Efficient heat dissipation display screen

Abstract

The utility model provides an efficient heat dissipation display screen, and relates to the technical field of display screens, the efficient heat dissipation display screen comprises a shell, a display screen and a heat dissipation substrate are arranged in the shell, and the heat dissipation substrate and the display screen are attached together so as to conduct heat dissipation operation on the display screen. A circuit board is arranged on one side, far away from the display screen, of the heat dissipation substrate; through the synergistic effect of the heat dissipation substrate, the liquid cooling microcirculation structure, the heat dissipation module and the air outlet component, heat generated when the display screen works can be rapidly and efficiently dissipated out, so that the internal temperature of the display screen always controls the chip, the circuit board main body and the display screen to be within a safe temperature interval of normal work; therefore, the heat dissipation effect of the display screen is good, and even if the display screen is operated for a long time at high load, such as continuous outdoor advertisement display and high-strength electronic sports competition, the stable performance of the chip and the circuit board main body can be ensured, and the luminous efficiency, the color rendition and the like are not influenced.

Description

Technical Field

[0001] This utility model relates to the field of display screen technology, specifically a high-efficiency heat dissipation display screen. Background Technology

[0002] With the continuous development of display technology, MiniLED displays have gradually been widely used in many fields due to their advantages such as high brightness, high contrast, and high pixel density, including outdoor advertising, high-end e-sports, automotive displays, and virtual reality (VR) / augmented reality (AR). However, MiniLED displays have a significant problem during operation: severe chip heat generation. Due to the high power density of MiniLED chips, a large number of chips will generate a lot of heat when operating for a long time. If heat dissipation is not timely and effective, it will lead to a series of adverse consequences.

[0003] On the one hand, high temperatures can degrade the performance of MiniLED chips, such as reducing luminous efficiency and causing color shift, directly affecting the display effect. On the other hand, sustained high temperatures can also shorten the lifespan of the chips, increasing maintenance costs and replacement frequency, which is extremely detrimental to commercial operations and high-end equipment applications. Existing heat dissipation measures, such as traditional air cooling, often suffer from low heat dissipation efficiency and high noise levels; while purely passive heat dissipation methods, such as heat sinks, are insufficient to meet the heat dissipation requirements under high load operation.

[0004] Therefore, a display screen capable of efficient heat dissipation is needed to solve these problems. Utility Model Content

[0005] The purpose of this invention is to provide a high-efficiency heat dissipation display screen, which aims to solve the problems in the prior art.

[0006] To achieve the above objectives, one embodiment of the present invention provides a high-efficiency heat dissipation display screen, comprising:

[0007] The outer casing has multiple air inlets and an air outlet on its top.

[0008] The display screen is located inside the casing;

[0009] A heat dissipation substrate is disposed inside the housing and is attached to the display screen to conduct heat generated by the display screen during operation;

[0010] A circuit board is disposed on the side of the heat dissipation substrate away from the display screen, and multiple heat dissipation modules are disposed on the circuit board;

[0011] A liquid-cooled micro-circulation structure is installed inside the outer casing. The liquid-cooled micro-circulation structure is used to perform liquid cooling heat dissipation on the circuit board and the heat-generating components on the circuit board.

[0012] An air outlet component is located on the top side of the housing and corresponds to the air outlet position. The air outlet component and the air inlet are used to perform air cooling heat dissipation on the interior of the housing and the liquid cooling micro-circulation structure to accelerate the heat dissipation speed of the circuit board.

[0013] Preferably, the heat dissipation substrate includes a copper plate, a boron nitride ceramic film, and a graphene coating. There are two boron nitride ceramic films, each connected to one side of the copper plate. There are also two graphene coatings, each connected to a boron nitride ceramic film, with a one-to-one correspondence between the graphene coating and the boron nitride ceramic film.

[0014] Preferably, the circuit board includes a circuit board body and a plurality of chips disposed on the circuit board body, with gaps between the plurality of chips, the number of chips corresponding to the number of heat dissipation modules, the chips being located on one side of the heat dissipation modules, and the chips corresponding one-to-one with the heat dissipation modules.

[0015] Preferably, the liquid-cooled microcirculation structure includes a circulation pipe, a micro liquid pump, and a microchannel heat exchanger. The circulation pipe is arranged around the circuit board. The micro liquid pump is connected to one end of the circulation pipe, and the microchannel heat exchanger is connected to the other end of the circulation pipe. The micro liquid pump and the microchannel heat exchanger are connected by a pipe. Multiple U-shaped channels are formed on the circulation pipe, and the chip is located inside the U-shaped channel. The chip corresponds to each U-shaped channel.

[0016] Preferably, the air outlet component includes an air duct and guide vanes. The air duct corresponds to the position of the air outlet and has a tapered design. There are multiple guide vanes, and all of the guide vanes are installed inside the air duct.

[0017] Preferably, a dust filter is installed on the inner wall of the air inlet.

[0018] Preferably, the heat dissipation module is made of paraffin-based composite phase change material.

[0019] Preferably, the outer shell includes a front shell and a rear shell, which are connected to each other.

[0020] Compared with the prior art, the beneficial effects of this utility model are:

[0021] 1. Through the synergistic effect of the heat dissipation substrate, liquid cooling micro-circulation structure, heat dissipation module, and air outlet components, the heat generated by the display during operation can be dissipated quickly and efficiently. This keeps the internal temperature of the display chip, circuit board, and display screen within the safe operating temperature range, resulting in good heat dissipation. Even under long-term high-load operation, such as continuous outdoor advertising displays or high-intensity e-sports competitions, the performance of the chip and circuit board remains stable, and the luminous efficiency and color reproduction are not affected.

[0022] 2. The efficient heat dissipation effectively solves the threat of high temperature to the lifespan of chips, circuit boards and display screens. Compared with similar displays using traditional heat dissipation methods, this display reduces product maintenance costs and replacement frequency, which is of great significance for large-scale commercial applications and professional fields with extremely high stability requirements. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the exploded structure of this utility model;

[0024] Figure 2 This is a schematic diagram of the structure of this utility model;

[0025] Figure 3 This is a schematic diagram of the circuit board structure of this utility model;

[0026] Figure 4 This is a schematic diagram of the structure of the rear shell of this utility model;

[0027] Figure 5 This is a schematic diagram of the air outlet component of this utility model;

[0028] Figure 6 This is a schematic diagram of the layered structure of the heat dissipation substrate of this utility model.

[0029] In the diagram: 10. Outer shell; 101. Air inlet; 11. Display screen; 12. Heat dissipation substrate; 121. Copper plate; 122. Boron nitride ceramic film; 123. Graphene coating; 13. Circuit board; 131. Circuit board body; 132. Chip; 14. Heat dissipation module; 15. Dust filter; 16. Front shell; 17. Rear shell; 20. Liquid-cooled micro-circulation structure; 21. Circulation pipe; 211. U-shaped channel; 22. Micro liquid pump; 23. Microchannel heat exchanger; 30. Air duct; 31. Guide vane. Detailed Implementation

[0030] The present invention will now be further described with reference to the accompanying drawings.

[0031] like Figures 1 to 6As shown, a high-efficiency heat dissipation display screen includes a housing 10. Inside the housing 10, a display screen 11 and a heat dissipation substrate 12 are disposed. The heat dissipation substrate 12 is attached to the display screen 11 to dissipate heat from the display screen 11. A circuit board 13 is disposed on the side of the heat dissipation substrate 12 away from the display screen 11. Multiple heat dissipation modules 14 are disposed on the circuit board 13. A liquid-cooled micro-circulation structure 20 is disposed inside the housing 10 to perform liquid cooling dissipation on the circuit board 13 and the heat-generating components on the circuit board 13. Multiple air inlets 101 are disposed on the housing 10. An air outlet is disposed on the top of the housing 10. An air outlet component is disposed on the top side of the housing 10 opposite to the air outlet. The air outlet component and the air inlets 101 are used to perform air cooling dissipation on the interior of the housing 10 and the liquid-cooled micro-circulation structure 20 to accelerate the heat dissipation speed of the circuit board 13.

[0032] When the display screen is working, the heat dissipation substrate 12 dissipates heat from the display screen 11 and the circuit board 13, the liquid cooling micro-circulation structure 20 and the heat dissipation module 14 dissipate heat from the circuit board 13 and the heat-generating components on the circuit board 13, and the air outlet component and the air inlet 101 dissipate heat from the interior of the outer casing 10. Thus, the heat generated by the display screen structure during operation can be quickly and efficiently dissipated to the outside, resulting in a good heat dissipation effect for the display screen.

[0033] The heat dissipation substrate 12 includes a copper plate 121, and boron nitride ceramic films 122 are provided on both sides of the copper plate 121. Each boron nitride ceramic film 122 is provided with a graphene coating 123 on the side away from the copper plate 121.

[0034] The copper plate 121 has good thermal conductivity, the boron nitride ceramic film 122 has excellent thermal conductivity and insulation, and the graphene has ultra-high thermal conductivity. Through the copper plate 121, the boron nitride ceramic film 122 and the graphene coating 123, the heat on the display screen 11 and the circuit board 13 can be effectively conducted, thereby quickly reducing the temperature of the display screen 11 and the circuit board 13.

[0035] It should be noted that the copper plate 121 is made of high-purity copper plate. The copper plate 121 is processed to a predetermined thickness through rolling, etching and other processes, and undergoes micro-nano structuring treatment, such as using laser etching to create micro-nano trenches to increase the surface area. The boron nitride ceramic thin film 122 is bonded to one side of the copper plate 121 through a vacuum coating process, and the coating thickness and uniformity are controlled to ensure the good insulation and thermal conductivity of the heat dissipation substrate 12. The graphene coating 123 is deposited on the boron nitride ceramic thin film 122 using chemical vapor deposition technology, and the deposition parameters are adjusted to ensure the quality and thermal radiation performance of the graphene coating 123.

[0036] The circuit board 13 includes a circuit board body 131 and a plurality of chips 132 disposed on the circuit board body 131. There are gaps between the plurality of chips 132. The number of chips 132 corresponds to the number of heat dissipation modules 14. The chips 132 are located on one side of the heat dissipation modules 14, and there is a one-to-one correspondence between the chips 132 and the heat dissipation modules 14.

[0037] When the display is working, the chip 132 works and generates heat. At this time, the heat dissipation module 14 can dissipate heat from the chip 132 to prevent the chip 132 from overheating.

[0038] The liquid-cooled micro-circulation structure 20 includes a circulation pipe 21, which is arranged around the circuit board 13. One end of the circulation pipe 21 is connected to a micro liquid pump 22, and the other end of the circulation pipe 21 is connected to a microchannel heat exchanger 23. The micro liquid pump 22 and the microchannel heat exchanger 23 are connected by a pipe. Multiple U-shaped channels 211 are formed on the circulation pipe 21. The chip 132 is located inside the U-shaped channel 211, and the chip 132 corresponds to the U-shaped channel 211 one by one.

[0039] When the display is working, the micro liquid pump 22 is activated, and the coolant circulates between the circulation pipe 21 and the microchannel heat exchanger 23. The circulation of the coolant cools the circuit board 13. When the coolant flows inside the U-shaped channel 211, it can carry away the heat around the chip 132, thereby reducing the temperature of the chip 132. In conjunction with the heat dissipation module 14, the heat dissipation speed of the chip 132 is faster, avoiding the chip 132 from overheating.

[0040] It should be noted that the circulation pipe 21 is a flexible pipe, and a sealed joint is used at the connection point when connecting the circulation pipe 21, the micro liquid pump 22 and the microchannel heat exchanger 23 to prevent coolant leakage. In addition, the micro liquid pump 22 is designed to be silent, so that the display screen has extremely low noise during operation, which meets the requirements for use in a quiet environment.

[0041] The air outlet component includes an air duct 30 corresponding to the air outlet position. The air duct 30 has a tapered design and multiple guide vanes 31 are provided inside the air duct 30. The guide vanes 31 are used to allow the gas inside the air duct 30 to flow smoothly to the outside of the air duct 30.

[0042] The tapered air duct 30, combined with the guide vane 31, accelerates the airflow speed and improves heat dissipation efficiency, thereby more efficiently removing heat from the inside of the casing 10 and accelerating the heat dissipation speed inside the casing 10, resulting in better heat dissipation.

[0043] It should be noted that the shape and angle of the guide vane 31 are designed based on the results of aerodynamic simulation, and can be trapezoidal, willow leaf-shaped, etc. The guide vane 31 is fixed to the inner wall of the air duct 30 by welding or riveting to ensure that the guide vane 31 is firmly installed and guides the airflow smoothly.

[0044] A dust filter 15 is installed on the inner wall of the air inlet 101. The dust filter 15 is used to prevent external dust from entering the interior of the housing 10 through the air inlet 101, so as to avoid the dust from affecting the internal components of the housing 10.

[0045] The heat dissipation module 14 is made of paraffin-based composite material phase change material.

[0046] Thermally conductive adhesive is provided at the connection between the heat dissipation module 14 and the circuit board 13. The paraffin-based composite phase change material has good thermal conductivity. The thermally conductive adhesive and the paraffin-based composite phase change material ensure good thermal contact between the heat dissipation module 14 and the circuit board 13, thereby better absorbing the heat generated by the chip 132.

[0047] The outer casing 10 includes a front casing 16 and a rear casing 17, which are connected to each other. The display screen 11 is located inside the front casing 16, and the air outlet component and the dust filter 15 are both located on the rear casing 17.

[0048] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0049] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A high-efficiency heat dissipation display screen, characterized in that, include: The outer casing (10) is provided with a plurality of air inlets (101) and an air outlet is provided on the top of the outer casing (10); The display screen (11) is located inside the housing (10); A heat dissipation substrate (12) is disposed inside the housing (10). The heat dissipation substrate (12) is attached to the display screen (11) to conduct heat generated by the display screen (11) during operation. A circuit board (13) is disposed on the side of the heat dissipation substrate (12) away from the display screen (11), and multiple heat dissipation modules (14) are disposed on the circuit board (13). A liquid-cooled micro-circulation structure (20) is disposed inside the outer shell (10). The liquid-cooled micro-circulation structure (20) is used to perform liquid-cooled heat dissipation operation on the circuit board (13) and the heat-generating elements on the circuit board (13). An air outlet component is provided on the top side of the housing (10) and corresponds to the air outlet position. The air outlet component and the air inlet (101) are used to perform air cooling heat dissipation on the interior of the housing (10) and the liquid cooling micro-circulation structure (20) to accelerate the heat dissipation speed of the circuit board (13).

2. The high-efficiency heat dissipation display screen according to claim 1, characterized in that, The heat dissipation substrate (12) includes a copper plate (121), a boron nitride ceramic film (122), and a graphene coating (123). There are two boron nitride ceramic films (122), and each boron nitride ceramic film (122) is connected to one side of the copper plate (121). There are two graphene coatings (123), and each graphene coating (123) is connected to a boron nitride ceramic film (122). The graphene coatings (123) and boron nitride ceramic films (122) correspond one-to-one.

3. The high-efficiency heat dissipation display screen according to claim 2, characterized in that, The circuit board (13) includes a circuit board body (131) and a plurality of chips (132) disposed on the circuit board body (131). There are gaps between the plurality of chips (132). The number of chips (132) corresponds to the number of heat dissipation modules (14). The chips (132) are located on one side of the heat dissipation modules (14). The chips (132) correspond one-to-one with the heat dissipation modules (14).

4. The high-efficiency heat dissipation display screen according to claim 3, characterized in that, The liquid-cooled micro-circulation structure (20) includes a circulation pipe (21), a micro liquid pump (22), and a microchannel heat exchanger (23). The circulation pipe (21) is arranged around the circuit board (13). The micro liquid pump (22) is connected to one end of the circulation pipe (21), and the microchannel heat exchanger (23) is connected to the other end of the circulation pipe (21). The micro liquid pump (22) and the microchannel heat exchanger (23) are connected by a pipe. Multiple U-shaped channels (211) are formed on the circulation pipe (21). The chip (132) is located inside the U-shaped channel (211), and the chip (132) corresponds one-to-one with the U-shaped channel (211).

5. A high-efficiency heat dissipation display screen according to claim 3, characterized in that, The air outlet component includes an air duct (30) and a guide vane (31). The air duct (30) corresponds to the position of the air outlet. The air duct (30) has a tapered design. There are multiple guide vanes (31), and multiple guide vanes (31) are installed inside the air duct (30).

6. A high-efficiency heat dissipation display screen according to claim 3, characterized in that, The inner wall of the air inlet (101) is equipped with a dust filter (15).

7. A high-efficiency heat dissipation display screen according to claim 5, characterized in that, The heat dissipation module (14) is made of paraffin-based composite material phase change material.

8. A high-efficiency heat dissipation display screen according to claim 5, characterized in that, The outer shell (10) includes a front shell (16) and a rear shell (17), which are connected to each other.

Images