Radio frequency power supply device and electronic equipment

By installing an isolation plate assembly and a fan assembly inside the housing of the RF power supply unit, the RF component, power supply component, and control component are separated into independent sub-cavities, thus solving the problem of electromagnetic interference inside the RF power supply unit, achieving efficient electromagnetic shielding and heat dissipation, and meeting the user's communication needs.

CN224205506UActive Publication Date: 2026-05-05SHENZHEN RSPOWER TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN RSPOWER TECH CO LTD
Filing Date
2025-05-27
Publication Date
2026-05-05

AI Technical Summary

Technical Problem

In existing radio frequency power supply devices, there are electromagnetic interference problems among radio frequency components, power supply components and control components, making it difficult to effectively achieve internal electromagnetic shielding.

Method used

An isolation plate assembly is installed inside the housing of the radio frequency power supply device to isolate the housing into independent first, second, and third sub-cavities. The radio frequency component, power supply component, and control component are placed in their respective sub-cavities. Heat dissipation is achieved through a fan assembly, and power and control interfaces are configured to achieve electromagnetic shielding.

Benefits of technology

It effectively avoids electromagnetic interference inside the RF power supply device, improves heat dissipation efficiency, and has a simple structure and efficient installation process. Users can flexibly replace the communication module to meet their communication needs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a radio frequency power supply device and electronic equipment, and relates to the technical field of radio frequency. The radio frequency power supply device comprises a shell, an isolation plate assembly, a radio frequency assembly, a power supply assembly and a control assembly. The shell is provided with an accommodating cavity. The isolation plate assembly is arranged in the containing cavity and used for isolating the containing cavity into a first sub-cavity, a second sub-cavity and a third sub-cavity. The radio frequency assembly is arranged in the first sub-cavity. The power supply assembly is arranged in the second sub-cavity. And the control assembly is at least used for controlling the radio frequency assembly to generate radio frequency electric energy and is arranged in the third sub-cavity. The power supply assembly is at least used for providing electric energy for the radio frequency assembly and the control assembly. According to the invention, electromagnetic shielding in the radio frequency power supply device can be effectively realized.
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Description

Technical Field

[0001] This application relates to the field of radio frequency technology, and in particular to a radio frequency power supply device and an electronic device. Background Technology

[0002] Currently, with the development of radio frequency (RF) power supply technology, RF power supply devices are being used more and more widely in various fields. This places higher demands on the internal layout of RF power supply devices, especially the need for electromagnetic shielding to prevent electromagnetic interference between functional components. Therefore, how to effectively achieve electromagnetic shielding between functional components within an RF power supply device, particularly addressing electromagnetic interference between RF components, power supply components, and control components, has become a problem that needs to be considered. Utility Model Content

[0003] This application provides a radio frequency power supply device and electronic device, which can effectively achieve electromagnetic shielding between the radio frequency components, power supply components and control components inside the radio frequency power supply device, and avoid electromagnetic interference.

[0004] In a first aspect, a radio frequency (RF) power supply device is provided, comprising a housing, an isolation plate assembly, an RF component, a power supply component, and a control component. The housing has a receiving cavity. The isolation plate assembly is disposed within the receiving cavity, and the isolation plate assembly is used to isolate the receiving cavity into a first sub-cavity, a second sub-cavity, and a third sub-cavity. The RF component is disposed in the first sub-cavity. The power supply component is disposed in the second sub-cavity. The control component, for controlling the RF component to generate RF power, is disposed in the third sub-cavity. The power supply component is used to provide power to at least the RF component and the control component.

[0005] In one possible implementation, the housing includes opposing front and rear plates, and the partition assembly includes a first partition and a second partition connected to each other. The first partition is perpendicular to both the front and rear plates, and the second partition is also perpendicular to both the front and rear plates, and perpendicular to both the first and second partitions. One side of the first partition mates with the front and rear plates to form a first sub-cavity, and the other side of the first partition mates with the front, rear, and second partitions, forming a second sub-cavity and a third sub-cavity on either side of the second partition.

[0006] In one possible implementation, the radio frequency power supply device further includes a fan assembly disposed on the side of the front panel facing the rear panel, the fan assembly being used to dissipate heat from the radio frequency component and / or the power supply component.

[0007] In one possible implementation, the fan assembly includes a first fan and a second fan. The first fan is mounted in the region of the front panel corresponding to the first sub-cavity, and the second fan is mounted in the region of the front panel corresponding to the second sub-cavity. The front panel is provided with ventilation holes, each corresponding to both the first and second fans. The first fan is used to dissipate heat from the radio frequency component disposed in the first sub-cavity, and the second fan is used to dissipate heat from the power supply component disposed in the second sub-cavity.

[0008] In one possible implementation, the rear panel is provided with a power input interface, which corresponds to the second sub-cavity and is used to connect to electrical energy. The power supply component is connected to the power input interface and at least to the radio frequency component and the control component. The power supply component converts the electrical energy connected to the power input interface and provides power to the control component and the radio frequency component.

[0009] In one possible implementation, the rear panel is provided with an RF output interface, which corresponds to the first sub-cavity. The RF output interface is used to connect to a load to output RF power to the load. The RF component includes an excitation source module, an RF power amplifier module, and a detection module connected in sequence. The excitation source module is connected to the power supply component and is used to convert the power supplied by the power supply component to drive the RF power amplifier module. The RF power amplifier module is connected to the control component and is used to convert the power supplied by the excitation source module into RF power under the control of the control component. The detection module is connected to the RF output interface and is used to detect the RF power and transmit the RF power to the RF output interface.

[0010] In one possible implementation, the RF component further includes an impedance matching module connected between the RF power amplifier module and the detection module. The impedance matching module is used to perform impedance matching on at least the load. The excitation source module, the RF power amplifier module, the impedance matching module, and the detection module are arranged sequentially along a direction from the front panel to the rear panel.

[0011] In one possible implementation, the rear panel is provided with a control interface corresponding to the third sub-cavity. The control interface is used to receive and / or send control signals. The control component includes a connected crystal oscillator module, a control module, and a communication module. The communication module is connected to the control interface and is used to transmit operation signals received by the control interface to the control module, and to transmit control signals sent by the control module to the control interface. The crystal oscillator module is connected to the radio frequency (RF) component. Under the control of the control module, the crystal oscillator module generates RF signals and transmits these RF signals to the RF component, causing the RF component to generate RF power.

[0012] In one possible implementation, the crystal oscillator module, the control module, and the communication module are arranged sequentially along the direction from the front board to the rear board.

[0013] Secondly, an electronic device is also provided, comprising a radio frequency (RF) power supply device. The RF power supply device includes a housing, an isolation plate assembly, an RF component, a power supply component, and a control component. The housing has a receiving cavity. The isolation plate assembly is disposed within the receiving cavity, and the isolation plate assembly is used to isolate the receiving cavity into a first sub-cavity, a second sub-cavity, and a third sub-cavity. The RF component is disposed in the first sub-cavity. The power supply component is disposed in the second sub-cavity. The control component, at least for controlling the RF component to generate RF power, is disposed in the third sub-cavity. The power supply component is at least used to provide power to the RF component and the control component.

[0014] The radio frequency power supply device and electronic device of this application, by setting an isolation plate assembly inside the housing of the radio frequency power supply device having a receiving cavity, and configuring the isolation plate assembly to isolate the receiving cavity into a first sub-cavity, a second sub-cavity and a third sub-cavity, and then the radio frequency component, the power supply component and the control component are respectively set in the first sub-cavity, the second sub-cavity and the third sub-cavity, can effectively achieve electromagnetic shielding between the radio frequency component, the power supply component and the control component inside the radio frequency power supply device, and avoid electromagnetic interference. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0016] Figure 1 This is a schematic diagram from a first-view perspective of a radio frequency power supply device in some embodiments of this application.

[0017] Figure 2This is a schematic diagram from a second perspective of some embodiments of the radio frequency power supply device in this application.

[0018] Figure 3 This is a schematic diagram from a third-view perspective of a radio frequency power supply device in some embodiments of this application.

[0019] Figure 4 This is a schematic diagram of an electronic device in some embodiments of this application.

[0020] Explanation of reference numerals in the attached drawings: 1000, Electronic equipment; 1, RF power supply device; 10, Isolation plate assembly; 110, First isolation plate; 120, Second isolation plate; 20, RF component; 210, Excitation source module; 220, RF power amplifier module; 230, Impedance matching module; 240, Detection module; 250, RF heat dissipation module; 30, Power supply assembly; 40, Control assembly; 410, Crystal oscillator module; 420, Control module; 430, Communication module; 50. Fan assembly, 510, First fan, 520, Second fan, 530, Fan mounting plate, 60, Housing, 610, Receiving cavity, 611, First sub-cavity, 612, Second sub-cavity, 613, Third sub-cavity, 620, Front panel, 630, Rear panel, 631, Power input interface, 632, RF output interface, 633, Control interface, 640, Left panel, 650, Right panel, 660, Upper panel, 670, Lower panel, 680, Indicator light panel. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0022] In the description of the embodiments of this application, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "inner", "outer" and other terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this application and simplifying the description, and do not imply or indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0023] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0024] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0025] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or server that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such processes, methods, products, or devices.

[0026] Please see Figure 1 , Figure 1 This is a schematic diagram from a first-view perspective of some embodiments of the radio frequency power supply device in this application. For example... Figure 1 As shown, this application provides a radio frequency (RF) power supply device 1, which includes a housing 60, an isolation plate assembly 10, an RF component 20, a power supply assembly 30, and a control assembly 40. The housing 60 has a receiving cavity 610. The isolation plate assembly 10 is disposed in the receiving cavity 610, and the isolation plate assembly 10 is used to isolate the receiving cavity 610 into a first sub-cavity 611, a second sub-cavity 612, and a third sub-cavity 613. The RF component 20 is disposed in the first sub-cavity 611. The power supply assembly 30 is disposed in the second sub-cavity 612. A control assembly 40, at least for controlling the RF component 20 to generate RF power, is disposed in the third sub-cavity 613. The power supply assembly 30 is used at least to provide power to the RF component 20 and the control assembly 40.

[0027] Therefore, the radio frequency power supply device 1 described in this application, by providing an isolation plate assembly 10 inside the housing 60 of the radio frequency power supply device 1 having a receiving cavity 610, and configuring the isolation plate assembly 10 to isolate the receiving cavity 610 into a first sub-cavity 611, a second sub-cavity 612, and a third sub-cavity 613, and then the radio frequency component 20, the power supply component 30, and the control component 40 are respectively disposed in the first sub-cavity 611, the second sub-cavity 612, and the third sub-cavity 613, can effectively achieve electromagnetic shielding between the radio frequency component 20, the power supply component 30, and the control component 40 inside the radio frequency power supply device 1, and avoid electromagnetic interference.

[0028] In some embodiments, the control component 40 receives an operation signal and generates a corresponding control signal based on the received operation signal, and controls the radio frequency component 20 to generate radio frequency power.

[0029] Please refer to the following: Figure 2 , Figure 3 , Figure 2 This is a schematic diagram from a second perspective of some embodiments of the radio frequency power supply device in this application. Figure 3 This is a schematic diagram from a third-view perspective of a radio frequency power supply device in some embodiments of this application. For example... Figure 1 , Figure 2 , Figure 3 As shown, the housing 60 includes a front plate 620 and a rear plate 630 facing each other. The partition plate assembly 10 includes a first partition plate 110 and a second partition plate 120 connected to each other. The first partition plate 110 is perpendicular to both the front plate 620 and the rear plate 630, and the second partition plate 120 is also perpendicular to both the front plate 620 and the rear plate 630. The second partition plate 120 is also perpendicular to the first partition plate 110. One side of the first partition plate 110 mates with the front plate 620 and the rear plate 630 to form a first sub-cavity 611. The other side of the first partition plate 110 mates with the front plate 620, the rear plate 630, and the second partition plate 120, forming a second sub-cavity 612 and a third sub-cavity 613 on both sides of the second partition plate 120, respectively.

[0030] Therefore, the radio frequency power supply device 1 described above in this application, by providing a housing 60 with opposing front plates 620 and rear plates 630, and an isolation plate assembly 10 with a connected first isolation plate 110 and a second isolation plate 120, and by configuring the first isolation plate 110 to be perpendicular to both the front plate 620 and the rear plate 630, and the second isolation plate 120 to be perpendicular to both the front plate 620 and the rear plate 630, and the second isolation plate 120 to be perpendicular to both the first isolation plate 110, enables one side of the first isolation plate 110 to be perpendicular to the front plate 620. The first sub-cavity 611 is formed in conjunction with the rear plate 630, and the other side of the first isolation plate 110 is in conjunction with the front plate 620, the rear plate 630 and the second isolation plate 120. The second sub-cavity 612 and the third sub-cavity 613 are formed on both sides of the second isolation plate 120, respectively. Thus, through the first isolation plate 110 and the second isolation plate 120, the first sub-cavity 611, the second sub-cavity 612 and the third sub-cavity 613 that can electromagnetically shield each other are formed in the housing 60, and each sub-cavity is independent of the others.

[0031] like Figure 1 , Figure 2 , Figure 3 As shown, the RF power supply device 1 also includes a fan assembly 50, which is disposed on the side of the front panel 620 facing the rear panel 630. The fan assembly 50 is used to dissipate heat from the RF component 20 and / or the power supply component 30.

[0032] Therefore, the radio frequency power supply device 1 described above in this application, by providing a fan assembly 50 on the side of the front panel 620 facing the rear panel 630, can dissipate heat at least the first sub-cavity 611 and / or the third sub-cavity 613, thereby dissipating heat from the radio frequency assembly 20 and / or the power supply assembly 30.

[0033] In some embodiments, the housing 60 further includes an indicator panel 680, which is fixedly connected to the front panel 620 and is used to indicate the status of the radio frequency power supply device 1.

[0034] The indicator light panel 680 can be an LED light panel.

[0035] In some embodiments, the power supply component 30 can be connected to both the indicator light panel 680 and the fan assembly 50 to provide power to both the indicator light panel 680 and the fan assembly 50.

[0036] like Figure 1 , Figure 2 , Figure 3As shown, the fan assembly 50 includes a first fan 510 and a second fan 520. The first fan 510 is installed in the area corresponding to the first sub-cavity 611 of the front panel 620, and the second fan 520 is installed in the area corresponding to the second sub-cavity 612 of the front panel 620. The front panel 620 is provided with ventilation holes, which correspond to the first fan 510 and the second fan 520 to form airflow channels. For example, the front panel 620 is designed with two ventilation holes, which are respectively located in the areas corresponding to the first sub-cavity 611 and the second sub-cavity 612 of the front panel 620, respectively forming airflow channels with the first fan 510 and the second fan 520. The first fan 510 is used to dissipate heat from the radio frequency component 20 disposed in the first sub-cavity 611, and the second fan 520 is used to dissipate heat from the power supply component 30 disposed in the second sub-cavity 612. That is, the first fan 510 is used to generate airflow into and out of the first sub-cavity 611. The airflow flows through the airflow channel formed with the corresponding ventilation hole, and carries away the heat from the radio frequency component 20 disposed in the first sub-cavity 611, so as to dissipate heat from the radio frequency component 20 disposed in the first sub-cavity 611. The second fan 520 is also used to generate airflow into and out of the second sub-cavity 612. The airflow also flows through the airflow channel formed with the corresponding ventilation hole, and carries away the heat from the power supply component 30 disposed in the second sub-cavity 612, so as to dissipate heat from the power supply component 30 disposed in the second sub-cavity 612.

[0037] In some embodiments, the front panel 620 has mounting holes at positions corresponding to the first sub-cavity 611 and the second sub-cavity 612, respectively, and the first fan 510 and the second fan 520 are respectively mounted in the corresponding mounting holes, and respectively mounted in the areas corresponding to the first sub-cavity 611 and the areas corresponding to the second sub-cavity 612 of the front panel 620.

[0038] Therefore, the radio frequency power supply device 1 described above in this application, by configuring the first fan 510 of the fan assembly 50 to be installed in the area corresponding to the first sub-cavity 611 of the front panel 620, and the second fan 520 of the fan assembly 50 to be installed in the area corresponding to the second sub-cavity 612 of the front panel 620, and configuring the front panel 620 to be provided with ventilation holes, the ventilation holes corresponding to the first fan 510 and the second fan 520, the first fan 510 and the second fan 520 can form airflow, thereby enabling air cooling of the radio frequency component 20 disposed in the first sub-cavity 611 and the power supply component 30 disposed in the second sub-cavity 612 respectively.

[0039] Furthermore, high heat loss functional components such as the radio frequency component 20 and the power supply component 30 form independent heat dissipation channels inside their respective independent sub-cavities, which makes the airflow stable, the heat dissipation channels simple and reliable, greatly improves the heat dissipation efficiency, and the heat from each independent sub-cavity does not interfere with each other.

[0040] In some embodiments, the rear panel 630 may also be provided with ventilation holes, which may correspond to both the first fan 510 and the second fan 520.

[0041] like Figure 1 , Figure 2 , Figure 3 As shown, the fan assembly 50 may further include a fan mounting plate 530, which is installed on the side of the front plate 620 facing the rear plate 630. The first fan 510 and the second fan 520 are locked to the side of the fan mounting plate 530 facing the rear plate 630, so as to be installed at the corresponding positions of the first sub-cavity 611 and the second sub-cavity 612 of the front plate 620, respectively.

[0042] like Figure 1 , Figure 2 , Figure 3 As shown, the housing 60 may also include opposing left plates 640 and right plates 650, as well as opposing upper plates 660 and lower plates 670, wherein the first partition plate 110 may be parallel to both the left plate 640 and the right plate 650, and the second partition plate 120 may be parallel to both the upper plate 660 and the lower plate 670.

[0043] In some embodiments, the front plate 620, the first partition plate 110, the rear plate 630, the left plate 640, and the right plate 650 can all be fixedly connected to the lower plate 670. The front plate 620, the first partition plate 110, the rear plate 630, the left plate 640, and the right plate 650 are also fixedly connected to the upper plate 660. The second partition plate 120 is also fixedly connected to the right plate 650. One side of the first partition plate 110 cooperates with a portion of the front plate 620, a portion of the rear plate 630, the left plate 640, a portion of the lower plate 670, and a portion of the upper plate 660 to form a first sub-cavity 611. The other side of the first partition plate 110 cooperates with another portion of the front plate 620, another portion of the rear plate 630, the right plate 650, another portion of the lower plate 670, another portion of the upper plate 660, and the second partition plate 120, forming a second sub-cavity 612 and a third sub-cavity 613 on both sides of the second partition plate 120, respectively.

[0044] Furthermore, the front plate 620, rear plate 630, left plate 640, right plate 650, upper plate 660 and lower plate 670 form a rectangular shell 60, thereby accommodating the cavity 610, which is also rectangular, and the first sub-cavity 611, the second sub-cavity 612 and the third sub-cavity 613 are also rectangular.

[0045] like Figure 1 , Figure 2 , Figure 3As shown, the rear panel 630 is provided with a power input interface 631, which corresponds to the second sub-cavity 612. The power input interface 631 is used to connect to electrical energy. The power supply component 30 is connected to the power input interface 631 and at least to the radio frequency component 20 and the control component 40. The power supply component 30 is used to convert the electrical energy connected to the power input interface 631 and provide power to the control component 40 and the radio frequency component 20.

[0046] Therefore, the radio frequency power supply device 1 described above in this application, by configuring the power input interface 631 to correspond with the second sub-cavity 612, can convert the electrical energy connected to the power input interface 631 into power supply component 30 to power control component 40 and radio frequency component 20, thereby enabling control component 40 and radio frequency component 20 to work normally.

[0047] In some embodiments, the power supply component 30 can be connected to the radio frequency component 20 and the control component 40 through the first isolation plate 110 and the second isolation plate 120, respectively.

[0048] The power supply component 30 can be used to convert the voltage of the electrical energy connected to the power input interface 631 to provide power to the control component 40 and the radio frequency component 20.

[0049] like Figure 1 , Figure 2 , Figure 3 As shown, the rear panel 630 is provided with an RF output interface 632, which corresponds to the first sub-cavity 611. The RF output interface 632 is used to connect to a load to output RF power to the load. The RF component 20 includes an excitation source module 210, an RF power amplifier module 220, and a detection module 240 connected in sequence. The excitation source module 210 is connected to the power supply component 30 and is used to convert the power supplied by the power supply component 30 to drive the RF power amplifier module 220. The RF power amplifier module 220 is connected to the control component 40 and is used to convert the power supplied by the excitation source module 210 into RF power under the control of the control component 40. The detection module 240 is connected to the RF output interface 632 and is used to detect the RF power and transmit the RF power to the RF output interface 632.

[0050] Therefore, the radio frequency power supply device 1 described above in this application, by configuring the radio frequency output interface 632 to correspond with the first sub-cavity 611, can transmit the radio frequency power generated by the radio frequency component 20 to the load, thereby providing power to the load.

[0051] In some embodiments, the RF power amplifier module 220 includes an RF power amplifier, which is used to amplify the RF signal output by the control component 40 under the drive of the excitation source module 210 to obtain RF power.

[0052] In some embodiments, the detection module 240 may include a voltage sensor, a current sensor, a power sensor, etc.

[0053] like Figure 1 , Figure 2 , Figure 3 As shown, the RF component 20 also includes an impedance matching module 230, which is connected between the RF power amplifier module 220 and the detection module 240. The impedance matching module 230 is used to perform impedance matching on at least the load. The excitation source module 210, the RF power amplifier module 220, the impedance matching module 230, and the detection module 240 are arranged sequentially along the direction from the front panel 620 to the rear panel 630.

[0054] Therefore, the RF power supply device 1 described above in this application can achieve impedance matching by configuring an impedance matching module 230 connected between the RF power amplifier module 220 and the detection module 240, thereby reducing the impact of reflected power on the RF power supply device 1.

[0055] Furthermore, by configuring the excitation source module 210, the RF power amplifier module 220, the impedance matching module 230, and the detection module 240 to be arranged sequentially from the front board 620 to the rear board 630, and by sequentially enhancing the power intensity of each module along the direction from the front board 620 to the rear board 630, the crosstalk of high-power RF energy to low-power RF signals can be reduced.

[0056] In some embodiments, the impedance matching module 230 can generally be used to perform impedance matching between the RF power amplifier module 220 and the load.

[0057] Specifically, when the excitation source module 210 and the detection module 240 have corresponding impedance values, the impedance matching module 230 can be used to perform impedance matching on the excitation source module 210, the RF power amplifier module 220, the detection module 240, and the load.

[0058] In some embodiments, the RF component 20 may further include an RF heat dissipation module 250, which is disposed on the side of the lower plate 670 facing the upper plate 660. The excitation source module 210, the RF power amplifier module 220, the impedance matching module 230, and the detection module 240 are disposed on the side of the RF heat dissipation module 250 facing the upper plate 660. The RF heat dissipation module 250 is used to dissipate heat from the excitation source module 210, the RF power amplifier module 220, the impedance matching module 230, and the detection module 240.

[0059] Among them, the radio frequency heat dissipation module 250 can be a water-cooled heat sink.

[0060] like Figure 1 , Figure 2 , Figure 3 As shown, the rear panel 630 is provided with a control interface 633, which corresponds to the third sub-cavity 613. The control interface 633 is used to receive and / or send control signals. The control component 40 includes a connected crystal oscillator module 410, a control module 420, and a communication module 430. The communication module 430 is connected to the control interface 633 and is used to transmit operation signals received by the control interface 633 to the control module 420, and to transmit control signals sent by the control module 420 to the control interface 633. The crystal oscillator module 410 is connected to the radio frequency component 20. Under the control of the control module 420, the crystal oscillator module 410 generates radio frequency signals and transmits the radio frequency signals to the radio frequency component 20, so that the radio frequency component 20 generates radio frequency power.

[0061] Therefore, the radio frequency power supply device 1 described above in this application, by configuring the control interface 633 to correspond with the third sub-cavity 613, can realize the interaction of operation signals and / or control signals.

[0062] The user can send an operation signal to the control interface 633, so that the communication module 430 can transmit the operation signal received by the control interface 633 to the control module 420.

[0063] In some embodiments, the communication module 430 can transmit the operation signals received by the control interface 633 to the control module 420 via wired and / or wireless means. Wired means include, for example, universal serial bus (USB), coaxial cable, optical fiber, etc., while wireless means include, for example, Bluetooth, wireless fidelity (Wi-Fi), near field communication (NFC), ultrawide band (UWB), etc.

[0064] Furthermore, the communication module 430 and the control module 420 are detachably connected so that users can replace them as needed.

[0065] In some embodiments, the crystal oscillator module 410 may be a quartz crystal oscillator.

[0066] In some embodiments, the control module 420 may be a general-purpose processor such as a central processing unit (CPU), or a digital signal processor (DSP), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or other programmable logic devices, discrete gate logic devices, transistor logic devices, or other logic control devices. It may also be a microprocessor such as a micro control unit (MCU).

[0067] like Figure 1 , Figure 2 , Figure 3 As shown, the crystal oscillator module 410, the control module 420, and the communication module 430 are arranged sequentially from the front board 620 to the rear board 630.

[0068] Therefore, the radio frequency power supply device 1 described above in this application, according to the signal transmission path, is configured with the crystal oscillator module 410, the control module 420 and the communication module 430 arranged sequentially from the front plate 620 to the rear plate 630, which results in a stable structure and improves the signal transmission effect.

[0069] The radio frequency power supply device 1 of this application, through the above-described structure, forms a first sub-cavity 611, a second sub-cavity 612, and a third sub-cavity 613 within the housing 60 of the radio frequency power supply device 1, which are electromagnetically shielded from each other. Each sub-cavity is independent of the others, which can effectively achieve electromagnetic shielding between the radio frequency components 20, the power supply components 30, and the control components 40 inside the radio frequency power supply device 1, avoid electromagnetic interference, and greatly improve the heat dissipation efficiency of each sub-cavity. Furthermore, users can flexibly replace the communication module 430 of the radio frequency power supply device 1 to meet their communication needs. The installation process of the radio frequency power supply device 1 is also simple and efficient.

[0070] Please see Figure 4 , Figure 4 This is a schematic diagram of an electronic device in some embodiments of this application. For example... Figure 4 As shown, this application also provides an electronic device 1000, which includes the radio frequency power supply device 1 in any of the foregoing embodiments.

[0071] Please refer to it again. Figure 1 .like Figure 1As shown, the radio frequency power supply device 1 includes a housing 60, an isolation plate assembly 10, a radio frequency component 20, a power supply assembly 30, and a control assembly 40. The housing 60 has a receiving cavity 610. The isolation plate assembly 10 is disposed within the receiving cavity 610, and the isolation plate assembly 10 is used to isolate the receiving cavity 610 into a first sub-cavity 611, a second sub-cavity 612, and a third sub-cavity 613. The radio frequency component 20 is disposed in the first sub-cavity 611. The power supply assembly 30 is disposed in the second sub-cavity 612. A control assembly 40, at least for controlling the radio frequency component 20 to generate radio frequency power, is disposed in the third sub-cavity 613. The power supply assembly 30 is used at least to provide power to the radio frequency component 20 and the control assembly 40.

[0072] For a more specific description of the structure of the radio frequency power supply device 1, please refer to the relevant content of the radio frequency power supply device 1 in any of the foregoing embodiments, which will not be repeated here.

[0073] The radio frequency power supply device 1 and electronic device 1000 of this application, through the above-described structure, form a first sub-cavity 611, a second sub-cavity 612, and a third sub-cavity 613 within the housing 60 of the radio frequency power supply device 1, which are electromagnetically shielded from each other. Each sub-cavity is independent of the others, which can effectively achieve electromagnetic shielding between the radio frequency components 20, the power supply components 30, and the control components 40 inside the radio frequency power supply device 1, avoid electromagnetic interference, and greatly improve the heat dissipation efficiency of each sub-cavity. Furthermore, users can flexibly replace the communication module 430 of the radio frequency power supply device 1 to meet their communication needs. The installation process of the radio frequency power supply device 1 is also simple and efficient.

[0074] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Where there is no conflict, the embodiments and features in the embodiments of this application can be combined with each other. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A radio frequency power supply device, characterized in that, include: The shell has a receiving cavity; An isolation plate assembly is disposed in the receiving cavity, the isolation plate assembly being used to isolate the receiving cavity into a first sub-cavity, a second sub-cavity, and a third sub-cavity; The radio frequency component is disposed in the first sub-cavity; A power supply assembly is disposed in the second sub-cavity; At least one control component for controlling the radio frequency components to generate radio frequency power is disposed in the third sub-cavity; The power supply component is used to provide power to at least the radio frequency component and the control component.

2. The radio frequency power supply device according to claim 1, characterized in that, The housing includes a front plate and a rear plate opposite to each other, and the partition plate assembly includes a first partition plate and a second partition plate connected together. The first partition plate is perpendicular to both the front plate and the rear plate, and the second partition plate is perpendicular to both the front plate and the rear plate. The second partition plate is also perpendicular to the first partition plate. The first partition plate has one side that cooperates with the front plate and the rear plate to form the first sub-cavity, and the other side of the first partition plate cooperates with the front plate, the rear plate and the second partition plate to form the second sub-cavity and the third sub-cavity on both sides of the second partition plate, respectively.

3. The radio frequency power supply device according to claim 2, characterized in that, The radio frequency power supply device further includes a fan assembly, which is disposed on the side of the front panel facing the rear panel, and the fan assembly is used to dissipate heat from the radio frequency component and / or the power supply component.

4. The radio frequency power supply device according to claim 3, characterized in that, The fan assembly includes a first fan and a second fan, wherein the first fan is installed in the area of ​​the front panel corresponding to the first sub-cavity, and the second fan is installed in the area of ​​the front panel corresponding to the second sub-cavity. The front panel is provided with ventilation holes, which correspond to both the first fan and the second fan. The first fan is used to dissipate heat from the radio frequency component disposed in the first sub-cavity, and the second fan is used to dissipate heat from the power supply component disposed in the second sub-cavity.

5. The radio frequency power supply device according to claim 2, characterized in that, The rear panel is provided with a power input interface, which corresponds to the second sub-cavity and is used to connect to electrical energy. The power supply component is connected to the power input interface and at least to the radio frequency component and the control component. The power supply component is used to convert the electrical energy input through the power input interface and provide electrical energy to the control component and the radio frequency component.

6. The radio frequency power supply device according to claim 2, characterized in that, The rear panel is provided with an RF output interface, which corresponds to the first sub-cavity. The RF output interface is used to connect to the load to output RF power to the load. The RF component includes an excitation source module, an RF power amplifier module, and a detection module connected in sequence. The excitation source module is connected to the power supply component, and the excitation source module is used to convert the electrical energy provided by the power supply component to drive the radio frequency power amplifier module. The radio frequency power amplifier module is connected to the control component, and the radio frequency power amplifier module is used to convert the electrical energy provided by the excitation source module into radio frequency electrical energy under the control of the control component. The detection module is connected to the radio frequency output interface, and the detection module is used to detect the radio frequency power and transmit the radio frequency power to the radio frequency output interface.

7. The radio frequency power supply device according to claim 6, characterized in that, The radio frequency component further includes an impedance matching module, which is connected between the radio frequency power amplifier module and the detection module. The impedance matching module is used to perform impedance matching on at least the load. The excitation source module, the radio frequency power amplifier module, the impedance matching module, and the detection module are arranged sequentially along the direction from the front board to the rear board.

8. The radio frequency power supply device according to claim 2, characterized in that, The rear plate is provided with a control interface, which corresponds to the third sub-cavity. The control interface is used to receive and / or send control signals. The control component includes a connected crystal oscillator module, a control module, and a communication module. The communication module is connected to the control interface. The communication module is used to transmit operation signals received by the control interface to the control module, and to transmit control signals issued by the control module to the control interface. The crystal oscillator module is connected to the radio frequency component. Under the control of the control module, the crystal oscillator module generates a radio frequency signal and transmits the radio frequency signal to the radio frequency component so that the radio frequency component generates radio frequency power.

9. The radio frequency power supply device according to claim 8, characterized in that, The crystal oscillator module, the control module, and the communication module are arranged sequentially from the front board to the rear board.

10. An electronic device, characterized in that, Includes the radio frequency power supply device as described in any one of claims 1-9.