T / R assembly liquid cooling device suitable for high heat flux and high overload environment, T / R assembly and radar

Abstract

The utility model discloses a T / R assembly liquid cooling device suitable for a high-heat-flux and high-overload environment, a T / R assembly and a radar. The T / R assembly liquid cooling device comprises a mounting plate and a liquid cooling cavity formed in the mounting plate; the liquid cooling cavity is internally provided with a plurality of branches, and a main liquid inlet path and a main liquid return path which are isolated from each other; fins are fixedly arranged in the multiple branches, the main liquid inlet path and the main liquid return path; the branches are arranged in parallel and are not communicated with each other, the first ends of the branches are communicated with the main liquid inlet path, the second ends of the branches are communicated with the main liquid return path, and the plurality of branches and the fins increase the heat dissipation area, so that the heat dissipation capability of the liquid cooling device is enhanced, the strength of the liquid cooling device is improved, and the liquid cooling device is ensured to meet the requirement of high overload impact resistance; the plurality of branches are not communicated with each other, and the temperature and the flow of the cooling liquid are the same, so that the liquid cooling device has good temperature uniformity.

Description

Technical Field

[0001] This application relates to the field of liquid cooling devices for T / R modules suitable for high heat flux density and high overload environments, and more particularly to a liquid cooling device for T / R modules, a T / R module, and a radar suitable for high heat flux density and high overload environments. Background Technology

[0002] With the rapid development of radar technology, high power, high integration, and miniaturization have become key development directions for radar transceiver (T / R) modules. Research shows that the reliability of electronic devices is closely related to temperature; when the temperature is between 70℃ and 80℃, the reliability of electronic devices decreases by 50% for every 10℃ increase in temperature. Therefore, with the development of high-power modules, heat dissipation has gradually become a key technology to be addressed in high-power T / R modules. A certain radar T / R module has high heat flux density, high front-end power consumption, and severe heat accumulation. To meet the requirements of heat dissipation and temperature uniformity, a liquid cooling system is used to cool the radar front end. In addition, considering the usage requirements, this radar also needs to be designed for airdrop adaptability, as the liquid cooling device must withstand impacts of tens of times the force of gravity during airdrop. In conclusion, there is an urgent need to develop a liquid cooling device suitable for high heat flux density and high overload environments to meet the usage requirements of this radar.

[0003] Currently, most published patents focus on improving the heat dissipation capacity of liquid cooling plates. Some patents enhance heat dissipation by optimizing fins and heat-conducting pillars; others disclose liquid cooling plates used to cool N battery cells arranged in one direction; still others disclose a liquid cooling plate with an alternating hot and cold pipe structure, in which heat pipes are embedded to enhance heat dissipation. In summary, currently published patents improve the heat dissipation capacity of liquid cooling plates through methods such as optimizing fins, adding heat-conducting pillars, and embedding heat pipes, but there is little research on the temperature uniformity and overload resistance of liquid cooling plates. Utility Model Content

[0004] The main objective of this application is to provide a liquid cooling device for T / R components, a T / R component, and a radar suitable for high heat flux density and high overload environments, aiming to solve the technical problems of liquid cooling devices for T / R components suitable for high heat flux density and high overload environments.

[0005] To achieve the above objectives, the first aspect of this application provides a liquid cooling device for T / R modules suitable for high heat flux density and high overload environments, comprising: a mounting plate and a liquid cooling cavity disposed on the mounting plate; the liquid cooling cavity has multiple branches, as well as a main liquid inlet and a main liquid return path that are isolated from each other; fins are fixedly provided in each of the multiple branches, the main liquid inlet path and the main liquid return path; each branch is arranged in parallel and is not interconnected with each other, and each branch's first end is connected to the main liquid inlet path, and each branch's second end is connected to the main liquid return path.

[0006] Optionally, the mounting plate is rectangular, and the main liquid inlet and main liquid return paths are respectively located on the inner sides of two adjacent sides of the mounting plate.

[0007] Optionally, the main liquid inlet and the main liquid return path are respectively provided with a liquid inlet and a liquid return outlet, and the liquid inlet and the liquid return outlet are both located on the same side of the mounting plate.

[0008] Optionally, each of the branches is located between the main inlet and the main return path.

[0009] Optionally, the branches are isolated from each other by reinforcing ribs.

[0010] Optionally, the difference in the number of fins in each of the branches shall not exceed 5.

[0011] Optionally, each of the branches includes a first branch, a second branch, a third branch, a fourth branch, and a fifth branch arranged in parallel with the main inlet channel.

[0012] In addition, to achieve the above objectives, a second aspect of this application also provides a T / R assembly, comprising: a liquid cooling device for a T / R assembly suitable for high heat flux density and high overload environments as provided in the first aspect; and the T / R assembly module disposed on the side of the liquid cooling cavity away from the mounting plate.

[0013] In addition, to achieve the above objectives, this application also provides a radar, including the T / R component provided in the second aspect.

[0014] This application proposes a liquid cooling device for T / R components, a T / R component, and a radar suitable for high heat flux density and high overload environments. The device utilizes a mounting plate and a liquid cooling cavity mounted on the mounting plate. The liquid cooling cavity contains multiple branches, as well as isolated main inlet and main return liquid paths. Fins are fixedly installed in each of the multiple branches, the main inlet, and the main return liquid path. Each branch is arranged in parallel and is not interconnected, with its first end connected to the main inlet and its second end connected to the main return liquid path. The multiple branches and fins increase the heat dissipation area, thereby enhancing the heat dissipation capacity of the liquid cooling device, and also increase the strength of the liquid cooling device, ensuring it meets the requirements for resisting high overload impacts. The multiple branches are not interconnected, and the coolant temperature and flow rate are the same, resulting in excellent temperature uniformity of the liquid cooling device, meeting the usage requirements of a certain radar. Attached Figure Description

[0015] Figure 1 A cross-sectional view provided for an embodiment of a liquid cooling device for T / R modules applicable to high heat flux density and high overload environments according to this application;

[0016] Figure 2This is a schematic diagram of the internal structure of the liquid cooling cavity provided in an embodiment of the liquid cooling device for T / R components applicable to high heat flux density and high overload environments according to this application;

[0017] Figure 3 This is a schematic diagram of a T / R component embodiment provided in this application.

[0018] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0019] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0020] The technical problem to be solved by this invention is to address the challenges of high heat flux density and high overload environment in radar applications by conducting design and performance research on liquid cooling devices for high overload T / R components. While ensuring lightweight and high strength, this invention effectively solves the problems of poor temperature distribution and low heat dissipation efficiency of liquid cooling plates in T / R components.

[0021] Reference Figure 1 The first embodiment of this application provides a liquid cooling device for T / R modules suitable for high heat flux density and high overload environments. The liquid cooling device for T / R modules suitable for high heat flux density and high overload environments may include: a mounting plate 1 and a liquid cooling cavity 13 disposed on the mounting plate 1; the liquid cooling cavity 13 has multiple branches inside, as well as a main liquid inlet 5 and a main liquid return 6 that are isolated from each other; fins 12 are fixedly provided in the multiple branches, the main liquid inlet 5 and the main liquid return 6; each branch is arranged in parallel and is not connected to each other, and each branch's first end is connected to the main liquid inlet 5, and each branch's second end is connected to the main liquid return 6.

[0022] Specifically, the coolant flows from the main inlet channel 5 to each branch channel. Within each branch channel, the coolant makes full contact with several fins 12 to remove heat from the T / R assembly, and then collects in the main return channel 6 before leaving the liquid cooling plate. This continuous circulation removes heat, ensuring the T / R assembly operates within a safe temperature range. The parallel connection of multiple non-interconnected branches ensures that the coolant will not short-circuit. The fins 12 increase the contact area between the liquid cooling device and the coolant, enhancing the heat dissipation capacity of the liquid cooling device, and also increase the strength of the liquid cooling device, ensuring it meets the requirements for resisting high overload impacts. In summary, this application, through optimized flow channel layout and the parallel connection of multiple flow channels, ensures that the liquid cooling device meets the requirements for resisting high overload impacts while also possessing good temperature uniformity and heat dissipation capabilities, thus meeting the requirements for radar operation.

[0023] Continue to refer to Figure 1In the embodiments of this application, the mounting plate 1 is rectangular, and the main inlet channel 5 and the main return channel 6 are respectively disposed on the inner sides of two adjacent sides of the mounting plate 1. This increases the meandering of the flow channels of each branch, thereby increasing the travel distance of the coolant and carrying away more heat.

[0024] Continue to refer to Figure 1 In the embodiments of this application, the main liquid inlet 5 and the main liquid return 6 are respectively provided with a liquid inlet 3 and a liquid return 4, and both the liquid inlet 3 and the liquid return 4 are located on the same side of the mounting plate 1. The fact that the liquid inlet 3 and the liquid return 4 are located on the same side of the mounting plate 1 can reduce the difficulty of the layout of the liquid cooling device and realize the matrix arrangement of multiple liquid cooling devices.

[0025] refer to Figure 1 and Figure 2 In the embodiments of this application, each branch is located between the main liquid inlet path 5 and the main liquid return path 6. This also reduces the difficulty of liquid cooling device layout and improves the overall integrity of the liquid cooling device.

[0026] refer to Figure 1 and Figure 2 In the embodiments of this application, the branches are isolated from each other by reinforcing ribs 14. By locally adding reinforcing ribs 14, the liquid cooling device can be guaranteed to withstand high overload impacts, and the branches can be isolated from each other to ensure that the entire liquid cooling device has good temperature uniformity.

[0027] Continue to refer to Figure 1 In the embodiments of this application, the difference in the number of fins 12 in each branch does not exceed 5. This further ensures that the entire liquid cooling device has good temperature uniformity.

[0028] Continue to refer to Figure 2 In the embodiments of this application, each branch includes a first branch 7, a second branch 8, a third branch 9, a fourth branch 10, and a fifth branch 11 arranged parallel to the main liquid inlet 5. The five branches are arranged in parallel and are not interconnected. The coolant inlet temperature and flow rate of the five branches are the same, which can further ensure that the entire liquid cooling device has good temperature uniformity.

[0029] refer to Figure 3 Based on the above embodiments, this application also provides a T / R assembly, including: a liquid cooling device for T / R assemblies suitable for high heat flux density and high overload environments as provided in any of the foregoing embodiments; and a T / R assembly module 2 disposed on the side of the liquid cooling cavity 13 away from the mounting plate 1. In this embodiment, the liquid cooling device can cool 9 sets of T / R assembly modules 2.

[0030] Based on the above embodiments, this application also provides a radar, including the T / R component provided in the foregoing embodiments.

[0031] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A liquid cooling device for T / R modules suitable for high heat flux density and high overload environments, characterized in that, include: Mounting plate (1) and liquid cooling cavity (13) disposed on the mounting plate (1); The liquid cooling cavity (13) has multiple branches inside, as well as a main liquid inlet path (5) and a main liquid return path (6) that are isolated from each other; Fins (12) are fixedly provided in each of the multiple branch lines, main inlet line (5) and main return line (6); Each of the branches is arranged in parallel and is not connected to each other, and each of the branches has its first end connected to the main liquid inlet (5) and its second end connected to the main liquid return (6).

2. The liquid cooling device for T / R modules suitable for high heat flux density and high overload environments as described in claim 1, characterized in that, The mounting plate (1) is rectangular, and the main liquid inlet (5) and the main liquid return (6) are respectively located on the inner sides of two adjacent sides of the mounting plate (1).

3. The liquid cooling device for T / R modules suitable for high heat flux density and high overload environments as described in claim 1, characterized in that, The main liquid inlet (5) and the main liquid return (6) are respectively provided with a liquid inlet (3) and a liquid return (4), and the liquid inlet (3) and the liquid return (4) are both located on the same side of the mounting plate (1).

4. The liquid cooling device for T / R modules suitable for high heat flux density and high overload environments as described in claim 1, characterized in that, Each of the aforementioned branches is located between the main inlet path (5) and the main return path (6).

5. The liquid cooling device for T / R modules suitable for high heat flux density and high overload environments as described in claim 1, characterized in that, Each of the branches is isolated from the others by reinforcing ribs (14).

6. The liquid cooling device for T / R modules suitable for high heat flux density and high overload environments as described in claim 1, characterized in that, The difference in the number of fins (12) in each branch shall not exceed 5.

7. The liquid cooling device for T / R modules suitable for high heat flux density and high overload environments as described in claim 1, characterized in that, Each of the branch paths includes a first branch path (7), a second branch path (8), a third branch path (9), a fourth branch path (10), and a fifth branch path (11) arranged in parallel with the main liquid inlet path (5).

8. A T / R component, characterized in that, include: Liquid cooling device for T / R components suitable for high heat flux density and high overload environments as described in any one of claims 1-7; And the T / R assembly module (2) disposed on the side of the liquid cooling cavity (13) away from the mounting plate (1).

9. A radar, characterized in that, Includes the T / R component as described in claim 8.

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