Manual tin dipping welding tool for circuit board

Abstract

The utility model discloses a kind of circuit board manual tin dipping welding tool, including detachably connected upper cover and lower box body. Upper cover is equipped with multiple welding holes and the soldering channel formed by outside flow guide boss;Corresponding fixed groove and circuit board placement groove are provided in lower box body. When working, connector is positioned in fixed groove, and its pin is inserted into welding hole by passing through circuit board, and welding is completed by guiding molten solder through channel. The tool can realize synchronous welding of multiple welding points, and the whole process only takes about 40 seconds, greatly shortening the production cycle. Through the design of positioning structure and flow channel, false welding and missed welding are effectively avoided, ensuring uniform coverage of soldering tin and improving consistency and reliability. It is simple to operate, and only clamping and tin dipping are needed to complete, reducing the dependence on personnel skills and training costs.

Description

Technical Field

[0001] This utility model belongs to the field of welding fixture technology, specifically a manual tin-dipping welding fixture for circuit boards. Background Technology

[0002] In the production of small-scale circuit boards and aerospace connectors, existing technologies generally employ manual point-by-point soldering to achieve a fixed connection. Due to the dense pin distribution of aerospace connectors, manual soldering not only heavily relies on the operator's soldering skill and proficiency but also suffers from significant technical drawbacks: From a production efficiency perspective, the average time for a single soldering point is approximately 5 seconds; for an assembly requiring 63 soldering points, the total time reaches 315 seconds, resulting in low overall production efficiency. From a soldering quality perspective, individual differences in manual operation can easily lead to problems such as cold solder joints, missed solder joints, or solder buildup, making it difficult to guarantee consistent soldering quality and significantly impacting product reliability due to human factors.

[0003] Currently, there is a lack of specialized tooling in existing technologies that can achieve precise positioning and rapid synchronous welding of circuit boards and aviation connectors, which limits the improvement of enterprise production efficiency and increases personnel training costs and product defect rates. There is an urgent need for a solution that is structurally reliable and easy to operate. Utility Model Content

[0004] The purpose of this invention is to provide a manual tin-dipping soldering fixture for circuit boards, in order to solve the problems of low production efficiency, poor soldering quality consistency, and dependence on the operator's skill level in the existing manual soldering of circuit boards and aviation connectors.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0006] A manual tin-dip soldering fixture for circuit boards includes an upper cover and a lower housing; wherein the upper cover and the lower housing are detachably connected; the upper cover is provided with a plurality of soldering holes for accommodating connector pins, and the lower housing is provided with a fixing groove corresponding to the soldering holes for placing connectors.

[0007] Inside the lower housing, there is a placement slot for placing the circuit board. The connector pins extend through the circuit board to the inside of the soldering hole, and the connector is soldered to the circuit board by molten solder.

[0008] Several protrusions are provided on the outer side of the top cover, and flow channels are formed between adjacent protrusions. Soldering holes are set on the flow channels, and molten solder flows along the flow channels to the soldering holes to complete the soldering.

[0009] According to the above technical solution, several grooves are also provided on the inner side of the top cover. The grooves are used to accommodate the protruding components on the circuit board to prevent the top cover and the lower box from not being able to close.

[0010] According to the above technical solution, the sides and protruding edges of the top cover are all inclined. The inclined edges reduce the resistance to solder flow and ensure that the molten solder flows smoothly during welding.

[0011] According to the above technical solution, a protrusion is also provided in the middle of the upper cover. The protrusion is located on both sides of the middle of the upper cover. The protrusion is used by the operator to hold it, which facilitates the separation of the upper cover from the lower box.

[0012] According to the above technical solution, a first magnet is provided inside the upper cover, and a second magnet with the opposite polarity is provided inside the lower box. The upper cover and the lower box are detachably connected by the first magnet and the second magnet.

[0013] According to the above technical solution, a limiting structure is also provided inside the fixing groove, and the fixing groove fixes the connector in the fixing groove through the limiting structure.

[0014] According to the above technical solution, a first mounting hole is provided on the inner side of the upper cover, and a second mounting hole is provided on the lower box body. The first mounting hole and the second mounting hole are arranged opposite to each other. The first mounting hole is used to install the first magnet, and the second mounting hole is used to install the second magnet.

[0015] According to the above technical solution, there are 6 to 8 first mounting holes and 8 second mounting holes. The first mounting holes are evenly distributed on the inner side of the upper cover, and the second mounting holes are evenly distributed on the lower box body.

[0016] According to the above technical solution, a holding part is provided on the upper part of the lower box body. The holding part is inclined upward and has a flange, which facilitates the operator's holding.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] In this invention, multi-point synchronous welding is achieved through tooling positioning and flow channel guidance, with the entire process taking only 40 seconds, effectively shortening the production cycle. This invention also utilizes positioning protrusions and limiting structures to achieve precise positioning of the circuit board and connectors, completely avoiding problems such as cold solder joints and missing solder joints caused by manual operation. Simultaneously, the flow channel and inclined edge design ensure uniform solder coverage of the welding area, significantly improving welding consistency and product reliability. Furthermore, the device in this invention does not rely on the welding skills of the operators; high-quality welding can be achieved by simply completing clamping and tinning steps, reducing personnel training costs. Attached Figure Description

[0019] Figure 1This is a schematic diagram of the overall structure of the welding fixture of this utility model;

[0020] Figure 2 This is one of the schematic diagrams of the upper cover structure of this utility model;

[0021] Figure 3 This is the second schematic diagram of the upper cover structure of this utility model;

[0022] Figure 4 This is one of the schematic diagrams of the lower box structure of this utility model;

[0023] Figure 5 This is the second schematic diagram of the lower box structure of this utility model;

[0024] Figure 6 This is a schematic diagram of the welding fixture of this utility model.

[0025] The markings in the diagram are: 100-top cover, 200-lower box body, 300-welding hole, 400-fixing groove, 500-placement groove, 600-protrusion, 700-flow channel, 800-groove, 900-protrusion, 1101-first magnet, 1102-second magnet, 111-limiting structure, 112-first mounting hole, 113-second mounting hole, 114-holding part, 115-flange. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Example 1

[0028] like Figure 1 As shown, this utility model discloses a manual tin-dipping soldering fixture for circuit boards, which mainly includes two major components: an upper cover 100 and a lower housing 200. The two are detachably connected, and through structural adaptation, they achieve precise positioning and efficient soldering of the circuit board and connectors. The upper cover 100 and the lower housing 200 are a plate-shaped and box-shaped combination structure with matching shapes. The upper cover 100 can cover the lower housing 200, and a specific connection structure allows for quick closing and opening / closing, ensuring assembly accuracy while improving operational convenience.

[0029] like Figure 2 and Figure 3As shown, for the upper cover 100 structure, its surface has several welding holes 300. The position and number of welding holes 300 are strictly matched with the distribution of the connector pins to be welded, for precise exposure of the welding parts; the outer side of the upper cover 100 has several protrusions 600 (such as... Figure 1 As shown, there are 5 protrusions 600. Flow channels 700 are formed between adjacent protrusions 600. Soldering holes 300 penetrate the bottom of the flow channels 700, allowing molten solder to be precisely guided along the flow channels 700 into the soldering holes 300, effectively preventing solder waste or misalignment during soldering. Simultaneously, the sides of the upper cover 100 and the edges of the protrusions 600 are inclined at angles of 15°-45°, preferably 30°. This inclination angle is designed based on solder flow characteristics, reducing solder flow resistance and ensuring smooth solder flow during soldering, thus improving soldering uniformity. To prevent the upper cover 100 from squeezing the protruding components on the circuit board when it closes with the lower housing 200, several grooves 800 are provided on the inner side of the upper cover 100. The position and shape of the grooves 800 are adapted to the contours of the protruding components on the circuit board, both accommodating the protruding components to prevent damage from pressure and ensuring a tight fit between the upper cover 100 and the lower housing 200. In addition, the upper cover 100 has protrusions 900 (i.e., gripping structures) on both sides of the middle part. The protrusions 900 extend outward to facilitate the operator to quickly separate the upper cover 100 from the lower box 200 after welding. The upper cover 100 also has several first mounting holes 112 on the inner side. The first mounting holes 112 are evenly distributed in the edge area of ​​the upper cover 100 (6-8 in total). The first magnets 1101 are fixedly installed inside to ensure that the adsorption force is balanced when connecting with the lower box 200 later.

[0030] like Figure 4 and Figure 5As shown, the lower housing 200's structural design revolves around the positioning of the connector and circuit board: Its interior has fixing grooves 400 that correspond one-to-one with the soldering holes 300 of the upper cover 100. The shape and size of the fixing grooves 400 are adapted to the connector's tail, used for placing and initially positioning the connector. The fixing grooves 400 also have limiting structures 111 (specifically, straight-edge limiting structures). One side of the connector's straight edge can fit tightly against the limiting structure 111, achieving a unique limitation on the connector's placement direction and preventing misalignment between the pins and soldering holes 300. A placement groove 500 is also provided on one side of the fixing groove 400. The placement groove 500 is used to accommodate the circuit board to be soldered. Its inner wall has several positioning protrusions that match the edge contour of the circuit board, limiting the circuit board's position within the placement groove 500 and preventing the circuit board from shifting during soldering. To achieve a detachable connection with the upper cover 100, a second mounting hole 113 is provided on the lower box 200 at the position corresponding to the first mounting hole 112 of the upper cover 100. A second magnet 1102 is fixedly installed in the second mounting hole 113, and the polarities of the opposing faces of the first magnet 1101 and the second magnet 1102 corresponding to the upper and lower covers are opposite, achieving quick assembly and precise positioning through magnetic attraction. At the same time, a holding part 114 is provided on the upper part of the lower box 200. The holding part 114 is inclined upward and has a flange 115 at the bottom, which facilitates the operator to hold the tool for tin dipping operations and prevents the tool from slipping.

[0031] In terms of the welding mating relationship, after the connector is placed in the fixing groove 400 and positioned by the limiting structure 111, the circuit board is placed in the placement groove 500 so that its welding holes are precisely aligned with the pins of the connector; after the upper cover 100 and the lower box 200 are magnetically attracted and closed, the pins of the connector can pass through the welding holes of the circuit board and extend into the welding holes 300 of the upper cover 100; during tinning, the molten solder is guided into the welding holes 300 through the flow channel 700, forming a reliable connection with the pins and the welding holes of the circuit board, and finally completing the welding operation.

[0032] Example 2

[0033] This embodiment is a further refinement of Embodiment 1. The specific structural parameters and material selections for each component of the manual tin-dipping soldering fixture for the circuit board in this embodiment are as follows:

[0034] The top cover 100 is integrally molded from synthetic stone material, which can withstand temperatures up to 320℃ and has a low thermal conductivity (≤0.3W / (m・K)), effectively preventing the high temperature during tinning from being conducted to the operator's hands. Five rectangular protrusions 600 are symmetrically arranged along the length of the outer side of the top cover 100. The height of each protrusion 600 is 3mm, and the width can be adjusted according to actual use, generally from 3 to 8mm. Parallel strip-shaped flow channels 700 are formed between adjacent protrusions 600, with a depth of 3mm. Circular soldering holes 300 are evenly distributed along the length of each flow channel 700. The diameter of the soldering holes 300 is 2mm-5mm, precisely matching the pin diameter of commonly used aviation connectors, ensuring that the pins can pass through smoothly and that the solder can fully cover them. Four grooves 800 are provided on the inner side of the top cover 100, corresponding to the positions of common protruding components on the circuit board (such as capacitors and inductors). The depth of the grooves 800 perfectly matches the contour of the protruding components, preventing damage to the components when they are closed. The upper cover 100 has symmetrical rectangular protrusions 900 on both sides of its center. The protrusions 900 are 3mm high and 20mm long, making it easy for operators to pry open and separate the upper and lower covers. The inner edge of the upper cover 100 has 6 cylindrical first mounting holes 112 evenly distributed around its circumference. The first mounting holes 112 are blind holes with a depth of 2mm and a diameter of 3mm. Each mounting hole has a circular first magnet 1101 (made of neodymium iron boron, 3mm in diameter, 4mm thick, and with a magnetic strength ≥8000Gs) that is interference-fitted into it to ensure stable adsorption force.

[0035] The lower housing 200 is injection molded from bakelite material. This material has an insulation resistance ≥10¹²Ω and mechanical strength (bending strength ≥80MPa) that meets the requirements for handheld operation. The lower housing 200 has rectangular fixing grooves 400 along its length that correspond one-to-one with the welding holes 300. The depth of the fixing grooves 400 is 10mm, and a straight edge limiting structure 111 (e.g., ...) is provided on the side closest to the placement groove 500. Figure 5 As shown, the straight edge of the limiting structure 111 completely matches the straight edge contour of the connector, forcibly limiting the placement direction of the connector and preventing misalignment between the pins and the soldering hole 300. A rectangular placement groove 500 is provided inside the lower housing 200, the size of which matches the circuit board to be soldered. Six cylindrical second mounting holes 113 (with parameters identical to the first mounting hole 112) are provided on the lower housing 200 corresponding to the position of the first mounting hole 112 on the upper cover 100. Each mounting hole contains a second magnet 1102 with the opposite polarity to the first magnet 1101 on the upper cover, ensuring that the gap between the upper and lower covers after adsorption is ≤0.1mm, with no loosening. Two arc-shaped holding parts 114 are symmetrically provided along the width direction on the upper part of the lower housing 200. The holding parts 114 are inclined upwards at 30°, and their bottoms have flanges 115 to prevent the tooling from slipping when held.

[0036] The specific assembly and usage process of this tooling is as follows:

[0037] Connector positioning: Slowly insert the aviation connector (model J30J-63TJP) into the fixing groove 400 of the lower housing 200 from the tail direction until the straight edge of the connector is tightly fitted with the limiting structure 111. At this time, the pins of the connector are facing upwards, and the deviation between the center of the pins and the center of the solder hole 300 is ≤0.1mm, thus completing the initial positioning.

[0038] Circuit board placement: Place the circuit board to be soldered horizontally into the placement slot 500, and adjust the position of the circuit board to ensure that its soldering holes are accurately fitted onto the pins of the connector, and the height of the pins protruding from the surface of the circuit board is controlled to be 2mm (achieved by matching the depth of the placement slot 500 with the thickness of the circuit board).

[0039] Assembly of upper and lower covers: With the inner side of the upper cover 100 facing down, slowly cover the lower box 200. At this time, the magnets of the upper and lower covers attract each other due to their opposite polarities, and automatically complete the precise alignment. After closing, the groove 800 of the upper cover 100 completely accommodates the protruding devices on the circuit board. The parallelism of the upper and lower cover surfaces is ≤0.05mm, with no obvious gaps.

[0040] Flux application: Use a wool brush to evenly apply flux (model RMA-218, solid content 15%) to the flow channel 700 and solder hole 300 areas. The application thickness should be controlled at 0.1-0.2mm to ensure that the solder can fully wet the soldering surface.

[0041] Tin-immersion soldering: such as Figure 6 As shown, the operator holds the gripping part 114 of the lower box 200 with their thumb and forefinger, and slowly immerses the assembled fixture into the solder bath (solder type Sn63Pb37, temperature control 260-280℃). The immersion depth is determined by the complete immersion of the flow channel 700. After immersion, the fixture is gently shaken left and right (shaking amplitude ≤5mm, frequency 1 time / second) for 3-5 seconds. During this process, the molten solder automatically flows into the soldering hole 300 under the guidance of the flow channel 700. Through the surface tension and capillary action of the solder, a reliable connection is formed with the pins and circuit board soldering holes. Due to the surface tension of the solder (about 0.5N / m at 250℃), the solder will not seep into the gaps between the upper and lower covers or into non-soldering areas.

[0042] Finished product removal: Remove the fixture vertically from the solder pot and allow it to cool naturally for 10-15 seconds (until the solder solidifies). Then, use your thumb to hold the protrusion 900 of the top cover 100 and gently apply upward force to separate the upper and lower covers. Finally, remove the soldered circuit board and connector assembly from the placement slot 500 to complete the entire soldering operation.

[0043] This invention solves the core defects of manual welding from a technical principle perspective through precise positioning structure, scientific flow channel design, and convenient magnetic assembly. Its solution does not rely on complex equipment, has low manufacturing costs, and allows for flexible adjustment of structural parameters according to actual needs, adapting to different types of circuit boards and connectors. Any equivalent adjustments made by those skilled in the art to the component dimensions, materials, or connection methods based on the technical solution of this invention fall within the protection scope of this invention.

[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0045] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A manual tin-dipping soldering fixture for circuit boards, characterized in that: It includes an upper cover (100) and a lower housing (200); wherein the upper cover (100) and the lower housing (200) are detachably connected; the upper cover (100) is provided with a plurality of solder holes (300) for accommodating connector pins; and the lower housing (200) is provided with a fixing groove (400) corresponding to the solder holes (300) for placing the connector. Inside the lower housing (200), there is also a placement slot (500) for placing the circuit board; the pins of the connector extend through the circuit board to the inside of the soldering hole (300) and the connector is soldered to the circuit board by molten solder. Several protrusions (600) are provided on the outer side of the top cover (100), and flow channels (700) are formed between adjacent protrusions (600). Soldering holes (300) are provided on the flow channels (700), and molten solder flows along the flow channels (700) to the soldering holes (300) to complete the soldering.

2. The manual tin-dipping soldering fixture for a circuit board according to claim 1, characterized in that: Several grooves (800) are provided on the inner side of the upper cover (100). The grooves (800) are used to accommodate the protruding devices on the circuit board to prevent the upper cover (100) and the lower box (200) from not being able to close.

3. The manual tin-dipping soldering fixture for a circuit board according to claim 2, characterized in that: The sides of the top cover (100) and the edges of the protrusion (600) are all inclined. The inclined edges reduce the resistance to solder flow and ensure that the molten solder flows smoothly during soldering.

4. The manual tin-dipping soldering fixture for a circuit board according to claim 3, characterized in that: A protrusion (900) is also provided in the middle of the upper cover (100). The protrusion (900) is located on both sides of the middle of the upper cover (100). The protrusion (900) is used by the operator to hold and facilitates the separation of the upper cover (100) from the lower box (200).

5. The manual tin-dipping soldering fixture for a circuit board according to claim 4, characterized in that: A first magnet (1101) is provided inside the upper cover (100), and a second magnet (1102) with the opposite polarity is provided inside the lower box (200). The upper cover (100) and the lower box (200) are detachably connected by the first magnet (1101) and the second magnet (1102).

6. The manual tin-dipping soldering fixture for a circuit board according to claim 5, characterized in that: The fixing groove (400) is also provided with a limiting structure (111), which fixes the connector in the fixing groove (400) through the limiting structure (111).

7. The manual tin-dipping soldering fixture for a circuit board according to claim 6, characterized in that: A first mounting hole (112) is provided on the inner side of the upper cover (100), and a second mounting hole (113) is provided on the lower box body (200). The first mounting hole (112) and the second mounting hole (113) are arranged opposite to each other. The first mounting hole (112) is used to install the first magnet (1101), and the second mounting hole (113) is used to install the second magnet (1102).

8. The manual tin-dipping soldering fixture for a circuit board according to claim 7, characterized in that: The first mounting hole (112) and the second mounting hole (113) are each provided with 6 to 8 holes, and the first mounting hole (112) is evenly provided on the inner side of the upper cover (100), and the second mounting hole (113) is evenly provided on the lower box (200).

9. A manual tin-dipping soldering fixture for a circuit board according to claim 8, characterized in that: The upper part of the lower box (200) is provided with a holding part (114), which is inclined upward, and a flange (115) is also provided on the holding part (114), which facilitates the operator's holding.

10. A manual tin-dipping soldering fixture for a circuit board according to claim 9, characterized in that: Flanges (115) are respectively provided on the left and right sides of the holding part (114).

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