Driving board assembly, electric control box and heating and ventilation equipment

Abstract

The utility model provides a driving board assembly, an electric control box and heating and ventilation equipment. The driving board assembly comprises a driving substrate, a protection box, a power module and heat-conducting glue. The protection box is arranged on the driving substrate, a containing cavity is formed in the protection box, and the protection box is provided with an opening communicated with the containing cavity; the power supply module is arranged in the accommodating cavity and is electrically connected with the driving substrate so as to supply power to the driving substrate; the heat-conducting glue is filled in the accommodating cavity and wraps at least part of the power supply module. Through the arrangement, the power supply module is mounted on the driving substrate as an independent component, and only a small part of heat generated by the power supply module is transferred to the driving substrate, so that the heat dissipation performance of the driving substrate is ensured. By arranging the protection box and the heat-conducting glue, the power module is subjected to glue pouring treatment, the sealing performance of the power module is improved, heat conduction can be conducted through the heat-conducting glue, the heat dissipation effect of the power module is improved, and therefore the reliability and safety of the power module are improved.

Description

Technical Field

[0001] This application relates to the field of HVAC equipment technology, and in particular to a drive board assembly, an electrical control box, and HVAC equipment. Background Technology

[0002] Heating, ventilation, and air conditioning (HVAC) systems are an important component of building environmental control, encompassing multiple systems such as heating, ventilation, and air conditioning. They are widely used in residential, commercial, and industrial buildings. Their main function is to create a comfortable and healthy living and working environment by regulating parameters such as indoor temperature, humidity, and airflow.

[0003] The electrical control board, a key component of HVAC equipment, is used to control the normal operation of various electrical appliances. To protect it, the control board is usually housed in a box, called the control box. The control board includes a drive board assembly, which performs the main functions of the control box, such as control and actuation. The drive base plate within the drive board assembly, as the main body of the assembly, is the key component for achieving these control and actuation functions. The drive base plate requires a power supply module to power the drive board assembly in performing these functions.

[0004] In related technologies, power modules are typically integrated onto a driver substrate. During the process of the power module supplying power to the driver substrate, the electronic components on it generate heat, causing the power module's temperature to rise. Due to its tight integration with the driver substrate, this also causes localized temperature increases on the driver substrate. This phenomenon not only affects the heat dissipation performance of the driver board assembly but may also reduce its overall lifespan. Since the power module relies solely on air conduction for heat dissipation, the cooling effect is often unsatisfactory, further impacting the power module's heat dissipation performance and potentially reducing the overall lifespan of the driver board assembly. Utility Model Content

[0005] This application provides a driver board assembly, an electrical control box, and HVAC equipment, aiming to improve the problem of poor heat dissipation of the power module, which affects the overall heat dissipation effect of the electrical control box.

[0006] In a first aspect, embodiments of this application provide a driver board assembly, including:

[0007] Drive substrate;

[0008] A protective box is disposed on the drive base plate, and the protective box has a receiving cavity and an opening communicating with the receiving cavity;

[0009] A power module, disposed within the receiving cavity and electrically connected to the driving substrate, supplies power to the driving substrate; and

[0010] Thermally conductive adhesive is filled into the receiving cavity and encapsulates at least a portion of the power module.

[0011] In some embodiments, the protective box is further provided with a mounting slot on the cavity wall of the receiving cavity, and the power module is located in the mounting slot.

[0012] In some embodiments, the mounting slot extends from the opening along the depth direction of the receiving cavity; the edge of the power module can be inserted into the mounting slot from the opening.

[0013] In some embodiments, the protective box includes:

[0014] The box body has the receiving cavity and the opening; and

[0015] Two clamping protrusions extend along the depth direction of the receiving cavity and are connected to the inner wall of the box body;

[0016] The two clamping protrusions are arranged at intervals relative to each other and cooperate with the inner wall of the box body to define the mounting groove.

[0017] In some embodiments, the clamping protrusion includes:

[0018] The clamping sections of the two clamping protrusions are arranged opposite each other to clamp the power module; and

[0019] A guide section is connected to the side of the clamping section near the opening, and the distance between the guide sections of the two clamping protrusions gradually decreases from the opening along the depth direction of the receiving cavity.

[0020] In some embodiments, there are two mounting slots, which are respectively located on opposite sides of the box body, and the edges of the power module on opposite sides are respectively inserted into the corresponding mounting slot.

[0021] In some embodiments, the protective box further includes:

[0022] A stop member is connected to the inner wall of the box body and is located in the groove of the mounting groove near the opening. The stop member abuts against the end face of the power module facing the opening.

[0023] In some embodiments, the stop member is further provided with a guide ramp, which is used to make sliding contact with the edge of the power module during the insertion of the power module into the receiving cavity.

[0024] In some embodiments, the side wall of the housing body away from the opening has a through-plate hole, the power module portion passes through the through-plate hole and exposes the housing body, and the portion of the power module exposed from the through-plate hole is electrically connected to the drive substrate.

[0025] In some embodiments, the driving substrate has mounting holes, and the portion of the power module exposed through the through-panel hole passes through the mounting holes.

[0026] In some embodiments, the box body has a recessed portion.

[0027] In some embodiments, the protective box further includes:

[0028] Connecting ears are attached to the outer wall of the box body to secure the protective box.

[0029] In some embodiments, the thermally conductive adhesive completely encapsulates the power module, and the thermally conductive adhesive is flush with the opening.

[0030] Secondly, embodiments of this application also provide an electrical control box, the electrical control box comprising:

[0031] The main box has a first cavity inside;

[0032] The drive board assembly as described above is disposed within the first cavity.

[0033] In some embodiments, a second cavity is provided inside the main box, and the first cavity and the second cavity are arranged at intervals relative to each other in the thickness direction of the main box;

[0034] The electrical control box includes a filter board assembly, which is disposed in the second cavity and electrically connected to the drive board assembly.

[0035] In some embodiments, the main housing includes a heat dissipation structure, a first cover, and a second cover, wherein the first cover cooperates with the heat dissipation structure to form the first cavity, and the second cover cooperates with the heat dissipation structure to form the second cavity;

[0036] The heat dissipation structure has a first side and a second side, with the first cavity and the second cavity located on the first side and the second side of the heat dissipation structure, respectively.

[0037] In some embodiments, the heat dissipation structure includes a cold plate body and a first enclosure plate connected to the cold plate body. The cold plate body and the first enclosure plate are integrally formed. The cold plate body is plate-shaped and provided with heat dissipation channels.

[0038] The first box cover and the side of the first enclosure away from the cold plate body are sealed together to form the first cavity.

[0039] In some embodiments, the heat dissipation structure further includes a second enclosure plate connected to the side of the cold plate body facing away from the first enclosure plate, and a second cover sealingly engaging with the side of the second enclosure plate away from the cold plate body to form the second cavity;

[0040] Alternatively, the second lid can be sealed to the side of the cold plate body facing away from the first enclosure to form the second cavity.

[0041] Thirdly, embodiments of this application also provide a heating, ventilation, and air conditioning (HVAC) device, which includes a housing and an electrical control box as described above, wherein the electrical control box is disposed within the housing.

[0042] In some embodiments, the housing is provided with an access port; the electrical control box is located at the access port, wherein the first cavity is disposed facing the access port.

[0043] In the embodiments of this application, the driver board assembly is an essential key component of the electronic control box, used to realize the main functions of the electronic control box such as control and drive. The driver substrate is the main part of the driver board assembly, which not only provides a mounting position for the protective box and power module, but also serves as a key component for realizing control and drive functions.

[0044] When the driver board assembly performs control and drive functions, the power module provides the necessary power support to the driver substrate. By separating the power module from the driver substrate, it is installed as an independent component without affecting its original power supply function. Furthermore, this independent design facilitates maintenance and replacement, improving maintainability and ease of operation. In addition, during the power supply process, only a small portion of the heat generated by the power module is transferred to the driver substrate, ensuring that the heat dissipation performance of the driver substrate is not affected and avoiding the risk of damage due to localized overheating, thus extending the lifespan of the driver substrate.

[0045] To further improve the heat dissipation of the driver board assembly, the power module underwent potting and was fitted with a protective box to house the power module and thermally conductive adhesive. Firstly, the protective box provides space for the potting process by housing the power module and thermally conductive adhesive. Secondly, the thermally conductive adhesive seals the power module, providing waterproofing, moisture protection, dustproofing, and corrosion protection, thus ensuring normal operation. Thirdly, the power module no longer relies solely on air for heat conduction; instead, it dissipates heat through radiation, improving overall heat dissipation and reliability. Finally, the potting process strengthens the connection between the power module and the protective box, effectively preventing the power module from detaching from the housing and enhancing its reliability. Attached Figure Description

[0046] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0047] Figure 1 This is a schematic diagram of the exposed access panel of a heating, ventilation, and air conditioning (HVAC) device according to an embodiment of this application.

[0048] Figure 2 This is an exploded view of a portion of the structure of the electrical control box in one embodiment of this application;

[0049] Figure 3 This is a schematic diagram of the structure of the driver board assembly in one embodiment of this application;

[0050] Figure 4 This is a partial structural schematic diagram of the driver board assembly in one embodiment of this application;

[0051] Figure 5 This is a schematic diagram of the structure of the protective box in one embodiment of this application;

[0052] Figure 6 This is a partial structural diagram of a power module in one embodiment of this application.

[0053] Explanation of reference numerals in the attached figures:

[0054] 1000, Electrical control box;

[0055] 100. Drive board assembly; 110. Drive base plate; 111. Mounting hole; 120. Protective box; 121. Box body; 121a. Receiving cavity; 121b. Opening; 122. Mounting slot; 123. Clamping protrusion; 123a. Clamping section; 123b. Guide section; 124. Stop; 124a. Connecting root; 124b. Free end; 124c. Guide slope; 125. Through hole; 126. Recess; 127. Connecting ear; 127a. Connecting hole; 130. Power module; 131. Power board; 132. Pin;

[0056] 200. Main box body; 200a. First cavity; 200b. Second cavity; 210. Heat dissipation structure; 211. Cold plate body; 212. First enclosure; 213. Third enclosure; 214. Heat dissipation channel; 220. First box cover; 230. Second box cover; 240. Third box cover; 200c. Third cavity;

[0057] 300. Filter board assembly;

[0058] 2000, Outdoor unit; 2100, Housing; 2100a, Inspection port. Detailed Implementation

[0059] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0060] Heating, ventilation, and air conditioning (HVAC) systems are used to regulate the indoor environment, including functions such as heating, ventilation, and air conditioning. Their main purpose is to provide users with a comfortable and healthy indoor environment by controlling parameters such as temperature, humidity, and airflow. Common HVAC equipment includes air conditioners, radiators, and ventilation systems. These devices are widely used in residential, commercial buildings, and industrial settings.

[0061] Taking HVAC equipment as an example, an air conditioning system can be a multi-split system for buildings, that is, multiple indoor units are connected in parallel with one or more outdoor units to form a refrigerant circuit so that the refrigerant can circulate. Figure 1 The image shows the outdoor unit 2000 of the air conditioning system. The outdoor unit 2000 has a casing 2100, inside which are housed a compressor, switching valve, outdoor heat exchanger, outdoor expansion valve, and oil separator, etc. These components are connected by refrigerant piping. Additionally, a blower fan is installed in the outdoor unit 2000.

[0062] Furthermore, the outdoor unit 2000 also includes an electrical control box 1000. The housing 2100 is the external structure of the outdoor unit 2000 of the HVAC system, protecting internal components, providing a mounting base, and optimizing airflow. The housing 2100 can be made of metal or high-strength plastic, possessing good mechanical strength and corrosion resistance. The housing 2100 can be cuboid and placed on the roof or ground. The housing 2100 isolates internal live components from the outside environment, preventing direct contact by users and reducing the occurrence of safety accidents such as electric shock. The electrical control box 1000 is the core control component in the HVAC system. Installing the electrical control box 1000 inside the housing 2100 facilitates maintenance and replacement, and also simplifies the installation and layout of the overall HVAC system structure. The electrical control box 1000 is responsible for the precise control of the operation of the HVAC equipment. The electrical control box 1000 is equipped with various control circuits and realizes the control functions of the HVAC equipment through various electronic components and lines. It is used to control the start, stop, temperature adjustment, mode switching and other operations of the HVAC equipment.

[0063] The housing 2100 provides protection for the electronic components inside the control box 1000, preventing dust, moisture, oil, and other external impurities from entering. It also protects the control box 1000 from extreme environmental conditions (such as temperature, humidity, and chemical corrosion), ensuring normal operation in various environments and extending the lifespan of the control box 1000. The control box 1000 contains high-voltage circuits and live components; housing them within the housing 2100 prevents accidental user contact, reduces the risk of electric shock, and improves safety. Furthermore, the housing 2100 also acts as shielding, reducing the impact of external electromagnetic interference on the electronic components inside the control box 1000 and ensuring the stability and reliability of the control system.

[0064] like Figure 1 As shown, in this embodiment, the housing 2100 is rectangular, while the electrical control box 1000 has a length direction, which is arranged along the height direction (i.e., the vertical direction) of the housing 2100. Therefore, the internal structure of the electrical control box 1000 has a vertical arrangement. This vertical length arrangement can better meet the overall structural layout requirements of the equipment when the housing 2100 has a large height and limited horizontal space, and is also conducive to heat dissipation and maintenance operations.

[0065] It should be noted that the present invention is not limited to the arrangement of the control box 1000 along the height direction of the housing 2100 in the above embodiments. In other embodiments, the control box 1000 may also be arranged along the length direction of the housing 2100, or the control box 1000 may also be arranged along the width direction of the housing 2100. Furthermore, the control box 1000 may not be a single form extending along the length direction; it may also vary according to the internal space of the housing 2100, for example, it may be shaped like a near "L" or a "T".

[0066] In some embodiments, an air duct is formed within the housing 2100. This air duct guides air to flow along a predetermined path, preventing disordered airflow within the housing 2100 and thus improving heat dissipation efficiency. Specifically, as exemplarily shown in the figure, the air supply fan is located at the top of the housing 2100, i.e., at the top of the air duct, and blows air upwards. Furthermore, the electrical control box 1000 is located within the air duct, thus utilizing the airflow within the air duct to remove the heat generated by the electrical control box 1000, ensuring effective heat dissipation of the electrical control box 1000.

[0067] In some embodiments, see Figure 1 The housing 2100 is provided with an access port 2100a. In one configuration, the housing 2100 includes a housing body and an access door rotatably connected to the housing body, allowing maintenance personnel to expose the access port 2100a by opening the access door. In another configuration, the housing 2100 includes a housing body and a front panel connected to the housing body, the front panel being fixedly connected to the housing body by screws, allowing maintenance personnel to separate the front panel from the housing body by removing the screws to expose the access port 2100a. This application does not impose specific limitations on the manner in which the access port 2100a is exposed.

[0068] The electrical control box 1000 is located at the access port 2100a, allowing maintenance personnel to quickly access the electrical control box 1000 without having to enter the casing 2100 to operate it, thus greatly improving the efficiency of maintenance and repair.

[0069] In some embodiments, see Figure 2 The electrical control box 1000 includes a main box 200 and a drive frequency converter module (not labeled). The main box 200 is the main structure of the electrical control box 1000. A frequency converter cavity (not labeled) is located inside the main box 200, and the drive frequency converter module is housed within the frequency converter cavity. Therefore, the main box 200 serves to support and protect the internal drive frequency converter module, preventing it from shifting or being damaged due to external vibration or impact during use. By using the main box 200, components such as the drive frequency converter module are integrated into a unified structure, which facilitates the overall design and assembly of the electrical control box 1000, simplifying production and maintenance.

[0070] In some embodiments, please refer to Figure 2 The drive frequency converter module includes a drive board assembly 100, and the frequency converter cavity includes a first cavity 200a, with the drive board assembly 100 disposed within the first cavity 200a. The drive frequency converter module also includes a filter board assembly 300, and the frequency converter cavity further includes a second cavity 200b, with the filter board assembly 300 disposed within the second cavity 200b. By setting up the first cavity 200a and the second cavity 200b, different functional modules can be partitioned and arranged; for example, different functional circuit modules can be arranged within the first cavity 200a and the second cavity 200b.

[0071] Understandably, the main box 200 is a shell structure with a certain thickness, and the first cavity 200a and the second cavity 200b are in the thickness direction of the main box 200 (e.g., ...). Figure 2 The main housing 200 is arranged with relative spacing in the Z direction, meaning that a portion of the main housing 200 separates the first cavity 200a and the second cavity 200b. The thickness direction of the drive board assembly 100 and the filter board assembly 300 is consistent with the thickness direction of the main housing 200. When viewed from the thickness direction of the main housing 200 (i.e., from one side to the other), the drive board assembly 100 and the filter board assembly 300 are arranged sequentially along the thickness direction of the main housing 200, rather than horizontally or diagonally. This layout allows the drive board assembly 100 and the filter board assembly 300 to fully utilize the space in the thickness direction of the main housing 200, making reasonable use of the internal space of the control box 1000 and resulting in a more compact overall structure. This design can achieve more functions within a limited space and is suitable for applications with high space requirements.

[0072] In some embodiments, the drive board assembly 100 is typically used to implement the main functions of the electrical control box 1000, such as control and drive. In this embodiment, the drive board assembly 100 is located within the first cavity 200a and is responsible for processing high-voltage signals. The filter board assembly 300 is used to filter the signals, remove noise and interference, and ensure signal purity. In this embodiment, the filter board assembly 300 is located within the second cavity 200b and is responsible for processing low-voltage signals.

[0073] In some embodiments, see Figure 2The main housing 200 includes a heat dissipation structure 210, a first cover 220, and a second cover 230. A portion of the heat dissipation structure 210 forms the interior of the main housing 200. This portion of the heat dissipation structure 210 can be made of a material with good thermal conductivity, such as aluminum alloy. The heat dissipation structure 210 can be designed with internal heat dissipation channels. These channels can be straight or curved, used to guide the flow of air or liquid, i.e., to remove heat through air cooling or water cooling. The first cover 220 and the second cover 230 can be respectively disposed on the front and rear sides of the heat dissipation structure 210, that is, along the thickness direction of the main body 200. The first cover 220 and the heat dissipation structure 210 cooperate to form a first cavity 200a, which is used to install and accommodate the drive board assembly 100. The second cover 230 and the heat dissipation structure 210 cooperate to form a second cavity 200b, which is used to install and accommodate the filter board assembly 300. Through the tight cooperation between the first cover 220 and the second cover 230 and the heat dissipation structure 210, external pollutants such as dust and water vapor can be effectively prevented from entering the interior of the first cavity 200a and the second cavity 200b.

[0074] The heat dissipation structure 210 can serve as part of the cavity wall that forms the first cavity 200a and the second cavity 200b, thereby more effectively conducting the heat dissipated by the drive board assembly 100 and the filter board assembly 300 installed in the first cavity 200a and the second cavity 200b, increasing the heat exchange area, improving heat dissipation efficiency, and ensuring that the drive board assembly 100 and the filter board assembly 300 remain stable under high load operation.

[0075] Furthermore, the heat dissipation structure 210 is used as part of the cavity wall of the first cavity 200a and the second cavity 200b. That is, the heat dissipation structure 210 directly participates in the formation of the outer shell wall of the main box 200. In this way, when the electronic control box 1000 is located in the air duct, the airflow in the air duct can quickly flow through the outer wall surface of the electronic control box 1000, thereby fully exchanging heat. This allows for a faster release of the heat generated by the electronic control box 1000.

[0076] Understandably, the drive board assembly 100 and the filter board assembly 300 generate heat during operation. At least one side of each assembly faces the heat dissipation structure 210. Since the thickness direction of the drive board assembly 100 and the filter board assembly 300 is consistent with the thickness direction of the main housing 200, the side facing the heat dissipation structure 210 is usually the larger side of the drive board assembly 100 and the filter board assembly 300. The heat from these sides is mainly transferred to the heat dissipation structure 210 through thermal conduction, and then dissipated to the external environment through the heat dissipation function of the heat dissipation structure 210. Through the thermal conduction and convection cooling functions of the heat dissipation structure 210, the heat generated by the drive board assembly 100 and the filter board assembly 300 can be quickly removed, maintaining the internal temperature of the control box 1000 within a reasonable range. The sides of the drive board assembly 100 and the filter board assembly 300 that face away from the heat dissipation structure 210 face the first cover 220 and the second cover 230, respectively. These sides can dissipate heat to the surrounding environment through radiation. This comprehensive heat dissipation strategy not only improves the efficiency of heat transfer, but also ensures the stability and reliability of the equipment during long-term operation.

[0077] The heat dissipation structure 210 has a first side and a second side, namely the front and rear sides of the heat dissipation structure 210 along the thickness direction of the main housing 200. The first cavity 200a and the second cavity 200b are located on the first and second sides of the heat dissipation structure 210, respectively. The first cover 220 and the second cover 230 can be tightly fitted with the heat dissipation structure 210 by screws, clips, or other fixing devices to form two relatively independent first cavities 200a and second cavities 200b. The heat generation and heat dissipation requirements of the drive board assembly 100 and the filter board assembly 300 may be different. By placing them in independent cavities, customized designs can be made according to the specific heat dissipation requirements of the drive board assembly 100 and the filter board assembly 300. This also effectively avoids heat cross-interference between the drive board assembly 100 and the filter board assembly 300, ensuring that the drive board assembly 100 and the filter board assembly 300 each have optimal matching heat dissipation settings, thereby improving the heat dissipation efficiency of the entire electrical control box 1000.

[0078] The driver board assembly 100 and the filter board assembly 300 are located in separate cavities and are electrically connected. The driver board assembly 100 and the filter board assembly 300 are partially isolated by the main housing 200. This layout effectively reduces signal interference between the driver board assembly 100 and the filter board assembly 300. In the electrical control box 1000, signal interference is one of the important causes of equipment instability and malfunction. The cavity design significantly reduces this interference and improves the reliability of the electrical control box 1000. Furthermore, it allows for clearer functional division within the electrical control box 1000, facilitating management and maintenance. When maintenance or repair of a particular circuit module is required, the problem can be located more quickly, minimizing the impact on other circuit modules and improving maintenance efficiency.

[0079] like Figure 2 As shown, in a specific embodiment, two drive board assemblies 100 are laid flat within the first cavity 200a, and the two drive board assemblies 100 can be arranged along the vertical direction of the main housing 200 (e.g., Figure 2 The drive board assemblies are arranged at intervals in the Y direction, which allows the drive board assembly 100 to make full use of the space of the first cavity 200a, improves space utilization, effectively reduces electromagnetic interference between the two drive board assemblies 100, and helps to improve heat dissipation.

[0080] In some embodiments, such as Figure 2 As shown, the heat dissipation structure 210 includes a cold plate body 211 and a first enclosure plate 212. The first enclosure plate 212 is connected to the cold plate body 211, and the two are integrated into one structure. The integrated heat dissipation structure 210 enhances the overall strength and durability, reducing the risk of damage caused by vibration or impact. The cold plate body 211 is typically made of a material with good thermal conductivity (such as aluminum alloy or copper alloy) to ensure efficient heat conduction. The heat dissipation structure 210 has heat dissipation channels 214 for the flow of heat exchange medium. The heat dissipation channels 214 are mainly formed on the cold plate body 211 and can remove heat through coolant or air flow. The design of the heat dissipation channels 214 can effectively absorb the heat generated by electronic components and conduct and dissipate heat through the heat dissipation channels 214, keeping the internal temperature of the electrical control box 1000 within a reasonable range.

[0081] The first cover 220 and the side of the first enclosure 212 away from the cold plate body 211 are sealed together to form the first cavity 200a. This sealing effectively prevents dust and moisture from entering, protecting the internal circuit modules. Furthermore, because the temperature of the heat exchange medium flowing in the heat dissipation channel 214 is low, the temperature difference between the heat exchange medium and the outside temperature is large, making it easy for water vapor in the outside air to condense. By setting the first cavity 200a as a sealed chamber, water vapor in the external environment can also be prevented from condensing, avoiding condensation from adhering to the drive board assembly 100 and causing damage, extending the service life of the drive board assembly 100, improving the safety and reliability of the drive board assembly 100, and thus improving the overall reliability and durability of the electrical control box 1000.

[0082] Since the driver board assembly 100 typically contains high-power electronic components, such as power conversion modules and drive modules, these components generate a significant amount of heat during operation. Therefore, the heat dissipation requirements of the first cavity 200a are relatively high. While the filter board assembly 300 in the second cavity 200b also generates heat, its heat dissipation requirements are relatively lower than those of the driver board assembly 100. Therefore, the second cavity 200b and the first cavity 200a share a heat dissipation channel, effectively utilizing heat dissipation resources.

[0083] By using die casting, the cold plate body 211 and the first enclosure plate 212 can be integrally formed, reducing assembly steps and improving production efficiency. The shape and size of the heat dissipation channel 214 can also be precisely controlled, thereby optimizing heat dissipation performance. Specifically, the cold plate body 211 includes a cold plate substrate and a channel portion. Along the thickness direction of the cold plate substrate, the channel portion protrudes from at least one side relative to the cold plate substrate, forming the aforementioned heat dissipation channel 214 within the channel portion. In this embodiment, the channel portion protrudes towards the first cavity 200a, meaning the heat dissipation channel 214 is mainly arranged in the portion of the cold plate body 211 that forms the first cavity 200a, and this portion also forms the portion that forms the second cavity 200b. Furthermore, the heat dissipation channel 214 can also be arranged circumferentially around the first enclosure plate 212, effectively guiding heat dissipation from all directions of the first enclosure plate 212 and reducing heat accumulation in local areas.

[0084] In some implementations, such as Figure 2 As shown, the second lid 230 is a lid with thickness, and the side of the second lid 230 near the cold plate body 211 has a thickness direction (e.g., Figure 2The cavity formed in the Z direction is sealed by the second cover 230 on the side of the cold plate body 211 facing away from the first enclosure 212 to form the second cavity 200b. The second cover 230 is directly sealed on the side of the cold plate body 211 facing away from the first enclosure 212, without the need for an additional enclosure. The process is simpler, which can improve production efficiency and reduce manufacturing costs.

[0085] In other embodiments, the heat dissipation structure 210 also includes a second enclosure (not shown in the figure), which is also integrally formed with the cold plate body 211, significantly enhancing the integrity and stability of the heat dissipation structure 210. This design makes the heat dissipation structure 210 more robust and better able to withstand the heat generated by the internal circuit modules and external mechanical pressure. The second enclosure is connected to the side of the cold plate body 211 facing away from the first enclosure 212, and the second cover 230 is sealed to the side of the second enclosure away from the cold plate body 211 to form a second cavity 200b, which can better seal the second cavity 200b, preventing external impurities such as dust and moisture from entering and improving the protection level of the electrical control box 1000.

[0086] In some embodiments, see Figure 2 The control box 1000 also includes a main control module assembly (not shown in the figure) and a third cover 240. The third cover 240, together with the heat dissipation structure 210, forms a third cavity 200c, meeting the sealing requirements of the control box 1000. This sealed design prevents external factors such as dust and moisture from affecting the internal components of the third cavity 200c, improving the reliability and service life of the control box 1000. The main control module assembly is located within the third cavity 200c. This main control module assembly can be an independent control unit or functional module, working in conjunction with the drive board assembly 100 and the filter board assembly 300. By setting up the third cavity 200c and the main control module assembly, the control box 1000 achieves a modular arrangement of circuit modules. Each cavity can be designed and installed independently, facilitating the integration and expansion of different functional modules and reducing the complexity of installation and maintenance.

[0087] See Figure 2 The heat dissipation structure 210 also includes a third enclosure plate 213, which is connected to the cold plate body 211 and the two are integrated. Through die casting, the cold plate body 211 and the third enclosure plate 213 can be integrally formed, reducing assembly steps and improving production efficiency. The integrated heat dissipation structure 210 enhances overall strength and durability, reducing the risk of damage due to vibration or impact. The third cover 240 and the side of the third enclosure plate 213 away from the cold plate body 211 form a sealed fit to create a third cavity 200c. This sealed fit effectively prevents dust and moisture from entering, protecting the internal main control module components.

[0088] Although the main control module components inside the third cavity 200c also generate heat during operation, their heat dissipation requirements are relatively low. Therefore, the heat dissipation requirements of the third cavity 200c are not high, and the efficiency of radiative heat dissipation can be increased by coating the inner surface of the third cavity 200c with a coating with a high emissivity.

[0089] See Figure 3 In this embodiment of the application, the drive board assembly 100 includes a drive substrate 110, a protective box 120, a power module 130, and thermally conductive adhesive (the thermally conductive adhesive is hidden in order to facilitate the display of other components inside the protective box 120).

[0090] The drive substrate 110, as the main body of the drive board assembly 100, is a key component for the control box 1000 to realize control, drive and other functions. The drive substrate 110 has a plate-shaped structure with multiple mounting positions, which can provide physical mounting positions for various electronic components (such as capacitors, resistors, chips, connectors, etc.) in the drive board assembly 100, ensuring that these electronic components remain stable during operation.

[0091] A protective box 120 is mounted on the drive base plate 110. The protective box 120 is a hollow, open box with a receiving cavity 121a inside and an opening 121b communicating with the receiving cavity 121a, facilitating the installation of other components into the receiving cavity 121a through the opening 121b. The protective box 120 can be made of plastic material, giving it good corrosion resistance and lightweight properties. The protective box 120 can be cuboid in shape and connected to the drive base plate 110.

[0092] The power module 130 is disposed within the receiving cavity 121a. The power module 130 includes a power board 131 and electronic components disposed on the power board 131. The power module 130 is electrically connected to the drive substrate 110. Under the action of the power board 131 and the electronic components thereon, the power module 130 can change the AC voltage, converting the AC voltage into a voltage that can be used by the drive substrate 110 to supply power to the drive substrate 110.

[0093] Thermally conductive adhesive can be filled into the receiving cavity 121a through the opening 121b, and the thermally conductive adhesive will cover at least part of the power module 130. By using thermally conductive adhesive, on the one hand, the heat generated by the power module 130 during operation can be conducted to the outside of the protective box 120, and the heat can be dissipated to the surrounding environment through radiation, thereby improving the heat dissipation effect of the power module 130 and thus improving the overall reliability and safety of the power module 130; on the other hand, it can also improve the connection strength between the power module 130 and the protective box 120, effectively preventing the power module 130 from falling out of the receiving cavity 121a, and improving the reliability of the power module 130. This application does not impose specific restrictions on the filling method of the thermally conductive adhesive.

[0094] By separating the power module 130 from the drive substrate 110, the power module 130 is installed as an independent component on the drive substrate 110 without affecting its original power supply function. Simultaneously, the independent design of the power module 130 facilitates maintenance and replacement, improving maintainability and ease of operation. On one hand, during the power supply process from the power module 130 to the drive substrate 110, only a small portion of the heat generated by the power module 130 is transferred to the drive substrate 110, ensuring that the heat dissipation performance of the drive substrate 110 is not affected and avoiding the risk of damage due to localized overheating, thus extending the lifespan of the drive substrate 110. On the other hand, the heat generated by the power module 130 can also be dissipated to the surrounding environment through radiation, no longer relying solely on the heat dissipation structure 210 to cool the drive substrate 100. This comprehensive heat dissipation strategy not only improves heat transfer efficiency but also ensures the stability and reliability of the equipment during long-term operation.

[0095] To further improve the heat dissipation of the driver board assembly 100, the power module 130 was potted, and a protective box 120 was fitted around it to house the power module 130 and the thermally conductive adhesive. First, the protective box 120 can accommodate the power module 130 and the thermally conductive adhesive, providing operational space for the potting process. Second, the thermally conductive adhesive seals the power module 130, providing waterproofing, moisture resistance, dustproofing, and corrosion protection, thus ensuring the power module 130 can operate normally. Third, the power module 130 no longer relies solely on air for heat conduction; its heat dissipation is improved by radiative heat dissipation, enhancing its overall reliability and safety. Finally, the potting process also strengthens the connection between the power module 130 and the protective box 120, effectively preventing the power module 130 from detaching from the housing cavity 121a, further improving the reliability of the power module 130.

[0096] In some embodiments, continue reading Figure 3 The protective box 120 has its side wall facing away from the opening 121b connected to the drive base plate 110, so that the opening 121b is located on the side of the protective box 120 facing away from the drive base plate 110. This design facilitates the installation of the power module 130 into the receiving cavity 121a via the opening 121b.

[0097] Alternatively, in an alternative embodiment, any sidewall of the protective box 120 adjacent to the opening 121b (i.e., the sidewall of the protective box 120 other than the sidewall facing away from the opening 121b) is connected to the drive substrate 110, so that the opening 121b is located on the side of the protective box 120 perpendicular to the drive substrate 110. This arrangement also allows the power module 130 to be installed into the receiving cavity 121a via the opening 121b.

[0098] In some embodiments, combined with Figure 4 and Figure 6 As shown, the power module 130 includes a power board 131 and electronic components mounted on the power board 131. The power board 131 is the main body of the power module 130 and has a plate-like structure, which provides physical mounting positions for the electronic components. The electronic components include, but are not limited to, transformers, capacitors, etc. These electronic components, together with the power board 131, can convert the raw power into power suitable for use by the drive substrate 110, thereby supplying power to the drive substrate 110.

[0099] In some embodiments, the protective box 120 is further provided with a mounting groove 122 on the cavity wall of the receiving cavity 121a, the mounting groove 122 being along the depth direction of the receiving cavity 121a (e.g., Figure 4 and Figure 5 The power board 131 is positioned within the mounting groove 122, extending in the Z direction. The edge of the power board 131 can be inserted into the mounting groove 122 through the opening 121b and slide along the depth direction of the receiving cavity 121a until the end face of the power board 131 facing away from the opening 121b abuts against the cavity wall of the receiving cavity 121a facing away from the opening 121b, thereby placing the power module 130 within the receiving cavity 121a. The mounting groove 122 can limit the position of the power module 130, preventing it from shaking within the receiving cavity 121a and avoiding displacement during potting.

[0100] In some embodiments, such as Figure 5 As shown, the protective box 120 includes a box body 121 and a clamping protrusion 123. The box body 121 has a receiving cavity 121a and an opening 121b communicating with the receiving cavity 121a. The clamping protrusion 123 extends along the depth direction of the receiving cavity 121a and connects to the inner wall of the box body 121. There are two clamping protrusions 123, which are spaced apart from each other and cooperate with the inner wall of the box body 121 to define a mounting groove 122. This design reduces the thickness of the protective box 120 wall, further saving production materials and lowering production costs.

[0101] It should be noted that this application does not limit the connection method between the clamping protrusion 123 and the inner wall of the box body 121. The connection method between the clamping protrusion 123 and the inner wall of the box body 121 includes, but is not limited to, welding connection, adhesive connection, snap-fit ​​connection, etc. Alternatively, in some embodiments, the clamping protrusion 123 can also be integrally injection molded with the box body 121, which facilitates the overall processing and manufacturing of the protective box 120 and also helps to improve the connection strength between the clamping protrusion 123 and the box body 121.

[0102] In other embodiments, the cavity wall of the receiving cavity 121a is recessed in a direction away from the receiving cavity 121a to form a mounting groove 122, and the mounting groove 122 is along the depth direction of the receiving cavity 121a (e.g., Figure 4 and Figure 5 (Z-direction) extension settings.

[0103] In a further implementation, refer to Figure 4 and Figure 5 The number of mounting slots 122 is two, and the two mounting slots 122 are respectively disposed on the cavity walls on opposite sides of the receiving cavity 121a, that is, the two mounting slots 122 are respectively disposed on the cavity walls on opposite sides of the receiving cavity 121a in the X direction, and the mounting slots 122 are along the depth direction of the receiving cavity 121a (e.g., Figure 4 and Figure 5 The power board 131 extends in the Z direction. The edge of the power board 131 (i.e., the edge of the power board 131 in the X direction) can be inserted into the mounting groove 122 through the opening 121b, and can slide along the depth direction of the receiving cavity 121a until the end face of the power board 131 facing away from the opening 121b abuts against the cavity wall of the receiving cavity 121a facing away from the opening 121b, thereby placing the power module 130 within the receiving cavity 121a. The mounting groove 122 can limit the position of the power module 130, preventing the power module 130 from shaking within the receiving cavity 121a and avoiding displacement of the power module 130 during potting.

[0104] It should be noted that the number and location of the mounting slots 122 are not fixed in this application, and those skilled in the art can adjust them flexibly according to the actual product situation. For example, if there is only one mounting slot 122, it can be located on the cavity wall of either side of the receiving cavity 121a. In this case, one edge of the power board 131 can be inserted into the mounting slot 122 for positioning and installation. Alternatively, if there are two mounting slots 122, they can be located on opposite sides of the cavity wall in the X direction of the receiving cavity 121a. In this case, the opposite edges of the power module 130 can be inserted into the corresponding mounting slot 122 for positioning and installation.

[0105] In some embodiments, such as Figure 5As shown, the clamping protrusion 123 includes a clamping section 123a and a guide section 123b. The clamping sections 123a of the two clamping protrusions 123 are arranged opposite each other and in a parallel state for clamping the power board 131. The guide section 123b is located on the side of the clamping section 123a near the opening 121b and is connected to the clamping section 123a. The distance between the guide sections 123b of the two clamping protrusions 123 is (e.g., ...). Figure 5 The distance between the two guide sections 123b in the Y direction gradually narrows from the opening 121b along the depth direction of the receiving cavity 121a. The power board 131 can first be inserted into the space formed by the two guide sections 123b and the inner wall of the box body 121 from the opening 121b, and then, under the action of the guide sections 123b, be inserted into the mounting groove 122 formed by the two clamping sections 123a and the inner wall of the box body 121, thereby clamping the power board 131 to achieve a limiting effect. Through the above arrangement, it is beneficial to guide the power board 131 and facilitate the precise insertion of the power board 131 into the mounting groove 122.

[0106] In some embodiments, the clamping section 123a and the guide section 123b are integrally formed structures, which can be manufactured by integral injection molding. This facilitates the overall processing of the clamping protrusion 123 and also helps to improve the connection strength between the clamping section 123a and the guide section 123b. Alternatively, in other embodiments, the clamping section 123a and the guide section 123b are separate structures, but they are interconnected. The connection methods of the clamping section 123a and the guide section 123b include, but are not limited to, welding, bonding, and snap-fit ​​connections.

[0107] It should be noted that the guide section 123b is not essential in this application, and those skilled in the art can choose it flexibly according to the actual product situation. When the guide section 123b is not provided, the clamping section 123a extends along the depth direction of the receiving cavity 121a, extending from the end face of the box body 121 located at the opening 121b to the inner wall of the box body 121 opposite to the opening 121b. The power board 131 of the power module 130 can be clamped within the mounting groove 122 formed by the two clamping sections 123a of the opening 121b and the inner wall of the box body 121, thereby achieving a limiting function.

[0108] In some embodiments, refer to Figure 4 and Figure 5The protective box 120 also includes a stop 124, which is disposed on the box body 121 and connected to the inner wall of the box body 121. The stop 124 is located in the groove of the mounting slot 122 near the opening 121b. When the power module 130 is placed in the receiving cavity 121a through the mounting slot 122, the stop 124 can abut against the end face of the power board 131 facing the opening 121b. This structural arrangement can prevent the power board 131 from coming out of the mounting slot 122, which helps to improve the installability and stability of the power module 130.

[0109] In a further embodiment, the stop 124 includes a connecting root 124a and a free end 124b connected to each other. The connecting root 124a is connected to the inner wall of the box body 121, and the free end 124b is located on the side of the connecting root 124a away from the inner wall of the box body 121 connected to the connecting root 124a, and extends into the cavity of the receiving cavity 121a. The distance between the end face of the free end 124b near the opening 121b and the plane where the opening 121b is located (e.g., ...) Figure 5 The distance in the Z direction between the plane containing the free end 124b and the opening 121b along the extension direction of the free end 124b (e.g., Figure 5 The guide slope 124c gradually increases in the X direction, so that a guide slope 124c is formed on the side of the free end 124b near the opening 121b. The guide slope 124c gradually slopes away from the opening 121b along the extension direction of the free end 124b. During the insertion of the power module 130 into the receiving cavity 121a, the guide slope 124c can slide into contact with the edge of the power board 131 to facilitate the insertion of the power board 131 into the mounting slot 122.

[0110] In some embodiments, see Figure 6 The power module 130 also includes pins 132, which are disposed on the side of the power board 131 opposite to the opening 121b and are electrically connected to the power board 131. A through-plate hole 125 is formed on the side wall of the housing 121 opposite to the opening 121b. When the power module 130 is installed into the receiving cavity 121a, the pins 132 pass through the through-plate hole 125 and are exposed in the housing 121. The exposed portion of the pins 132 is electrically connected to the drive substrate 110 to supply power to the drive substrate 110.

[0111] Furthermore, the drive substrate 110 has mounting holes 111, and the pins 132 of the power module 130, which are exposed through the through-panel hole 125, pass through the mounting holes 111 and are inserted into the drive substrate 110. This structure facilitates the fixing of the power board 131 and helps to improve the stability of the electrical connection between the drive substrate 110 and the power module 130.

[0112] In some embodiments, pin 132 and power board 131 are an integral structure, which can be integrally formed by injection molding or other methods during the fabrication of power board 131. This structure can improve the stability and reliability of power board 131, reduce contact problems, and improve current carrying capacity. In other embodiments, pin 132 and power board 131 are separate structures, and pin 132 can be connected to power board 131 through etching or other processes; this structure can improve flexibility.

[0113] It should be noted that this application Figure 6 The diagram shows three pins 132 spaced apart on the side of the power board 131 opposite to the opening 121b, but this is merely exemplary and not limiting. In other embodiments, those skilled in the art can flexibly adjust the number of pins 132 according to specific product requirements. For example, one, two, four, or other numbers of pins 132 may be provided. Furthermore, when the number of pins 132 changes, the number of mounting holes 111 on the drive substrate 110 needs to be flexibly adjusted according to the number of pins 132 to ensure a one-to-one correspondence between the pins 132 and the mounting holes 111.

[0114] In some embodiments, thermally conductive adhesive completely encapsulates the power module 130 and completely fills the receiving cavity 121a. In the filled state, the thermally conductive adhesive is flush with the opening 121b, thus filling the entire receiving cavity 121a. Through this arrangement, firstly, the thermally conductive adhesive can seal the power module 130, preventing external water, insects, etc., from corroding the electronic components on the power module 130, achieving waterproofing, moisture-proofing, dustproofing, and corrosion prevention, thereby ensuring the normal operation of the power module 130; secondly, the power module 130 no longer relies solely on air for heat conduction, achieving better heat conduction by dissipating heat to the surrounding environment through radiation, improving the heat dissipation effect of the power module 130, thereby improving the overall reliability and safety of the power module 130; thirdly, potting also enhances the connection strength between the power module 130 and the protective box 120, effectively preventing the power module 130 from detaching from the receiving cavity 121a, thus improving the reliability of the power module 130.

[0115] In alternative embodiments, the thermally conductive adhesive only wraps a portion of the power module 130. For example, in some embodiments, the thermally conductive adhesive only wraps the electronic components on the power board 131, which can also achieve a certain degree of sealing and heat dissipation. Similarly, in other embodiments, the thermally conductive adhesive only wraps the power board 131, which can also achieve a certain degree of sealing and heat dissipation.

[0116] It should be noted that this application does not limit the type of thermally conductive adhesive, and those skilled in the art can flexibly adjust it according to the actual product situation. In some embodiments, the thermally conductive adhesive is in a solid state at room temperature and becomes a fluid state when heated to a certain temperature. The thermally conductive adhesive can be filled into the receiving cavity 121a through the opening 121b in a fluid state. In other embodiments, the thermally conductive adhesive can also be a soft gel, which can be placed in the receiving cavity 121a through the opening 121b. Among them, the thermally conductive adhesive includes, but is not limited to, silicone thermally conductive adhesive, epoxy resin AB glue, acrylic thermally conductive adhesive, polyurethane thermally conductive adhesive, or thermally conductive silicone grease, etc.

[0117] In some embodiments, such as Figure 4 As shown, the receiving cavity 121a is used to accommodate the power board 131 and the electronic components on the power board 131. Because the electronic components vary in size and shape, the power module 130 is not a regular shape. To further save on production materials, a recessed portion 126 is provided on the housing body 121 that recesses into the receiving cavity 121a. The specific shape of the recessed portion 126 is not limited to that described in this application. Figure 4 As shown, the recess 126 can be reasonably set according to the overall shape of the power module 130 without affecting the assembly of the power module 130. On the one hand, it saves production materials for the housing body 121 and reduces production costs; on the other hand, it reduces the volume of the receiving cavity 121a and reduces the amount of thermally conductive adhesive used, further reducing production costs.

[0118] In some embodiments, see Figure 4 The protective box 120 also includes a connecting ear 127, which is disposed on the box body 121 and connected to the outer wall of the box body 121. The connecting ear 127 has a connecting hole 127a for inserting a fastener. The fastener passes through the connecting hole 127a and connects to the drive base plate 110, thereby fixing the power module 130 to the drive base plate 110. The fastener may include screws, including but not limited to self-tapping screws, bolts, studs, etc.

[0119] It should be noted that, although this application Figure 4 The illustration shows one connecting ear 127 on the bottom outer wall of the box body 121, but this is only exemplary and not restrictive; in other embodiments, those skilled in the art can flexibly adjust the number of connecting ears 127 according to the specific product. For example, two, three, or other numbers of connecting ears 127 can also be provided. In addition, the location of the connecting ear 127 is not fixed in this application; the connecting ear 127 can also be provided on the outer wall in the middle of the box body 121.

[0120] It should also be noted that this application does not limit the connection method between the connecting ear 127 and the outer wall of the box body 121. The connection method between the connecting ear 127 and the outer wall of the box body 121 includes, but is not limited to, welding connection, adhesive connection, snap-fit ​​connection, etc. Alternatively, in some embodiments, the connecting ear 127 can also be integrally injection molded with the box body 121, which facilitates the overall processing and manufacturing of the protective box 120 and also helps to improve the connection strength between the connecting ear 127 and the box body 121.

[0121] In the description of this application, it should be understood that if terms such as "upper," "lower," "left," "right," "front," and "rear" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0122] Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0123] In the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0124] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0125] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A driver board assembly, characterized in that, include: Drive substrate; A protective box is disposed on the drive base plate, and the protective box has a receiving cavity and an opening communicating with the receiving cavity; A power module is disposed within the receiving cavity and electrically connected to the driving substrate to supply power to the driving substrate; as well as Thermally conductive adhesive is filled into the receiving cavity and encapsulates at least a portion of the power module.

2. The driver board assembly according to claim 1, characterized in that, The protective box is further provided with a mounting slot on the cavity wall of the receiving cavity, and the power module is located in the mounting slot.

3. The drive board assembly according to claim 2, characterized in that, The mounting slot extends from the opening along the depth direction of the receiving cavity; the edge of the power module can be inserted into the mounting slot from the opening.

4. The drive board assembly according to claim 3, characterized in that, The protective box includes: The box body has the receiving cavity and the opening; and Two clamping protrusions extend along the depth direction of the receiving cavity and are connected to the inner wall of the box body; The two clamping protrusions are arranged at intervals relative to each other and cooperate with the inner wall of the box body to define the mounting groove.

5. The driver board assembly according to claim 4, characterized in that, The clamping protrusion includes: The clamping sections of the two clamping protrusions are arranged opposite each other to clamp the power module; and A guide section is connected to the side of the clamping section near the opening, and the distance between the guide sections of the two clamping protrusions gradually decreases from the opening along the depth direction of the receiving cavity.

6. The drive board assembly according to claim 4, characterized in that, The number of mounting slots is two, and the two mounting slots are respectively located on opposite sides of the box body. The edges of the power module on opposite sides are respectively inserted into the corresponding mounting slot.

7. The drive board assembly according to claim 4, characterized in that, The protective box also includes: A stop member is connected to the inner wall of the box body and is located in the groove of the mounting groove near the opening. The stop member abuts against the end face of the power module facing the opening.

8. The driver board assembly according to claim 7, characterized in that, The stop member also has a guide slope, which is used to slide in contact with the edge of the power module during the insertion of the power module into the receiving cavity.

9. The drive board assembly according to claim 4, characterized in that, The box body has a through-plate hole on the side wall away from the opening. The power module part passes through the through-plate hole and exposes the box body. The part of the power module exposed from the through-plate hole is electrically connected to the drive substrate.

10. The drive board assembly according to claim 9, characterized in that, The drive substrate has mounting holes, and the portion of the power module exposed through the through-board hole passes through the mounting holes.

11. The drive board assembly according to claim 4, characterized in that, The box body has a recessed portion.

12. The drive board assembly according to claim 4, characterized in that, The protective box also includes: Connecting ears are attached to the outer wall of the box body to secure the protective box.

13. The drive board assembly according to any one of claims 1-12, characterized in that, The thermally conductive adhesive completely covers the power module, and the thermally conductive adhesive is flush with the opening.

14. An electrical control box, characterized in that, The electrical control box includes: The main box has a first cavity inside; The drive board assembly as claimed in any one of claims 1-13, wherein the drive board assembly is disposed within the first cavity.

15. The electrical control box according to claim 14, characterized in that, The main box body is provided with a second cavity, and the first cavity and the second cavity are arranged at intervals relative to each other in the thickness direction of the main box body; The electrical control box includes a filter board assembly, which is disposed in the second cavity and electrically connected to the drive board assembly.

16. The electrical control box according to claim 15, characterized in that, The main box includes a heat dissipation structure, a first box cover, and a second box cover. The first box cover cooperates with the heat dissipation structure to form the first cavity, and the second box cover cooperates with the heat dissipation structure to form the second cavity. The heat dissipation structure has a first side and a second side, with the first cavity and the second cavity located on the first side and the second side of the heat dissipation structure, respectively.

17. The electrical control box according to claim 16, characterized in that, The heat dissipation structure includes a cold plate body and a first enclosure plate connected to the cold plate body. The cold plate body and the first enclosure plate are integrally formed. The cold plate body is plate-shaped and has heat dissipation channels. The first box cover and the side of the first enclosure away from the cold plate body are sealed together to form the first cavity.

18. The electrical control box according to claim 17, characterized in that, The heat dissipation structure also includes a second enclosure plate, which is connected to the side of the cold plate body facing away from the first enclosure plate. The second cover is sealed to the side of the second enclosure plate away from the cold plate body to form the second cavity. Alternatively, the second lid can be sealed to the side of the cold plate body facing away from the first enclosure to form the second cavity.

19. A heating, ventilation, and air conditioning (HVAC) device, characterized in that, The HVAC equipment includes a housing and an electrical control box as described in any one of claims 14-18, wherein the electrical control box is disposed within the housing.

20. The HVAC equipment according to claim 19, characterized in that, The housing is provided with an inspection port; the electrical control box is located at the inspection port, wherein the first cavity is disposed facing the inspection port.

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