Air-cooled inverter

Abstract

The utility model relates to the technical field of inverters, in particular to an air-cooled inverter. The air-cooled inverter comprises a shell, cooling fins, a power module, a filter, a power panel, a capacitor assembly and a driving control panel. The two sides of the power panel are connected with the filter and the power module respectively, and plastic insulating seats are arranged at the connecting positions of the two sides of the power panel and the filter and the connecting positions of the two sides of the power panel and the power module respectively so as to support the connecting positions of the power panel and the filter and the connecting positions of the power panel and the power module and prevent the connecting positions from being suspended. And the phenomenon that the joint is loosened during vibration is prevented. The plurality of heat dissipation fins are vertically arranged at intervals on the end face, far away from the power module, of the shell, the heat dissipation fins are arranged corresponding to the power module in position, an air cooling structure is simpler, air cooling does not need liquid circulation, short circuit or equipment damage caused by leakage is avoided, and the service life of the power module is prolonged. A sealing device, a water channel and other assemblies do not need to be arranged, and cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of inverter technology, and in particular to an air-cooled inverter. Background Technology

[0002] With the rapid development of power electronics technology, high-power-density, high-efficiency semiconductor power modules are increasingly widely used in new energy power generation, electric vehicles, and industrial frequency converters. However, power modules generate a large amount of heat during operation. Insufficient heat dissipation will lead to increased junction temperature, performance degradation, and even permanent damage. Therefore, heat dissipation technology is a core element in ensuring the reliability and extending the service life of power modules. Currently, the main heat dissipation method for power modules is liquid cooling, which achieves efficient heat dissipation through liquid circulation. However, this system is complex, costly, and suffers from problems such as coolant leakage, pipeline corrosion, and maintenance difficulties. In addition, the electrical connections between components inside the inverter typically use a rigid fixed structure, such as direct welding or bolt connections. The electrical connection ends between different components are fixed by welding or bolts to achieve electrical conduction and mechanical fixation. However, sometimes vibration or impact of the inverter can cause displacement, affecting the connection. Utility Model Content

[0003] In view of this, the present invention provides an air-cooled inverter to solve the above-mentioned technical problems.

[0004] An air-cooled inverter includes a housing, multiple heat dissipation fins disposed on the housing, a power module disposed on the housing, a filter disposed on the housing, a power board disposed on the housing, a capacitor assembly disposed on the power board, and a drive control board disposed on the housing. The housing has a mounting surface for mounting the power module. The multiple heat dissipation fins are vertically arranged and spaced apart from each other on the end face of the housing away from the power module, with the heat dissipation fins corresponding to the positions of the power module. The power module is mounted on a heat dissipation substrate, which is fixed to the mounting surface. Thermally conductive silicone is disposed between the heat dissipation substrate and the mounting surface. The power board has the filter and the power module connected to its two sides, respectively. Plastic insulating seats are provided at the connection points between the power board and the filter and the power module on both sides of the power board. The plastic insulating seats are disposed on the housing and located between the power board and the housing to support the connection points between the power board and the filter and the power module.

[0005] Furthermore, the housing is provided with a plurality of mounting posts, which are used to mount the power board and the drive control board.

[0006] Furthermore, the capacitor assembly includes a plurality of thin-film capacitors disposed on the power board, a plurality of X capacitors disposed on the power board, and a plurality of Y capacitors disposed on the power board. The plurality of thin-film capacitors are spaced apart from each other, and the thin-film capacitors, the X capacitors, and the Y capacitors are disposed on the end face of the power board away from the housing.

[0007] Furthermore, the power module has multiple input terminals, output terminals, a chip, a heat sink, and signal pins, which are inserted into the drive control board.

[0008] Furthermore, the drive control board integrates drive circuitry and control circuitry.

[0009] Furthermore, the drive control board is provided with multiple maintenance holes, the positions of which are coaxially arranged with and correspond to the connection points of the power module and the housing and the connection points of the power module and the power board.

[0010] Compared with existing technologies, the air-cooled inverter provided by this utility model has multiple heat dissipation fins arranged vertically and spaced apart from each other on the end face of the housing away from the power module, transferring heat from the power module to the fins. When air flows between adjacent heat dissipation fins, it undergoes convective heat exchange with the fins, achieving a heat dissipation effect. Air cooling is simpler than water cooling, eliminating the need for liquid circulation, avoiding short circuits or equipment damage due to leakage, and eliminating the need for sealing devices and water channels, thus reducing costs. Plastic insulating seats are provided on both sides of the power board at the connection points with the filter and the power module, respectively. These plastic insulating seats are located on the housing and between the power board and the housing. The plastic insulating seats support the connections between the power board and the filter and power module, preventing the connections from being suspended and preventing loosening during vibration. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of an air-cooled inverter provided by this utility model.

[0012] Figure 2 This is a structural schematic diagram of an air-cooled inverter provided by this utility model from another angle.

[0013] Figure 3 for Figure 1 A schematic diagram of the exploded structure of an air-cooled inverter.

[0014] Figure 4 for Figure 1 Another exploded view of the air-cooled inverter. Detailed Implementation

[0015] The specific embodiments of this utility model are described in further detail below. It should be understood that the description of the embodiments of this utility model herein is not intended to limit the scope of protection of this utility model.

[0016] like Figures 1 to 4 The diagram shown is a structural schematic of the air-cooled inverter provided by this utility model. The air-cooled inverter includes a housing 10, multiple heat dissipation fins 20 disposed on the housing 10, a power module 30 disposed on the housing 10, a filter 40 disposed on the housing 10, a power board 50 disposed on the housing 10, a capacitor assembly 60 disposed on the power board 50, and a drive control board 70 disposed on the housing 10. It is conceivable that the air-cooled inverter also includes other functional modules, such as connection components and mounting components, etc., which are technologies well known to those skilled in the art and will not be described in detail here.

[0017] The housing 10 is used to house the aforementioned functional modules. The housing 10 is provided with multiple mounting posts 11 for mounting the power board 50 and the drive control board 70. The housing 10 is also provided with a mounting surface 12 for mounting the power module 30.

[0018] The housing 10 is used to support the above-mentioned functional modules. Therefore, the housing 10 is also provided with a variety of functional structures, such as screws, bolts, mounting slots, etc., to complete the installation and assembly of the above-mentioned functional modules. These can be set according to actual needs, and will not be described in detail here.

[0019] Multiple heat dissipation fins 20 are vertically arranged and spaced apart from each other on the end face of the housing 10 away from the power module 30. The heat dissipation fins 20 are positioned corresponding to the power module 30, thereby bringing them close to the heat source and conducting heat to the fins 20. When air is blown by an external blower, it flows between adjacent heat dissipation fins 20, and convective heat exchange occurs between them, achieving the effect of heat dissipation.

[0020] The power module 30 is mounted on a heat dissipation substrate 31. The heat dissipation substrate 31 is fixed to the mounting surface 12 inside the housing 10 by fasteners. Thermally conductive silicone is provided between the heat dissipation substrate 31 and the mounting surface 12, so that the heat generated by the power module 30 during operation can be quickly conducted to the fins 20 through the heat dissipation substrate 31 and the thermally conductive silicone.

[0021] The power module 30 is mounted on the heat dissipation substrate 31 by fasteners. The power module 30 has multiple input terminals, output terminals, chips, heat sinks, and signal pins to realize the basic functions of the power module. The power module 30 is an electronic component integrating multiple functions, mainly used to process and control electrical power and undertake high voltage and high current conversion tasks. It should be existing technology and will not be described in detail here.

[0022] The filter 40 is connected to an external input power supply. The filter 40 is used to filter out high-frequency noise and ripple in the input power supply to ensure a stable input voltage.

[0023] The power board 50 is mounted on the mounting post 11 by fasteners. The power board 50 is connected to the input terminals of the filter 40 and the power module 30 on both sides via fasteners, thereby converting the input high-voltage DC to low-voltage DC for power supply to the power module 30. Since the connection between the power board 50 and the filter 40 and power module 30 is electrical, plastic insulating seats 13 are provided at the connection points of the power board 50 with the filter 40 and power module 30 on both sides to ensure insulation and connection strength. The plastic insulating seats 13 are located on the housing 10 and between the power board 50 and the housing 10. Fasteners for connecting the power board 50 to the filter 40 and power module 30 can be inserted into the plastic insulating seats 13, thereby supporting the connection points, preventing them from being suspended, and providing insulation to prevent the housing 10 from becoming electrified.

[0024] The capacitor assembly 60 includes multiple thin-film capacitors 61, multiple X capacitors 62, and multiple Y capacitors 63 disposed on the power board 50. The thin-film capacitors 61 work in conjunction with the filter 40 to smooth the DC voltage, filter out high-frequency ripple and noise, and ensure stable input voltage for power devices. The multiple thin-film capacitors 61 are spaced apart, providing space for natural convection and improving heat dissipation. The X capacitors 62 are connected to the positive and negative terminals of the power supply and are used to eliminate differential-mode interference. The Y capacitors are connected between the positive or negative terminal of the power supply and ground to eliminate common-mode interference. The X and Y capacitors, by suppressing differential-mode and common-mode interference, protect other components in the circuit from interference, thereby improving circuit stability and reliability. The thin-film capacitors 61, X capacitors 62, and Y capacitors 63 are disposed on the end face of the power board 50 away from the housing 10, thus concentrating all capacitors on one side and reducing the number of double-sided processing steps on the power board 50.

[0025] The drive control board 70 is fastened to the mounting post 11. The signal pins of the power module 30 are inserted into the drive control board 70 to connect the signal section of the power module. The drive control board 70 integrates the drive circuit and the control circuit, serving as the control center of the entire inverter brick, responsible for receiving, processing, and sending control signals. The integration of both drive and control circuits eliminates the need for multiple circuit boards, allowing drive and control signals to be transmitted on the same board. This reduces parasitic inductance and electromagnetic interference introduced by long-distance traces, improving signal integrity. Furthermore, the integration eliminates the need for connectors between the drive board and the control board, simplifying the overall design and saving space.

[0026] The drive control board 70 is provided with a plurality of maintenance holes 71. The positions of the maintenance holes 71 are coaxially arranged and correspond to the connection points of the power module 30 and the housing 10 and the power module 30 and the power board 50, so that when performing maintenance or checking whether the fasteners of the connectors are loose due to long-term use, the fasteners can be tightened directly through the maintenance holes 71 without removing the drive control board 70.

[0027] Compared with the prior art, the air-cooled inverter provided by this utility model has multiple heat dissipation fins 20 arranged vertically and spaced apart from each other on the end face of the housing 10 away from the power module 30, which conducts the heat of the power module to the fins 20. When air flows between adjacent heat dissipation fins 20, it convects and exchanges heat with the heat dissipation fins 20 to achieve the effect of heat dissipation. The air-cooling structure is simpler than water-cooling. Air cooling does not require liquid circulation, avoiding short circuits or equipment damage caused by leakage, and does not require sealing devices and water channels, thus reducing costs. Plastic insulating seats 13 are provided on both sides of the power board 50 at the connection points with the filter 40 and the power module 30, respectively. The plastic insulating seats 13 are set on the housing 10 and located between the power board 50 and the housing 10. The plastic insulating seats 13 support the connection points of the power board 50 with the filter 40 and the power module 30, preventing the connection points from being suspended and preventing loosening of the connection points during vibration.

[0028] The above are merely preferred embodiments of the present utility model and are not intended to limit the scope of protection of the present utility model. Any modifications, equivalent substitutions or improvements within the spirit of the present utility model are covered within the scope of the claims of the present utility model.

Claims

1. An air-cooled inverter, characterized in that: The air-cooled inverter includes a housing, multiple heat dissipation fins disposed on the housing, a power module disposed on the housing, a filter disposed on the housing, a power board disposed on the housing, a capacitor assembly disposed on the power board, and a drive control board disposed on the housing. The housing has a mounting surface for mounting the power module. The multiple heat dissipation fins are vertically arranged and spaced apart from each other on the end face of the housing away from the power module, with the heat dissipation fins corresponding to the positions of the power module. The power module is mounted on a heat dissipation substrate, which is fixed to the mounting surface. Thermally conductive silicone is disposed between the heat dissipation substrate and the mounting surface. The power board has the filter and the power module connected to its two sides respectively. Plastic insulating seats are disposed at the connection points between the power board and the filter and the power module on both sides of the power board. The plastic insulating seats are disposed on the housing and located between the power board and the housing to support the connection points between the power board and the filter and the power module.

2. The air-cooled inverter as described in claim 1, characterized in that: The housing is provided with a plurality of mounting posts, which are used to mount the power board and the drive control board.

3. The air-cooled inverter as described in claim 1, characterized in that: The capacitor assembly includes multiple thin-film capacitors disposed on the power board, multiple X capacitors disposed on the power board, and multiple Y capacitors disposed on the power board. The multiple thin-film capacitors are spaced apart from each other, and the thin-film capacitors, the X capacitors, and the Y capacitors are disposed on the end face of the power board away from the housing.

4. The air-cooled inverter as described in claim 1, characterized in that: The power module has multiple input terminals, output terminals, a chip, a heat sink, and signal pins, which are inserted into the drive control board.

5. The air-cooled inverter as described in claim 1, characterized in that: The drive control board integrates drive circuitry and control circuitry.

6. The air-cooled inverter as described in claim 1, characterized in that: The drive control board is provided with multiple maintenance holes. The positions of the maintenance holes are coaxially arranged with the connection points of the power module and the housing and the connection points of the power module and the power board, and their positions correspond to each other.

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