Power integration module protection structure

Abstract

The utility model provides a power integration module protection structure comprising the following elements: a first heat radiation plate which passes through the opening position of a mounting groove and the end face of which is attached to the back of a power integration chip; the four second heat dissipation plates are vertically arranged on the end face of one end, close to the power integrated chip, of the first heat dissipation plate in a rectangular array mode, and the interiors of the second heat dissipation plates are communicated with the interior of the first heat dissipation plate; the second heat conduction columns are evenly arranged on the end faces of the adjacent ends of the four second heat dissipation plates, one ends of the second heat conduction columns penetrate through heat dissipation assemblies in second heat dissipation cavities formed in the second heat dissipation plates, the second heat conduction columns are arranged on the first heat dissipation plate, and cooling airflow is controlled to circularly flow in the first heat dissipation cavities and the second heat dissipation cavities; the mounting plate is detachably mounted at the opening position of the mounting groove; when the first heat dissipation plate is arranged in the mounting groove in a penetrating manner, the four second heat dissipation plates are arranged in the mounting groove in a penetrating manner; according to the utility model, the power integration module can be conveniently protected, and the heat radiation effect of the power integration module is improved.

Description

A protection structure for power integrated modules Technical Field

[0001] This utility model relates to the field of frequency converter technology, specifically a protection structure for a power integrated module. Background Technology

[0002] A variable-frequency drive (VFD) is a power control device that uses frequency conversion technology and microelectronics to control an AC motor by changing the frequency of the power supply. It mainly consists of a rectification, filtering, inverter, braking unit, drive unit, detection unit, and microprocessor unit. VFDs have many protection functions, such as overcurrent, overvoltage, and overload protection. Because the power integrated module of a VFD carries a large current, it generates significant heat. If this heat cannot be dissipated in time, excessive temperature rise can easily burn out electronic components.

[0003] In the existing technology, the heat dissipation effect of the inverter power integration module is not ideal, which makes it difficult for heat to be dissipated inside the power integration module. This leads to heat accumulation inside the power integration module, which accelerates the aging of electronic components and may even cause the electronic components to burn out due to excessive temperature. Summary of the Invention

[0004] To address the aforementioned technical problems, this utility model provides a protective structure for a power integrated module, which can conveniently protect the power integrated module and improve its heat dissipation effect.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a power integrated module protection structure, comprising:

[0006] The module housing has a mounting slot on its bottom end face, and a power integrated chip is installed in the mounting slot;

[0007] The first heat sink is inserted through the opening of the mounting slot and its end face is attached to the back of the power integrated chip, and a first heat dissipation cavity is opened inside it.

[0008] Four second heat sinks are arranged in a rectangular array and vertically positioned on the end face of the first heat sink near the power integrated chip, and their interiors are connected to the interior of the first heat sink.

[0009] The second heat-conducting pillars are evenly distributed on the adjacent end faces of the four second heat dissipation plates, and one end of each second heat-conducting pillar passes through a second heat dissipation cavity opened inside the second heat dissipation plate.

[0010] A heat dissipation component is installed on the first heat dissipation plate, and the cooling airflow is controlled to circulate within the first and second heat dissipation chambers.

[0011] The mounting plate can be detachably installed at the opening of the mounting slot;

[0012] When the first heat sink is inserted into the mounting slot, the four second heat sinks are inserted into the mounting slot.

[0013] Preferably, a limiting strip perpendicular to the end face of the first heat sink is provided on the side of the second heat sink; when the second heat sink is inserted into the positioning groove opened in the wall of the mounting groove, the limiting strip is movably inserted into the limiting groove opened in the wall of the positioning groove.

[0014] Preferably, the second heat sink has two heat dissipation holes on the end face of the first heat sink adjacent to the first heat sink, which are connected to the interior of the second heat sink cavity.

[0015] Preferably, the heat dissipation component includes:

[0016] Four connecting posts penetrate the first heat sink plate. One end of each post is connected to a heat sink hole on the second heat sink plate, and the other end is inserted under the first heat sink plate. A connecting channel is provided inside the connecting post.

[0017] A guide ring is fixedly installed on the bottom end face of the first heat sink plate, and the inner ring is in communication with the inside of the first heat sink cavity;

[0018] Four connecting pipes, one end of which is set on the side of the guide ring and passes through the inside of the guide ring, and the other end is connected to different connecting posts respectively.

[0019] The sealing plate is located on the end face of the guide ring away from the first heat sink plate.

[0020] The heat sink is located inside the guide ring and controls the flow of cooling air from the connecting pipe to the first heat sink cavity.

[0021] Preferably, the heat sink includes:

[0022] A guide fan is installed inside the guide ring and driven by a motor to control the airflow from the connecting pipe through the guide ring into the first heat dissipation cavity;

[0023] Multiple cooling bars are arranged in a circular array on the end face opening of the guide ring near the first heat sink plate to cool the airflow passing through the guide ring opening.

[0024] Preferably, the cooling strip uses a semiconductor cooling chip.

[0025] Preferably, a heat-conducting plate extends through one end face of the first heat sink adjacent to the power integrated chip, and multiple first heat-conducting pillars are uniformly arranged on the end face of the heat-conducting plate.

[0026] The beneficial effects of this utility model are as follows: The end face of the first heat sink is attached to the back of the power integrated chip. Most of the heat generated by the power integrated chip during operation is transferred to the first heat sink, and the other part is transferred to the mounting slot. A second heat sink is provided in the mounting slot. The cooling airflow is controlled by the heat dissipation component to flow in the first and second heat dissipation chambers. The cooling airflow cools the first and second heat sinks, which facilitates heat dissipation of the power integrated chip and avoids the accumulation of heat in the mounting slot, which would cause the power integrated chip to operate at a high temperature. This prevents the power integrated chip from aging faster due to high temperature and even the burning of electronic components. It can conveniently protect the power integrated module and improve the heat dissipation effect of the power integrated module. Attached Figure Description

[0027] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0028] Figure 1 is a schematic diagram of the unfolded structure of the power integrated module protection structure proposed in this utility model.

[0029] Figure 2 is a top view schematic diagram of the protective structure of the power integrated module of this utility model.

[0030] Figure 3 is a schematic diagram of the heat dissipation component structure of this utility model.

[0031] Figure 4 is a schematic diagram of the second heat sink structure of this utility model.

[0032] Figure 5 is a schematic diagram of the cross-sectional structure of the heat sink of this utility model.

[0033] In the diagram: 1. Module shell; 2. Mounting slot; 3. First heat sink; 4. Connecting post; 5. Connecting pipe; 6. Mounting plate; 7. Positioning slot; 8. Limiting slot; 9. Second heat sink; 10. Limiting strip; 11. Second heat conduction post; 12. Heat conduction plate; 13. Heat dissipation hole; 14. Guide ring; 15. Cooling strip; 16. Guide fan; 17. Sealing plate; 18. First heat conduction post. Detailed Implementation

[0034] To make the technical means, creative features, and achieved objectives and effects of this utility model easier to understand, the present utility model is further described below with reference to specific embodiments and accompanying drawings. However, the following embodiments are only preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described in the embodiments without creative effort are all within the protection scope of this utility model.

[0035] Please refer to Figures 1-5, a power integrated module protection structure, including:

[0036] The module housing 1 has a mounting groove 2 on its bottom end face, and a power integrated chip is installed in the mounting groove 2.

[0037] The first heat sink 3 is inserted through the opening of the mounting slot 2 and its end face is attached to the back of the power integrated chip, and a first heat dissipation cavity is opened inside it.

[0038] Four second heat sinks 9 are arranged in a rectangular array and vertically disposed on one end face of the first heat sink 3 near the power integrated chip, and their interiors are connected to the interior of the first heat sink 3.

[0039] The second heat-conducting pillars 11 are evenly arranged on the adjacent end faces of the four second heat dissipation plates 9, and one end of each second heat-conducting pillar 11 passes through a second heat dissipation cavity opened inside the second heat dissipation plate 9.

[0040] A heat dissipation component is disposed on the first heat dissipation plate 3, and the cooling airflow is controlled to circulate within the first and second heat dissipation chambers.

[0041] Mounting plate 6 is detachably mounted at the opening of mounting slot 2;

[0042] When the first heat sink 3 is inserted into the mounting groove 2, the four second heat sinks 9 are inserted into the mounting groove 2.

[0043] As shown in Figures 1-5, when the power integrated chip is installed in the mounting slot 2, most of the heat generated is transferred to the first heat sink 3, and the other part is transferred to the mounting slot 2. At this time, the heat in the mounting slot 2 is transferred to the second heat sink 9 that passes through the mounting slot 2. Together with the heat dissipation components, the cooling airflow circulates in the first and second heat dissipation chambers, which facilitates the cyclic cooling of the first heat sink 3 and the second heat sink 9, ensuring that the power integrated chip works normally at the normal temperature. This can conveniently protect the power integrated module and improve the heat dissipation effect of the power integrated module.

[0044] The second heat sink 9 has a limiting strip 10 perpendicular to the end face of the first heat sink 3 on its side; when the second heat sink 9 is inserted into the positioning groove 7 opened in the wall of the mounting groove 2, the limiting strip 10 is inserted into the limiting groove 8 opened in the wall of the positioning groove 7.

[0045] As shown in Figure 2-3, when the second heat sink 9 is installed in the positioning groove 7, the limiting strip 10 passes through the limiting groove 8, ensuring the stability of the position of the second heat sink 9 installed in the mounting groove 2.

[0046] Two heat dissipation holes 13 are provided on the end face of the second heat dissipation plate 9 near the first heat dissipation plate 3, which are connected to the interior of the second heat dissipation cavity. The two heat dissipation holes 13 are connected to the interior of the first heat dissipation cavity.

[0047] The two heat dissipation holes 13 on the end face of the second heat dissipation plate 9 are connected to the interior of the first heat dissipation cavity, ensuring that the interiors of the first heat dissipation plate 3 and the second heat dissipation plate 9 are connected.

[0048] The heat dissipation components include:

[0049] Four connecting posts 4 pass through the first heat sink 3. One end of each post is connected to the four heat sink holes 13 on the second heat sink 9. The other end passes through the bottom of the first heat sink 3. A connecting channel is provided inside the connecting post 4.

[0050] The guide ring 14 is fixedly disposed on the bottom end face of the first heat sink 3, and the inner ring is in communication with the inside of the first heat sink cavity;

[0051] Four connecting pipes 5, one end of each is set on the side of the guide ring 14 and passes through the inner ring of the guide ring 14, and the other end is connected to different connecting posts 4 respectively.

[0052] The sealing plate 17 is sealed on the end face of the guide ring 14 away from the first heat sink 3;

[0053] The heat sink is located inside the guide ring 14 and controls the cooling airflow from the connecting pipe 5 to the first heat sink cavity.

[0054] As shown in Figures 1-5, part of the heat generated by the power integrated chip during operation is transferred to the first heat-conducting column 18 located in the first heat dissipation cavity through the heat-conducting plate 12, and another part of the heat is transferred to the mounting groove 2. The multiple second heat-conducting columns 11 set on the second heat dissipation plate 9 absorb the heat in the mounting groove 2 and transfer it to the inside of the second heat dissipation cavity. The cooling airflow driven by the heat dissipation component flows into the first heat dissipation cavity through the connecting pipe 5, and enters the second heat dissipation cavity through a heat dissipation hole 13 opened on each second heat dissipation plate 9. It is then transported to the connecting pipe 5 through the connecting column 4 to form a circulating cooling.

[0055] The cooling airflow dissipates heat from the first heat-conducting column 18 when passing through the first heat dissipation cavity, and dissipates heat from the second heat-conducting column 11 when passing through the second heat dissipation cavity. This achieves heat dissipation for both the first and second heat dissipation cavities, thereby cooling the working environment of the power integrated chip. This ensures the stability of the operating temperature of the power integrated chip, provides convenient protection for the power integrated module, and improves the heat dissipation effect of the power integrated module.

[0056] The heat sink includes:

[0057] A guide fan 16 is set inside the inner ring of the guide ring 14 and driven by a motor to control the airflow from the connecting pipe 5 through the guide ring 14 into the first heat dissipation cavity.

[0058] Multiple cooling bars 15 are arranged in a circular array on the end face opening of the guide ring 14 near the first heat sink 3 to cool the airflow passing through the opening of the guide ring 14.

[0059] As shown in Figures 2 and 5, the motor drives the guide fan 16 to rotate, which in turn drives the airflow in the connecting pipe 5 through the guide ring 14 and through multiple cooling bars 15 into the first heat dissipation cavity. The cooling bars 15 cool the airflow, so that the cooled airflow circulates in the first and second heat dissipation cavities.

[0060] The cooling strip 15 uses a semiconductor cooling chip.

[0061] A heat-conducting plate 12 extends through one end face of the first heat sink 3 adjacent to the power integrated chip, and multiple first heat-conducting pillars 18 are evenly arranged on the end face of the heat-conducting plate 12.

[0062] As shown in Figure 2-5, when the power integrated chip is working, the heat generated on the back is transferred to the heat-conducting plate 12 and then to multiple first heat-conducting pillars 18 on the heat-conducting plate 12. When the cooling airflow flows in the first heat dissipation cavity, it dissipates heat and cools the first heat-conducting pillars 18.

[0063] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A protection structure for a power integrated module, characterized in that, include: The module housing (1) has a mounting groove (2) on its bottom end face, and a power integrated chip is installed in the mounting groove (2); the first heat sink (3) is installed at the opening of the mounting groove (2) and its end face is attached to the back of the power integrated chip, and a first heat dissipation cavity is opened inside; four second heat sinks (9) are arranged in a rectangular array vertically on the end face of the first heat sink (3) near the power integrated chip, and their interiors are connected to the interior of the first heat sink (3); multiple second heat conduction pillars (11) are evenly arranged on the end face of the four second heat sinks (9) adjacent to each other, and one end of the multiple second heat conduction pillars (11) is installed inside the second heat sink (9) to open a heat dissipation component in the second heat dissipation cavity, which is set on the first heat sink (3) to control the cooling airflow to circulate in the first heat dissipation cavity and the second heat dissipation cavity; the mounting plate (6) is detachably installed at the opening of the mounting groove (2); when the first heat sink (3) is installed in the mounting groove (2), the four second heat sinks (9) are installed in the mounting groove (2).

2. The power integrated module protection structure according to claim 1, characterized in that: The second heat sink (9) has a limiting strip (10) perpendicular to the end face of the first heat sink (3) on its side; when the second heat sink (9) is inserted into the positioning groove (7) opened in the wall of the mounting groove (2), the limiting strip (10) is inserted into the limiting groove (8) opened in the wall of the positioning groove (7).

3. A power integrated module protection structure according to claim 1 or 2, characterized in that: The second heat sink (9) has two heat dissipation holes (13) on one end face of the first heat sink (3) that are connected to the inside of the second heat dissipation cavity. The two heat dissipation holes (13) are connected to the inside of the first heat dissipation cavity.

4. The power integrated module protection structure according to claim 3, characterized in that: The heat dissipation assembly includes: four connecting posts (4) that pass through the first heat dissipation plate (3), one end of which is connected to the four second heat dissipation plates (9) with heat dissipation holes (13) respectively, and the other end is inserted under the first heat dissipation plate (3). A connecting channel is provided in the connecting post (4); a guide ring (14) that is fixedly set on the bottom end face of the first heat dissipation plate (3) and the inner ring is connected to the inside of the first heat dissipation cavity; four connecting pipes (5) that are all set on the side of the guide ring (14) and connected to the inside of the inner ring of the guide ring (14), and the other end is connected to different connecting posts (4) respectively; a sealing plate (17) that is sealed on the end face of the guide ring (14) away from the first heat dissipation plate (3); and a heat dissipation component that is set in the guide ring (14) and controls the cooling airflow to flow from the connecting pipe (5) into the first heat dissipation cavity.

5. The power integrated module protection structure according to claim 4, characterized in that: The heat sink includes: A guide fan (16) is set inside the guide ring (14) and driven by a motor to control the airflow from the connecting pipe (5) through the guide ring (14) into the first heat dissipation cavity; multiple cooling bars (15) are arranged in a circumferential array on the end face opening of the guide ring (14) near the first heat dissipation plate (3) to cool the airflow passing through the opening of the guide ring (14).

6. The power integrated module protection structure according to claim 5, characterized in that: The cooling strip (15) uses a semiconductor cooling chip.

7. The power integrated module protection structure according to claim 6, characterized in that: The first heat sink (3) has a heat-conducting plate (12) running through one end face of the power integrated chip, and multiple first heat-conducting pillars (18) are evenly arranged on the end face of the heat-conducting plate (12).

Images