slot, and mounting pins, can be soldered and installed in different positions to achieve the effect of soldering and installation according to actual needs. The use of connecting strips and soldering strips ensures a more secure soldering result, preventing loosening after soldering. This solves the problem of how to solder and install according to actual needs, achieving greater adaptability during soldering, avoiding poor solder joints, and facilitating stable use in practice. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This utility model Figure 1 A schematic diagram of the structure viewed from below;

[0021] Figure 3 This utility model Figure 1 A schematic diagram of the heat dissipation mechanism;

[0022] Figure 4 This utility model Figure 1 A schematic diagram of the welding mechanism.

[0023] In the diagram: 1. Coil frame; 2. Coil; 3. Arc-shaped heat flow guide plate; 4. Base; 5. Copper layer plate; 6. Heat dissipation hole one; 7. Heat dissipation hole two; 8. Through slot; 9. Mounting plate; 10. Moving slot; 11. Mounting pin; 12. Connecting strip; 13. Welding strip; 14. Heat dissipation mechanism; 15. Welding mechanism. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 3A small-volume surface-mount common-mode inductor includes a coil frame 1. Heat dissipation mechanisms 14 are provided at opposite ends of the inner side of the coil frame 1. Each heat dissipation mechanism 14 includes an arc-shaped heat flow guide plate 3, a base 4, and a copper layer plate 5. The left side of the base 4 is fixedly installed to the left end of the inner side of the coil frame 1. The left side of the arc-shaped heat flow guide plate 3 is fixedly installed to the right side of the base 4. The left side of the copper layer plate 5 is fixedly connected to the left side of the interior of the base 4. Through slots 8 are provided on both sides of the interior of the coil frame 1. A heat dissipation hole 6 is provided at the bottom of the interior of the base 4. A second heat dissipation hole 7 is provided on the upper surface of the base 4. The arc-shaped heat flow guide plate 3 is located directly below the coil 2, and its height is higher than that of the base 4. The number of heat dissipation holes 6 is equal to the number of heat dissipation holes 7, and the positions of the heat dissipation holes 6 and 7 are aligned.

[0026] Specifically, the combination of the arc-shaped heat flow guiding plate 3, the base 4, and the copper layer plate 5 is used. The arc-shaped heat flow guiding plate 3 is located directly below the coil 2 and is higher than the base 4. When the heat generated by the coil 2 dissipates upwards, the arc-shaped heat flow guiding plate 3 can effectively guide the heat, allowing it to diffuse along its arc-shaped surface to both sides, preventing heat from accumulating locally. The copper layer plate 5 has good thermal conductivity, and its left side is fixedly connected to the left side inside the base 4, enabling it to quickly conduct the heat guided by the arc-shaped heat flow guiding plate 3 to the base 4, further accelerating the heat dissipation speed. The bottom of the base 4 has a heat dissipation hole 6, and the upper surface has a heat dissipation hole 7. The number of heat dissipation holes 6 is the same as the number of heat dissipation holes 7. The number of heat dissipation holes 7 is equal and their positions are aligned. This design allows heat to enter the base 4 through the heat dissipation hole 6 and then dissipate from the heat dissipation hole 7, forming an effective heat dissipation channel. This greatly improves heat dissipation efficiency, reduces the temperature of coil 2, and thus extends the service life of the inductor and improves its stability and reliability. Both sides of the coil frame 1 are provided with through slots 8. These through slots 8 increase the air circulation space inside the coil frame 1, allowing heat to flow more freely inside and exchange heat with the outside air, further enhancing the heat dissipation effect. This helps maintain the temperature balance inside the inductor and reduces the risk of performance degradation or damage due to excessive temperature.

[0027] Please see Figure 4Welding mechanisms 15 are provided on both sides of the coil frame 1. The welding mechanism 15 includes a mounting plate 9, mounting pins 11, connecting strips 12 and welding strips 13. The right side of the mounting plate 9 is fixedly installed with the left side of the coil frame 1. A moving groove 10 is opened inside the mounting plate 9. The outer surface of the mounting pins 11 is slidably connected with the inner wall of the moving groove 10. The right side of the connecting strips 12 is fixedly installed with the left side of the coil frame 1. Both sides of the welding strips 13 are engaged with the mounting pins 11 and the connecting strips 12. The length of the mounting plate 9 is equal to the length of the connecting strips 12. The lower surface of the mounting pins 11 is on the same plane as the lower surface of the base 4.

[0028] Specifically, through the combined use of mounting plate 9, movable slot 10, and mounting pin 11, the movable slot 10 inside mounting plate 9 allows mounting pin 11 to slide on its inner wall. This design allows the position of mounting pin 11 to be adjusted according to the actual circuit board layout requirements, improving the installation flexibility and adaptability of the inductor. It can better adapt to circuit boards of different sizes and layouts, reducing the risk of installation difficulties or circuit board damage due to unsuitable installation positions. During the soldering process, the soldering strip 13, as an intermediate connector, can more reliably solder the electrical connection between mounting pin 11 and connecting strip 12 to the circuit board, improving the soldering quality and the stability of the electrical connection, and reducing the risk of circuit failure or performance degradation due to poor soldering.

[0029] Please see Figure 1 and Figure 2 Coils 2 are fixedly installed on opposite ends of the inner side of the coil frame 1.

[0030] Specifically, by fixing the coil 2 to the opposite end inside the coil frame 1, this fixing method makes the coil 2 and the coil frame 1 tightly connected. During the overall operation, even if subjected to external forces such as vibration and impact, the coil 2 can maintain a relatively stable position and is not easy to shift or loosen, thereby ensuring the overall structural stability and extending the overall service life.

[0031] Working principle: During use, when installing and welding the whole assembly, first place the coil frame 1 at the welding position, then abut the bottom of the base 4 against the welding position. Then, depending on the actual welding environment, slide the mounting pin 11 along the inner wall of the movable groove 10 inside the mounting plate 9. After sliding the mounting pin 11 to the relevant welding position, the welding strip 13 can be snapped between the mounting pin 11 and the connecting strip 12. Then, weld the mounting pin 11, connecting strip 12 and welding strip 13 first to initially ensure the stability of the welding of the mounting pin 11 and the coil frame 1. Then, weld the mounting pin 11 to the welding position to further ensure the stability of the coil frame 1 during welding and installation.

[0032] After prolonged use, the coil 2 and the environment will generate heat. To dissipate heat from the coil 2, the arc-shaped heat flow guide plate 3 can be fixedly installed on the opposite side of the base 4 to guide the heat and allow it to move to both sides, avoiding heat concentration and reducing the heat dissipation effect. Then, the heat can leave the area of ​​the coil 2 through the through slot 8. When dissipating heat from the bottom of the coil frame 1, the heat can be dissipated through the heat dissipation holes 6 and 7 inside the base 4. The base 4 also has a copper plate 5 inside, which conducts the heat to the copper plate 5 for heat dissipation. The heat can also rise and dissipate heat through the through slot 8.

[0033] It should be noted that the electrical components and equipment mentioned above all use external power sources. The circuits, electronic components, and modules involved in this utility model are all existing technologies, which can be fully implemented by those skilled in the art and need not be elaborated upon. Although embodiments of this utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of this utility model. The scope of this utility model is defined by the appended claims and their equivalents.

[0034] In addition, throughout this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, without necessarily requiring or implying any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

Claims

1. A small volume patch common mode inductor characterized by: The coil frame (1) includes a coil skeleton (1), and heat dissipation mechanisms (14) are provided on opposite ends of the inner side of the coil skeleton (1). The heat dissipation mechanism (14) includes an arc-shaped heat flow guide plate (3), a base (4) and a copper layer plate (5). The left side of the base (4) is fixedly installed to the left end of the inner side of the coil skeleton (1), the left side of the arc-shaped heat flow guide plate (3) is fixedly installed to the right side of the base (4), and the left side of the copper layer plate (5) is fixedly connected to the left side of the inside of the base (4). Through slots (8) are provided on both sides of the inside of the coil skeleton (1).

2. A small volume patch common mode inductor according to claim 1, characterized in that: Welding mechanisms (15) are provided on both sides of the coil frame (1). The welding mechanism (15) includes a mounting plate (9), mounting pins (11), connecting strips (12) and welding strips (13). The right side of the mounting plate (9) is fixedly installed with the left side of the coil frame (1). A moving groove (10) is opened inside the mounting plate (9). The outer surface of the mounting pins (11) is slidably connected with the inner wall of the moving groove (10). The right side of the connecting strips (12) is fixedly installed with the left side of the coil frame (1). Both sides of the welding strips (13) are engaged with the mounting pins (11) and the connecting strips (12).

3. A small volume surface-mount common-mode inductor according to claim 1, wherein: The base (4) has a heat dissipation hole 1 (6) at the bottom and a heat dissipation hole 2 (7) on the upper surface of the base (4).

4. A small-volume surface-mount common-mode inductor according to claim 1, characterized in that: The arc-shaped heat flow guide plate (3) is located directly below the coil (2), and the height of the arc-shaped heat flow guide plate (3) is higher than the height of the base (4).

5. A small volume surface-mount common-mode inductor according to claim 3, wherein: The number of heat dissipation holes one (6) is equal to the number of heat dissipation holes two (7), and the positions of heat dissipation holes one (6) and heat dissipation holes two (7) are aligned.

6. A small volume surface-mount common-mode inductor as defined in claim 2, wherein: Coils (2) are fixedly installed on opposite ends of the inner side of the coil frame (1).

7. A small volume surface-mount common-mode inductor as defined in claim 2, wherein: The length of the mounting plate (9) is equal to the length of the connecting strip (12), and the lower surface of the mounting pin (11) is set on the same plane as the lower surface of the base (4).

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