一种高性能弹性触点连接套件
By using a high-performance flexible contact connection kit, the DRAM chip is directly connected to the motherboard, which solves the transmission performance bottleneck and manufacturing complexity of traditional memory module connection structures, achieving higher memory bandwidth and stability, and facilitating memory upgrades.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN INTEPUZE TECHNOLOGY CO LTD
- Filing Date
- 2025-04-28
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional memory module and motherboard connection structures suffer from transmission performance bottlenecks, complex manufacturing processes, and high costs. In particular, in DDR5 memory modules, the dense gold fingers and complex topology circuits on the PCB board lead to bandwidth loss and increased manufacturing difficulty.
It adopts a high-performance flexible contact connection kit, including a positioning plate, an insulating elastomer, and a conductive colloid, to directly connect the DRAM chip to the motherboard, eliminating soldering and redundant lines. Direct signal transmission is achieved through the conductive colloid, increasing the number of I/Os and shortening the connection path.
It greatly shortens the path between the chip and the motherboard, reduces signal loss, increases memory bandwidth, improves connection stability, and supports convenient memory upgrades.
Smart Images
Figure CN224520229U_ABST
Abstract
Claims
1. A high performance elastic contact connection kit, characterized in that, include: The positioning plate has one or more positioning areas; the positioning plate also has a positioning part; An insulating elastomer is disposed in the positioning area; A conductive colloid, wherein there are multiple conductive colloids arranged in a predetermined conductive position on the insulating elastomer, and both ends of the conductive colloids are exposed on the end face of the insulating elastomer; The motherboard is provided with an array connector corresponding to the conductive colloid of the array; the motherboard is also provided with a first connecting part corresponding to the positioning part.
2. A high performance elastomeric contact connection kit according to claim 1, wherein, Each of the conductive colloids is isolated from the others, and the center-to-center distance between adjacent conductive colloids is at least 0.15 mm.
3. A high performance elastomeric contact connector assembly according to claim 1, wherein, The thickness of the positioning plate is 0.1 to 2 mm.
4. A high performance elastomeric contact connector assembly according to claim 1, wherein, The conductive colloid is an elastic conductor composed of a mixture of silicone and conductive powder.
5. A high performance elastomeric contact connector assembly according to claim 4, wherein, The conductive powder is either nickel powder or iron powder, which has magnetic attraction properties, and the particle size of the conductive powder is 10 to 60 micrometers; the surface of the conductive powder is plated with gold, silver or palladium.
6. A high performance elastomeric contact connector assembly according to claim 1, wherein, It includes a pressure plate, which has a second connecting part, and the second connecting part is correspondingly connected to the positioning part and the first connecting part.
7. A high performance elastomeric contact connector assembly according to claim 1, wherein, The conductive colloid is perpendicularly inserted through the insulating elastomer.
8. A high performance elastomeric contact connector assembly according to claim 1, wherein, The insulating elastomer is made of silicone; the positioning plate is made of stainless steel or a rigid insulating material. When the positioning plate is made of stainless steel, the end face of the positioning plate opposite to the main board is provided with an insulating fiber layer, and the insulating fiber layer is provided with a clearance hole corresponding to the conductive colloid.
9. A high performance elastomeric contact connector assembly according to claim 8, wherein, The insulating fiber layer is a polyimide film with a thickness of 0.05 to 0.2 mm.
10. A high performance elastomeric contact connector assembly according to claim 1, wherein, The positioning part is a through hole, and the first connecting part and the second connecting part are mating holes corresponding to the through hole.