power module
By adopting a vertically arranged packaging structure and an insulated thermally conductive heat dissipation design in the power module, the problems of large packaging area and parasitic effects are solved, achieving smaller packaging and more efficient heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- RAYBEN TECH (ZHUHAI) LTD
- Filing Date
- 2025-05-28
- Publication Date
- 2026-05-29
AI Technical Summary
The planar arrangement of power chips in existing power modules results in a large package area and increased circuit connection length, generating a strong parasitic effect that affects module performance.
The vertically arranged packaging structure places the power chip between the circuit boards and dissipates heat through insulated thermally conductive components and a metal heat sink, reducing the packaging area and reducing parasitic effects.
This reduces the package area of the power module and the parasitic effect, thereby improving heat dissipation efficiency and module performance.
Smart Images
Figure CN224306300U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a power module. Background Technology
[0002] Power modules contain power chips (such as MOSFET chips and IGBT chips) that generate a significant amount of heat during operation, thus requiring high heat dissipation performance. Chinese patent document CN219476670U discloses a power module comprising a package and power chips disposed between two circuit boards. The power chips include a first power chip and a second power chip forming a half-bridge circuit. The circuit boards include an insulating substrate, conductive lines, and heat-conducting components disposed within the insulating substrate. The power chips are connected to the heat-conducting components, allowing the generated heat to dissipate rapidly outwards through the heat-conducting components on both sides, resulting in excellent heat dissipation performance.
[0003] While the aforementioned prior art has solved the heat dissipation problem of the module, the first power chip and the second power chip are arranged in a planar manner between two circuit boards. This planar arrangement structure leads to a larger package area and increases the length of the line connection between the power chips and their current loops, resulting in stronger parasitic effects (such as parasitic capacitance or inductance), which in turn reduces the performance of the power module. Utility Model Content
[0004] In view of the shortcomings of the prior art, the main purpose of this utility model is to provide an improved power module in which the power chips adopt a vertically arranged packaging structure to reduce the packaging area and reduce parasitic effects.
[0005] To achieve the aforementioned main objectives, this utility model discloses a power module, including a circuit board assembly and a power chip assembly; wherein:
[0006] The circuit board assembly includes a first circuit board, a third circuit board, and a second circuit board disposed between the two. The power chip assembly includes a first power chip disposed between the first circuit board and the second circuit board, and a second power chip disposed between the third circuit board and the second circuit board. The second circuit board has a metal component, and both the first power chip and the second power chip are electrically connected to the metal component. The first circuit board has a first insulating heat-conducting component for dissipating heat from the first power chip, and the third circuit board has a second insulating heat-conducting component for dissipating heat from the second power chip.
[0007] Furthermore, the outer surface of the first circuit board is provided with a first metal heat sink connected to the first insulating heat-conducting component, and the outer surface of the third circuit board is provided with a second metal heat sink connected to the second insulating heat-conducting component.
[0008] Preferably, both the first insulating and thermally conductive component and the second insulating and thermally conductive component are ceramic blocks.
[0009] Furthermore, the first power chip and the second power chip are arranged symmetrically with respect to the second circuit board.
[0010] Preferably, the circuit board assembly has a first driving circuit and a second driving circuit symmetrically arranged, the first driving circuit being used to drive the first power chip, and the second driving circuit being used to drive the second power chip.
[0011] Furthermore, the second circuit board is electrically connected to the first circuit board and to the third circuit board via conductive blocks.
[0012] Furthermore, a capacitor is provided between the third circuit board and the first circuit board, and the two terminals of the capacitor are electrically connected to the first power chip and the second power chip, respectively.
[0013] Furthermore, both the first power chip and the second power chip are MOSFET chips, with a drain on one side surface and a source and a gate on the opposite side surface.
[0014] Specifically, the source and gate of the first power chip are electrically connected to the first circuit board, the source and gate of the second power chip are electrically connected to the third circuit board, and the drains of both the first and second power chips are electrically connected to the metal component.
[0015] Furthermore, both the first circuit board and the third circuit board are configured to partially overlap the second circuit board in their thickness direction, thereby reserving sufficient space for the installation of other electronic components on the circuit board.
[0016] The technical solution of this utility model has the following beneficial effects:
[0017] The first power chip is disposed between the first circuit board and the second circuit board, and the second power chip is disposed between the third circuit board and the second circuit board, so that heat can be dissipated quickly through the insulating heat-conducting components in the first circuit board and the third circuit board respectively.
[0018] The first power chip and the second power chip are arranged perpendicularly along the thickness direction of the second circuit board. This perpendicular arrangement can reduce the package area of the power module and reduce parasitic effects. Preferably, the first power chip, the second power chip, and their driving circuits are symmetrically arranged, which is beneficial to further reduce parasitic effects.
[0019] To more clearly illustrate the purpose, technical solution, and advantages of this utility model, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the power module in the embodiment. Detailed Implementation
[0021] The technical solution of this utility model is described in detail below with reference to specific embodiments. However, this utility model can also be implemented in other variations based on this description. Therefore, the protection scope of this utility model is not limited to the specific embodiments disclosed below.
[0022] like Figure 1 As shown, the power module described in this embodiment includes a circuit board assembly and a power chip assembly. The circuit board assembly includes a first circuit board 11, a second circuit board 12, and a third circuit board 13 stacked together, with the second circuit board 12 disposed between the first circuit board 11 and the third circuit board 13. Exemplarily, conductive lines may be provided on both sides of the first circuit board 11, the second circuit board 12, and the third circuit board 13; wherein the first circuit board 11 and the second circuit board 12 are electrically connected via a first conductive block 141, and the third circuit board 13 and the second circuit board 12 are electrically connected via a second conductive block 142. The first conductive block 141 and the second conductive block 142 are preferably copper blocks.
[0023] The power chip assembly includes a first power chip 21 disposed between a first circuit board 11 and a second circuit board 12, and a second power chip 22 disposed between a third circuit board 13 and the second circuit board 12. The first power chip 21 and the second power chip 22 can form a half-bridge circuit. The first power chip 21 and the second power chip 22 are positioned on opposite sides of the second circuit board 12, i.e., vertically arranged in the thickness direction of the second circuit board 12. This vertical arrangement structure can reduce the package area of the power module and reduce parasitic effects.
[0024] The second circuit board 12 includes a metal component 121, such as a copper block. The first power chip 21 and the second power chip 22 are both electrically connected to the metal component 121, for example, by soldering to device pads on the surface of the metal component 121. It should be noted that there can be one or more metal components 121, and each metal component 121 can electrically connect to one or more first power chips 21 and second power chips 22. Preferably, the number of first power chips 21 and second power chips 22 electrically connected to each metal component 121 is equal.
[0025] Preferably, the first power chip 21 and the second power chip 22 are symmetrically arranged with respect to the second circuit board 12; the circuit board assembly has a symmetrically arranged first driving circuit and second driving circuit, the first driving circuit is used to drive the first power chip 21 and the second driving circuit is used to drive the second power chip 22. This symmetrical structure is beneficial to further reduce parasitic effects.
[0026] The first circuit board 11 has a first insulating heat-conducting component 111 for dissipating heat from the first power chip 21. The outer surface of the first circuit board 11 has a first metal heat sink 112 connected to the first insulating heat-conducting component 111. The inner surface of the first circuit board 11 has an inner conductive line 110, which is partially disposed on the first insulating heat-conducting component 111. The first power chip 21 is electrically connected to the inner conductive line 110 and is configured to at least partially overlap the first insulating heat-conducting component 111 in the thickness direction of the first circuit board 11.
[0027] The third circuit board 13 has a second insulating heat-conducting component 131 for dissipating heat from the second power chip 22. The outer surface of the third circuit board 13 has a second metal heat sink 132 connected to the second insulating heat-conducting component 131. The inner surface of the third circuit board 13 has an inner conductive line 130, which is partially disposed on the second insulating heat-conducting component 131. The second power chip 22 is electrically connected to the inner conductive line 130 and is configured to at least partially overlap the second insulating heat-conducting component 131 in the thickness direction of the third circuit board 13.
[0028] When the power module is operating, the heat generated by the power chip can be conducted to the metal heat sink through the insulating thermally conductive component, and then further conducted to an external heat sink or directly diffused into the external environment through the metal heat sink. Preferably, the metal heat sink has a larger surface area than the insulating thermally conductive component, that is, the metal heat sink extends laterally to the outside of the insulating thermally conductive component.
[0029] In the embodiments, the first insulating heat-conducting component 111 and the second insulating heat-conducting component 131 are preferably ceramic blocks. As a variation of the embodiments, the insulating heat-conducting components may also be made only partially of an insulating material such as ceramic, for example, using a ceramic sheet with metal layers on both sides as the insulating heat-conducting component, as long as electrical isolation from the metal heat sink can be achieved.
[0030] Preferably, the first circuit board 11 and the third circuit board 13 are both configured to partially overlap the second circuit board 12 in their thickness direction, thereby reserving sufficient space for the installation of other electronic components 40 on the circuit boards. The electronic components 40 may be passive devices such as inductors, resistors, and capacitors, but this invention is not limited to these.
[0031] For example, both the first power chip 21 and the second power chip 22 are MOSFET chips, with a drain on one side surface and a source and a gate on the opposite side surface. The source and gate of the first power chip 21 are electrically connected to the first circuit board 11 / inner conductive line 110, and the source and gate of the second power chip 22 are electrically connected to the third circuit board 13 / inner conductive line 130. The drains of both the first power chip 21 and the second power chip 22 are electrically connected to the metal component 121.
[0032] Furthermore, a capacitor 30 (e.g., a decoupling capacitor) is provided between the third circuit board 13 and the first circuit board 11. The two terminals of the capacitor 30 are electrically connected to the first power chip 21 and the second power chip 22, respectively. For example, one terminal of the capacitor 30 is electrically connected to the first circuit board 11, and then to the drain of the first power chip 21; the other terminal of the capacitor 30 is electrically connected to the third circuit board 13, and then to the source of the second power chip 22.
[0033] Preferably, the capacitor 30 is located adjacent to the second circuit board 12, or located in a through hole / slot in the second circuit board 12 adjacent to the metal component 121, so as to minimize the current loop between the capacitor 30 and the first power chip 21 and the second power chip 22 and reduce parasitic effects.
[0034] Although the present invention has been disclosed above with reference to specific embodiments, these embodiments are not intended to limit the scope of the present invention. Any person skilled in the art may make some modifications or variations without departing from the scope of the present invention; that is, all equivalent changes made in accordance with the present invention should be covered by the protection scope of the present invention.
Claims
1. A power module, comprising a circuit board assembly and a power chip assembly; characterized in that: The circuit board assembly includes a first circuit board, a third circuit board, and a second circuit board disposed between the two; the power chip assembly includes a first power chip disposed between the first circuit board and the second circuit board, and a second power chip disposed between the third circuit board and the second circuit board. The second circuit board contains a metal component, and both the first power chip and the second power chip are electrically connected to the metal component; the first circuit board contains a first insulating heat-conducting component for dissipating heat from the first power chip, and the third circuit board contains a second insulating heat-conducting component for dissipating heat from the second power chip.
2. The power module according to claim 1, characterized in that: The outer surface of the first circuit board is provided with a first metal heat sink connected to the first insulating heat-conducting component, and the outer surface of the third circuit board is provided with a second metal heat sink connected to the second insulating heat-conducting component.
3. The power module according to claim 2, characterized in that: Both the first insulating and heat-conducting component and the second insulating and heat-conducting component are ceramic blocks.
4. The power module according to claim 1, characterized in that: The first power chip and the second power chip are arranged symmetrically with respect to the second circuit board.
5. The power module according to claim 4, characterized in that: The circuit board assembly has a first driving circuit and a second driving circuit symmetrically arranged. The first driving circuit is used to drive the first power chip, and the second driving circuit is used to drive the second power chip.
6. The power module according to claim 1, characterized in that: The second circuit board is electrically connected to the first circuit board and to the third circuit board via conductive blocks.
7. The power module according to claim 1, characterized in that: A capacitor is provided between the third circuit board and the first circuit board, and the two terminals of the capacitor are electrically connected to the first power chip and the second power chip, respectively.
8. The power module according to claim 1, characterized in that: Both the first power chip and the second power chip are MOSFET chips. The MOSFET chip has a drain on one side surface and a source and a gate on the opposite side surface.
9. The power module according to claim 8, characterized in that: The source and gate of the first power chip are electrically connected to the first circuit board, the source and gate of the second power chip are electrically connected to the third circuit board, and the drains of both the first power chip and the second power chip are electrically connected to the metal component.
10. The power module according to claim 1, characterized in that: Both the first circuit board and the third circuit board are configured to partially overlap the second circuit board in their thickness direction.