Solid state disk with chip protection structure

Abstract

The utility model discloses a solid state disk with a chip protection structure, which comprises an installation assembly, a chip body, a circuit board, a shell, a cover plate, a fixing piece, a butt joint piece, a clamping piece and a dismounting piece, the chip body is fixedly connected to the top of the circuit board, the chip body and the circuit board are both located in an inner cavity of the shell, and the chip body is fixedly connected to the top of the circuit board. The cover plate is arranged at the top of the shell, the fixing pieces are fixedly connected to the bottom of an inner cavity of the shell and matched with the circuit board, the butt joint pieces are located on the two sides of the circuit board, the chip body and the circuit board can be installed in the shell through the fixing pieces, and the cover plate and the shell can be connected and fixed through the clamping pieces. In the process, bolts are not used, tools such as screwdrivers are not needed for assembling, assembling is convenient, and meanwhile damping and heat dissipation of the chip body and the circuit board can be achieved through the damping piece and the heat dissipation piece in the connecting and fixing process of the shell and the cover plate.

Description

Technical Field

[0001] This utility model relates to the field of solid-state drive technology, and in particular to a solid-state drive with a chip protection structure. Background Technology

[0002] Solid-state drives (SSDs), also known as solid-state drives, are hard drives made of solid-state electronic storage chip arrays. The internal storage of an SSD mainly consists of NAND flash memory chips and controller chips. These chips are directly soldered to the PCB using soldering technology (usually ball grid array packaging, or BGA). This ensures a reliable electrical connection between the chips and the circuit board and enables data read and write functions. Although SSDs have certain advantages over traditional hard disk drives (HDDs) in terms of resistance to physical vibration and shock, they still face a variety of potential threats from the external environment and internal components.

[0003] Common solid-state drives (SSDs) use bolts to fix the PCB board containing the chip inside the casing, and bolts to fix the cover plate to the casing. However, traditional bolted connections require tools such as screwdrivers for assembly, which is inconvenient and dependent on tools. At the same time, the protection of the chip is poor. When the hard drive is impacted or dropped, the chip is prone to vibration and breakage, which poses a certain safety hazard. Utility Model Content

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0005] In view of the problems existing in the above and / or existing solid-state drives with chip protection structures, this utility model is proposed.

[0006] Therefore, the problem to be solved by this utility model is how to address the inconvenience of assembly, the dependence on tools, and the poor protection of the chip.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a solid-state drive with a chip protection structure, comprising,

[0008] The mounting assembly includes a chip body, a circuit board, a housing, a cover plate, fasteners, mating parts, snap-fit ​​parts, and a disassembly part. The chip body is fixedly connected to the top of the circuit board. Both the chip body and the circuit board are located within the inner cavity of the housing. The cover plate is located at the top of the housing. The fasteners are fixedly connected to the bottom of the inner cavity of the housing and cooperate with the circuit board. The mating parts are located on both sides of the circuit board. The snap-fit ​​parts are fixedly connected to one side of the inner cavity of the housing. The housing and the cover plate are connected via snap-fit ​​parts. The disassembly part is located on one side of the snap-fit ​​parts.

[0009] The protective assembly includes a shock absorber, a heat sink, a linkage plate, and flow holes. The shock absorber contacts the top and bottom of the circuit board. The heat sink is located on both sides of the housing. The linkage plate is fixedly connected to one side of the fixing component and cooperates with the heat sink. The flow holes are formed on the surface of the shock absorber.

[0010] As a preferred embodiment of the solid-state drive with chip protection structure described in this utility model, the fixing component includes a fixing seat fixedly connected to the bottom of the inner cavity of the outer shell, a threaded rod threadedly connected to one side of the fixing seat, a rotating part fixedly connected to one side of the threaded rod, and a clamping plate rotatably connected to the other side of the threaded rod via a bearing, the clamping plate contacting one side of the circuit board.

[0011] As a preferred embodiment of the solid-state drive with chip protection structure described in this utility model, the docking component includes docking tubes fixedly connected to both sides of the bottom of the inner cavity of the outer shell, and docking seats fixedly connected to both sides of the top of the inner cavity of the cover plate, the docking seats contacting the top of the circuit board.

[0012] As a preferred embodiment of the solid-state drive with chip protection structure described in this utility model, the latching component includes a first hinge seat fixedly connected to the inner wall of the outer casing, a crank hinged to one side of the first hinge seat, a spring fixedly connected to one side of the crank, the spring fixedly connected to the inner wall of the outer casing, a latching block fixedly connected to the bottom of the crank, and fixing blocks fixedly connected to the top of the inner cavity of the cover plate on all four sides. A latching groove is opened on one side of the fixing block, and the latching block is latched into the inner cavity of the latching groove.

[0013] As a preferred embodiment of the solid-state drive with chip protection structure described in this utility model, the disassembly component includes a second hinge seat fixedly connected to one side of the card block, a movable rod hinged to one side of the second hinge seat, and a pulling part fixedly connected to one side of the movable rod through the outer shell.

[0014] As a preferred embodiment of the solid-state drive with chip protection structure described in this utility model, the top of the pull part is provided with an anti-slip groove.

[0015] As a preferred embodiment of the solid-state drive with chip protection structure described in this utility model, the shock-absorbing component includes a first shock-absorbing pad fixedly connected to the bottom of the inner cavity of the outer casing, the first shock-absorbing pad being in contact with the bottom of the circuit board, and a second shock-absorbing pad fixedly connected to the top of the inner cavity of the cover plate, the second shock-absorbing pad being in contact with the top of the circuit board.

[0016] As a preferred embodiment of the solid-state drive with chip protection structure of this utility model, the heat dissipation component includes through grooves opened on both sides of the outer shell, and sliding grooves are opened on both sides of the inner cavity of the through grooves. A heat dissipation mesh is slidably connected to the inner cavity of the sliding grooves, and a sealing plate is fixedly connected to one side of the heat dissipation mesh.

[0017] As a preferred embodiment of the solid-state drive with chip protection structure described in this utility model, the linkage plate is fixedly connected to one side of the sealing plate, and one side of the linkage plate is fixedly connected to the surface of the clamping plate.

[0018] As a preferred embodiment of the solid-state drive with chip protection structure described in this utility model, there are multiple flow holes, which are evenly distributed on the surfaces of the first and second shock-absorbing pads.

[0019] The beneficial effects of this utility model are as follows: the chip body and circuit board can be installed inside the housing by the fastener, and the cover plate and housing can be connected and fixed by the snap-fit. No bolts are used in this process and no tools such as screwdrivers are needed for assembly, making the assembly more convenient. The shock-absorbing component can reduce the vibration of the chip body and circuit board during the connection and fixing of the housing and cover plate. The linkage plate can achieve ventilation and heat dissipation of the chip body and circuit board during the installation of the chip body and circuit board in the housing, which is conducive to the solid-state drive maintaining long-term stable working performance. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0021] Figure 1 This is a structural diagram of a solid-state drive with a chip protection structure.

[0022] Figure 2 This is a cross-sectional view of the casing structure of a solid-state drive with a chip protection structure.

[0023] Figure 3 This is an exploded view of a solid-state drive with a chip-protected structure.

[0024] Figure 4 This is a cross-sectional view of the casing and cover structure of a solid-state drive with a chip protection structure.

[0025] Figure 5 For solid-state drives with chip protection structure Figure 2 Enlarged view of region A in the middle.

[0026] Figure 6 For solid-state drives with chip protection structure Figure 4 Enlarged view of region B in the middle. Detailed Implementation

[0027] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0028] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0029] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0030] Example 1

[0031] Reference Figures 1-6 This is the first embodiment of the present invention. This embodiment provides a solid-state drive with a chip protection structure. The solid-state drive with the chip protection structure includes a mounting component 100 and a protective component 200. The mounting component 100 can install the chip body 101 and the circuit board 102 inside the housing 103 without using bolts or tools, and fix the housing 103 and the cover plate 104. The protective component 200 can reduce shock and dissipate heat for the chip body 101 and the circuit board 102 during the connection process of the chip body 101, the circuit board 102, the housing 103 and the cover plate 104.

[0032] Specifically, the mounting component 100 includes a chip body 101, a circuit board 102, a housing 103, a cover plate 104, a fixing member 105, a mating member 106, a snap-fit ​​member 107, and a disassembly member 108. The chip body 101 is fixedly connected to the top of the circuit board 102. Both the chip body 101 and the circuit board 102 are located inside the housing 103. The cover plate 104 is located on the top of the housing 103. The fixing member 105 is fixedly connected to the bottom of the inner cavity of the housing 103 and cooperates with the circuit board 102. The mating member 106 is located on both sides of the circuit board 102. The snap-fit ​​member 107 is fixedly connected to one side of the inner cavity of the housing 103. The housing 103 and the cover plate 104 are connected by the snap-fit ​​member 107. The disassembly member 108 is located on one side of the snap-fit ​​member 107.

[0033] The internal storage of a solid-state drive (SSD) mainly consists of NAND flash memory chips and a controller chip. These chips are directly soldered onto a PCB using soldering technology. Therefore, the chip body 101 and the circuit board 102 are existing technologies. In the existing technology, the chip body 101 and the circuit board 102 are a single structure that is fixedly connected to the housing 103 by bolts. The housing 103 and the cover plate 104 are also connected by bolts to protect the chip body 101 and the circuit board 102. The working principle of this technology will not be elaborated here.

[0034] The end of the circuit board 102 can be fixed by the fastener 105 through a snap-fit, while the mating part 106 can limit the circuit board 102 from both sides and the top. Thus, the circuit board 102 and the housing 103 can be firmly installed by the cooperation of the fastener 105 and the mating part 106.

[0035] The snap-fit ​​connector 107 allows the housing 103 and the cover plate 104 to be connected and fixed without bolts or tools. During the connection process, the cover plate 104 is placed on top of the housing 103 and force is applied to the cover plate 104 in the direction of the housing 103.

[0036] The cover plate 104 can be disassembled without bolts or tools using the disassembly component 108, separating the outer shell 103 from the cover plate 104, which facilitates subsequent disassembly and maintenance.

[0037] The protective component 200 includes a shock absorber 201, a heat sink 202, a linkage plate 203, and a flow hole 204. The shock absorber 201 contacts the top and bottom of the circuit board 102. The heat sink 202 is located on both sides of the housing 103. The linkage plate 203 is fixedly connected to one side of the fixing member 105 and cooperates with the heat sink 202. The flow hole 204 is opened on the surface of the shock absorber 201.

[0038] The shock absorber 201 can reduce the vibration of the chip body 101 and the circuit board 102 during the connection and fixation process of the housing 103 and the cover plate 104. The shock absorption effect can be achieved without additional operation. It should be noted that the shock absorber 201 is usually made of soft material (such as rubber or foam). Those skilled in the art can choose according to the actual situation.

[0039] The heat sink 202 enables ventilation and heat dissipation for the chip body 101 and the circuit board 102. Furthermore, the linkage plate 203 allows the heat sink 202 to be deployed during the installation of the circuit board 102 inside the housing 103, facilitating airflow inside and outside the housing 103.

[0040] The flow hole 204 can reduce the impact of the damping component 201 on heat dissipation, so that the damping component 201 can reduce the burden on heat dissipation while achieving damping.

[0041] Specifically, the fastener 105 includes a fixed seat 105a fixedly connected to the bottom of the inner cavity of the housing 103. A threaded rod 105b is threadedly connected to one side of the fixed seat 105a. A rotating part 105c is fixedly connected to one side of the threaded rod 105b. A clamping plate 105d is rotatably connected to the other side of the threaded rod 105b through a bearing. The clamping plate 105d contacts one side of the circuit board 102.

[0042] The inner cavity of the fixed seat 105a is embedded with a threaded sleeve that works with the threaded rod 105b. When the threaded rod 105b is rotated by the rotating part 105c, the threaded rod 105b will drive the clamping plate 105d to move, thereby fixing the circuit board 102. It should be noted that the bearing design can keep the clamping plate 105d balanced during the movement to prevent it from rotating.

[0043] Specifically, the docking component 106 includes docking tubes 106a fixedly connected to both sides of the bottom of the inner cavity of the housing 103, and docking seats 106b fixedly connected to both sides of the top of the inner cavity of the cover plate 104, with the docking seats 106b contacting the top of the circuit board 102.

[0044] The circuit board 102 has grooves on both sides that match the connecting tube 106a. The connecting tube 106a is located in the groove, which can limit the two sides of the circuit board 102. At the same time, the dimensions of the connecting tube 106a and the docking seat 106b are matched. When the outer shell 103 and the cover plate 104 are connected, the connecting tube 106a will be inserted into the inner cavity of the docking seat 106b, and one side of the bottom of the docking seat 106b will contact the circuit board 102, thereby fixing the top of the circuit board 102.

[0045] Specifically, the snap-fit ​​component 107 includes a first hinge seat 107a fixedly connected to the inner wall of the outer casing 103. A crank 107b is hinged to one side of the first hinge seat 107a. A spring 107c is fixedly connected to one side of the crank 107b. The spring 107c is fixedly connected to the inner wall of the outer casing 103. A snap-fit ​​block 107d is fixedly connected to the bottom of the crank 107b. Fixing blocks 107e are fixedly connected to the top of the inner cavity of the cover plate 104. A slot 107f is opened on one side of the fixing block 107e. The snap-fit ​​block 107d snaps into the inner cavity of the slot 107f.

[0046] The end of the locking block 107d is arc-shaped. When the cover plate 104 is installed, the fixing block 107e will descend and contact the locking block 107d. At this time, the locking block 107d will be pushed and swing to one side of the outer shell 103 under the action of the first hinge 107a and the crank 107b. When the locking block 107d and the slot 107f are aligned, the crank 107b will rebound under the action of the spring 107c and make the locking block 107d engage in the inner cavity of the slot 107f, thereby fixing it. This can realize the connection and fixation of the outer shell 103 and the cover plate 104.

[0047] Specifically, the shock absorber 201 includes a first shock absorber 201a fixedly connected to the bottom of the inner cavity of the housing 103, the first shock absorber 201a contacting the bottom of the circuit board 102, and a second shock absorber 201b fixedly connected to the top of the inner cavity of the cover plate 104, the second shock absorber 201b contacting the top of the circuit board 102.

[0048] By using the first damping pad 201a and the second damping pad 201b, which respectively contact the bottom and top of the circuit board 102, the impact of external vibration on the chip body 101 and the circuit board 102 can be effectively reduced, thereby reducing the potential risks caused by possible impacts or external vibrations.

[0049] Specifically, the heat sink 202 includes through grooves 202a on both sides of the outer shell 103, and sliding grooves 202b are provided on both sides of the inner cavity of the through grooves 202a. A heat sink 202c is slidably connected to the inner cavity of the sliding grooves 202b, and a sealing plate 202d is fixedly connected to one side of the heat sink 202c.

[0050] When the circuit board 102 is not installed inside the housing 103, the sealing plate 202d is located in the through groove 202a. After the circuit board 102 is installed by the fastener 105, part of the sealing plate 202d will move into the inner cavity of the slide groove 202b, while the heat dissipation mesh 202c will be located in the through groove 202a. At this time, ventilation and heat dissipation can be achieved through the heat dissipation mesh 202c, and the heat dissipation mesh 202c can reduce the entry of external dust.

[0051] Specifically, the linkage plate 203 is fixedly connected to one side of the sealing plate 202d, and one side of the linkage plate 203 is fixedly connected to the surface of the clamping plate 105d.

[0052] The linkage plate 203 enables the sealing plate 202d and the clamping plate 105d to become a linked structure. When the circuit board 102 is installed and removed, the positions of the heat dissipation mesh 202c and the sealing plate 202d can be switched, thereby realizing the ventilation and relative sealing state switching of the outer casing 103.

[0053] Example 2

[0054] Reference Figure 3 and Figure 5 This is the second embodiment of the present invention, which is based on the previous embodiment.

[0055] Specifically, the disassembly component 108 includes a second hinge 108a fixedly connected to one side of the locking block 107d. A movable rod 108b is hinged to one side of the second hinge 108a. One side of the movable rod 108b passes through the outer shell 103 and is fixedly connected to a pulling part 108c.

[0056] The pulling part 108c can sequentially drive the movable rod 108b and the locking block 107d to move, so that the locking block 107d moves away from the locking slot 107f. At this time, the fixing of the fixing block 107e can be released, making it easier to separate the cover plate 104 and the outer shell 103. The second hinge seat 108a can flexibly change the angle of the movable rod 108b according to its position, thereby avoiding physical interference with other components.

[0057] Specifically, the top of the pull part 108c is provided with an anti-slip groove 108c-1.

[0058] The anti-slip groove 108c-1 increases the contact surface of the pulling part 108c, improves friction, and makes it less likely to slip accidentally during movement.

[0059] Specifically, there are multiple flow holes 204, which are evenly distributed on the surfaces of the first damping pad 201a and the second damping pad 201b.

[0060] The first shock-absorbing pad 201a and the second shock-absorbing pad 201b are both U-shaped, with a hollow middle that does not contact the circuit board 102, thus facilitating heat conduction in the middle gap. The flow hole 204 facilitates the dissipation of heat in the gap, preventing heat from being unable to be effectively conducted to the outer shell 103 and the surrounding air.

[0061] In use, the circuit board 102 is placed on top of the first shock-absorbing pad 201a, and the connecting pipe 106a is positioned in the grooves on both sides of the circuit board 102 to limit the two sides of the circuit board 102. Then, the threaded rod 105b is rotated by rotating the rotating part 105c, thereby moving the clamping plate 105d and fixing the end of the circuit board 102. At this time, the clamping plate 105d will drive the sealing plate 202d to move under the action of the linkage plate 203, so that part of the sealing plate 202d enters the slide groove 202b and the heat dissipation mesh 202c enters the through groove 202a, thereby achieving ventilation and heat dissipation using the heat dissipation mesh 202c. Then, the cover plate 104 is pressed against the outer shell 103. The assembly involves aligning the docking seat 106b with the docking tube 106a. At this point, the docking seat 106b contacts the top of the circuit board 102, limiting the top of the circuit board 102. Simultaneously, the fixing block 107e descends and contacts the locking block 107d. The locking block 107d is then pushed and swings to one side under the action of the crank 107b and the first hinge seat 107a until the locking block 107d is in a horizontal position with the slot 107f. The locking block 107d then rebounds under the action of the spring 107c and enters the slot 107f, thereby fixing the fixing block 107e and connecting and fixing the outer shell 103 and the cover plate 104. This process allows for convenient and quick installation without the aid of external tools.

[0062] During installation, the first shock-absorbing pad 201a and the second shock-absorbing pad 201b will contact the bottom and top of the circuit board 102 respectively to achieve shock absorption. At the same time, the flow hole 204 can reduce the impact of the first shock-absorbing pad 201a and the second shock-absorbing pad 201b on heat dissipation, thus maintaining the long-term stable working performance of the solid-state drive.

[0063] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A solid state drive with a chip guard structure, characterized by: include, The mounting assembly (100) includes a chip body (101), a circuit board (102), a housing (103), a cover plate (104), a fastener (105), a connector (106), a snap-fit ​​connector (107), and a disassembly component (108). The chip body (101) is fixedly connected to the top of the circuit board (102). Both the chip body (101) and the circuit board (102) are located inside the housing (103). The cover plate (104) is disposed on the housing (103). The top of 03), the fixing member (105) is fixedly connected to the bottom of the inner cavity of the outer shell (103) and cooperates with the circuit board (102), the docking member (106) is located on both sides of the circuit board (102), the snap-fit ​​member (107) is fixedly connected to one side of the inner cavity of the outer shell (103), the outer shell (103) and the cover plate (104) are connected by the snap-fit ​​member (107), the disassembly member (108) is located on one side of the snap-fit ​​member (107); and, The protective component (200) includes a shock absorber (201), a heat sink (202), a linkage plate (203), and a flow hole (204). The shock absorber (201) contacts the top and bottom of the circuit board (102). The heat sink (202) is located on both sides of the housing (103). The linkage plate (203) is fixedly connected to one side of the fixing member (105) and cooperates with the heat sink (202). The flow hole (204) is opened on the surface of the shock absorber (201).

2. The solid state drive with chip guard structure of claim 1, wherein: The fixing member (105) includes a fixing seat (105a) fixedly connected to the bottom of the inner cavity of the outer shell (103). A threaded rod (105b) is threadedly connected to one side of the fixing seat (105a). A rotating part (105c) is fixedly connected to one side of the threaded rod (105b). A clamping plate (105d) is rotatably connected to the other side of the threaded rod (105b) through a bearing. The clamping plate (105d) contacts one side of the circuit board (102).

3. The solid state drive with chip guard structure of claim 2, wherein: The docking component (106) includes docking tubes (106a) fixedly connected to both sides of the bottom of the inner cavity of the outer shell (103), and docking seats (106b) fixedly connected to both sides of the top of the inner cavity of the cover plate (104), and the docking seats (106b) are in contact with the top of the circuit board (102).

4. The solid state drive with chip guard structure of claim 3, wherein: The snap-fit ​​component (107) includes a first hinge seat (107a) fixedly connected to the inner wall of the outer shell (103). A crank (107b) is hinged to one side of the first hinge seat (107a). A spring (107c) is fixedly connected to one side of the crank (107b). The spring (107c) is fixedly connected to the inner wall of the outer shell (103). A locking block (107d) is fixedly connected to the bottom of the crank (107b). Fixing blocks (107e) are fixedly connected to the top of the inner cavity of the cover plate (104). A locking groove (107f) is opened on one side of the fixing block (107e). The locking block (107d) is engaged in the inner cavity of the locking groove (107f).

5. The solid state drive with chip guard structure of claim 4, wherein: The disassembly component (108) includes a second hinge (108a) fixedly connected to one side of the locking block (107d). A movable rod (108b) is hinged to one side of the second hinge (108a). One side of the movable rod (108b) passes through the outer shell (103) and is fixedly connected to a pulling part (108c).

6. The solid state drive with chip guard structure of claim 5, wherein: The top of the pull part (108c) is provided with an anti-slip groove (108c-1).

7. The solid state drive with chip guard structure of claim 1, wherein: The shock absorber (201) includes a first shock absorber (201a) fixedly connected to the bottom of the inner cavity of the outer shell (103), the first shock absorber (201a) being in contact with the bottom of the circuit board (102), and a second shock absorber (201b) fixedly connected to the top of the inner cavity of the cover plate (104), the second shock absorber (201b) being in contact with the top of the circuit board (102).

8. The solid-state drive with chip protection structure as described in claim 7, characterized in that: The heat sink (202) includes through slots (202a) on both sides of the outer shell (103). Sliding grooves (202b) are provided on both sides of the inner cavity of the through slots (202a). A heat dissipation mesh (202c) is slidably connected to the inner cavity of the sliding grooves (202b). A sealing plate (202d) is fixedly connected to one side of the heat dissipation mesh (202c).

9. The solid state drive with chip guard structure of claim 8, wherein: The linkage plate (203) is fixedly connected to one side of the sealing plate (202d), and one side of the linkage plate (203) is fixedly connected to the surface of the clamping plate (105d).

10. The solid state drive with a chip guard structure of claim 1, wherein: There are multiple flow holes (204), which are evenly distributed on the surfaces of the first damping pad (201a) and the second damping pad (201b).

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