A capacitor assembly with high-efficiency heat dissipation function

Abstract

This utility model relates to the field of electronic component technology, specifically a capacitor assembly with high-efficiency heat dissipation function. It includes a circuit board with a base plate at the top, a heat dissipation layer in the middle, a heat-conducting plate at the bottom of the heat dissipation layer, heat dissipation fins distributed at the bottom of the heat-conducting plate, and grooves evenly distributed on the heat-conducting plate. These grooves are connected to a capacitor via copper electrodes. The capacitor is encased in a ceramic shell. Terminals are located at the top and bottom of the capacitor's interior. A barrier layer is located inside each terminal, and an external electrode is located inside each barrier layer. A graphene dielectric is located between the external electrodes, and an internal electrode is located inside the graphene dielectric. This utility model achieves heat dissipation by rapidly dispersing the heat generated by the capacitor through the heat dissipation layer and heat-conducting plate, further accelerating heat dissipation by increasing the heat dissipation area with the heat dissipation fins, and finally dissipating and releasing the internal heat of the capacitor through the ceramic shell and graphene dielectric.

Description

Technical Field

[0001] This utility model relates to the field of electronic components technology, specifically a capacitor assembly with high-efficiency heat dissipation function. Background Technology

[0002] A capacitor is an ideal element that characterizes the charge storage properties of a circuit element. Its original model is a parallel-plate capacitor consisting of two metal plates separated by an insulating dielectric. When a voltage is applied to the two plates, equal amounts of positive and negative charges accumulate on the plates, generating an electric field between the two plates. The more charge accumulated, the stronger the electric field, and the greater the electric energy stored in the capacitor.

[0003] A capacitor structure disclosed in patent announcement number CN221927788U includes a main capacitor. The main capacitor has a positive terminal and a negative terminal at its end. A first terminal is fixedly connected to both the positive terminal and the negative terminal, and the first terminal is electrically connected to both the positive terminal and the negative terminal. A first circuit board is fixedly mounted between the first terminal and the positive terminal and the negative terminal. The first circuit board is electrically connected to the positive terminal, the negative terminal, and the first terminal. A supercapacitor is soldered onto the first circuit board. The effect is as follows: By integrating and soldering multiple supercapacitors onto the first circuit board, each supercapacitor is connected in series, and the series-connected supercapacitors form a capacitor bank. Since the first circuit board is electrically connected to the main capacitor through the first terminal, the capacitor bank and the main capacitor are connected in parallel, thereby increasing the capacitance. Furthermore, the capacitor is smaller in size and easier to install due to the above connection method.

[0004] However, it still has some shortcomings, such as a single heat conduction path and low heat dissipation efficiency, which affects the lifespan of the component. To address these issues, we propose a capacitor component with high-efficiency heat dissipation, which solves the problems of a single heat conduction path and low heat dissipation efficiency affecting the lifespan of the component. Utility Model Content

[0005] The purpose of this invention is to provide a capacitor assembly with high-efficiency heat dissipation function to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A capacitor assembly with high-efficiency heat dissipation function includes a capacitor encased in a ceramic shell. The ceramic shell has a copper electrode at its top, terminals at its top and bottom inside, a barrier layer inside each terminal, an outer electrode inside each barrier layer, a graphene dielectric between the outer electrodes, and an inner electrode inside the graphene dielectric.

[0008] Preferably, the copper electrode is located at the bottom of the circuit board.

[0009] Preferably, the circuit board includes a base plate, a heat spreader layer, and a heat conduction plate, with the base plate disposed at the top of the heat spreader layer and the heat conduction plate disposed at the bottom of the heat spreader layer.

[0010] Preferably, the heat-conducting plate has heat dissipation fins evenly distributed at its bottom end, and grooves are provided between the heat dissipation fins.

[0011] Preferably, the groove is provided with a threading hole.

[0012] Preferably, the threading hole connects the base plate and the heat spreader.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. A capacitor assembly with high-efficiency heat dissipation function includes a capacitor encased in a ceramic shell. A copper electrode is provided at the top of the ceramic shell. Terminals are provided at the top and bottom of the interior of the ceramic shell. A barrier layer is provided inside each terminal. An outer electrode is provided inside each barrier layer. A graphene dielectric is provided between the outer electrodes. An inner electrode is provided inside the graphene dielectric. The graphene dielectric can quickly and evenly dissipate the internal temperature, and the ceramic shell can then achieve the purpose of rapid heat dissipation of the capacitor.

[0015] 2. A capacitor assembly with high-efficiency heat dissipation function includes a circuit board. The circuit board has a base plate at its top, a heat spreader layer in the middle, a heat conduction plate at its bottom, and heat dissipation fins distributed at the bottom of the heat conduction plate. The heat dissipation fins are provided between the heat dissipation fins, and a through hole is provided in the groove. The through hole connects the base plate and the heat spreader layer. The heat generated by the internal resistance of the copper electrode is quickly dispersed through the heat spreader layer, and the heat is quickly absorbed and conducted to the heat dissipation fins through the heat conduction plate. Finally, the heat dissipation fins dissipate heat quickly by increasing the surface area. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0017] Figure 2 This is a schematic cross-sectional view of the main structure of this utility model;

[0018] Figure 3 This is a schematic diagram showing the disassembled main structure of this utility model;

[0019] Figure 4 This is a schematic diagram of a single capacitor cross-section of this utility model.

[0020] In the diagram: 101, capacitor; 102, ceramic casing; 103, copper electrode; 104, terminal; 105, barrier layer; 106, external electrode; 107, graphene dielectric; 108, internal electrode; 201, circuit board; 202, base plate; 203, heat spreader; 204, heat conduction plate; 205, groove; 301, heat dissipation fins; 302, wiring hole. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figures 1-4 As shown, this utility model provides a technical solution:

[0023] A capacitor assembly with high-efficiency heat dissipation function includes a capacitor 101, which is encased in a ceramic shell 102. The ceramic shell 102 is characterized by having a copper electrode 103 at its top, terminals 104 at its top and bottom inside, a barrier layer 105 inside each terminal 104, an outer electrode 106 inside each barrier layer 105, a graphene dielectric 107 between the outer electrodes 106, and an inner electrode 108 inside the graphene dielectric 107.

[0024] In this embodiment, preferably, the copper electrode 103 is located at the bottom of the circuit board 201.

[0025] In this embodiment, preferably, the circuit board 201 includes a base plate 202, a heat spreader layer 203 and a heat conduction plate 204, the base plate 202 is disposed at the top of the heat spreader layer 203 and the heat conduction plate 204 is disposed at the bottom of the heat spreader layer 203.

[0026] In this embodiment, preferably, heat dissipation fins 301 are evenly distributed at the bottom of the heat-conducting plate 204, and grooves 205 are provided between the heat dissipation fins 301.

[0027] In this embodiment, preferably, the groove 205 is provided with a wire hole 302.

[0028] In this embodiment, preferably, the threading hole 302 connects the base plate 202 and the heat dissipation layer 203.

[0029] In this embodiment, a capacitor assembly with high-efficiency heat dissipation function is used. The capacitor 101 is encased in a ceramic shell 102. A copper electrode 103 is located at the top of the ceramic shell 102. Terminals 104 are located at the top and bottom of the ceramic shell 102. A barrier layer 105 is provided inside each terminal 104, and an external electrode 106 is located inside each barrier layer 105. A graphene dielectric 107 is disposed between the external electrodes 106. An internal electrode 108 is located inside the graphene dielectric 107. The graphene dielectric 107 rapidly and uniformly dissipates the internal temperature, and the ceramic shell 102 further facilitates rapid heat dissipation from the capacitor 101. The circuit board 20... The circuit board 201 has a base plate 202 at the top, a heat dissipation layer 203 in the middle, a heat conduction plate 204 at the bottom of the heat dissipation layer 203, heat dissipation fins 301 distributed at the bottom of the heat conduction plate 204, a groove 205 between the heat dissipation fins 301, and a wire hole 302 in the groove 205. The wire hole 302 connects the base plate 202 and the heat dissipation layer 203. The heat generated by the internal resistance of the copper electrode 103 is quickly dispersed through the heat dissipation layer 203, and then the heat is quickly absorbed and conducted to the heat dissipation fins 301 through the heat conduction plate 204. Finally, the heat dissipation fins 301 dissipate heat quickly by increasing the surface area.

[0030] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A capacitor assembly with high heat dissipation function, comprising a capacitor (101) wrapped with a ceramic shell (102), characterized in that: The ceramic shell (102) has a copper electrode (103) at its top end. The ceramic shell (102) has terminals (104) at its top and bottom ends. Each terminal (104) has a barrier layer (105) on its inner side. Each barrier layer (105) has an outer electrode (106) on its inner side. Graphene medium (107) is provided between the outer electrodes (106). An inner electrode (108) is provided inside the graphene medium (107).

2. The capacitor assembly with high-efficiency heat dissipation function according to claim 1, characterized in that: The copper electrode (103) is located at the bottom of the circuit board (201).

3. A capacitor assembly with high-efficiency heat dissipation function according to claim 2, characterized in that: The circuit board (201) includes a base plate (202), a heat spreader (203) and a heat conduction plate (204). The base plate (202) is located at the top of the heat spreader (203) and the heat conduction plate (204) is located at the bottom of the heat spreader (203).

4. A capacitor assembly with high-efficiency heat dissipation function according to claim 3, characterized in that: The heat-conducting plate (204) has heat dissipation fins (301) evenly distributed at its bottom end, and grooves (205) are provided between the heat dissipation fins (301).

5. A capacitor assembly with high-efficiency heat dissipation function according to claim 4, characterized in that: The groove (205) is provided with a wire hole (302).

6. A capacitor assembly with high-efficiency heat dissipation function according to claim 5, characterized in that: The threading hole (302) connects the base plate (202) and the heat dissipation layer (203).

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