Heat dissipation fixing structure for mainboard of network transceiver

Abstract

The utility model relates to the technical field of network transceivers, in particular to a network transceiver mainboard heat dissipation fixing structure which comprises a mainboard, a heat dissipation mechanism and heat dissipation fins are installed on the mainboard, a supporting mechanism and an installation block are fixed on the heat dissipation mechanism, a dustproof mechanism is rotatably installed on the installation block, and the dustproof mechanism comprises a rotating plate and a cover plate. A rotating plate is rotationally connected to the mounting block, a plurality of clamping grooves are formed in the rotating plate, inserting blocks are mounted at the clamping groove parts in a clamping manner, a cover plate is fixedly connected to the inserting blocks, a dustproof net is fixedly mounted on the cover plate, the dustproof net is communicated with the interior of the mounting block, the inserting blocks are fixedly connected with the rotating plate through inserting rods, and a connecting block is fixedly mounted on the rotating plate; a connecting block is pressed, a rotating plate drives a cover plate to rotate, then the interior of the heat dissipation mechanism can be overhauled, and a dustproof net on the cover plate can be conveniently disassembled and assembled by rotating an inserting rod through a tool.

Description

Technical Field

[0001] This utility model relates to the field of network transceiver technology, specifically to a heat dissipation and fixing structure for a network transceiver motherboard. Background Technology

[0002] The main function of a network transceiver is to convert, transmit, and receive signals. Specifically, a network transceiver can convert electrical signals into optical signals, or vice versa, thereby enabling signal transmission and reception. The main function of the heatsink fins on the transceiver motherboard is to increase the heat dissipation area and improve heat dissipation efficiency. By increasing the surface area, the heatsink fins expand the range of heat conduction, allowing heat to dissipate more quickly.

[0003] However, the motherboard of a network transceiver generates a lot of heat during operation. The heat dissipation speed of the motherboard through the heat sink fins is relatively slow. When a fan is installed on the motherboard to improve the heat dissipation effect of the fins, the dust cover installed on the fan will accumulate a lot of dust after long-term use, and it is inconvenient to disassemble and facilitate the heat dissipation.

[0004] Therefore, the circuit board structure of the network transceiver needs to be optimized to improve heat dissipation. Utility Model Content

[0005] To solve the above problems, the present invention provides a network transceiver motherboard heat dissipation fixing structure, which uses a rotating plate and a pressing connecting block to make the rotating plate drive the cover plate to rotate, thereby enabling internal maintenance of the heat dissipation mechanism. Furthermore, the dustproof mesh on the cover plate can be easily removed and installed by using tools to rotate the plug rod.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A network transceiver motherboard heat dissipation and fixing structure includes a motherboard, on which a heat dissipation mechanism and heat dissipation fins are mounted. A support mechanism and a mounting block are fixed to the heat dissipation mechanism. A dustproof mechanism is rotatably mounted on the mounting block. The dustproof mechanism includes a rotating plate and a cover plate. The rotating plate is rotatably connected to the mounting block. The rotating plate has several slots, and insert blocks are engaged in the slots. A cover plate is fixedly connected to the insert blocks, and a dustproof mesh is fixedly mounted on the cover plate. The dustproof mesh communicates with the interior of the mounting block. The insert blocks are fixedly connected to the rotating plate via insert rods. A connecting block is fixedly mounted on the rotating plate.

[0008] Optionally, in one embodiment of the present invention, the insertion rod penetrates the inner wall of the insertion block, the insertion rod is threadedly connected to the rotating plate, and the top end of the insertion rod is provided with a regular hexagonal structure.

[0009] Optionally, in one embodiment of the present invention, the insert block and the rotating plate are engaged, and the part of the rotating plate that contacts the insert block is provided with an arc-shaped structure.

[0010] Optionally, in one embodiment of the present invention, the heat dissipation mechanism includes a fixed plate and a limiting groove. The fixed plate is fixedly connected to the part of the main board near the heat dissipation fins. The fixed plate is provided with a limiting groove. A clamping plate is engaged in the limiting groove. A heat dissipation mesh and a support plate are fixedly installed on the clamping plate. A motor is fixedly installed at the top of the support plate. The output end of the motor is fixedly connected to a rotating shaft through a coupling. Fan blades are fixedly installed on the rotating shaft.

[0011] Optionally, in one embodiment of this utility model, the card plate and the fixing plate are engaged and connected, and the heat dissipation mesh is in communication with the interior of the mounting block.

[0012] Optionally, in one embodiment of the present invention, the motor is located at the center of the support plate, and the rotating shaft is rotatably connected to the support plate.

[0013] Optionally, in one embodiment of the present invention, the fan blade is located at the top of the heat dissipation fins, and the width of the fixing plate is greater than the width of the card plate.

[0014] Optionally, in one embodiment of the present invention, the support mechanism includes protrusions and sleeves. A plurality of protrusions are fixedly installed on the top of the main board, and sleeves are threadedly connected to the protrusions. A locking block is engaged at the top of the sleeve, a support frame is fixedly connected to the locking block, and a positioning rod is threadedly connected to the sleeve.

[0015] Optionally, in one embodiment of the present invention, the diameter of the protrusion is greater than the diameter of the sleeve, and the diameter of the sleeve is less than the diameter of the locking block.

[0016] Optionally, in one embodiment of the present invention, the support frame is arranged in an L-shape, and the positioning rod penetrates the inner wall of the support frame.

[0017] Beneficial effects of this utility model

[0018] This utility model relates to a network transceiver motherboard heat dissipation fixing structure. When the connecting block is pressed, it causes the rotating plate to rotate along the inner wall of the mounting block. A cover plate is fitted inside the rotating plate. When the rotating plate rotates, the interior of the mounting block is opened, facilitating the maintenance of the heat dissipation mechanism inside the mounting block. The fixing plate has several slots, and insert blocks are fitted into the slots. The insert blocks are fixedly connected to the cover plate. When the insert rod is rotated with a tool, it can be removed from the inside of the fixing plate and the insert block, thus separating the insert block from the rotating plate. This facilitates the removal of the cover plate for cleaning the dust filter, thereby improving the heat dissipation effect of the mounting block. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 for Figure 1 The diagram shows an enlarged view of part A.

[0022] Figure 3 This is a schematic diagram of the connection structure of the motherboard and the fixing plate of this utility model;

[0023] Figure 4 This is a schematic diagram of the connection structure of the card plate and support frame of this utility model;

[0024] Figure 5 This is a schematic diagram of the connection structure between the cover plate and the dustproof net of this utility model;

[0025] Figure 6 This is a schematic diagram of the connection structure of the fan blade and the rotating shaft of this utility model;

[0026] Figure 7 This is a schematic diagram of the connection structure of the mounting block and rotating plate of this utility model;

[0027] Figure 8 for Figure 7 The diagram shows an enlarged view of part B.

[0028] Explanation of reference numerals in the attached drawings: Main board 1, Support mechanism 2, Protrusion 201, Sleeve 202, Locking block 203, Positioning rod 204, Support frame 205, Heat dissipation mechanism 3, Fixing plate 301, Locking plate 302, Heat dissipation mesh 303, Limiting groove 304, Support plate 305, Motor 306, Fan blade 307, Rotating shaft 308, Mounting block 4, Dustproof mechanism 5, Rotating plate 501, Cover plate 502, Dustproof mesh 503, Insert rod 504, Inserting block 505, Connecting block 506, Locking groove 507, Heat dissipation fins 6. Detailed Implementation

[0029] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments. Example

[0030] To achieve more efficient heat dissipation for the network transceiver, a heat dissipation mounting structure for the network transceiver motherboard was designed, and the specific solution is as follows:

[0031] like Figure 1-8 As shown, the heat dissipation and fixing structure of the network transceiver motherboard includes a motherboard 1, on which a heat dissipation mechanism 3 and heat dissipation fins 6 are mounted. A support mechanism 2 and a mounting block 4 are fixed on the heat dissipation mechanism 3. A dustproof mechanism 5 is rotatably mounted on the mounting block 4. The dustproof mechanism 5 includes a rotating plate 501 and a cover plate 502. The rotating plate 501 is rotatably connected to the mounting block 4. The rotating plate 501 is provided with several slots 507. Insert blocks 505 are engaged in the slots 507. The cover plate 502 is fixedly connected to the insert block 505. A dustproof net 503 is fixedly mounted on the cover plate 502. The dustproof net 503 is connected to the interior of the mounting block 4. The insert block 505 is fixedly connected to the rotating plate 501 through a plug rod 504. A connecting block 506 is fixedly mounted on the rotating plate 501.

[0032] The insertion rod 504 penetrates the inner wall of the insertion block 505. The insertion rod 504 is threadedly connected to the rotating plate 501. The top of the insertion rod 504 is set with a regular hexagonal structure. By rotating the insertion rod 504, the insertion rod 504 can be rotated out from the inside of the rotating plate 501 and the insertion block 505.

[0033] The insert 505 is engaged with the rotating plate 501, and the part of the rotating plate 501 that contacts the insert 505 is set with an arc surface structure. When the insert 505 is engaged in the rotating plate 501, the cover plate 502 can be fixed and limited.

[0034] The heat dissipation mechanism 3 includes a fixed plate 301 and a limiting groove 304. The fixed plate 301 is fixedly connected to the part of the main board 1 near the heat dissipation fins 6. The fixed plate 301 is provided with a limiting groove 304. A clamping plate 302 is engaged and installed in the limiting groove 304. A heat dissipation mesh 303 and a support plate 305 are fixedly installed on the clamping plate 302. A motor 306 is fixedly installed at the top of the support plate 305. The output end of the motor 306 is fixedly connected to a rotating shaft 308 through a coupling. A fan blade 307 is fixedly installed on the rotating shaft 308. When the motor 306 is started, the rotating shaft 308 can drive the fan blade 307 to rotate, thereby allowing the fan blade 307 to dissipate heat from the heat dissipation fins 6.

[0035] The card plate 302 and the fixing plate 301 are engaged and connected. The heat dissipation mesh 303 is connected to the interior of the mounting block 4. Through the heat dissipation mesh 303, the heat emitted by the heat dissipation fins 6 can be discharged.

[0036] The motor 306 is located at the center of the support plate 305. The shaft 308 is rotatably connected to the support plate 305. When the fan blade 307 rotates, the heat inside the card plate 302 can be discharged through the heat dissipation mesh 303.

[0037] The fan blade 307 is located at the top of the heat dissipation fins 6. The width of the fixing plate 301 is greater than the width of the card plate 302. The card plate 302 can be installed into the fixing plate 301 through the limiting groove 304.

[0038] The support mechanism 2 includes a protrusion 201 and a sleeve 202. Several protrusions 201 are fixedly installed on the top of the main board 1. The sleeve 202 is threadedly connected to the protrusion 201. A locking block 203 is engaged at the top of the sleeve 202. A support frame 205 is fixedly connected to the locking block 203. A positioning rod 204 is threadedly connected to the sleeve 202. When the positioning rod 204 is rotated to a state that abuts against the top of the support frame 205, the support frame 205 can be limited.

[0039] The diameter of the protrusion 201 is larger than the diameter of the sleeve 202, and the diameter of the sleeve 202 is smaller than the diameter of the locking block 203. By rotating the sleeve 202 to the bottom end of the protrusion 201, it can be fixed inside the protrusion 201.

[0040] The support frame 205 is arranged in an L-shape, and the positioning rod 204 passes through the inner wall of the support frame 205. The support frame 205 supports the card plate 302 and can install it in the fixing plate 301.

[0041] Instructions for use:

[0042] First, when installing the card plate 302, the operator can first snap its end into the limiting groove 304 provided in the fixing plate 301. Since the fixing plate 301 is installed at the top of the main board 1, when the card plate 302 is inside the fixing plate 301, it can shield the heat dissipation fins 6 fixed on the main board 1. Furthermore, a heat dissipation mesh 303 is fixedly installed on the card plate 302. Through the heat dissipation mesh 303, heat can be discharged from the inside of the card plate 302 when the heat dissipation fins 6 dissipate heat, thereby improving the efficiency of the heat dissipation fins 6. As a result; several support frames 205 are fixedly connected to the clamping plate 302, and clamping blocks 203 are fixed on the support frames 205. When the clamping plate 302 is located inside the fixing plate 301, the clamping blocks 203 and the support frames 205 are engaged at the top of the sleeve 202. The sleeve 202 is threaded into the protrusion 201 fixed on the main plate 1, thereby limiting the support frame 205. The end of the positioning rod 204 passes through the inner wall of the support frame 205 and is threaded into the sleeve 202, which can position the support frame 205, thereby limiting the clamping plate 302; the mounting block 4 is fixed with When the support plate 305 is turned on, the motor 306 installed on the support plate 305 is switched on. The motor 306 drives the rotating shaft 308 to rotate inside the support plate 305, which in turn drives the fan blade 307 to rotate inside the clamping plate 302. The fan blade 307 is designed to improve the heat dissipation effect of the heat sink 6. When the motor 306 needs to be inspected, the operator can press the connecting block 506 by hand. The rotating plate 501 rotates along the inner wall of the mounting block 4, and the cover plate 502 is engaged inside the rotating plate 501. When the rotating plate 501 rotates, the interior of the mounting block 4 can be opened. The mounting block 4 is in an open state, which facilitates the maintenance of the motor 306 inside the mounting block 4. The rotating plate 501 has several slots 507, and the slots 507 are fitted with insert blocks 505. The insert blocks 505 are fixedly connected to the cover plate 502. When the insert rod 504 is rotated with a tool, the insert rod 504 can be removed from the inside of the rotating plate 501 and the insert block 505, which allows the insert block 505 to be separated from the rotating plate 501. This makes it easier to remove the cover plate 502 and clean the dust filter 503, thereby improving the heat dissipation effect of the mounting block 4.

[0043] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0044] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A heat dissipation and fixing structure for a network transceiver motherboard, comprising a motherboard, characterized in that: The motherboard is equipped with a heat dissipation mechanism and heat dissipation fins. The heat dissipation mechanism is fixed with a support mechanism and a mounting block. A dustproof mechanism is rotatably mounted on the mounting block. The dustproof mechanism includes a rotating plate and a cover plate. The rotating plate is rotatably connected to the mounting block. The rotating plate has several slots. Insert blocks are engaged in the slots. The cover plate is fixedly connected to the insert blocks. A dustproof net is fixedly mounted on the cover plate. The dustproof net communicates with the interior of the mounting block. The insert blocks are fixedly connected to the rotating plate through insert rods. A connecting block is fixedly mounted on the rotating plate.

2. The network transceiver motherboard heat dissipation fixing structure according to claim 1, characterized in that: The insertion rod penetrates the inner wall of the insertion block, and the insertion rod is threadedly connected to the rotating plate. The top end of the insertion rod has a regular hexagonal structure.

3. The network transceiver motherboard heat dissipation fixing structure according to claim 1, characterized in that: The insert block and the rotating plate are engaged and connected, and the part of the rotating plate that contacts the insert block has an arc-shaped structure.

4. The network transceiver motherboard heat dissipation fixing structure according to claim 1, characterized in that: The heat dissipation mechanism includes a fixed plate and a limiting groove. The fixed plate is fixedly connected to the part of the main board near the heat dissipation fins. The fixed plate has a limiting groove, and a clamping plate is engaged in the limiting groove. A heat dissipation mesh and a support plate are fixedly installed on the clamping plate. A motor is fixedly installed at the top of the support plate. The output end of the motor is fixedly connected to a rotating shaft through a coupling. Fan blades are fixedly installed on the rotating shaft.

5. The network transceiver motherboard heat dissipation fixing structure according to claim 4, characterized in that: The card plate and the fixing plate are engaged and connected, and the heat dissipation mesh is in communication with the interior of the mounting block.

6. The network transceiver mainboard heat dissipation fixing structure according to claim 4, characterized in that: The motor is located at the center of the support plate, and the rotating shaft is rotatably connected to the support plate.

7. The network transceiver mainboard heat dissipation fixing structure according to claim 4, characterized in that: The fan blades are located at the top of the heat dissipation fins, and the width of the fixing plate is greater than the width of the card plate.

8. The network transceiver motherboard heat dissipation fixing structure according to claim 1, characterized in that: The support mechanism includes protrusions and sleeves. Several protrusions are fixedly installed on the top of the main board. Sleeves are threadedly connected to the protrusions. A locking block is engaged at the top of the sleeve. A support frame is fixedly connected to the locking block. A positioning rod is threadedly connected to the sleeve.

9. The network transceiver mainboard heat dissipation fixing structure according to claim 8, characterized in that: The diameter of the protrusion is larger than the diameter of the sleeve, and the diameter of the sleeve is smaller than the diameter of the locking block.

10. The network transceiver motherboard heat dissipation fixing structure according to claim 8, characterized in that: The support frame is arranged in an L-shape, and the positioning rod passes through the inner wall of the support frame.

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