Impedance matcher and electronic device

Abstract

The utility model provides an impedance matcher and electronic equipment, and relates to the technical field of radio frequency. The impedance matcher comprises a shell, an isolation plate, an impedance matching assembly, a control assembly and a fan assembly. The shell is provided with an accommodating cavity. The isolation plate is arranged in the accommodating cavity and is used for isolating the accommodating cavity into a first sub-cavity and a second sub-cavity; the impedance matching assembly is arranged in the first sub-cavity. The control assembly is used for adjusting the matching impedance value of the impedance matching assembly, the fan assembly is at least used for cooling the control assembly, the control assembly and the fan assembly are both arranged in the second sub-cavity, and the control assembly is connected with the impedance matching assembly through an isolation plate. According to the invention, electromagnetic shielding in the impedance matcher can be effectively realized.

Description

Technical Field

[0001] This application relates to the field of radio frequency technology, and in particular to an impedance matching device and electronic equipment. Background Technology

[0002] Currently, with the development of radio frequency (RF) power supply technology, RF power supply devices are increasingly widely used in various fields. During application, RF power supply devices require impedance matching devices, which places higher demands on the internal layout of these devices, especially the need for electromagnetic shielding to prevent electromagnetic interference between functional components. Therefore, effectively achieving electromagnetic shielding between functional components within the impedance matching device, particularly addressing electromagnetic interference between the impedance matching components and the control components, has become a crucial issue. Utility Model Content

[0003] This application provides an impedance matching device and an electronic device that can effectively achieve electromagnetic shielding between the internal impedance matching components and the control components of the impedance matching device, thereby avoiding electromagnetic interference.

[0004] In a first aspect, an impedance matching device is provided, comprising a housing, an isolation plate, an impedance matching component, a control component, and a fan assembly. The housing has a receiving cavity. The isolation plate is disposed within the receiving cavity, dividing the receiving cavity into a first sub-cavity and a second sub-cavity. The impedance matching component is disposed in the first sub-cavity. The control component, used for adjusting the matching impedance value of the impedance matching component, and the fan assembly, used for at least cooling the control component, are both disposed in the second sub-cavity. The control component and the impedance matching component are connected via the isolation plate.

[0005] In one possible implementation, the control component includes a power module, a control board, and a motor module. The power module is connected to both the control board and the fan assembly, and supplies power to both. The control board is connected to the motor module and controls its rotation. The motor module is connected to the impedance matching component via the isolation plate, and adjusts the impedance matching value of the impedance matching component in response to the control board's control.

[0006] In one possible implementation, the housing includes a front panel and a rear panel facing each other, the front panel, the rear panel, and the isolation plate arranged in parallel, the isolation plate being located between the front panel and the rear panel. The control board is mounted on the front panel, and the power module, the motor module, and the fan assembly are all mounted on the side of the isolation plate facing the front panel.

[0007] In one possible implementation, the impedance matching component includes a first capacitor, a second capacitor, and a third capacitor. The first and second capacitors are both mounted on the side of the isolation plate facing the rear plate, and the third capacitor is connected to the second capacitor. At least one of the first, second, and third capacitors is an adjustable capacitor. The motor module is connected to the at least one adjustable capacitor via the isolation plate to adjust its capacitance value, thereby adjusting the matching impedance value of the impedance matching component.

[0008] In one possible implementation, both the first capacitor and the second capacitor are adjustable capacitors, and the motor module includes a first motor and a second motor. The first capacitor and the first motor are coaxially mounted on opposite sides of the isolation plate, and the second capacitor and the second motor are coaxially mounted on opposite sides of the isolation plate. The first motor is used to adjust the capacitance value of the first capacitor, and the second motor is used to adjust the capacitance value of the second capacitor.

[0009] In one possible implementation, the impedance matching component further includes a first inductor and a second inductor. The first inductor is at least connected to the first capacitor, and the second inductor is mounted on the side of the isolation plate facing the rear plate and is positioned corresponding to the fan assembly. The isolation plate has a first ventilation hole corresponding to the fan assembly to form a gas flow path between the fan assembly and the second inductor. The fan assembly is also used to dissipate heat from the second inductor through the gas flow path.

[0010] In one possible implementation, the housing further includes opposing top and bottom plates, the first inductor being connected to the top plate, and the first capacitor, the second capacitor, and the third capacitor being disposed on the side of the bottom plate facing the top plate.

[0011] In one possible implementation, the housing further includes two opposing side plates, each with a second ventilation hole, and one of the side plates also has a power interface for receiving electrical energy. The power module is connected to the power interface and converts the electrical energy received through the power interface to power the control board and the fan assembly.

[0012] In one possible implementation, the isolation plate is made of aluminum.

[0013] Secondly, an electronic device is also provided, comprising an impedance matching device. The impedance matching device includes a housing, an isolation plate, an impedance matching component, a control component, and a fan assembly. The housing has a receiving cavity. The isolation plate is disposed within the receiving cavity, dividing the receiving cavity into a first sub-cavity and a second sub-cavity. The impedance matching component is disposed in the first sub-cavity. The control component, used for adjusting the matching impedance value of the impedance matching component, and the fan assembly, used for at least heat dissipation of the control component, are both disposed in the second sub-cavity. The control component and the impedance matching component are connected via the isolation plate.

[0014] The impedance matching device and electronic device of this application, by setting an isolation plate inside the housing of the impedance matching device having a receiving cavity, and configuring the isolation plate to isolate the receiving cavity into a first sub-cavity and a second sub-cavity, and then setting the impedance matching component and the control component in the first sub-cavity and the second sub-cavity respectively, can effectively achieve electromagnetic shielding between the impedance matching component and the control component inside the impedance matching device and avoid electromagnetic interference. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0016] Figure 1 This is a schematic diagram from a first-view perspective of an impedance matching device in some embodiments of this application.

[0017] Figure 2 This is a schematic diagram from a second perspective of the impedance matching device in some embodiments of this application.

[0018] Figure 3 This is a schematic diagram of an electronic device in some embodiments of this application.

[0019] Explanation of reference numerals in the attached drawings: 1000, electronic device; 10, impedance matching device; 100, housing; 110, receiving cavity; 111, first sub-cavity; 112, second sub-cavity; 120, front panel; 130, rear panel; 140, top panel; 150, bottom panel; 160, side panel; 161, second ventilation hole; 162, power interface; 200, isolation plate; 210, first ventilation hole; 300, impedance matching component; 310, first capacitor; 320, second capacitor; 330, third capacitor; 340, first inductor; 350, second inductor; 400, control component; 410, power module; 420, control board; 430, motor module; 431, first motor; 432, second motor; 500, fan assembly. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0021] In the description of the embodiments of this application, it should be noted that the terms "upper", "lower", "front", "rear", "side", "vertical", "inner", "outer", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this application and simplifying the description, and do not imply or indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0022] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0023] Hereinafter, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0024] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or server that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such processes, methods, products, or devices.

[0025] Please see Figure 1 , Figure 1 This is a schematic diagram from a first-view perspective of the impedance matching device in some embodiments of this application. For example... Figure 1As shown, this application provides an impedance matching device 10, which includes a housing 100, an isolation plate 200, an impedance matching component 300, a control component 400, and a fan assembly 500. The housing 100 has a receiving cavity 110. The isolation plate 200 is disposed in the receiving cavity 110, and the isolation plate 200 is used to isolate the receiving cavity 110 into a first sub-cavity 111 and a second sub-cavity 112. The impedance matching component 300 is disposed in the first sub-cavity 111. The control component 400 is used to adjust the matching impedance value of the impedance matching component 300, and the fan assembly 500 is used to dissipate heat from the control component 400. Both the control component 400 and the fan assembly 500 are disposed in the second sub-cavity 112, and the control component 400 and the impedance matching component 300 are connected through the isolation plate 200.

[0026] Therefore, the impedance matching device 10 described above in this application, by providing an isolation plate 200 inside the housing 100 of the impedance matching device 10 having a receiving cavity 110, and configuring the isolation plate 200 to isolate the receiving cavity 110 into a first sub-cavity 111 and a second sub-cavity 112, and then the impedance matching component 300 and the control component 400 are respectively disposed in the first sub-cavity 111 and the second sub-cavity 112, can effectively achieve electromagnetic shielding between the impedance matching component 300 and the control component 400 inside the impedance matching device 10, and avoid electromagnetic interference.

[0027] Furthermore, by rationally placing the fan assembly 500 inside the housing 100 of the impedance matching device 10, the space utilization rate is improved and the volume of the impedance matching device 10 is reduced.

[0028] Please refer to the following: Figure 2 , Figure 2 This is a schematic diagram from a second perspective of the impedance matching device in some embodiments of this application. For example... Figure 1 , Figure 2 As shown, the control component 400 includes a power module 410, a control board 420, and a motor module 430. The power module 410 is connected to both the control board 420 and the fan assembly 500, and provides power to both. The control board 420 is also connected to the motor module 430, and controls its rotation. The motor module 430 is connected to the impedance matching component 300 via an isolation plate 200, and adjusts the impedance matching value of the impedance matching component 300 in response to the control of the control board 420.

[0029] Therefore, the impedance matching device 10 described above in this application, by configuring the control component 400 including the power module 410, the control board 420 and the motor module 430, can realize the power supply to the control board 420 and the fan assembly 500, and realize the adjustment of the matching impedance value of the impedance matching component 300.

[0030] like Figure 1 , Figure 2 As shown, the housing 100 includes a front plate 120 and a rear plate 130 facing each other. The front plate 120, the rear plate 130, and the isolation plate 200 are arranged in parallel, with the isolation plate 200 located between the front plate 120 and the rear plate 130. A control board 420 is mounted on the front plate 120, and a power module 410, a motor module 430, and a fan assembly 500 are all mounted on the side of the isolation plate 200 facing the front plate 120.

[0031] Therefore, the impedance matching device 10 described above in this application, by configuring the front plate 120, rear plate 130 and isolation plate 200 of the housing 100 to be arranged in parallel, enables the front plate 120 and one side of the isolation plate 200 to form a second sub-cavity 112, and the rear plate 130 and the other side of the isolation plate 200 to form a first sub-cavity 111.

[0032] Furthermore, to improve space utilization and heat dissipation for the control board 420, the control board 420 is mounted on the front panel 120, while the power module 410 and fan assembly 500 are mounted on the side of the isolation plate 200 facing the front panel 120. The motor module 430 is also mounted on the side of the isolation plate 200 facing the front panel 120, which facilitates the adjustment of the impedance matching assembly 300 on the side of the isolation plate 200 away from the front panel 120.

[0033] In some embodiments, the control board 420 may include a general-purpose processor such as a central processing unit (CPU), or a digital signal processor (DSP), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or other programmable logic devices, discrete gate logic devices, transistor logic devices, or microprocessors such as micro control units (MCUs).

[0034] like Figure 1 , Figure 2As shown, the impedance matching component 300 includes a first capacitor 310, a second capacitor 320, and a third capacitor 330. The first capacitor 310 and the second capacitor 320 are both mounted on the side of the isolation plate 200 facing the rear plate 130. The third capacitor 330 is connected to the second capacitor 320. At least one of the first capacitor 310, the second capacitor 320, and the third capacitor 330 is an adjustable capacitor. The motor module 430 is connected to the at least one adjustable capacitor via the isolation plate 200 to adjust the capacitance value of the at least one adjustable capacitor, thereby adjusting the matching impedance value of the impedance matching component 300.

[0035] Therefore, the impedance matching device 10 described above in this application, by configuring the impedance matching component 300 including the first capacitor 310, the second capacitor 320 and the third capacitor 330, allows for flexible use of the capacitor topology inside the impedance matching device 10, resulting in good versatility.

[0036] In some embodiments, the second capacitor 320 is also connected to the first capacitor 310.

[0037] like Figure 1 , Figure 2 As shown, both the first capacitor 310 and the second capacitor 320 are adjustable capacitors. The motor module 430 includes a first motor 431 and a second motor 432. The first capacitor 310 and the first motor 431 are coaxially mounted on both sides of the isolation plate 200, and the second capacitor 320 and the second motor 432 are coaxially mounted on both sides of the isolation plate 200. The first motor 431 is used to adjust the capacitance value of the first capacitor 310, and the second motor 432 is used to adjust the capacitance value of the second capacitor 320.

[0038] Therefore, the impedance matching device 10 described above in this application, by configuring the first capacitor 310 and the second capacitor 320 to be adjustable capacitors, and the motor module 430 correspondingly including the first motor 431 and the second motor 432, can adjust the capacitance values ​​of the first capacitor 310 and the second capacitor 320 accordingly, thereby adjusting the matching impedance value of the impedance matching component 300.

[0039] like Figure 1 , Figure 2 As shown, the impedance matching assembly 300 further includes a first inductor 340 and a second inductor 350. The first inductor 340 is at least connected to the first capacitor 310, and the second inductor 350 is mounted on the side of the isolation plate 200 facing the rear plate 130 and is positioned corresponding to the fan assembly 500. The isolation plate 200 is provided with a first ventilation hole 210, which corresponds to the fan assembly 500 to form an airflow path between the fan assembly 500 and the second inductor 350. The fan assembly 500 is also used to dissipate heat from the second inductor 350 through the airflow path.

[0040] Therefore, the impedance matching device 10 described above in this application further increases the compatibility of the impedance matching component 300 by including a first inductor 340 and a second inductor 350 in the impedance matching component 300.

[0041] Furthermore, the first inductor 340 can be a grounding inductor, mainly used to suppress electromagnetic interference, thereby improving the stability and reliability of the impedance matching circuit 10. The second inductor 350 can be an output inductor, mainly used to at least adjust the impedance matching with the load. The second inductor 350 generates a large amount of heat. By configuring the isolation plate 200, a first ventilation hole 210 is provided. The first ventilation hole 210 corresponds to the fan assembly 500 to form an air flow path between the fan assembly 500 and the second inductor 350, so that the fan assembly 500 can dissipate heat from the second inductor 350 through the air flow path.

[0042] In some embodiments, the first capacitor 310, the second capacitor 320, and the third capacitor 330 are electrically connected.

[0043] In some embodiments, the first inductor 340 is also electrically connected to at least the first capacitor 310, and the second capacitor 320 and the third capacitor 330 are electrically connected through the second inductor 350.

[0044] Furthermore, the electrical connection between the first capacitor 310, the second capacitor 320, the third capacitor 330, the first inductor 340, and the second inductor 350 can be in series, in parallel, or grounded. The first capacitor 310, the second capacitor 320, the third capacitor 330, the first inductor 340, and the second inductor 350 can be electrically connected to form one or more impedance matching topologies of π-type, L-type, and T-type. This application is not limited to this, as long as the corresponding impedance matching value can be provided.

[0045] like Figure 1 , Figure 2 As shown, the housing 100 also includes a top plate 140 and a bottom plate 150 opposite each other, a first inductor 340 connected to the top plate 140, and a first capacitor 310, a second capacitor 320 and a third capacitor 330 disposed on the side of the bottom plate 150 facing the top plate 140.

[0046] Therefore, the impedance matching device 10 described above in this application, by configuring the housing 100 to also include a top plate 140 and a bottom plate 150, enables the first inductor 340 to be grounded, dissipating electromagnetic interference, and the first capacitor 310, the second capacitor 320 and the third capacitor 330 to be disposed on the side of the bottom plate 150 facing the top plate 140, thereby improving the structural stability of the impedance matching device 10.

[0047] like Figure 1 , Figure 2As shown, the housing 100 also includes two opposing side plates 160, each side plate 160 being provided with a second ventilation hole 161, and one of the side plates 160 also being provided with a power interface 162 for connecting to electrical energy. A power module 410 is connected to the power interface 162, and the power module 410 is used to convert the electrical energy connected to the power interface 162 and supply power to the control board 420 and the fan assembly 500.

[0048] Therefore, the impedance matching device 10 described above in this application, by configuring the housing 100, also includes two opposing side plates 160, and each side plate 160 is provided with a second ventilation hole 161, which increases the heat dissipation efficiency of the fan assembly 500. Furthermore, one of the side plates 160 is also provided with a power interface 162, which can provide electrical energy to the power module 410, and the power module 410 converts the electrical energy connected to the power interface 162 to power the control board 420 and the fan assembly 500.

[0049] In some embodiments, the power module 410 can be used to convert the voltage of the electrical energy connected to the power interface 162 to provide power to the control board 420 and the fan assembly 500.

[0050] In some embodiments, the power module 410 may be disposed at the position of the corresponding power module 410 on one of the side plates 160 to reduce the complexity of wiring.

[0051] In some embodiments, the first ventilation hole 210 and / or the second ventilation hole 161 may be ventilation honeycomb holes.

[0052] In some embodiments, the front plate 120, rear plate 130, two side plates 160, top plate 140 and bottom plate 150 form a rectangular shell 100, thereby accommodating the cavity 110, which is also rectangular, and the first sub-cavity 111 and the second sub-cavity 112 are also rectangular.

[0053] In some embodiments, the material of the isolation plate 200 is aluminum.

[0054] Therefore, the impedance matching device 10 described above in this application can further improve the electromagnetic shielding capability of the isolation plate 200 by setting the material of the isolation plate 200 to aluminum.

[0055] It should be noted that, as Figure 1 , Figure 2 The brackets shown are merely illustrative; for example, as... Figure 1 The housing 100 shown includes a rear plate 130 and a top plate 140, but in reality, the housing 100 also includes a front plate 120, two side plates 160, and a bottom plate 150, etc.

[0056] The impedance matching device 10 of this application, through the above-described structure, forms a first sub-cavity 111 and a second sub-cavity 112 that are electromagnetically shielded from each other inside the housing 100 of the impedance matching device 10, which has a housing cavity 110. Each sub-cavity is independent of the others. The impedance matching component 300 and the control component 400 are respectively disposed in the first sub-cavity 111 and the second sub-cavity 112. This can effectively achieve electromagnetic shielding between the impedance matching component 300 and the control component 400 inside the impedance matching device 10, avoiding electromagnetic interference. Furthermore, the fan component 500 is built into the housing 100 of the impedance matching device 10, saving the space occupied by the impedance matching device 10. The installation process is simple, efficient, and modular.

[0057] Please see Figure 3 , Figure 3 This is a schematic diagram of an electronic device in some embodiments of this application. For example... Figure 3 As shown, this application also provides an electronic device 1000, which includes the impedance matching device 10 in any of the foregoing embodiments.

[0058] Please refer to it again. Figure 1 .like Figure 1 As shown, the impedance matching device 10 includes a housing 100, an isolation plate 200, an impedance matching component 300, a control component 400, and a fan assembly 500. The housing 100 has a receiving cavity 110. The isolation plate 200 is disposed within the receiving cavity 110, dividing the receiving cavity 110 into a first sub-cavity 111 and a second sub-cavity 112. The impedance matching component 300 is disposed within the first sub-cavity 111. The control component 400, used to adjust the matched impedance value of the impedance matching component 300, and the fan assembly 500, used for at least cooling the control component 400, are both disposed within the second sub-cavity 112. The control component 400 and the impedance matching component 300 are connected via the isolation plate 200.

[0059] For a more specific description of the impedance matching device 10, please refer to the relevant content of the impedance matching device 10 in any of the foregoing embodiments, which will not be repeated here.

[0060] The impedance matching device 10 and electronic device 1000 of this application, through the above-described structure, form a first sub-cavity 111 and a second sub-cavity 112 that are electromagnetically shielded from each other inside the housing 100 of the impedance matching device 10, which has a housing cavity 110. Each sub-cavity is independent of the others. The impedance matching component 300 and the control component 400 are respectively disposed in the first sub-cavity 111 and the second sub-cavity 112. This can effectively achieve electromagnetic shielding between the impedance matching component 300 and the control component 400 inside the impedance matching device 10, avoiding electromagnetic interference. Furthermore, the fan component 500 is built into the housing 100 of the impedance matching device 10, saving the space occupied by the impedance matching device 10. The installation process is simple, efficient, and modular.

[0061] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Where there is no conflict, the embodiments and features in the embodiments of this application can be combined with each other. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An impedance matching device, characterized in that, include: The shell has a receiving cavity; An isolation plate is disposed in the receiving cavity, the isolation plate being used to divide the receiving cavity into a first sub-cavity and a second sub-cavity; An impedance matching component is disposed in the first sub-cavity; A control component for adjusting the matching impedance value of the impedance matching component and a fan component for cooling the control component are both disposed in the second sub-cavity, and the control component and the impedance matching component are connected through the isolation plate.

2. The impedance matching device according to claim 1, characterized in that, The control components include a power module, a control board, and a motor module; The power module is connected to both the control board and the fan assembly, and the power module is used to supply power to the control board and the fan assembly. The control board is connected to the motor module and is used to control the rotation of the motor module; The motor module is connected to the impedance matching component through the isolation plate, and the motor module is used to adjust the matching impedance value of the impedance matching component in response to the control of the control board.

3. The impedance matching device according to claim 2, characterized in that, The housing includes a front plate and a rear plate opposite to each other, the front plate, the rear plate and the partition plate are arranged in parallel, and the partition plate is located between the front plate and the rear plate; The control board is mounted on the front panel, and the power module, the motor module, and the fan assembly are all mounted on the side of the isolation plate facing the front panel.

4. The impedance matching device according to claim 3, characterized in that, The impedance matching component includes a first capacitor, a second capacitor, and a third capacitor. The first capacitor and the second capacitor are both mounted on the side of the isolation plate facing the rear plate, and the third capacitor is connected to the second capacitor. In this configuration, at least one of the first capacitor, the second capacitor, and the third capacitor is an adjustable capacitor. The motor module is connected to the at least one adjustable capacitor via the isolation plate to adjust the capacitance value of the at least one adjustable capacitor, thereby adjusting the matching impedance value of the impedance matching component.

5. The impedance matching device according to claim 4, characterized in that, Both the first capacitor and the second capacitor are adjustable capacitors, and the motor module includes a first motor and a second motor; The first capacitor and the first motor are coaxially mounted on both sides of the isolation plate, and the second capacitor and the second motor are coaxially mounted on both sides of the isolation plate. The first motor is used to adjust the capacitance value of the first capacitor, and the second motor is used to adjust the capacitance value of the second capacitor.

6. The impedance matching device according to claim 4, characterized in that, The impedance matching component further includes a first inductor and a second inductor. The first inductor is at least connected to the first capacitor, and the second inductor is mounted on the side of the isolation plate facing the rear plate and is configured corresponding to the fan assembly. The isolation plate is provided with a first ventilation hole, which corresponds to the fan assembly to form a gas flow path between the fan assembly and the second inductor. The fan assembly is also used to dissipate heat from the second inductor through the gas flow path.

7. The impedance matching device according to claim 6, characterized in that, The housing also includes a top plate and a bottom plate opposite each other, the first inductor is connected to the top plate, and the first capacitor, the second capacitor and the third capacitor are disposed on the side of the bottom plate facing the top plate.

8. The impedance matching device according to claim 3, characterized in that, The housing also includes two opposing side plates, each side plate having a second ventilation hole, and one of the side plates also having a power interface for connecting to electrical energy. The power module is connected to the power interface, and the power module is used to convert the electrical energy connected to the power interface and to supply power to the control board and the fan assembly.

9. The impedance matching device according to claim 1, characterized in that, The material of the isolation plate is aluminum.

10. An electronic device, characterized in that, Including the impedance matching device as described in any one of claims 1-9.

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