Circuit device cooling structure, cooling liquid channel structural member, all-in-one machine and new energy vehicle

Abstract

The utility model discloses a kind of circuit equipment cooling structure, circuit equipment cooling liquid channel structural member, OBC and DCDC integrated machine and new energy vehicle, the circuit equipment cooling structure includes PCB mainboard, multiple heating circuit devices and the cooling liquid channel structural member with inlet and outlet, the main flow channel portion of this cooling liquid channel structural member is protruding from the surface of PCB mainboard and annularly arranged, so that the main flow channel portion between cooling liquid channel structural member is enclosed circuit device accommodating cavity, wherein at least a part of heating circuit device is arranged in the circuit device accommodating cavity, and at least two surfaces of the at least a part of heating circuit device form heat conduction contact with the main flow channel portion.The utility model can realize the efficient, uniform heat dissipation of heating circuit device, significantly reduce system operating temperature, improve reliability and service life, while reducing material and manufacturing cost.

Description

Technical Field

[0001] This utility model relates to heat dissipation technology for circuit equipment, specifically, to a cooling structure for circuit equipment. Further, this utility model also relates to a cooling fluid channel structure for circuit equipment. In addition, this utility model also relates to an integrated OBC and DC-DC converter and a new energy vehicle. Background Technology

[0002] High-power circuit devices are becoming increasingly common. For example, with the rapid development of electric vehicle technology, the power level of on-board power systems is constantly increasing. The OBC (On-Board Charger) and DCDC (Direct-to-DC Converter) combined system is gradually becoming mainstream due to its high integration and lightweight design. However, the increase in power density also brings severe thermal management challenges. Heat-generating components such as MOSFETs, transformers, and three-phase PFCs generate a large amount of heat during operation. If heat cannot be dissipated in a timely and effective manner, it will seriously affect the system's reliability and lifespan.

[0003] In existing heat dissipation structures, limited by the traditional heat conduction shape design, circuit devices are mostly cooled by single-sided partial attachment of heat sinks or water channels. This is difficult to effectively dissipate heat from large, high-power devices (such as three-phase PFCs), resulting in limited heat dissipation efficiency. To cope with this poor heat dissipation condition, circuit devices often have to use high-temperature resistant materials or increase the number of heat sinks, which leads to increased costs and structural complexity.

[0004] In addition, due to the large differences in shape, size and power of different heat-generating devices, traditional heat dissipation structures are difficult to achieve uniform heat dissipation due to their rough heat transfer structure, which can easily cause local overheating and affect the overall performance of the machine.

[0005] In view of this, there is an urgent need for a new heat dissipation structure solution for circuit equipment. Utility Model Content

[0006] The problem to be solved by this utility model is to provide a cooling structure for circuit equipment, an integrated OBC and DCDC machine and a new energy vehicle, whose cooling liquid channel structure can relatively effectively dissipate heat from circuit devices and improve the problem of local overheating of circuit devices.

[0007] To solve the above-mentioned technical problems, this utility model provides a circuit device cooling structure, including a PCB motherboard and a plurality of heat-generating circuit devices disposed on the PCB motherboard. The cooling structure further includes a cooling liquid channel structure having an inlet and an outlet. The main channel portion of the cooling liquid channel structure protrudes from the surface of the PCB motherboard and is arranged in a ring shape, thereby forming a circuit device receiving cavity between the main channel portions of the cooling liquid channel structure. At least a portion of the plurality of heat-generating circuit devices is disposed within the circuit device receiving cavity, and at least two surfaces of the at least a portion of the heat-generating circuit devices form thermal conductive contact with the main channel portion.

[0008] Optionally, a portion of the multiple heating circuit devices are arranged inside the circuit device receiving cavity, and another portion of the heating circuit devices are arranged outside the circuit device receiving cavity, and all the heating circuit devices form the heat conduction contact with the sidewall of the main channel portion; and / or the top of the main channel portion is covered with a sealing cover plate, and a sealing ring is provided between the sealing cover plate and the top of the main channel portion.

[0009] Typically, the annular arrangement is an annular arrangement with multiple square corners, such that at least two sides of the heating circuit device within the circuit device receiving cavity can form the heat conduction contact with the sidewall of the main channel portion.

[0010] Preferably, the coolant channel structure further includes a bottom additional channel portion disposed on the surface of the PCB motherboard and connected to the main channel portion, wherein the bottom surface of the heat-generating circuit device in the circuit device receiving cavity and whose operating heat generation exceeds a set threshold forms the heat conduction contact with the bottom additional channel portion.

[0011] Typically, the plurality of circuit heating devices include a MOSFET assembly, a transformer, and a three-phase PFC, wherein the transformer and the three-phase PFC are arranged within the circuit device housing cavity, and the MOSFET assembly is arranged outside the circuit device housing cavity.

[0012] As an alternative structural form, the MOS transistor assembly is fixed by an L-shaped pressure plate disposed on the outside of the main flow channel portion; and the three-phase PFC is a heating circuit device whose working heat generation exceeds the set threshold, the bottom surface of the three-phase PFC forms the heat conduction contact with the bottom additional flow channel portion, and a heat-conducting metal plate is added between the side surface of the three-phase PFC and the main flow channel portion.

[0013] Alternatively, the heat conduction contact may include direct contact between the heating circuit device and the flow channel wall of the coolant channel structure and / or the space between them being filled with thermally conductive adhesive.

[0014] Based on the above-mentioned technical solutions for the cooling fluid channel structure of circuit equipment, this utility model also provides a cooling fluid channel structure component for circuit equipment, which is the cooling fluid channel structure component used in the cooling structure of circuit equipment described in any of the above technical solutions.

[0015] Furthermore, this utility model provides an OBC and DC-DC integrated machine, which includes the circuit equipment cooling structure described in any of the above technical solutions.

[0016] In addition, this utility model also provides a new energy vehicle, wherein the new energy vehicle includes the above-mentioned OBC and DC-DC integrated machine.

[0017] This invention proposes a cooling structure for circuit devices, which can typically be applied to OBC and DC-DC integrated machines. Because this invention designs a main channel portion of the coolant channel structure protruding from the PCB motherboard surface, the main channel portion is arranged in a ring shape. This adaptive structural design provides convenient conditions for the circuit devices arranged in the circuit device housing cavity to form multi-faceted heat conduction contact (e.g., a ring arrangement with square corners or other bent ring arrangements adapted to the shape of the circuit devices). This allows the heat-generating circuit devices to have two or three sides in close contact with the main channel portion of the coolant channel, improving heat dissipation performance, enhancing heat dissipation effect, and reducing operating temperature. It also solves the cost problem caused by the use of expensive high-temperature resistant heat-generating circuit device materials in existing technologies.

[0018] Furthermore, in some preferred embodiments of this utility model, considering that the heating circuit devices have significant differences in shape, arrangement, and heating power, and that some parts can make direct contact with the main channel while others may have gaps, this utility model comprehensively uses potting thermally conductive adhesive to fill the gaps, so that the heating circuit devices with different structures can effectively contact the coolant channels, fully dissipate heat, further enhance the heat dissipation effect, and reduce the operating temperature.

[0019] Other advantages and effects of various embodiments of this utility model will be described in detail below. Attached Figure Description

[0020] Figure 1 This is a schematic diagram showing the layout of common heat-generating circuit components on the PCB motherboard of an OBC and DCDC all-in-one machine.

[0021] Figure 2 This is a front view schematic diagram of the coolant channel structure in some embodiments of this utility model;

[0022] Figure 3 This is a front view schematic diagram of the cooling structure of the circuit device in some embodiments of this utility model;

[0023] Figure 4 This is a schematic diagram of the coolant flow path of the circuit device cooling structure in some embodiments of the present invention. For the sake of simplification and clear display, the schematic diagram is shown from the back of the coolant channel structure.

[0024] Explanation of reference numerals in the accompanying drawings of this utility model:

[0025] 1 PCB motherboard; 2a First MOSFET assembly; 2b Second MOSFET assembly; 2c Third MOSFET assembly; 3a First transformer; 3b Second transformer; 4 Three-phase PFC; 5 Coolant channel structure; 6 Base plate; 7 Inlet; 8 Outlet; 9 Main channel section; 10 Circuit device housing cavity; 11 Bottom additional channel section; 12 Fixing structure. Detailed Implementation

[0026] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of this utility model.

[0027] First, it should be noted that in the following description of the present invention, coolant generally refers to a liquid cooling medium used to cool heat-generating circuit devices, typically such as cooling oil, cold water, or cooling composite liquid. However, the present invention is not limited to this. Any fluid cooling medium that can cool circuit devices can be applied to the present invention.

[0028] In addition, it should be noted that although the circuit device cooling structure is described in the preceding part of the following description of the present invention in order to more clearly demonstrate the advantages of the present invention, the cooling liquid channel structure used in the circuit device cooling structure can be formed as an independent component, which is also one of the subjects that the present invention can independently protect.

[0029] In particular, although the circuit device cooling structure of this utility model is described in the following description with an OBC and DC-DC integrated machine as a typical embodiment, the circuit device cooling structure and cooling liquid channel structure of this utility model are not limited to the application of OBC and DC-DC integrated machines, but can be applied to various circuit devices that require effective heat dissipation, and these applications are all within the protection scope of this utility model.

[0030] See Figure 1 As shown, Figure 1This diagram shows the layout of common heat-generating circuit components on the PCB motherboard 1 of an OBC / DC-DC integrated machine. These components mainly include transformers, MOSFET assemblies, and three-phase PFC (Power Factor Correction Circuit or Power Factor Corrector) soldered onto the PCB motherboard. The number and location of these transformers, MOSFET assemblies, and three-phase PFC may vary slightly on different PCB motherboards. Figure 1 The first MOSFET assembly 2a, the second MOSFET assembly 2b, the first transformer 3a, the second transformer 3b, and the three-phase PFC4 shown are examples. However, on some other PCB motherboards 1, the number, location, shape, and power of the heat-generating components vary. For example... Figure 3 The middle part may include the third MOSFET assembly 3c, etc., and these heat-generating circuit devices have more requirements for heat dissipation methods.

[0031] To meet the above requirements for effective heat dissipation, see [link / reference]. Figure 3 As shown, the circuit device cooling structure of the basic embodiment of this utility model includes a PCB motherboard 1 and a plurality of heat-generating circuit devices disposed on the PCB motherboard 1. The cooling structure also includes a cooling liquid channel structure 5 having an inlet 7 and an outlet 8. The main channel portion 9 of the cooling liquid channel structure 5 protrudes from the surface of the PCB motherboard 1 and is arranged in a ring shape. This ring shape can be closed or not, as long as the main channel portions 9 of the cooling liquid channel structure 5 form a circuit device receiving cavity 10. At least a portion of the plurality of heat-generating circuit devices are arranged in the circuit device receiving cavity 10, and at least two surfaces of the at least a portion of the heat-generating circuit devices form thermal conductive contact with the main channel portion 9.

[0032] In the above basic implementation method, as described above, see [link to relevant documentation]. Figure 4 As shown, the coolant channel structure 5 can be an independent component, which can generally be integrally formed by casting or other processing methods, and then mounted to the PCB motherboard 1 by the fixing structure 12 on the edge of the base plate 6. The main channel portion 9 of this coolant channel structure 5 can be formed as a fully closed or a non-closed ring arrangement with gaps. This ring arrangement can adapt to the shape of different heat-generating circuit devices to form multiple turns or corners, so that the circuit devices arranged in the circuit device receiving cavity 10 have convenient conditions for forming multi-sided heat conduction contact (e.g., a ring arrangement with square corners or other bent ring arrangements adapted to the shape of the circuit devices). This allows the heat-generating circuit devices to be in close contact with the main channel portion of the coolant channel on two or three sides, improving heat dissipation performance, enhancing heat dissipation effect, reducing operating temperature, and also solving the cost problem caused by the use of expensive high-temperature heat-generating circuit device materials in the prior art.

[0033] join Figure 3As shown, in an alternative embodiment, some of the aforementioned heating circuit devices are arranged within the circuit device receiving cavity 10, while others can be arranged outside the circuit device receiving cavity 10. All of the heating circuit devices form thermal conductive contact with the sidewall of the main channel portion 9. For example, in Figure 3 In this circuit, because the MOSFET assembly is small in size and generates less heat than other circuit devices, all the MOSFET assemblies are arranged in the circuit device housing cavity 10 and in contact with the side wall of the main channel section 9. This effectively ensures the heat dissipation of the MOSFET assembly.

[0034] In some embodiments, due to the significant differences in shape between different heating circuit devices, when the heating circuit device contacts the main flow channel portion 9, some parts may be in direct contact while others have gaps. Therefore, the aforementioned heat conduction contact can include direct contact between the heating circuit device and the flow channel wall of the coolant channel structure, or simultaneous pouring of thermally conductive adhesive between them, or a combination of both methods depending on the situation. This can accommodate different external contours. By designing the coolant channel structure as a loop surrounding the side of the heating circuit device to form a circuit device receiving cavity 10, the heating circuit device, such as a transformer, three-phase PFC, or other complex devices, is contained within. Then, thermally conductive adhesive is poured in as needed to achieve the desired heat transfer effect.

[0035] In some embodiments, for aesthetic purposes and to prevent foreign objects such as dust from entering, the top of the main channel section 9 may be covered with a sealing cover (not shown in the figure), and a sealing ring may be provided between the sealing cover and the top of the main channel section 9, thereby sealing the coolant channel from the outside and preventing coolant leakage.

[0036] See Figure 2 and Figure 3 As shown above, in some embodiments, the annular arrangement can be an annular arrangement with multiple square corners, which allows at least two sides of the heating circuit device within the circuit device housing cavity 10 to form thermal conductive contact with the sidewall of the main channel portion 9. Of course, depending on the shape of the heating circuit device, the annular arrangement can be adaptively configured with a surrounding structure to facilitate thermal conductive contact and achieve better heat dissipation.

[0037] See Figure 4 As shown, in some preferred embodiments, for some high-power circuit devices that generate a lot of heat, such as three-phase PFC, the coolant channel structure 5 may also include a bottom additional flow channel portion 11 arranged on the surface of the PCB motherboard 1 and connected to the main flow channel portion 9. The bottom surface of the heat-generating circuit device in the circuit device receiving cavity 10 and whose working heat generation exceeds a set threshold forms a thermal conduction contact with the bottom additional flow channel portion 11.

[0038] For example, in some embodiments, the aforementioned multiple circuit heat-generating devices typically include MOSFET assemblies, transformers, and three-phase PFCs, wherein the transformer and three-phase PFC can be arranged inside the circuit device housing 10, and the MOSFET assembly can be arranged outside the circuit device housing 10. In this case, the MOSFET assembly can be fixed by an L-shaped pressure plate disposed outside the main flow channel portion 9; the aforementioned three-phase PFC, as a heat-generating circuit device whose operating heat generation exceeds the set threshold, forms a thermally conductive contact between the bottom surface of the three-phase PFC and the bottom additional flow channel portion 11, and a thermally conductive metal plate can be added between the side surface of the three-phase PFC and the main flow channel portion 9. In this way, the three-phase PFC will form a three-sided thermally conductive contact with the coolant channel structure 5, and the thermally conductive metal plate will enhance the thermal conductivity, thereby achieving a better heat dissipation effect and ensuring the working performance of the three-phase PFC.

[0039] Based on the technical solution of the cooling structure for the circuit equipment described above in this utility model, see also Figures 2 to 4 As described above, in some embodiments, the cooling channel structure 5 used in the above-mentioned circuit equipment cooling structure of this utility model is a specific implementation structure of the circuit equipment cooling structure of this utility model, which can be independently produced and sold, and falls within the protection scope of this utility model.

[0040] In addition, this utility model also provides an OBC and DCDC integrated machine with the above-mentioned circuit equipment cooling structure, and a new energy vehicle using the OBC and DCDC integrated machine.

[0041] To help those skilled in the art to understand this utility model more deeply, the following references are made. Figures 2 to 4 This invention describes a relatively comprehensive and specific preferred embodiment of the cooling structure of the circuit device, which is described using the PCB motherboard of an OBC and DCDC all-in-one machine.

[0042] In this preferred embodiment, the cooling structure of the circuit device mainly includes: (1) PCB motherboard 1: multiple heat-generating circuit devices are soldered on it, including a first MOS transistor assembly 2a, a first transformer 3a, a three-phase PFC 4, a second transformer 3b, a second MOS transistor assembly 2b, and a third MOS transistor assembly 2c. These devices have different power, shapes, and arrangement positions. (2) Cooling liquid channel structure 5: The cooling liquid channel structure 5 is designed as a loop structure surrounding the heat-generating circuit devices, forming an internal cavity (i.e., circuit device receiving cavity 10) that includes the transformer, three-phase PFC, etc. The main channel portion 9 of the cooling liquid channel structure 5 can be in direct contact with the heat-generating circuit devices, or a certain gap can be reserved between the cooling liquid channel structure 5 and the heat-generating circuit devices for filling with thermally conductive potting compound. (3) Potting thermally conductive compound: it can be potted and filled between the main channel portion 9 of the cooling liquid channel structure 5 and the heat-generating circuit devices, adapting to different device shapes and ensuring efficient heat transfer to the main channel portion 9. The potting thermally conductive compound has good thermal conductivity and fluidity, and can cover multiple surfaces of the device.

[0043] In terms of specific cooling structure and location design, for the MOSFET assembly heat dissipation structure, the MOSFET assembly can be directly fixed to the outside of the main flow channel section 9 using an L-shaped pressure plate, achieving large-area contact heat dissipation and improving heat dissipation efficiency. For the three-phase PFC, enhanced heat dissipation is adopted. Considering the high power of the three-phase PFC, an additional bottom flow channel section 11 is added to its bottom, and a metal vertical plate enhances heat conduction between the main flow channel section 9 and the three-phase PFC, achieving multi-faceted cooling. Furthermore, a sealing cover is installed on the top of the main flow channel section 9, and a sealing ring is installed between it and the top of the main flow channel section 9 to ensure that coolant will not leak in case of accidents, ensuring good system airtightness.

[0044] In other words, in the preferred embodiment described above, the coolant channel structure 1 is designed as a loop structure surrounding the heat-generating circuit devices, forming an internal cavity that encapsulates complex devices such as transformers and three-phase PFCs. The cavity is filled with potting compound to achieve sufficient thermal contact between the heat-generating circuit devices and the coolant channel structure 1, particularly enabling simultaneous cooling of two or three sides of the devices. For high-power three-phase PFCs, an additional bottom coolant channel path is added, and a metal stand is installed to enhance heat conduction. The MOSFET assembly is directly fixed to the outside of the main channel section 9 via an L-shaped pressure plate, achieving efficient heat dissipation.

[0045] See Figure 4As shown, during operation, coolant flows in from the inlet 7, passes through the bottom auxiliary flow channel 11, enters the main flow channel 9 with annular protrusions, and finally flows out from the outlet 8. During the flow, it absorbs heat to achieve continuous cooling of the heat-generating circuit components. Through the above structure, efficient and uniform heat dissipation of various heat-generating circuit components in the OBC and DCDC integrated machine is achieved, which significantly reduces the system operating temperature, improves reliability and service life, and reduces material and manufacturing costs.

[0046] As described above, this invention solves the problems of uneven heat dissipation, low efficiency, and high cost existing in the prior art, providing a highly efficient multi-faceted cooling structure suitable for circuit equipment. The advantages of this invention are: First, the multi-faceted heat dissipation design significantly improves heat dissipation efficiency, making it particularly suitable for integrated systems with high power density and diverse device shapes; second, the use of potting thermally conductive adhesive adapts to different device shapes, achieving uniform heat conduction and avoiding localized overheating; third, the structure is compact and highly compatible with PCB layout, without significantly increasing volume or weight; fourth, it reduces the temperature resistance requirements of circuit device materials, effectively controlling costs; fifth, it has good sealing performance and high reliability, making it suitable for harsh automotive environments. Actual testing confirms that the circuit equipment cooling structure of this invention can maintain heat-generating components of different power levels within a similar operating temperature range through multi-faceted heat dissipation, improving the heat dissipation performance of heat-generating circuit devices.

[0047] The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention, and these simple modifications all fall within the protection scope of the present invention.

[0048] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable way without contradiction. In order to avoid unnecessary repetition, this utility model will not describe the various possible combinations separately.

[0049] Furthermore, various different embodiments of this utility model can be combined in any way, as long as they do not violate the spirit of this utility model, they should also be regarded as the content disclosed by this utility model.

Claims

1. A cooling structure for circuit equipment, comprising a PCB motherboard and multiple heat-generating circuit devices disposed on the PCB motherboard, characterized in that, The cooling structure also includes a cooling channel structure with an inlet and an outlet. The main channel portion of the cooling channel structure protrudes from the surface of the PCB motherboard and is arranged in a ring shape, thereby forming a circuit device receiving cavity between the main channel portions of the cooling channel structure. At least a portion of the plurality of heat-generating circuit devices are arranged in the circuit device receiving cavity, and at least two surfaces of the at least a portion of the heat-generating circuit devices form thermal conductive contact with the main channel portion.

2. The circuit device cooling structure according to claim 1, characterized in that, A portion of the multiple heating circuit devices are arranged inside the circuit device receiving cavity, while another portion of the heating circuit devices are arranged outside the circuit device receiving cavity, and all of the heating circuit devices form the heat conduction contact with the sidewall of the main channel portion. and / or The top of the main channel section is covered with a sealing cover plate, and a sealing ring is provided between the sealing cover plate and the top of the main channel section.

3. The circuit device cooling structure according to claim 1, characterized in that, The annular arrangement is an annular arrangement with multiple square corners, so that at least two sides of the heating circuit device in the circuit device receiving cavity can form the heat conduction contact with the sidewall of the main channel portion.

4. The circuit device cooling structure according to any one of claims 1 to 3, characterized in that, The coolant channel structure also includes a bottom additional channel portion arranged on the surface of the PCB motherboard and connected to the main channel portion. The bottom surface of the heat-generating circuit device that is housed in the circuit device cavity and whose operating heat generation exceeds a set threshold forms the heat conduction contact with the bottom additional channel portion.

5. The circuit device cooling structure according to claim 4, characterized in that, The plurality of heating circuit devices include a MOSFET assembly, a transformer, and a three-phase PFC, wherein the transformer and the three-phase PFC are arranged inside the circuit device housing cavity, and the MOSFET assembly is arranged outside the circuit device housing cavity.

6. The circuit device cooling structure according to claim 5, characterized in that, The MOS transistor assembly is fixed by an L-shaped pressure plate disposed on the outside of the main channel portion; and The three-phase PFC is a heating circuit device whose working heat generation exceeds the set threshold. The bottom surface of the three-phase PFC forms the heat conduction contact with the bottom additional flow channel portion, and a heat-conducting metal plate is added between the side surface of the three-phase PFC and the main flow channel portion.

7. The circuit device cooling structure according to any one of claims 1 to 3, characterized in that, The heat conduction contact includes direct contact between the heating circuit device and the flow channel wall of the cooling liquid channel structure and / or the space between the two is filled with thermally conductive adhesive.

8. A cooling fluid channel structure for circuit equipment, characterized in that, It is the cooling fluid channel structure used in the cooling structure of the circuit device according to any one of claims 1 to 7.

9. An OBC and DC-DC integrated machine, characterized in that, Includes a circuit device cooling structure as described in any one of claims 1 to 7.

10. A new energy vehicle, characterized in that, The new energy vehicle includes the OBC and DC-DC integrated unit as described in claim 9.

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