Parallel local electroplating thermopile integrated heat flow sensor

Abstract

The utility model relates to the technical field of thermal measurement, and specifically relates to a parallel partial electroplating thermopile integrated heat flow sensor, including module, the module includes bakelite support baseplate and constantan wire, copper wire and epoxy glue, the outside of bakelite support baseplate is wound with constantan wire and copper wire, the outside of constantan wire is covered with epoxy glue, the contact point between constantan wire and copper wire forms thermal junction, the constantan wire is covered area of epoxy glue and forms cold junction, three pieces are oppositely parallel to the module. Replace traditional manual welding with short side half-sealing electroplating process, and three hundred pairs of copper-constantan thermoelectric junctions can be generated in batches by single module, and the total thermoelectric junction reaches nine hundred pairs after three-module cascade, which significantly improves production efficiency and junction consistency, and solves the problem of uneven multi-module integrated thermal field by parallel three-stage direct connection topology and four-millimeter spacing design, and the output voltage is stable under the actual measurement of heat flow, the response time is short, and the high-precision rapid measurement demand is met.

Description

Technical Field

[0001] This utility model relates to the field of thermal measurement technology, specifically to a parallel local electroplated thermopile integrated heat flow sensor. Background Technology

[0002] Traditional thermopile fabrication requires the manual welding of hundreds of thermoelectric junctions, which suffers from low efficiency and poor consistency. Although recent electroplating processes have increased the number of junctions, multi-module integration still faces the challenge of uneven thermal field. Therefore, a parallel local electroplated thermopile integrated heat flow sensor is proposed. Utility Model Content

[0003] The main objective of this invention is to provide a parallel local electroplated thermopile integrated heat flow sensor, which can effectively solve the problems in the background technology.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0005] A parallel-type locally electroplated thermopile integrated heat flow sensor includes a module. The module includes a bakelite support substrate, constantan wire, copper wire, and epoxy resin. The outer side of the bakelite support substrate is wound with constantan wire and copper wire. The outer side of the constantan wire is covered with epoxy resin. The contact point between the constantan wire and the copper wire forms a hot junction, and the area of ​​the constantan wire covered by epoxy resin forms a cold junction. The module is arranged in three parallel sections.

[0006] Specifically, the module is fixedly installed inside the lower housing, and the lower housing has a positioning groove for the three modules to be placed horizontally.

[0007] Specifically, two adjacent modules are connected in series by copper wires, and there are two copper wires.

[0008] Specifically, one end of the copper wire is connected to the hot junction of one of the modules, and the other end of the copper wire is connected to the cold junction of another module 3.

[0009] Specifically, the upper housing is fastened to the top of the lower housing.

[0010] The beneficial effects of this utility model are:

[0011] This utility model discloses a parallel-type locally electroplated thermopile integrated heat flow sensor. It employs a short-side semi-sealed electroplating process to replace traditional manual welding. A single module can generate 300 pairs of copper-constantan thermoelectric junctions in batches, and the total number of thermoelectric junctions reaches 900 pairs after three modules are cascaded, significantly improving production efficiency and junction consistency. The parallel three-level direct-connection topology and 4mm spacing design solve the problem of uneven thermal field in multi-module integration; at 500W / m 2The measured output under heat flux is 21.5mV, with a response time of only 2.2s, meeting the requirements for high-precision and rapid measurement. Attached Figure Description

[0012] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0014] Figure 2 This is a schematic diagram of the substrate structure of this utility model;

[0015] Figure 3 This is a schematic diagram of the substrate planar structure of this utility model;

[0016] Figure 4 This is a schematic diagram of the lower shell structure of this utility model;

[0017] In the diagram: 1. Upper shell; 2. Lower shell; 3. Module; 4. Epoxy resin; 5. Constantan wire; 6. Bakelite support substrate; 7. Copper wire; 8. Hot junction; 9. Cold junction; 10. Positioning groove; 11. Copper wire. Detailed Implementation

[0018] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0019] As one embodiment of this utility model, such as Figures 1-4 As shown, the parallel local electroplated thermopile integrated heat flow sensor of this utility model includes a module 3. The module 3 includes a bakelite support substrate 6, constantan wire 5, copper wire 7, and epoxy resin 4. The outer side of the bakelite support substrate 6 is wound with constantan wire 5 and copper wire 7. The outer side of the constantan wire 5 is covered with epoxy resin 4. The contact point between the constantan wire 5 and the copper wire 7 forms a hot junction 8. The area of ​​the constantan wire 5 covered by epoxy resin 4 forms a cold junction 9. The module 3 is arranged in three parallel sections.

[0020] The present invention also includes that the module 3 is fixedly installed inside the lower housing 2, and the lower housing 2 has a positioning groove 10 inside, which is used for the three modules 3 to be placed horizontally.

[0021] This utility model also includes a series connection between two adjacent modules 3 via copper wires 11, wherein two copper wires 11 are provided.

[0022] The present invention also includes that one end of the copper wire 11 is connected to the hot junction 8 of one of the modules 3, and the other end of the copper wire 11 is connected to the cold junction 9 of another module 3.

[0023] The present invention also includes an upper housing 1 fastened to the top of the lower housing 2.

[0024] When using this utility model, firstly, in an area of ​​80×10×1mm... 3 A 0.15mm constantan wire 5 is uniformly wound 300 turns around the surface of the bakelite support substrate 6. A 5mm wide area is then covered using a dispensing machine for a semi-sealing process, effectively sealing the constantan wire 5 with epoxy adhesive 4. After curing at 80℃ for 1 hour, the exposed constantan wire 5 is immersed in a copper cyanide plating solution (CuCN 40g / L, NaCN 65g / L) at a rate of 1.5A / dm². 2 Electroplating at a current density for 10 minutes generates a 12μm thick copper layer, forming copper wire 7. 300 thermoelectric junctions are formed at the contact points between copper wire 7 and constantan wire 5 on a single module. Subsequently, three modules 3 are installed parallel to each other in the positioning groove 10 of the lower housing 2, with a spacing of 4mm between modules 3. A 0.3mm copper wire 11 is used to connect the cold junction 9 of module A 3 to the hot junction 8 of module B 3, and the cold junction 9 of module B 3 to the hot junction 8 of module C 3, forming a series weld. Conductive silver paste is applied to the solder joints. Finally, all components are covered with mixed epoxy resin through vacuum casting. After closing the upper housing 1, the entire assembly is cured at 80℃ for 2 hours to complete the overall potting, achieving efficient integration and protection of 900 thermoelectric junctions.

[0025] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The descriptions of the above embodiments and specifications are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A parallel local electroplating thermopile integrated heat flow sensor comprising a module (3), characterized in that, The module (3) includes a bakelite support substrate (6), constantan wire (5), copper wire (7), and epoxy resin (4). The outer side of the bakelite support substrate (6) is wound with constantan wire (5) and copper wire (7). The outer side of the constantan wire (5) is covered with epoxy resin (4). The contact point between the constantan wire (5) and the copper wire (7) forms a hot junction (8). The area of ​​the constantan wire (5) covered by epoxy resin (4) forms a cold junction (9). The module (3) is arranged in three parallel sections.

2. A parallel type partial electroplating thermopile integrated heat flow sensor according to claim 1, wherein, The module (3) is fixedly installed inside the lower housing (2). The lower housing (2) has a positioning groove (10) inside, which is used for the three modules (3) to be placed horizontally.

3. The parallel-type, partially electroplated thermopile integrated heat flux sensor of claim 1, wherein, The two adjacent modules (3) are connected in series by copper wires (11), and there are two copper wires (11).

4. A parallel-type locally electroplated thermopile integrated heat flux sensor according to claim 3, characterized in that, One end of the copper wire (11) is connected to the hot junction (8) of one of the modules (3), and the other end of the copper wire (11) is connected to the cold junction (9) of another module (3).

5. A parallel-type locally electroplated thermopile integrated heat flux sensor according to claim 2, characterized in that, The upper housing (1) is fastened to the top of the lower housing (2).

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