FPGA chip, power supply circuit thereof and multilayer circuit board
By introducing a combination of primary and secondary power modules into the FPGA chip, the problems of complex power module design and high cost in heterogeneous FPGA systems are solved, and precise control of current signals and cost optimization are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU HIRAIN AUTOMOTIVE ELECTRONICS CO LTD
- Filing Date
- 2025-07-02
- Publication Date
- 2026-06-26
AI Technical Summary
Heterogeneous FPGA systems require multiple different power rails, which makes power module design complex and costly.
It adopts a structure of primary and secondary power modules, and through the combination of multiple voltage conversion modules and voltage regulation modules, it achieves precise control and distribution of current, reducing the number of circuit modules used.
The power supply circuit design was optimized, reducing manufacturing costs and improving the accuracy and stability of the current signal.
Smart Images
Figure CN224418678U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of power supply technology, and in particular to an FPGA chip and its power supply circuit and multilayer circuit board. Background Technology
[0002] With the popularization of new energy vehicles and the surge in demand for advanced driver assistance systems, the demand for heterogeneous field-programmable gate arrays (FPGAs) is also gradually increasing. Because heterogeneous FPGA architectures have the ability to efficiently process massive amounts of real-time data and execute complex algorithms compared to traditional FPGAs, they also place higher demands on power supply design.
[0003] Because heterogeneous FPGA systems require multiple different power rails to power pins with different voltages, and the requirements for voltage accuracy and timing are extremely strict, related technologies typically deploy multiple low-dropout regulators, with one low-dropout regulator for each power rail. This makes the design of the entire power module more complex, and the use of more modules also increases the cost of power design. Utility Model Content
[0004] To solve or at least partially solve the above-mentioned technical problems, this disclosure provides an FPGA chip and its power supply circuit, as well as a multilayer circuit board. By reducing the use of circuit modules, this disclosure optimizes the circuit design of the power supply circuit and reduces the manufacturing cost of the power supply circuit.
[0005] This disclosure provides a power supply circuit for an FPGA chip, including: a primary power supply module and a secondary power supply module. The primary power supply module is connected to an external power supply; the primary power supply module includes multiple voltage conversion modules; each voltage conversion module is connected to at least one first-type power rail; the secondary power supply module is connected to at least one voltage conversion module, and the secondary power supply module is connected to at least one second-type power rail; the first-type power rail is used to supply power to a first-type load and the secondary power supply module, and the second-type power rail is used to supply power to a second-type load.
[0006] Optionally, the primary power module includes a first voltage conversion module; the first type of power rail includes a first power rail and a second power rail; the first output channel of the first voltage conversion module is connected in parallel with the second output channel of the first voltage conversion module, and the first output channel of the first voltage conversion module is connected to the first power rail; the third output channel of the first voltage conversion module is connected in parallel with the fourth output channel of the first voltage conversion module, and the third output channel of the first voltage conversion module is connected to the second power rail; wherein, the first voltage conversion module is used to supply power through the first power rail and the second power rail; the first power rail and the second power rail are used to provide a first current.
[0007] Optionally, the secondary power supply module includes at least one second voltage conversion module and at least one voltage regulator module; the input channel of the second voltage conversion module is connected to the first power rail, and the input channel of the voltage regulator module is connected to the second power rail; the output channels of the second voltage conversion module and the output channels of the voltage regulator module are respectively connected to the corresponding second type of power rail for supplying power to the second type of load.
[0008] Optionally, the primary power module includes a third voltage conversion module; the first type of power rail includes a third power rail; the first output channel of the third voltage conversion module is connected in parallel with the second output channel, the third output channel, and the fourth output channel of the third voltage conversion module, and the first output channel of the third voltage conversion module is connected to the third power rail; wherein, the third voltage conversion module is used to supply power to the first type of load through the third power rail; the third power rail is used to provide the second current.
[0009] Optionally, the primary power module includes a fourth voltage conversion module; the first type of power rail includes a fourth power rail, a fifth power rail, and a sixth power rail; the first output channel of the fourth voltage conversion module is connected in parallel with the second output channel of the fourth voltage conversion module, and the first output channel of the fourth voltage conversion module is connected to the fourth power rail; the third output channel of the fourth voltage conversion module is connected to the fifth power rail, and the fourth output channel of the fourth voltage conversion module is connected to the sixth power rail; wherein, the fourth voltage conversion module is used to supply power to the first type of load through the fourth power rail, the fifth power rail, and the sixth power rail; the fourth power rail is used to provide a third current, and the fifth and sixth power rails are used to provide a fourth current.
[0010] Optionally, the primary power module includes a fifth voltage conversion module; the first type of power rails includes a seventh, eighth, ninth, and tenth power rail; the first output channel of the fifth voltage conversion module is connected to the seventh power rail, the second output channel of the fifth voltage conversion module is connected to the eighth power rail, the third output channel of the fifth voltage conversion module is connected to the ninth power rail, and the fourth output channel of the fifth voltage conversion module is connected to the tenth power rail; wherein, the fifth voltage conversion module is used to supply power to the first type of load through the seventh, eighth, ninth, and tenth power rails; the seventh, eighth, ninth, and tenth power rails are all used to provide the fifth current.
[0011] This disclosure also provides a multilayer circuit board for use in any of the aforementioned power supply circuits. The secondary power module includes at least one second voltage conversion module and at least one voltage regulator module. The multilayer circuit board includes a top layer, multiple intermediate layers, and a bottom layer. The primary power module and the voltage regulator module are disposed on the top layer; the second voltage conversion module is disposed on the bottom layer.
[0012] Optionally, the multiple intermediate layers include at least one power layer; a first type of power rail and a second type of power rail are disposed on the power layer; wherein both the first type of power rail and the second type of power rail are copper-clad.
[0013] Optionally, the multiple intermediate layers include at least one high-speed signal layer; the routing direction of the high-speed signal layer intersects with the routing direction of the power layer.
[0014] This disclosure also provides an FPGA chip that is connected to any of the power supply circuits described above.
[0015] This disclosure provides an FPGA chip and its power supply circuit, as well as a multilayer circuit board. The power supply circuit includes a primary power module and a secondary power module. An external power supply powers the primary power module. Multiple voltage conversion modules within the primary power module convert the voltage supplied by the external power supply and output different currents to various pins of the FPGA chip according to the power requirements of the FPGA chip through a first type of power rail connected to the multiple voltage conversion modules. This enables power supply to the first type of load within the FPGA chip and to power the secondary power module through the first type of power rail. For the second type of load within the FPGA chip that requires high-precision input, the secondary power module further adjusts the current signal provided by the first type of power rail and outputs it to the second type of power rail, resulting in a current signal with lower ripple and noise, thereby improving the accuracy of the current signal. Thus, this disclosure enables the provision of different currents according to the different power requirements of the FPGA chip, as well as providing higher-precision currents. Furthermore, the voltage conversion modules can connect to multiple power rails, eliminating the need for a separate voltage conversion module for each power rail. This reduces the number of circuit modules used, optimizes the circuit design of the power supply circuit, and reduces the manufacturing cost of the power supply circuit. Attached Figure Description
[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the power supply circuit of an FPGA chip provided in an embodiment of the present disclosure.
[0018] Figure 2 This is a schematic diagram of the power supply circuit for another FPGA chip provided in an embodiment of the present disclosure.
[0019] Figure 3This is a schematic diagram of the power supply circuit for another FPGA chip provided in an embodiment of the present disclosure.
[0020] Figure 4 This is a schematic diagram of the power supply circuit for another FPGA chip provided in an embodiment of the present disclosure.
[0021] Figure 5 This is a schematic diagram of the power supply circuit for another FPGA chip provided in an embodiment of the present disclosure.
[0022] Figure 6 This is a schematic diagram of the power supply circuit for another FPGA chip provided in an embodiment of the present disclosure.
[0023] Figure 7 This is a schematic diagram of the power supply circuit of a preferred FPGA chip provided in an embodiment of the present disclosure.
[0024] Figure 8 This is a cross-sectional schematic diagram of a multilayer circuit board provided in an embodiment of the present disclosure, as shown below. Figure 8 As shown.
[0025] 10. Primary power supply module; 100. Voltage conversion module; 110. First voltage conversion module; 111. First output channel of the first voltage conversion module; 112. Second output channel of the first voltage conversion module; 113. Third output channel of the first voltage conversion module; 114. Fourth output channel of the first voltage conversion module; 120. Third voltage conversion module; 121. First output channel of the third voltage conversion module; 122. Second output channel of the third voltage conversion module; 123. Third output channel of the third voltage conversion module; 124. Fourth output channel of the third voltage conversion module; 130. Fourth voltage conversion module; 131. First output channel of the fourth voltage conversion module; 132. Second output channel of the fourth voltage conversion module; 133. Third output channel of the fourth voltage conversion module; 134. Fourth output channel of the fourth voltage conversion module. ; 140. Fifth voltage conversion module; 141. First output channel of the fifth voltage conversion module; 142. Second output channel of the fifth voltage conversion module; 143. Third output channel of the fifth voltage conversion module; 144. Fourth output channel of the fifth voltage conversion module; 20. Secondary power supply module; 21. Second voltage conversion module; 22. Voltage regulator module; 30. External power supply; 41. First type power rail; 411. First power rail; 412. Second power rail; 413. Third power rail; 414. Fourth power rail; 415. Fifth power rail; 416. Sixth power rail; 417. Seventh power rail; 418. Eighth power rail; 419. Ninth power rail; 420. Tenth power rail; 42. Second type power rail; 50. FPGA chip; 51. First type load; 52. Second type load; 61. Top layer; 62. Middle layer; 63. Bottom layer. Detailed Implementation
[0026] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description in order to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples thereof.
[0027] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The embodiments will now be described in detail with reference to the accompanying drawings.
[0028] This disclosure provides a power supply circuit for an FPGA chip, which includes a primary power supply module and a secondary power supply module.
[0029] The primary power module is connected to an external power source. The primary power module comprises multiple voltage conversion modules; each voltage conversion module is connected to at least one Class I power rail.
[0030] The secondary power module is connected to at least one voltage conversion module, and the secondary power module is connected to at least one Class II power rail. The Class I power rail is used to power the Class I load and the secondary power module, and the Class II power rail is used to power the Class II load.
[0031] For example, Figure 1 This is a schematic diagram of the power supply circuit for an FPGA chip provided in an embodiment of the present disclosure, as shown below. Figure 1 As shown, the following example illustrates the power supply module 10, which includes four voltage conversion modules 100. The voltage conversion modules 100 are connected to the first type of load 51 through four first type power rails 41, and the voltage conversion modules 100 are connected to the second type power module 20 through one first type power rail 41. The second type power module 20 is connected to two second type power rails 42.
[0032] The primary power module 10 includes four voltage conversion modules 100, three of which are connected to a primary load 51 via four primary power rails 41, one of which is connected to a secondary power module 20 via a primary power rail 41, and the secondary power module 20 is connected to a secondary load 52 via two secondary power rails 42. Both the primary load 51 and the secondary load 52 are located in the FPGA chip 50.
[0033] An external power supply 30 supplies power to the primary power module 10. Four voltage conversion modules 100 within the primary power module 10 convert the voltage supplied by the external power supply 30. Three of these voltage conversion modules, through the first type of power rail 41, output different currents to various pins of the FPGA chip 50 according to its power requirements, thereby supplying power to the first type of load 51 within the FPGA chip 50. The remaining voltage conversion module 100 directly supplies power to the secondary power module 20 through the first type of power rail 41. The current supplied by each first type of power rail 41 can be the same or different. The FPGA chip 50 has a second type of load 52 requiring high-precision input. The secondary power module 20 can be a power module capable of high-precision output, such as a low-dropout regulator. The secondary power module 20 further adjusts the current signal supplied by the first type of power rail 41 and outputs it to the second type of power rail 42, resulting in a lower ripple and noise current signal output by the second type of power rail 42, thus improving the accuracy of the current signal. Therefore, this disclosure enables the supply of different currents according to the different power requirements of the FPGA chip 50, as well as the supply of currents with higher precision. Furthermore, the voltage conversion module 100 can connect to multiple power rails, eliminating the need for a separate module for voltage conversion for each power rail. This reduces the number of circuit modules used, optimizes the circuit design of the power supply circuit, and lowers the manufacturing cost of the power supply circuit.
[0034] It should be noted that the primary power module 10 includes four voltage conversion modules 100. The voltage conversion modules 100 are connected to the primary load 51 through four primary power rails 41, and the voltage conversion modules 100 are connected to the secondary power module 20 through one primary power rail 41. The secondary power module 20 is connected to two secondary power rails 42. These are examples. The number of voltage conversion modules 100, primary power rails 41 and secondary power rails 42 need to be set according to the actual situation, and no specific limit is made here.
[0035] In some embodiments, Figure 2 This is a schematic diagram of the power supply circuit for another FPGA chip provided in an embodiment of the present disclosure, as shown below. Figure 2 As shown, the primary power module 10 includes a first voltage conversion module 110; the first type of power rail includes a first power rail 411 and a second power rail 412.
[0036] The first output channel 111 of the first voltage conversion module 110 is connected in parallel with the second output channel 112 of the first voltage conversion module 110, and the first output channel 111 of the first voltage conversion module 110 is connected to the first power rail 411.
[0037] The third output channel 113 of the first voltage conversion module 110 is connected in parallel with the fourth output channel 114 of the first voltage conversion module 110, and the third output channel 113 of the first voltage conversion module 110 is connected to the second power rail 412.
[0038] The first voltage conversion module 110 is used to supply power through the first power rail 411 and the second power rail 412; the first power rail 411 and the second power rail 412 are used to provide the first current.
[0039] For example, taking an external power supply 30 with a maximum output current of 100A as an example. The external power supply 30 is connected to the first voltage conversion module 110. The first output channel 111, the second output channel 112, the third output channel 113, and the fourth output channel 114 of the first voltage conversion module 110 can each output a maximum current of 25A. The first voltage conversion module 110 is connected to the FPGA chip 50 or the secondary power module 20 through the first power rail 411 and the second power rail 412. Since the first output channel 111 and the second output channel 112 of the first voltage conversion module 110 are connected in parallel and connected to the first power rail 411, the maximum current output by the first voltage conversion module 110 to the first power rail 411 is 50A. Therefore, the maximum first current provided by the first voltage conversion module 110 through the first power rail 411 is 50A. Since the third output channel 113 of the first voltage conversion module 110 is connected in parallel with the fourth output channel 114 of the first voltage conversion module 110 and connected to the second power rail 412, the maximum current output by the first voltage conversion module 110 to the second power rail 412 is 50A. Therefore, the first voltage conversion module 110 also provides a first current of up to 50A through the second power rail 412. Thus, the first voltage conversion module 110 can supply power to two power rails of the same magnitude by using a parallel connection of each output channel, according to the power demand of the first type of load in the FPGA chip 50 or the power demand of the secondary power module 20. This disclosure can achieve power supply to two power rails with a single first voltage conversion module 110, thus eliminating the need for a separate voltage conversion module for each power rail. This reduces the number of circuit modules used, optimizes the circuit design of the power supply circuit, and lowers the manufacturing cost of the power supply circuit.
[0040] It should be noted that the maximum output current of the external power supply 30 is 100A for example only. The maximum output current of the external power supply 30 needs to be determined according to the actual situation, and no specific limit is made here.
[0041] In some embodiments, the secondary power module includes at least one second voltage conversion module and at least one voltage regulator module.
[0042] The input channel of the second voltage conversion module is connected to the first power rail, and the input channel of the voltage regulator module is connected to the second power rail.
[0043] The output channels of the second voltage conversion module 21 and the voltage regulator module 22 are respectively connected to the corresponding second type of power rail 42 to supply power to the second type of load 52.
[0044] For example, Figure 3 This is a schematic diagram of the power supply circuit for another FPGA chip provided in an embodiment of the present disclosure, as shown below. Figure 3 As shown, taking an external power supply 30 with a maximum output current of 100A, the secondary power module 20 includes five second voltage conversion modules 21 and two voltage regulator modules 22 as an example. The input channel of each second voltage conversion module 21 is connected to the first power rail 411, and the input channel of each voltage regulator module 22 is connected to the second power rail 412. The second voltage conversion module 21 is a voltage conversion module that can change the current magnitude and improve the accuracy of the output current signal. The voltage regulator module 22 can improve the accuracy of the output current signal without changing the current magnitude.
[0045] The output current of both the first power rail 411 and the second power rail 412 is 50A. For a second type of load 52 with the same power demand as the output current of the power rails, the secondary power module 20 outputs the current provided by the second power rail 412 to the second type of load 52 through the voltage regulator module 22. The voltage regulator module 22 is used to reduce the output ripple and noise of the current signal and improve the accuracy of the current signal while keeping the output current constant. For a second type of load 52 with a different power demand than the output current of the power rails, the secondary power module 20 outputs the current provided by the first power rail 411 to the second type of load 52 after transformation through the second voltage conversion module 21. The second voltage conversion module 21 is used to convert the output current to the current required by the second type of load 52, and also to reduce the output ripple and noise of the current signal and improve the accuracy of the current signal. Thus, this disclosure realizes the ability to provide different currents according to different power demands of the FPGA chip, as well as to provide currents with higher accuracy.
[0046] It should be noted that the maximum output current of the external power supply 30 is 100A for example only. The maximum output current of the external power supply 30 needs to be determined according to the actual situation, and no specific limit is made here.
[0047] It should be noted that the secondary power module 20, which includes five second voltage conversion modules 21 and two voltage regulator modules 22, is only an example. The number of second voltage conversion modules 21 and voltage regulator modules 22 needs to be determined according to the actual situation, and no specific limit is made here.
[0048] In some embodiments, Figure 4 This is a schematic diagram of the power supply circuit for another FPGA chip provided in an embodiment of the present disclosure, as shown below. Figure 4 As shown, the primary power module 10 includes a third voltage conversion module 120, and the first type of power rail includes a third power rail 413.
[0049] The first output channel 121 of the third voltage conversion module 120 is connected in parallel with the second output channel 122, the third output channel 123, and the fourth output channel 124 of the third voltage conversion module 120. The first output channel 121 of the third voltage conversion module 120 is connected to the third power rail 413. The third voltage conversion module is used to supply power to the first type of load 51 through the third power rail 413. The third power rail 413 is used to provide the second current.
[0050] For example, taking an external power supply 30 with a maximum output current of 100A as an example, the external power supply 30 is connected to the third voltage conversion module 120. The first output channel 121, the second output channel 122, the third output channel 123, and the fourth output channel 124 of the third voltage conversion module 120 can each output a maximum current of 25A. When the first output channel 121, the second output channel 122, the third output channel 123, and the fourth output channel 124 are connected in parallel, the third power rail 413 can output a second current of up to 100A. Therefore, the third voltage conversion module 120 can output a single current to supply power according to the power demand of the first type of load 51 in the FPGA chip, using a method where all output channels are connected in parallel.
[0051] It should be noted that the maximum output current of the external power supply 30 is 100A for example only. The maximum output current of the external power supply 30 needs to be determined according to the actual situation, and no specific limit is made here.
[0052] In some embodiments, Figure 5 This is a schematic diagram of the power supply circuit for another FPGA chip provided in an embodiment of the present disclosure, as shown below. Figure 5 As shown, the primary power module 10 includes a fourth voltage conversion module 130; the first type of power rail includes a fourth power rail 414, a fifth power rail 415, and a sixth power rail 416.
[0053] The first output channel 131 of the fourth voltage conversion module 130 is connected in parallel with the second output channel 132 of the fourth voltage conversion module 130, and the first output channel 131 of the fourth voltage conversion module 130 is connected to the fourth power rail 414; the third output channel 133 of the fourth voltage conversion module 130 is connected to the fifth power rail 415, and the fourth output channel 134 of the fourth voltage conversion module 130 is connected to the sixth power rail 416.
[0054] The fourth voltage conversion module 130 is used to supply power to the first type of load 51 through the fourth power rail 414, the fifth power rail 415 and the sixth power rail 416; the fourth power rail 414 is used to provide the third current, and the fifth power rail 415 and the sixth power rail 416 are used to provide the fourth current.
[0055] For example, taking an external power supply 30 with a maximum output current of 100A as an example, the external power supply 30 is connected to the fourth voltage conversion module 130. The first output channel 131, the second output channel 132, the third output channel 133, and the fourth output channel 134 of the fourth voltage conversion module 130 can each output a maximum current of 25A. When the first output channel 131 and the second output channel 132 of the fourth voltage conversion module 130 are connected in parallel, the fourth power rail 414 can output a third current of up to 50A. The fifth power rail 415 is directly connected to the third output channel 133 of the fourth voltage conversion module 130, and the sixth power rail 416 is directly connected to the fourth output channel 134 of the fourth voltage conversion module 130. Therefore, the fifth power rail 415 and the sixth power rail 416 can output a fourth current of up to 25A. Therefore, the fourth voltage conversion module 130 can supply power according to the power demand of the first type of load 51 in the FPGA chip by using two output channels connected in parallel to output one current, and the other two output channels directly output two currents of the same magnitude. This disclosure can realize the power supply of three power rails with a single fourth voltage conversion module 130, so there is no need to set up a module for voltage conversion for each power rail, thereby reducing the use of circuit modules, optimizing the circuit design of the power supply circuit, and reducing the manufacturing cost of the power supply circuit.
[0056] It should be noted that the maximum output current of the external power supply 30 is 100A for example only. The maximum output current of the external power supply 30 needs to be determined according to the actual situation, and no specific limit is made here.
[0057] In some embodiments, Figure 6 This is a schematic diagram of the power supply circuit for another FPGA chip provided in an embodiment of the present disclosure, as shown below. Figure 6 As shown, the primary power module 10 includes a fifth voltage conversion module 140; the first type of power rails includes a seventh power rail 417, an eighth power rail 418, a ninth power rail 419, and a tenth power rail 420.
[0058] The first output channel 141 of the fifth voltage conversion module 140 is connected to the seventh power rail 417, the second output channel 142 of the fifth voltage conversion module 140 is connected to the eighth power rail 418, the third output channel 143 of the fifth voltage conversion module 140 is connected to the ninth power rail 419, and the fourth output channel 144 of the fifth voltage conversion module 140 is connected to the tenth power rail 420.
[0059] The fifth voltage conversion module 140 is used to supply power to the first type of load 51 through the seventh power rail 417, the eighth power rail 418, the ninth power rail 419 and the tenth power rail 420; the seventh power rail 417, the eighth power rail 418, the ninth power rail 419 and the tenth power rail 420 are all used to provide the fifth current.
[0060] For example, taking an external power supply 30 with a maximum output current of 100A as an example, the external power supply 30 is connected to the fifth voltage conversion module 140. The first output channel 141, the second output channel 142, the third output channel 143, and the fourth output channel 144 of the fifth voltage conversion module 140 can each output a maximum current of 25A. Since the seventh power rail 417 is directly connected to the first output channel 141 of the fifth voltage conversion module 140, the eighth power rail 418 is directly connected to the second output channel 142 of the fifth voltage conversion module 140, the ninth power rail 419 is directly connected to the third output channel 143 of the fifth voltage conversion module 140, and the tenth power rail 420 is directly connected to the fourth output channel 144 of the fifth voltage conversion module 140, the seventh power rail 417, the eighth power rail 418, the ninth power rail 419, and the tenth power rail 420 can output a fifth current of up to 25A. Therefore, the fifth voltage conversion module 140 can supply power to the first type of load 51 in the FPGA chip by directly outputting four currents of the same magnitude through its four output channels. This disclosure achieves power supply to four power rails with a single fifth voltage conversion module 140, eliminating the need for a separate voltage conversion module for each power rail. This reduces the number of circuit modules used, optimizes the power supply circuit design, and lowers the manufacturing cost of the power supply circuit.
[0061] It should be noted that the maximum output current of the external power supply 30 is 100A for example only. The maximum output current of the external power supply 30 needs to be determined according to the actual situation, and no specific limit is made here.
[0062] Preferably, the upper limit of the first current is the same as the upper limit of the third current, the upper limit of the second current is greater than the upper limit of the first current, the upper limit of the fourth current is the same as the upper limit of the fifth current, and the upper limit of the fourth current is also less than the upper limit of the first current.
[0063] Preferred, Figure 7 This is a schematic diagram of a preferred power supply circuit for an FPGA chip provided in an embodiment of the present disclosure, as shown below. Figure 7 As shown, the primary power supply module includes a first voltage conversion module 110, a third voltage conversion module 120, a fourth voltage conversion module 130, and a fifth voltage conversion module 140. The secondary power supply module includes a second voltage conversion module 21 and a voltage regulator module 22. The first type of power rails includes a first power rail 411, a second power rail 412, a third power rail 413, a fourth power rail 414, a fifth power rail 415, a sixth power rail 416, a seventh power rail 417, an eighth power rail 418, a ninth power rail 419, and a tenth power rail 420.
[0064] The first output channel 111 of the first voltage conversion module 110 is connected in parallel with the second output channel 112 of the first voltage conversion module 110, and the first output channel 111 of the first voltage conversion module 110 is connected to the first power rail 411. The third output channel 113 of the first voltage conversion module 110 is connected in parallel with the fourth output channel 114 of the first voltage conversion module 110, and the third output channel 113 of the first voltage conversion module 110 is connected to the second power rail 412.
[0065] The first output channel 121 of the third voltage conversion module 120 is connected in parallel with the second output channel 122, the third output channel 123 and the fourth output channel 124 of the third voltage conversion module 120. The first output channel 121 of the third voltage conversion module 120 is connected to the third power rail 413.
[0066] The first output channel 131 of the fourth voltage conversion module 130 is connected in parallel with the second output channel 132 of the fourth voltage conversion module 130, and the first output channel 131 of the fourth voltage conversion module 130 is connected to the fourth power rail 414; the third output channel 133 of the fourth voltage conversion module 130 is connected to the fifth power rail 415, and the fourth output channel 134 of the fourth voltage conversion module 130 is connected to the sixth power rail 416.
[0067] The first output channel 141 of the fifth voltage conversion module 140 is connected to the seventh power rail 417, the second output channel 142 of the fifth voltage conversion module 140 is connected to the eighth power rail 418, the third output channel 143 of the fifth voltage conversion module 140 is connected to the ninth power rail 419, and the fourth output channel 144 of the fifth voltage conversion module 140 is connected to the tenth power rail 420.
[0068] The input channel of the second voltage conversion module 21 is connected to the first power rail 411, the input channel of the voltage regulator module 22 is connected to the second power rail 412, and the output channels of the second voltage conversion module 21 and the voltage regulator module 22 are respectively connected to the corresponding second type of power rail 42.
[0069] For example, the maximum output current of the external power supply 30 is 100A. The first voltage conversion module 110 provides two first currents, each with a maximum of 50A, through the first power rail 411 and the second power rail 412. The third voltage conversion module 120 provides one second current, with a maximum of 100A, through the third power rail 413. The fourth voltage conversion module 130 provides one third current, with a maximum output of 50A, through the fourth power rail 414, and outputs one fourth current, with a maximum of 25A, through the fifth power rail 415 and the sixth power rail 416. The fifth voltage conversion module 140 outputs four fifth currents, each with a maximum of 25A, through the seventh power rail 417, the eighth power rail 418, the ninth power rail 419, and the tenth power rail 420. The first power rail 411 and the second power rail 412 are used to supply power to the secondary power module 20. The third power rail 413, the fourth power rail 414, the fifth power rail 415, the sixth power rail 416, the seventh power rail 417, the eighth power rail 418, the ninth power rail 419, and the tenth power rail 420 can all be used to supply power to the first type of load 51. Thus, this disclosure can provide ten power rails by using four voltage conversion modules: the first voltage conversion module 110, the third voltage conversion module 120, the fourth voltage conversion module 130, and the fifth voltage conversion module 140. Therefore, it is not necessary to set up a module for voltage conversion for each power rail, thereby reducing the number of circuit modules used, optimizing the circuit design of the power supply circuit, and reducing the manufacturing cost of the power supply circuit.
[0070] Since the first power rail 411 and the second power rail 412 provide a maximum current of 50A, for the second type of load 52 with the same power demand as the output current of the power rails, the secondary power module 20 outputs the current provided by the second power rail 412 to the second type of load 52 through the voltage regulator module 22. The voltage regulator module 22 is used to reduce the output ripple and noise of the current signal and improve the accuracy of the current signal while keeping the output current constant. For the second type of load 52 with a different power demand than the output current of the power rails, the secondary power module 20 outputs the current provided by the first power rail 411 to the second type of load 52 after transformation through the second voltage conversion module 21. The second voltage conversion module 21 is used to reduce the output ripple and noise of the current signal and improve the accuracy of the current signal while converting the output current to the current required by the second type of load 52. Thus, this disclosure realizes the ability to provide different currents according to different power demands of the FPGA chip 50, as well as to provide currents with higher accuracy.
[0071] It should be noted that the maximum output current of the external power supply 30 is 100A for example only. The maximum output current of the external power supply 30 needs to be determined according to the actual situation, and no specific limit is made here.
[0072] Figure 8 This is a cross-sectional view of a multilayer circuit board provided in an embodiment of this disclosure. The multilayer circuit board is applied to the power supply circuit corresponding to any of the above embodiments. The secondary power module includes at least one second voltage conversion module and at least one voltage regulator module, such as... Figure 8 As shown, the multilayer circuit board includes: a top layer 61, multiple intermediate layers 62, and a bottom layer 63. The primary power supply module and voltage regulator module are located on the top layer 61; the secondary voltage conversion module is located on the bottom layer 63.
[0073] Specifically, the primary power module includes multiple voltage conversion modules. If both the primary power module and the second voltage conversion module are located on the top layer 61, the heat generated by these modules during operation will concentrate on the top layer, which is detrimental to the heat dissipation of the entire multilayer circuit board. Therefore, placing the voltage conversion modules in the primary power module on the top layer 61 and the second voltage conversion module on the bottom layer 63 prevents heat from concentrating on the top layer 61, thus improving the heat dissipation of the multilayer circuit board. Furthermore, with the voltage regulator module located on the top layer 61 and the second voltage conversion module on the bottom layer 63, and multiple intermediate layers 62 between the top layer 61 and the bottom layer 63, crosstalk between the voltage regulator module and the second voltage conversion module can be isolated through the intermediate layers 62, thereby enabling the voltage regulator module and the second voltage conversion module to output more accurate current signals.
[0074] In some embodiments, the plurality of intermediate layers include at least one power layer; a first type of power rail and a second type of power rail are disposed on the power layer; wherein both the first type of power rail and the second type of power rail are copper-clad.
[0075] For example, multiple intermediate layers may include a first power layer and a second power layer. First-type power rails and second-type power rails can be respectively disposed on the first and second power layers, thereby preventing crosstalk between the first-type and second-type power rails. Furthermore, due to the increased number of power layers, the overall area of the power layers increases, and the distance between adjacent power rail traces during layout also increases, similarly preventing crosstalk between adjacent power rail traces, thus increasing the accuracy of the current signals output by the first-type and second-type power rails. Both the first-type and second-type power rails are copper-clad, and the width of the copper foil must meet the current transmission requirements, thereby ensuring power supply stability.
[0076] It should be noted that the multiple intermediate layers, including the first power layer and the second power layer, are only examples. The specific number of power layers needs to be determined according to the actual situation, and no specific limit is made here.
[0077] In some embodiments, the plurality of intermediate layers include at least one high-speed signal layer; the wiring direction of the high-speed signal layer intersects with the wiring direction of the power layer.
[0078] For example, the multiple intermediate layers include a first high-speed signal layer and a second high-speed signal layer, with other intermediate layers disposed between the first and second high-speed signal layers. This allows adjacent high-speed signal layers to be shielded by other intermediate layers, thereby effectively reducing parasitic inductance. Furthermore, the intersection of the wiring direction of the high-speed signal layer and the wiring direction of the power layer can reduce crosstalk between the power layer and the high-speed signal layer.
[0079] Preferably, the wiring direction of the high-speed signal layer is orthogonal to the wiring direction of the power layer.
[0080] Preferably, in order to match the impedance of the pads with the impedance of other devices, a cutout design can be made under the pads to avoid the influence of large pads on the microstrip lines.
[0081] This disclosure also provides an FPGA chip, which is connected to the power supply circuit corresponding to any of the above embodiments.
[0082] It is understood that the FPGA chip provided in this application embodiment can achieve the corresponding beneficial effects of the power supply circuit provided in the above embodiments, which will not be elaborated here.
[0083] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.
[0084] The above are merely specific embodiments of this disclosure, enabling those skilled in the art to understand or implement this disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not to be limited to these embodiments, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A power supply circuit for an FPGA chip, characterized in that, include: A primary power module is connected to an external power source; the primary power module includes multiple voltage conversion modules; each voltage conversion module is connected to at least one Class I power rail. A secondary power supply module is connected to at least one of the voltage conversion modules, and the secondary power supply module is connected to at least one Class II power rail; The first type of power rail is used to supply power to the first type of load and the secondary power module, and the second type of power rail is used to supply power to the second type of load.
2. The power supply circuit according to claim 1, characterized in that, The primary power module includes a first voltage conversion module; the first type of power rail includes a first power rail and a second power rail. The first output channel of the first voltage conversion module is connected in parallel with the second output channel of the first voltage conversion module, and the first output channel of the first voltage conversion module is connected to the first power rail. The third output channel of the first voltage conversion module is connected in parallel with the fourth output channel of the first voltage conversion module, and the third output channel of the first voltage conversion module is connected to the second power rail. The first voltage conversion module is used to supply power through the first power rail and the second power rail; the first power rail and the second power rail are used to provide a first current.
3. The power supply circuit according to claim 2, characterized in that, The secondary power module includes at least one second voltage conversion module and at least one voltage regulator module; The input channel of the second voltage conversion module is connected to the first power rail, and the input channel of the voltage regulator module is connected to the second power rail; The output channels of the second voltage conversion module and the voltage regulator module are respectively connected to the corresponding second type of power rail to supply power to the second type of load.
4. The power supply circuit according to claim 1, characterized in that, The primary power module includes a third voltage conversion module; the first type of power rail includes a third power rail. The first output channel of the third voltage conversion module is connected in parallel with the second output channel, the third output channel, and the fourth output channel of the third voltage conversion module, and the first output channel of the third voltage conversion module is connected to the third power rail. The third voltage conversion module is used to supply power to the first type of load through the third power rail; the third power rail is used to provide a second current.
5. The power supply circuit according to claim 1, characterized in that, The primary power module includes a fourth voltage conversion module; the first type of power rail includes a fourth power rail, a fifth power rail, and a sixth power rail. The first output channel of the fourth voltage conversion module is connected in parallel with the second output channel of the fourth voltage conversion module, and the first output channel of the fourth voltage conversion module is connected to the fourth power rail; the third output channel of the fourth voltage conversion module is connected to the fifth power rail, and the fourth output channel of the fourth voltage conversion module is connected to the sixth power rail. The fourth voltage conversion module is used to supply power to the first type of load through the fourth power rail, the fifth power rail and the sixth power rail; the fourth power rail is used to provide a third current, and the fifth power rail and the sixth power rail are used to provide a fourth current.
6. The power supply circuit according to claim 1, characterized in that, The primary power module includes a fifth voltage conversion module; the first type of power rail includes a seventh power rail, an eighth power rail, a ninth power rail, and a tenth power rail. The first output channel of the fifth voltage conversion module is connected to the seventh power rail, the second output channel of the fifth voltage conversion module is connected to the eighth power rail, the third output channel of the fifth voltage conversion module is connected to the ninth power rail, and the fourth output channel of the fifth voltage conversion module is connected to the tenth power rail. The fifth voltage conversion module is used to supply power to the first type of load through the seventh power rail, the eighth power rail, the ninth power rail and the tenth power rail; the seventh power rail, the eighth power rail, the ninth power rail and the tenth power rail are all used to provide the fifth current.
7. A multilayer circuit board, characterized in that, Applied to the power supply circuit as described in any one of claims 1-6, the secondary power supply module includes at least one second voltage conversion module and at least one voltage regulator module, comprising: The primary power supply module and the voltage regulator module are located on the top layer. Multiple intermediate layers; The second voltage conversion module is located on the bottom layer.
8. The multilayer circuit board according to claim 7, characterized in that, The plurality of intermediate layers includes at least one power layer; The first type of power rail and the second type of power rail are disposed on the power layer; wherein the first type of power rail and the second type of power rail are both copper-clad.
9. The multilayer circuit board according to claim 8, characterized in that, The plurality of intermediate layers includes at least one high-speed signal layer; The wiring direction of the high-speed signal layer intersects with the wiring direction of the power layer.
10. An FPGA chip, characterized in that, It is connected to the power supply circuit according to any one of claims 1-6.