Backlight module and display device

Abstract

The application relates to the display field and specifically discloses a backlight module and a display device, which comprise a lamp plate and a light guide plate, the light guide plate is located on one side of a light emitting surface of the lamp plate, and the lamp plate comprises a first plate and a second plate. The first plate is connected with the second plate, a plurality of lamp beads are arranged on the first plate at intervals, a plurality of supporting strips are arranged on the second plate at intervals, the light guide plate is mounted on the supporting strips, and the supporting strips support the light guide plate to a preset height relative to the second plate. The application improves the problem that the temperature of the lamp beads is increased and the lamp beads are aged due to the fact that heat is concentrated around the lamp beads, and improves the heat dissipation efficiency of the lamp plate.

Description

Technical Field

[0001] This application relates to the field of displays, and more particularly to a backlight module and a display device. Background Technology

[0002] Due to the spatial limitations between the traditional lamp board and light guide plate, hot airflow is not easy to circulate, causing heat to easily concentrate near the lamp beads. This results in the lamp beads' temperature continuously rising, accelerating their aging.

[0003] Therefore, improving the heat generated by the lamp board and reducing its excessive concentration near the LED beads, as well as enhancing the heat dissipation effect of the backlight module, has become an urgent problem to be solved in this field. Utility Model Content

[0004] This application discloses a backlight module and a display device, the purpose of which is to improve the heat dissipation effect of the backlight module by addressing the problem that the heat generated by the lamp board is too concentrated near the lamp beads, which leads to the lamp beads aging due to increased temperature.

[0005] This application discloses a backlight module, including a lamp board and a light guide plate. The light guide plate is located on one side of the light-emitting surface of the lamp board. The lamp board includes a first plate and a second plate. The first plate is connected to the second plate. A plurality of LED beads are spaced apart on the first plate. A plurality of support strips are spaced apart on the second plate. The light guide plate is mounted on the plurality of support strips. The plurality of support strips support the light guide plate at a preset height relative to the second plate.

[0006] Optionally, the backlight module further includes a back plate, which includes a side plate and a bottom plate. The side plate is connected to the edge of the bottom plate, the first plate is connected to the side plate, the second plate is connected to the bottom plate, and the first plate is perpendicular to the second plate.

[0007] Optionally, a heat dissipation device is provided on the second plate between two adjacent support bars, the heat dissipation device being used to sweep away the hot airflow around the lamp beads.

[0008] Optionally, the heat dissipation device includes multiple fans, each fan corresponding one-to-one with the position of each LED between two adjacent support bars.

[0009] Optionally, the heat dissipation device includes a fan, at least two LED beads are positioned between two adjacent support bars, and at least two LED beads form a light-emitting group, with the fan corresponding to the position of each light-emitting group.

[0010] Optionally, a main control chip is provided on the second board. The main control chip is connected to the fan signal and is used to control the fan to turn on or off.

[0011] Optionally, a photoelectric sensor is also provided on the first board. The photoelectric sensor is connected to the main control chip. The photoelectric sensor is used to detect the brightness of the LED beads and transmit the detection signal to the main control chip. The main control chip controls the current transmitted to the fan according to the acquired detection signal, so as to control the speed of the fan.

[0012] Optionally, each of the support bars has an opening corresponding to the position of the fan, and the width of the opening is greater than or equal to the width of the fan.

[0013] Optionally, the back plate includes a first sidewall and a second sidewall disposed opposite to each other along the length direction of the lamp plate. The first sidewall is provided with a first opening, and the second sidewall is provided with a second opening. The first opening and the second opening are respectively located between the light guide plate and the second plate.

[0014] This application also discloses a display device, including a housing, and the display device further includes the backlight module described above. The backlight module is disposed inside the housing and connected to the housing.

[0015] This application improves upon traditional backlight modules. The backlight module's lamp board comprises a first board and a second board. Multiple LEDs are mounted on the first board, while multiple support strips are provided on the second board. Firstly, a light guide plate is mounted on the support strips, connecting the light guide plate to the second board via the support strips. This allows both the LEDs and the light guide plate, serving as the light source, to be mounted on the lamp board. Secondly, the support strips support the light guide plate at a predetermined height relative to the second board, creating a cavity between the second board and the light guide plate. This allows heat generated by the LEDs to circulate between the LEDs and the light guide plate, as well as within the cavity between the light guide plate and the second board. This facilitates the exchange of hot air with the surrounding cooler air, preventing heat from concentrating near the LEDs, reducing their temperature, slowing down their aging, and ultimately improving the heat dissipation of the backlight module. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the embodiments of this application and form part of the specification. They serve to demonstrate implementation methods of this application and, together with the textual description, explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort. In the drawings:

[0017] Figure 1 This is a schematic diagram of the first embodiment of the backlight module of this application;

[0018] Figure 2 This is a schematic diagram of a second embodiment of the backlight module of this application;

[0019] Figure 3 This is a schematic diagram of the third embodiment of the backlight module of this application;

[0020] Figure 4 This is a schematic diagram of the fourth embodiment of the backlight module of this application;

[0021] Figure 5 This is a schematic diagram of the fifth embodiment of the backlight module of this application;

[0022] Figure 6 This is a schematic diagram of the sixth embodiment of the backlight module of this application;

[0023] Figure 7 This is a schematic diagram of an embodiment of the display device of this application.

[0024] Among them, 10 is a display device; 100 is a backlight module; 200 is a housing; 110 is a lamp board; 111 is a first board; 112 is an LED bead; 113 is a light-emitting group; 114 is a photoelectric sensor; 120 is a second board; 121 is a support bar; 122 is an opening; 123 is a main control chip; 130 is a light guide plate; 140 is a back plate; 141 is a side plate; 142 is a bottom plate; 143 is a first side wall; 144 is a first opening; 145 is a second side wall; 146 is a second opening; 150 is a heat dissipation device; and 151 is a fan. Detailed Implementation

[0025] The present application will now be described in detail with reference to the accompanying drawings and optional embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0026] Figure 1 This is a schematic diagram of the first embodiment of the backlight module of this application. This application discloses a backlight module 100, including a lamp board 110 and a light guide plate 130. The light guide plate 130 is located on one side of the light-emitting surface of the lamp board 110. The lamp board 110 includes a first plate 111 and a second plate 120. The first plate 111 is connected to the second plate 120. A plurality of lamp beads 112 are spaced apart on the first plate 111. A plurality of support strips 121 are spaced apart on the second plate 120. The light guide plate 130 is mounted on the plurality of support strips 121. The plurality of support strips 121 support the light guide plate 130 relative to the second plate 120 at a preset height.

[0027] This application improves upon the traditional backlight module 100. In this application, the lamp board 110 of the backlight module 100 consists of two parts: a first board 111 and a second board 120. Multiple LEDs 112 are mounted on the first board 111, and multiple support strips 121 are provided on the second board 120. On one hand, a light guide plate 130 is mounted on the multiple support strips 121, connecting the light guide plate 130 to the second board 120 of the lamp board 110 via the support strips 121. This allows both the multiple LEDs 112, which serve as the light source, and the light guide plate 130 to be mounted on the lamp board 110. On the other hand, the support strips... The support bar 121 supports the light guide plate 130 at a preset height relative to the second plate 120, so that a cavity is formed between the second plate 120 and the light guide plate 130. In this way, the heat generated by the lamp bead 112 can flow between the lamp bead 112 and the light guide plate 130 and the cavity between the light guide plate 130 and the second plate 120. This helps the hot air to exchange with the relatively cool air around it, so that the heat is not easy to concentrate near the lamp bead 112, which helps to reduce the temperature of the lamp bead 112, slow down the aging speed of the lamp bead 112, and thus improve the heat dissipation effect of the backlight module 100.

[0028] In this embodiment of the application, the backlight module 100 further includes a back plate 140, which includes a side plate 141 and a bottom plate 142. The edges of the side plate 141 and the bottom plate 142 are connected. A first plate 111 is connected to the side plate 141, and a second plate 120 is connected to the bottom plate 142. The first plate 111 and the second plate 120 are perpendicular to each other.

[0029] Since the first plate 111 is perpendicular to the second plate 120, when the light guide plate 130 is installed on the multiple support bars 121, the light guide plate 130 is also perpendicular to the first plate 111. This causes the heat convection direction generated by the multiple LED beads 112 on the first plate 111 to be exactly towards the cavity formed between the light guide plate 130 and the second plate 120. The hot airflow can easily circulate in the gap between the LED beads 112 and the light guide plate 130, as well as in the cavity between the light guide plate 130 and the second plate 120. This helps the hot airflow to exchange with the relatively cool air around it, so that the heat is not easily concentrated near the LED beads 112. This helps to reduce the temperature of the LED beads 112 and slow down the aging speed of the LED beads 112, thereby improving the heat dissipation effect of the backlight module 100.

[0030] In addition, the first plate 111 and the second plate 120 of the lamp panel 110 can be fixed to the side plate 141 and the bottom plate 142 of the back plate 140 respectively by screws. Compared with the traditional lamp panel installation method, the tedious process of applying thermal conductive adhesive and lamp strips is eliminated, which further improves production efficiency.

[0031] Furthermore, in order to accelerate the flow of hot air between the lamp panel 110 and the light guide plate 130, thereby accelerating the exchange of hot and cold air and improving the heat dissipation speed, this application also makes improvements to the backlight module, the specific improvements of which are as follows:

[0032] Figure 2 This is a schematic diagram of a second embodiment of the backlight module of this application, as shown below. Figure 2 As shown, a heat dissipation device 150 is provided on the second plate 120 between two adjacent support bars 121. The heat dissipation device 150 is used to sweep away the hot airflow around the lamp bead 112.

[0033] The difference between this embodiment and the previous embodiment is that this embodiment adopts an active heat dissipation method. A heat dissipation device 150 is also provided between two adjacent support bars 121. The heat dissipation device 150 is located in the cavity between the light guide plate 130 and the second plate 120, and sweeps the hot air generated by the lamp bead 112. The active sweeping of the heat dissipation device 150 accelerates the circulation of hot air in the cavity, and to a certain extent drives the circulation of hot air between the lamp bead 112 and the light guide plate 130, thereby accelerating the heat exchange between the hot air and the relatively cool air around it. This allows the hot air to be quickly carried away from the vicinity of the heat source (lamp bead 112), so that heat is not easily concentrated near the lamp bead 112, which helps to reduce the temperature of the lamp bead 112, slow down the aging speed of the lamp bead 112, and thus improve the heat dissipation effect of the backlight module 100.

[0034] Specifically, the heat dissipation device 150 includes multiple fans 151, and each fan 151 corresponds one-to-one with the position of each LED 112 between two adjacent support bars 121.

[0035] In this embodiment, multiple fans 151 can share a control circuit with the lamp board 110, or they can be connected by an additional circuit. Controlling the lamp board 110 and the fans 151 to turn on and off at the same time through the same control circuit is a conventional design, and will not be described in detail here.

[0036] When the lamp board 110 starts working, the fans 151 start simultaneously. Multiple fans 151 sweep the hot air generated by the lamp beads 112 in the cavity between the light guide plate 130 and the second plate 120. Since each lamp bead 112 has a corresponding fan 151 for sweeping, the heat generated between two adjacent lamp beads 112 is less likely to interfere with each other. The hot airflow generated by each lamp bead 112 can be quickly carried away from the heat source (each lamp bead). The active sweeping of the fans 151 accelerates the circulation of hot air in the cavity and, to a certain extent, promotes the circulation of hot airflow between the lamp beads 112 and the light guide plate 130. This accelerates the heat exchange between the hot airflow and the relatively cooler airflow around it, so that the hot airflow is quickly carried away from the vicinity of the heat source (lamp beads 112). This makes it less likely for heat to concentrate near the lamp beads 112, which helps to reduce the temperature of the lamp beads 112, slows down the aging speed of the lamp beads 112, and thus improves the heat dissipation effect of the backlight module 100.

[0037] Figure 3 This is a schematic diagram of the third embodiment of the backlight module of this application, as shown below. Figure 3 As shown, Figure 3 The illustrated embodiment is based on Figure 2 The improvement includes a fan 151 in the heat dissipation device 150, at least two LED beads 112 between two adjacent support bars 121, and at least two LED beads 112 form a light-emitting group 113. The fan 151 is positioned corresponding to each light-emitting group 113.

[0038] The difference between this embodiment and the previous embodiment is that in this embodiment, a fan 151 sweeps the hot airflow around at least two LED beads 112. On the one hand, this can effectively reduce the number of fans 151 and save costs. On the other hand, since the heat between two adjacent LED beads 112 is prone to interference under normal circumstances, the heat between multiple LED beads 112 is often higher. Therefore, by using a fan 151 to actively sweep the heat generated by the light-emitting group 113 formed by at least two LED beads 112, the heat generated by multiple LED beads 112 as a whole can be effectively reduced, thereby improving the heat dissipation efficiency of the backlight module 100.

[0039] Figure 4 This is a schematic diagram of the fourth embodiment of the backlight module of this application, as shown below. Figure 4 As shown, in this embodiment, a main control chip 123 is provided on the second board 120. The main control chip 123 is connected to the fan 151 by a signal and is used to control the fan 151 to turn on or off.

[0040] In this embodiment, the main control chip 123 controls the opening and closing of the fan 151. The main control chip 123 can have a separate signal path to each fan 151. The main control chip 123 controls the opening and closing of each fan 151 and provides an electrical signal to each fan 151. The speed of the fan 151 is controlled by the magnitude of the electrical signal. In this way, the fan 151 corresponding to the lamp bead 112 with abnormal heat can be targeted to blow air according to the heat status of different lamp beads 112 on the lamp board 110. The blowing force of the fan 151 can be adjusted according to the heat status of the lamp bead 112. This can effectively control the overheating problem of local lamp beads 112 and help to achieve zoned heat dissipation.

[0041] Specifically, a photoelectric sensor 114 is also provided on the first board 111. The photoelectric sensor 114 is connected to the main control chip 123. The photoelectric sensor 114 is used to detect the brightness of the lamp bead 112 and transmits the detection signal to the main control chip 123. The main control chip 123 controls the current transmitted to the fan 151 according to the acquired detection signal, so as to control the speed of the fan 151.

[0042] It is understandable that the higher the brightness of the LED bead 112, the greater the heat generation. Therefore, in this embodiment, the brightness of the LED bead 112 is detected in real time by the photoelectric sensor 114, and the detection signal is transmitted to the main control chip 123. The main control chip 123 determines whether the heating of the LED bead 112 is abnormal based on the acquired detection signal, and then controls the corresponding fan 151 to turn on. The fan 151 sweeps the hot airflow generated near the LED bead 112 that is experiencing abnormal heating in the cavity between the light guide plate 130 and the second plate 120, utilizing... The active sweeping of fan 151 accelerates the circulation of hot air in the cavity and, to a certain extent, drives the circulation of hot air between LED 112 and light guide plate 130. This accelerates the heat exchange between the hot air near the abnormally hot LED 112 and the relatively cool air around it, so that the hot air is quickly carried away from the heat source (LED 112). This makes it less likely for heat to concentrate near LED 112, which helps to reduce the temperature of LED 112 and slow down the aging speed of LED 112, thereby improving the heat dissipation effect of backlight module 100.

[0043] Figure 5 This is a schematic diagram of the fifth embodiment of the backlight module of this application, as shown below. Figure 5 As shown, each support bar 121 has an opening 122 at the position corresponding to the fan 151, and the width of the opening 122 is greater than or equal to the width of the fan 151.

[0044] The difference between this embodiment and the previous embodiment is that in this embodiment, each support bar 121 is provided with an opening 122 at the position corresponding to the fan 151. The airflow between two adjacent fans 151 can be facilitated through the opening 122, which helps to accelerate the airflow in the cavity between the light guide plate 130 and the second plate 120. This makes it easier for the hot airflow generated by the lamp bead 112 to exchange with the relatively cool air around it, so that the heat is less likely to concentrate near the lamp bead 112. This helps to reduce the temperature of the lamp bead 112, slow down the aging speed of the lamp bead 112, and thus improve the heat dissipation effect of the backlight module 100.

[0045] Furthermore, when the width of the opening 122 is greater than or equal to the width of the fan 151, the airflow generated by the rotation of the fan 151 is not easily blocked by the support strip 121, and can flow relatively smoothly through the opening 122 on the support strip 121 in various areas of the cavity formed between the light guide plate 130 and the second plate 120, thereby helping to accelerate the airflow in the cavity between the light guide plate 130 and the second plate 120, thereby improving the heat dissipation effect of the backlight module 100.

[0046] Figure 6 This is a schematic diagram of the sixth embodiment of the backlight module of this application, as shown below. Figure 6 As shown, the back panel 140 includes a first sidewall 143 and a second sidewall 145 arranged opposite to each other along the length of the lamp panel 110. The first sidewall 143 is provided with a first opening 144, and the second sidewall 145 is provided with a second opening 146. The first opening 144 and the second opening 146 are respectively located between the light guide plate 130 and the second plate 120.

[0047] The difference between this embodiment and the previous embodiment is that, in this embodiment, a first opening 144 and a second opening 146 are respectively provided on the first side wall 143 and the second side wall 145 of the back plate 140, wherein the first side wall 143 and the second side wall 145 can be the opposite side plates on the left and right sides of the back plate 140.

[0048] The internal space of the back panel 140 is connected to the external space of the back panel 140 through the first opening 144 and the second opening 146. The first opening 144 can be used as an air inlet and the second opening 146 can be used as an air outlet. Cold air from the external environment can enter the back panel 140 through the first opening 144, thereby accelerating the air circulation under the drive of the fan 151 and flowing out through the second opening 146, carrying the hot airflow to the external environment. This allows the heat generated by the LED 112 to be quickly carried away from the vicinity of the heat source (LED 112), preventing heat from accumulating at the location of the LED 112. This effectively reduces the temperature of the LED 112, improves the aging problem of the LED 112 caused by the increase in the temperature of the LED 112, and enhances the heat dissipation effect of the backlight module 100.

[0049] Figure 7 This is a schematic diagram of an embodiment of the display device of this application, as shown below. Figure 7 As shown in the illustration, this application also discloses a display device 10, including a housing 200. The display device 10 further includes the aforementioned backlight module 100, which is disposed within and connected to the housing 200. The housing 200 protects the backlight module 100 from damage by external forces and, to a certain extent, prevents external moisture and dust from entering the backlight module 100 and causing corrosion, thus extending the service life of the backlight module 100.

[0050] In a traditional display device 10, the lamps 112 on the backlight module 100 tend to generate a lot of heat during long-term operation. The heat is not easily dissipated between the lamp panel 110 and the light guide plate 130, causing the heat to concentrate near the lamps 112. This leads to the lamps 112 aging due to increased temperature, which in turn affects the quality and lifespan of the display device 10.

[0051] Based on the above problems, this application improves the backlight module 100 in the conventional display device 10. In this application, the lamp board 110 of the backlight module 100 is composed of two parts: a first board 111 and a second board 120. Multiple LEDs 112 are mounted on the first board 111, and multiple support strips 121 are provided on the second board 120. On the one hand, a light guide plate 130 is mounted on the multiple support strips 121, so that the light guide plate 130 is connected to the second board 120 of the lamp board 110 through the support strips 121. This allows the multiple LEDs 112, which serve as the light source, and the light guide plate 130 to be mounted on the lamp board 110. On the other hand, the support strips 121... The light guide plate 130 is supported at a preset height relative to the second plate 120, so that a cavity is formed between the second plate 120 and the light guide plate 130. In this way, the heat generated by the lamp bead 112 can flow between the lamp bead 112 and the light guide plate 130 and the cavity between the light guide plate 130 and the second plate 120. This helps the hot air to exchange with the relatively cool air around it, so that the heat is not easily concentrated near the lamp bead 112. This helps to reduce the temperature of the lamp bead 112, slow down the aging speed of the lamp bead 112, improve the heat dissipation effect of the backlight module 100, and thus improve the quality and service life of the display device 10.

[0052] It should be noted that the inventive concept of this application can form many embodiments, but due to the limited space of the application documents, they cannot all be listed. Therefore, without conflict, the embodiments described above or the technical features can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effect will be enhanced.

[0053] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. A backlight module, comprising a lamp panel and a light guide plate, wherein the light guide plate is located on one side of the light-emitting surface of the lamp panel, characterized in that, The lamp panel includes a first plate and a second plate, the first plate being connected to the second plate, and a plurality of lamp beads being spaced apart on the first plate. The second plate is provided with a plurality of support strips at intervals, and the light guide plate is mounted on the plurality of support strips. The plurality of support strips support the light guide plate at a preset height relative to the second plate.

2. The backlight module according to claim 1, characterized in that, The backlight module also includes a back plate, which includes a side plate and a bottom plate. The side plate is connected to the edge of the bottom plate. The first plate is connected to the side plate, and the second plate is connected to the bottom plate. The first plate and the second plate are perpendicular to each other.

3. The backlight module according to claim 2, characterized in that, A heat dissipation device is provided on the second plate between two adjacent support bars. The heat dissipation device is used to sweep away the hot airflow around the lamp beads.

4. The backlight module according to claim 3, characterized in that, The heat dissipation device includes multiple fans, and each fan corresponds one-to-one with the position of each LED between two adjacent support bars.

5. The backlight module according to claim 3, characterized in that, The heat dissipation device includes a fan, and at least two LED beads are located between two adjacent support bars. At least two LED beads form a light-emitting group, and the fan corresponds to the position of each light-emitting group.

6. The backlight module according to claim 4 or 5, characterized in that, The second board is equipped with a main control chip, which is connected to the fan signal and is used to control the fan to turn on or off.

7. The backlight module according to claim 6, characterized in that, The first board is also equipped with a photoelectric sensor, which is connected to the main control chip via signal transmission. The photoelectric sensor is used to detect the brightness of the LED beads and transmit the detection signal to the main control chip. The main control chip controls the current transmitted to the fan based on the acquired detection signal, so as to control the speed of the fan.

8. The backlight module according to claim 7, characterized in that, Each of the support bars has an opening corresponding to the position of the fan, and the width of the opening is greater than or equal to the width of the fan.

9. The backlight module according to claim 8, characterized in that, The back plate includes a first sidewall and a second sidewall that are arranged opposite to each other along the length of the lamp plate. The first sidewall has a first opening and the second sidewall has a second opening. The first opening and the second opening are respectively located between the light guide plate and the second plate.

10. A display device, comprising a housing, characterized in that, The display device further includes a backlight module as described in any one of claims 1 to 9, wherein the backlight module is disposed within the housing and connected to the housing.

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