Cooling device for heat dissipation from at least one chip

Abstract

A cooling device for heat dissipation from at least one chip (2) and for rear-side contacting of the chip (2) and / or a printed circuit board (4) on which the chip (2) is arranged is proposed, comprising at least one flexible thermal conductivity unit (3) for thermally connecting the chip (2) and / or the printed circuit board (4) with at least one heat sink (5) and at least one rigid receiving unit (6) for receiving the thermal conductivity unit (3) at least partially, wherein the thermal conductivity unit (3) protrudes from the receiving unit (6) on at least one side (7) in order to be compressed between the chip (2) and / or the printed circuit board (4) and the heat sink (5), in particular to achieve tolerance compensation, wherein the receiving unit (6) extends at least partially along a circumference of the chip (2).

Description

[0001] The invention relates to a cooling device for heat dissipation from at least one chip. Furthermore, the invention also relates to a cooling system and a control unit. In addition, the invention relates to an automated vehicle.

[0002] Cooling devices for cooling chips are known from the prior art. These are usually rigid heat sinks that make contact with the chip over as large an area as possible on one side.

[0003] EP 0 348 838 A2 discloses a bellows heat pipe for the thermal control of electronic components. DE 10 2015 103 096 A1 discloses a cooling device and a cooling arrangement incorporating the cooling device. DE 11 2021 002 263 T5 discloses a heat dissipation structure and a battery provided with the same heat dissipation structure.

[0004] A cooling device for heat dissipation from at least one chip is proposed. The cooling device comprises at least one flexible thermal interface unit for thermally connecting the chip and / or a printed circuit board on which the chip is mounted to at least one heat sink. The cooling device also includes at least one rigid receiving unit for at least partially receiving the thermal interface unit. The thermal interface unit projects from at least one side of the receiving unit to be compressed between the chip and / or the printed circuit board and the heat sink, particularly to compensate for tolerances. The receiving unit extends at least partially along a circumference of the chip.

[0005] The cooling device is preferably designed for use in a control unit, particularly a vehicle control unit. The control unit can, in particular, include the cooling device. The control unit is preferably designed as an electronic control unit (ECU). The cooling device is preferably designed to dissipate waste heat from the chip. The chip is preferably designed as a system-on-a-chip (SoC). Alternatively, it is conceivable that the chip is designed as a processor, particularly a graphics processor, as an electronic circuit such as an FPGA or an ASIC, as a microcontroller, or the like. Preferably, the cooling device is designed for cooling a single chip. Alternatively, it is conceivable that the cooling device is designed for cooling several, in particular different, chips, which are preferably arranged on the same circuit board.The term "intended" should be understood to mean, in particular, specially programmed, specially equipped, and / or specially designed. The fact that an object is intended for a function should be understood to mean, in particular, that the object performs the function in at least one operating state.

[0006] The thermal conductivity unit is preferably elastically deformable. Preferably, the thermal conductivity unit is compressible under force, in particular squeezable. In particular, the thermal conductivity unit can be formed at least partially from an elastomer. In particular, the thermal conductivity unit can be formed at least partially from a silicone, a rubber, a PVC, or the like. In particular, the thermal conductivity unit can be formed at least partially from a material with a higher thermal conductivity than plastics, such as gold, silver, copper, or carbon. In particular, the thermal conductivity unit can be formed from, in particular alternating, layers of a material with high thermal conductivity and an elastomer. Alternatively, it is conceivable that the thermal conductivity unit is formed from an elastomer matrix in which particles of the material with high thermal conductivity are embedded.

[0007] The receiving unit is preferably designed to be rigid enough that it does not deform under the influence of forces that would cause deformation, in particular compression, of the heat-conducting unit. The receiving unit can, in particular, be made at least partially of a metal, a fiber-reinforced composite material, a thermoset, or the like. The receiving unit preferably has walls that define a receiving area into which the heat-conducting unit is received, at least partially. The receiving area can, in particular, be groove-shaped. Preferably, the receiving unit is open on one side so that the heat-conducting unit projects out of the receiving unit, in particular the receiving area, on this side. In particular, the heat-conducting unit is taller than the receiving unit, especially the walls of the receiving unit.In an alternative embodiment, it is conceivable that the receiving unit is open on two sides, in particular opposite sides, so that the heat conduction unit can protrude from the receiving unit on both sides.

[0008] Preferably, the heat transfer unit is designed to make thermally conductive contact with the chip and / or the circuit board or the heat sink on the side where it protrudes from the receiving unit. In the embodiment where the heat transfer unit protrudes from the receiving unit on two sides, it is preferably designed to make thermally conductive contact with the chip and / or the circuit board on one side and with the heat sink on the opposite side. In particular, the cooling device is arranged between the chip and / or the circuit board and the heat sink when installed. The heat sink can be designed, in particular, as an air heat sink and / or as a liquid heat sink. In particular, the heat sink can be formed, at least partially, by a housing of the control unit.The heat transfer unit is preferably designed to absorb heat from the chip and transfer it directly or via at least one wall of the receiving unit and / or at least one thermal connection element to the heat sink. The heat sink is preferably designed to dissipate the heat, in particular to a cooling medium such as air or a coolant.

[0009] According to the invention, the cooling device, in particular the heat conduction unit, is designed to make contact with the chip and / or the printed circuit board from the rear. Specifically, the cooling device rests against the rear of the chip and / or the printed circuit board, facing away from the front on which the chip is mounted. In particular, the chip and / or the printed circuit board can be cooled on the front side by an additional cooling unit, which is known, in particular, to those skilled in the art. Preferably, the cooling device can make direct contact with the chip from the rear through at least one recess in the printed circuit board and / or make contact with the printed circuit board, particularly in the immediate vicinity of the chip.Alternatively, it is conceivable that the cooling device contacts the chip and / or the circuit board on its front side, or that two cooling devices are provided, one contacting the chip and / or the circuit board on its back and another contacting the chip and / or the circuit board on its front side. Preferably, the cooling device rests on the heat sink on the opposite side from the contact side with the chip and / or the circuit board.

[0010] Preferably, the chip and / or the printed circuit board are attached to the heat sink in an assembled state, for example by screws, such that a force acts on the cooling device arranged between the chip and / or printed circuit board and the heat sink, parallel to a compression direction. Preferably, the force compresses, particularly in the area where it protrudes from the receiving unit, the heat conductor, especially by pinching it. This compression of the heat conductor can, in particular, compensate for tolerances in a cooling system and ensure correct alignment of the chip and / or printed circuit board relative to the heat sink.

[0011] The receiving unit preferably extends along a portion of the chip's circumference. In particular, the receiving unit can also extend along the entire circumference of the chip. Preferably, the heat sink completely fills the receiving unit, especially the receiving area. In particular, an extension of the heat sink along the chip's circumference corresponds to an extension of the receiving area along the chip's circumference. An extension of the cooling device, especially the receiving unit, along the chip's circumference is particularly perpendicular to the compression direction or an imaginary shortest connecting line between the chip and / or the circuit board and the heat sink.

[0012] The perimeter of the chip corresponds in particular to the sides of a rectangle, especially a square. In particular, the chip can be at least substantially cuboid or plate-shaped. The cooling device, in particular the receiving unit, extends in particular along at least one circumferential side, preferably along at least two circumferential sides, and most preferably along at least three circumferential sides of the chip. In particular, the cooling device, in particular the receiving unit, can be angled, curved, or the like. The heat conduction unit can in particular contact the chip or a region of the circuit board below the chip at least partially along the perimeter of the chip.Alternatively, it is conceivable that the cooling device, in particular the receiving unit, extends at least partially along the circumference of the chip, offset from it, so that, in particular, the heat conduction unit contacts an area of ​​the circuit board along the circumference of the chip that, viewed from the center of the chip, is offset outwards from the chip. Preferably, the heat conduction unit does not contact the chip over its entire surface. In particular, an area of ​​the heat conduction unit perpendicular to the compression direction or the imaginary shortest connecting line between the chip and / or the circuit board and the heat sink is smaller than an area of ​​the chip.

[0013] The design of the cooling device according to the invention advantageously enables efficient heat dissipation from a chip. Manufacturing tolerances can be advantageously compensated for. Cooling of the chip from the rear is also advantageously possible.

[0014] Furthermore, it is proposed that the receiving unit extends along at least three circumferential sides of the chip, in particular in a U-shape. The chip, in particular, has four circumferential sides. The receiving unit has three legs, in particular two of which are parallel to each other and connected by a third leg that is perpendicular to the other two legs. In particular, the cooling device, in particular the receiving unit, is U-shaped, in particular corresponding to a square U, within a plane perpendicular to the compression direction or the imaginary shortest connecting line between the chip and / or circuit board and the heat sink. Advantageously, a space-efficient cooling device can be provided.

[0015] Furthermore, it is proposed that the receiving unit be made at least partially of a thermally conductive material, in particular a metal, to serve as an additional heat sink for dissipating heat transferred by the heat transfer unit. In particular, the receiving unit can be made at least partially of a material with a higher thermal conductivity than plastics. Preferably, the receiving unit is made at least partially of aluminum. Alternatively, it is conceivable that the receiving unit is made at least partially of copper, steel, or another thermally conductive material that would be suitable to a person skilled in the art. Preferably, the receiving unit is designed to absorb heat from the heat transfer unit and release it to an environment, in particular the air. In particular, the receiving unit can also transfer the absorbed heat to the heat sink. Advantageously, this can enable particularly efficient cooling.

[0016] Furthermore, it is proposed that the receiving unit has walls extending parallel to a compression direction between the chip and / or circuit board and the heat sink, enclosing the thermal interface unit in such a way that, as a result of a force being applied, the thermal interface unit is pressed against the walls parallel to the compression direction. In particular, as a result of a force being applied parallel to the compression direction or the imaginary shortest connecting line between the chip and / or circuit board and the heat sink, the thermal interface unit is squeezed into the receiving unit, especially the receiving area.Since the expansion of the heat transfer unit parallel to the compression direction is limited by the chip and / or the circuit board and the heat sink and / or a bottom wall of the receiving unit extending perpendicular to the compression direction, the heat transfer unit can only expand transversely, and especially perpendicularly, to the compression direction, where its expansion is limited by the walls against which it is pressed. Preferably, the heat transfer unit pressed against the walls makes contact with the walls over a large area, especially the entire surface, so that efficient heat transfer between the heat transfer unit and the receiving unit, especially the walls, can be achieved. Advantageously, the cooling capacity can be further increased.

[0017] Furthermore, it is proposed that the cooling device comprises at least one thermal connection element for the thermally conductive connection of the receiving unit and / or the heat transfer unit to the chip, the circuit board, and / or the heat sink. Preferably, the thermal connection element is provided for the thermally conductive connection of a bottom wall of the receiving unit to the chip, the circuit board, and / or the heat sink. In particular, the thermal connection element can be in contact with the bottom wall over a large area, especially across its entire surface. Alternatively, it is conceivable that the thermal connection element is provided for the thermally conductive connection of the heat transfer unit to the chip, the circuit board, and / or the heat sink, especially on a side where the heat transfer unit protrudes from the receiving unit.In particular, the cooling device can comprise several thermal connection elements for the thermally conductive connection of different components of the cooling device to the chip, the printed circuit board, and / or the heat sink. The thermal connection element can extend over a large area, preferably the entire surface, along a contact surface of the receiving unit and / or the thermal interface material. The thermal connection element is preferably at least partially made of a thermal interface material (TIM). The thermal connection element can be, in particular, a thermal paste, a thermal pad, a thermal adhesive, a thermal tape, a phase-change pad, a thermal solder joint, or the like. In particular, the thermal connection element can provide a material bond between the receiving unit and / or the thermal interface material and the chip, the printed circuit board, and / or the heat sink.In particular, the thermal connection element can be used to compensate for tolerances. Advantageously, this can enable a thermally efficient connection of the cooling device.

[0018] Furthermore, a cooling system is proposed. The cooling system comprises at least one chip. The cooling system comprises at least one printed circuit board (PCB) on which the chip is mounted. The cooling system comprises at least one heat sink. The cooling system comprises at least one cooling device according to the invention, which is in thermally conductive contact with the chip and / or the PCB and the heat sink. The cooling device is preferably connected to the chip and / or the PCB and the heat sink by a form-fit, force-fit, and / or material-fit connection. A form-fit and force-fit connection can be realized, in particular, by means of a snap-fit ​​or screw connection. In particular, the heat sink and the heat-conducting unit or the heat sink and the receiving unit can be formed as a single piece. Preferably, the cooling device is arranged along the compression direction between the chip and / or the PCB and the heat sink.Preferably, the chip and / or the circuit board and the heat sink are mechanically connected to each other, in particular by force-fit and / or form-fit connections. Advantageously, a cooling system with efficient heat dissipation from the chip can be provided.

[0019] Furthermore, it is proposed that the chip and / or the printed circuit board, the cooling device, and the heat sink are connected such that at least one thermal interface element of the cooling device is compressed along a compression direction between the chip and / or the printed circuit board and the heat sink. In particular, the chip and / or the printed circuit board, the cooling device, and the heat sink are connected such that a force parallel to the compression direction acts on the thermal interface element, compressing the thermal interface element. Specifically, the thermal interface element is squeezed between the chip and / or the printed circuit board and the heat sink. Advantageously, this allows for high cooling performance.

[0020] It is further proposed that the cooling system comprises at least one cooling unit for cooling the chip, which is arranged on a side of the chip and / or the circuit board facing away from the cooling device. Preferably, the chip and / or the circuit board is arranged between the cooling device and the cooling unit. The cooling unit is preferably primarily intended for cooling the chip. In particular, the cooling capacity of the cooling unit is higher than that of the cooling device. Preferably, the cooling device is designed to assist the cooling unit in cooling the chip. Preferably, the cooling unit is in direct, in particular over a large area, preferably over the entire surface, contact with the chip, especially with a front face of the chip. Preferably, the cooling unit comprises at least one heat sink.In particular, the cooling unit can comprise at least one thermal connector, at least one heat spreader, and / or other components that a person skilled in the art would consider useful. Preferably, the thermal connector is in direct contact with the chip, the heat spreader is in contact with the thermal connector, and the heat sink is in contact with the heat spreader. Preferably, the heat sink and the heat spreader are formed as a single unit. Advantageously, cooling of the chip from both sides can be enabled.

[0021] Furthermore, a control unit, particularly for an automated vehicle, is proposed. The control unit comprises at least one cooling system according to the invention. An "automated vehicle" is understood to mean, in particular, a vehicle with one of the automation levels 1 to 5 of standard SAE J3016. Specifically, the automated vehicle has technical equipment required for these automation levels. The technical equipment includes, in particular, environmental perception sensors, such as radar sensors, lidar sensors, cameras, and / or acoustic sensors, and at least one control unit or the like. Preferably, the control unit, in particular by means of the chip, is provided for controlling functions of the vehicle, such as autonomous driving functions, driver assistance functions, navigation functions, entertainment functions, or the like.In particular, the control unit can be designed to control individual vehicle components, such as a transmission, chassis, or similar. Alternatively or additionally, the control unit could be intended for use outside of a vehicle, for example, in industrial machinery, consumer electronics, household appliances, or similar devices. A high-performance and durable control unit can be advantageously provided.

[0022] Furthermore, an automatically operated vehicle is proposed. The automatically operated vehicle comprises at least one cooling system or at least one control unit according to the invention. Preferably, the vehicle is designed as a land vehicle. The vehicle can be designed, in particular, as a passenger car, preferably as a passenger transport vehicle, especially an autonomous shuttle, as a truck, as a construction vehicle, as an agricultural vehicle, or as another vehicle that would appear suitable to a person skilled in the art. Alternatively, the vehicle can also be designed as an aircraft, for example, as a drone, as an airplane, as a helicopter, as a vertical take-off and landing aircraft, or the like, or as a watercraft, in particular as a ship, as a boat, or the like. Advantageously, a particularly safe, comfortable, and reliable vehicle can be provided.

[0023] The invention is illustrated by an exemplary embodiment in the following figures. They show: Fig. 1 a schematic representation of an automated vehicle according to the invention, Fig. 2 an exploded view of a cooling system according to the invention of the automatically operated vehicle according to the invention Fig. 1 in a perspective schematic representation and Fig. 3 a sectional view of a part of the cooling system according to the invention Fig. 2 in a schematic representation.

[0024] Fig. Figure 1 shows a schematic representation of an automated vehicle 14. In the present embodiment, the vehicle 14 is exemplary as a land vehicle, in particular as a passenger car. The vehicle 14 comprises at least one control unit 13. The control unit 13 comprises at least one cooling system 11.

[0025] Fig. Figure 2 shows an exploded view of the cooling system 11 of the automated vehicle 14. Fig. Figure 1 in a perspective schematic representation. The cooling system 11 comprises at least one chip 2. The cooling system 11 comprises at least one printed circuit board 4 on which the chip 2 is arranged. The cooling system 11 comprises at least one heat sink 5. The cooling system 11 comprises at least one cooling device 1, which is in thermally conductive contact with the chip 2 and / or the printed circuit board 4 and the heat sink 5. The cooling device 1 is connected to the chip 2 and / or the printed circuit board 4 and the heat sink 5 by a form-fit, force-fit, and / or material-fit connection. The cooling device 1 is arranged along a compression direction 9 between the chip 2 and / or the printed circuit board 4 and the heat sink 5. In the present embodiment, the cooling device 1 is connected to the chip 2 and / or the printed circuit board 4 and the heat sink 5 by a force-fit and / or form-fit connection, in particular by screws (see screw holes 15 in the heat sink 5).

[0026] The cooling system 11 comprises at least one cooling unit 12 for cooling the chip 2, which is arranged on a side of the chip 2 and / or the circuit board 4 facing away from the cooling device 1. The chip 2 and the circuit board 4 are arranged between the cooling device 1 and the cooling unit 12. The cooling unit 12 is primarily intended for cooling the chip 2. The cooling capacity of the cooling unit 12 is higher than that of the cooling device 1. The cooling device 1 is designed to assist the cooling unit 12 in cooling the chip 2. The cooling unit 12 is in direct, in particular large-area, preferably full-area, contact with the chip 2, especially with a front face of the chip 2. The cooling unit 12 comprises at least one heat sink 16. The cooling unit 12 comprises at least one thermal connecting element 17. The cooling unit 12 comprises at least one heat spreader 18.The thermal connecting element 17 is in direct contact with the chip 2, the heat distributor 18 is in contact with the thermal connecting element 17, and the heat sink 16 is in contact with the heat distributor 18. In an alternative embodiment, the heat sink and the heat distributor can be formed as a single unit.

[0027] The cooling device 1 is designed to dissipate heat from the chip 2. The cooling device 1 comprises at least one flexible thermal interface unit 3 for thermally connecting the chip 2 and / or the circuit board 4, on which the chip 2 is arranged, to the heat sink 5. The cooling device 1 comprises at least one rigid receiving unit 6 for receiving the thermal interface unit 3, at least partially. The thermal interface unit 3 projects from the receiving unit 6 on at least one side 7 in order to be compressed between the chip 2 and / or the circuit board 4 and the heat sink 5, in particular to achieve tolerance compensation (see Figure 1). Fig. 3) The recording unit 6 extends at least partially along a circumference of the chip 2.

[0028] The heat conduction unit 3 is elastically deformable. The heat conduction unit 3 is compressible under the influence of force, in particular squeezable. The receiving unit 6 is rigidly designed so that it does not deform under the influence of forces that lead to deformation, in particular squeezing, of the heat conduction unit 3. The receiving unit 6 has walls 8 that define a receiving area 19 into which the heat conduction unit 3 is received, at least partially. The receiving area 19 is groove-shaped. The receiving unit 6 is open on one side 7, so that the heat conduction unit 3 projects out of the receiving unit 6, in particular the receiving area 19, on this side 7. The heat conduction unit 3 is higher than the receiving unit 6, in particular the walls 8 of the receiving unit 6 (see figure). Fig. 3).

[0029] The thermal conductivity unit 3 is designed to make thermally conductive contact with the chip 2 and / or the circuit board 4 or the heat sink 5 (in this exemplary embodiment, the circuit board 4) at the side 7 where it protrudes from the receiving unit 6. In this exemplary embodiment, the heat sink 5 is, by way of example, formed at least partially by a housing of the control unit 13. The thermal conductivity unit 3 is designed to absorb heat from the chip 2, here via a rear surface of the circuit board 4 in contact with the chip 2, and to conduct it directly or via the walls 8 of the receiving unit 6 and / or at least one thermal connection element 10 of the cooling device 1 to the heat sink 5. The heat sink 5 is designed to dissipate the heat, in particular to a cooling medium, such as air or a coolant.

[0030] The cooling device 1, in particular the heat conduction unit 3, is designed to make contact with the chip 2 and / or the circuit board 4 from the rear. In the present embodiment, the cooling device 1 is located, for example, on the rear side of the circuit board 4, which faces away from the front side on which the chip 2 is mounted. In this embodiment, the cooling device 1 makes contact with the circuit board 4 from the rear, particularly in the immediate vicinity of the chip 2. The cooling device 1 is located on the heat sink 5 on the opposite side from the contact side with the chip 2 and / or the circuit board 4.

[0031] The receiving unit 6 extends along part of the circumference of the chip 2. The thermal interface unit 3 completely fills the receiving unit 6, in particular the receiving area 19. An extension of the thermal interface unit 3 along the circumference of the chip 2 corresponds to an extension of the receiving area 19 along the circumference of the chip 2. An extension of the cooling device 1, in particular the receiving unit 6, along the circumference of the chip 2 is perpendicular to the compression direction 9 or an imaginary shortest connecting line between the chip 2 and / or the circuit board 4 and the heat sink 5.

[0032] The perimeter of chip 2 corresponds to sides of a rectangle, in particular a square. Chip 2 is at least substantially cuboidal or plate-shaped. The cooling device 1, in particular the receiving unit 6, is angled. The thermal interface 3 makes contact, at least partially along the perimeter of chip 2, with an area of ​​the circuit board 4 below chip 2. The thermal interface 3 does not make full contact with chip 2, in particular with the area of ​​the circuit board 4 below chip 2. An area of ​​the thermal interface 3 perpendicular to the compression direction 9 or the imaginary shortest connecting line between chip 2 and / or the circuit board 4 and the heat sink 5 is smaller than an area of ​​chip 2.

[0033] The receiving unit 6 extends along at least three circumferential sides of the chip 2, in particular in a U-shape. The chip 2 has four circumferential sides. The receiving unit 6 has three legs 20, 21, 22, two of which are parallel to each other and connected by a third leg 22 that is perpendicular to the other two legs 20, 21. The cooling device 1, in particular the receiving unit 6, is U-shaped, in particular corresponding to a square U, within a plane perpendicular to the compression direction 9 or the imaginary shortest connecting line between the chip 2 and / or circuit board 4 and the heat sink 5.

[0034] The receiving unit 6 is at least partially made of a thermally conductive material, in particular a metal, to serve as an additional heat sink for dissipating heat transferred from the heat conduction unit 3. The receiving unit 6 is designed to absorb heat from the heat conduction unit 3 and release it to an environment, in particular the air. The receiving unit 6 can also transfer the absorbed heat to the heat sink 5.

[0035] The cooling device 1 comprises at least one thermal connecting element 10 for the thermally conductive connection of the receiving unit 6 and / or the thermal conducting unit 3 to the chip 2, the circuit board 4 and / or the heat sink 5. Fig. In Figure 2, the thermal connecting element 10 is indicated only by dashed lines. In the present embodiment, the thermal connecting element 10 is provided, by way of example, for the thermally conductive connection of a bottom wall of the receiving unit 6 (not visible here due to the perspective view) to the heat sink 5. The thermal connecting element 10 is at least partially made of a thermally conductive material. The thermal connecting element 10 is provided for the realization of tolerance compensation.

[0036] Fig. Figure 3 shows a sectional view of part of the cooling system 11. Fig.Figure 2 is shown in a schematic diagram. A portion of the printed circuit board 4, a portion of the receiving unit 6, and a portion of the heat conduction unit 3 are depicted. The chip 2 and / or the printed circuit board 4, the cooling device 1, and the heat sink 5 are connected such that the heat conduction unit 3 of the cooling device 1 is compressed along the compression direction 9 between the chip 2 and / or the printed circuit board 4 and the heat sink 5. The chip 2 and / or the printed circuit board 4, the cooling device 1, and the heat sink 5 are connected such that a force parallel to the compression direction 9 acts on the heat conduction unit 3, compressing it. The heat conduction unit 3 is squeezed between the chip 2 and / or the printed circuit board 4 and the heat sink 5. The force causes the heat conduction unit 3 to be compressed, in particular squeezed, especially in an area where it protrudes from the receiving unit 6, in particular a first squashing area 23.By compressing the heat conduction unit 3, tolerances in the cooling system 11 can be compensated for and correct alignment of the chip 2 and / or the circuit board 4 relative to the heat sink 5 can be ensured.

[0037] The receiving unit 6 has walls 8 that extend parallel to the compression direction 9 between the chip 2 and / or the circuit board 4 and the heat sink 5 and enclose the thermal conductivity unit 3 such that, as a result of a force being applied parallel to the compression direction 9, the thermal conductivity unit 3 is pressed against the walls 8. As a result of a force being applied parallel to the compression direction 9 or the imaginary shortest connecting line between the chip 2 and / or circuit board 4 and the heat sink 5, the thermal conductivity unit 3 is squeezed into the receiving unit 6, in particular the receiving area 19.Since the expansion of the heat conduction unit 3 parallel to the compression direction 9 is limited by the circuit board 4 and the bottom wall of the receiving unit 6 extending perpendicular to the compression direction 9, the heat conduction unit 3 can only expand transversely, in particular perpendicularly, to the compression direction 9, where its expansion is limited by the walls 8 against which the heat conduction unit 3 is therefore pressed. The heat conduction unit 3, pressed against the walls 8, makes contact with the walls 8 over a large area, in particular over the entire area, especially in a second compression zone 24, so that efficient heat transfer between the heat conduction unit 3 and the receiving unit 6, in particular the walls 8, can be achieved. Reference sign 1 cooling device 2 Chip 3 Heat conduction unit 4 circuit boards 5 heat sinks 6 recording unit Page 7 8 wall 9 Compression direction 10 thermal connecting element 11 Cooling system 12 cooling units 13 Control unit 14 vehicles 15 screw holes 16 heat sinks 17 thermal connecting element 18 heat distributors 19 Recording area 20 thighs 21 thighs 22 thighs 23 crush area 24 crush area

Claims

[1] Cooling device for heat dissipation from at least one chip (2) and for rear-side contacting of the chip (2) and / or of a printed circuit board (4) on which the chip (2) is arranged, comprising at least one flexible thermal conductivity unit (3) for thermally connecting the chip (2) and / or the printed circuit board (4) with at least one heat sink (5) and at least one rigid receiving unit (6) for receiving the thermal conductivity unit (3) at least partially, wherein the thermal conductivity unit (3) protrudes from the receiving unit (6) on at least one side (7) in order to be compressed between the chip (2) and / or the printed circuit board (4) and the heat sink (5), in particular to achieve tolerance compensation, wherein the receiving unit (6) extends at least partially along a circumference of the chip (2). [2] Cooling device according to claim 1, wherein the receiving unit (6) extends along at least three circumferential sides of the chip (2), in particular in a U-shape. [3] Cooling device according to claim 1 or 2, wherein the receiving unit (6) is at least partially made of a thermally conductive material, in particular a metal, to serve as an additional heat sink for dissipating heat transferred from the heat conducting unit (3). [4] Cooling device according to one of the preceding claims, wherein the receiving unit (6) has walls (8) which extend parallel to a compression direction (9) between the chip (2) and / or the circuit board (4) and the heat sink (5) and enclose the heat conduction unit (3) in such a way that the heat conduction unit (3) is pressed against the walls (8) as a result of a force being applied parallel to the compression direction (9). [5] Cooling device according to one of the preceding claims, comprising at least one thermal connecting element (10) for thermally connecting the receiving unit (6) and / or the thermal conducting unit (3) to the chip (2), the circuit board (4) and / or the heat sink (4). [6] Cooling system comprising at least one chip (2), at least one printed circuit board (4) on which the chip (2) is arranged, at least one heat sink (5) and at least one cooling device (1) according to one of the preceding claims, which is in thermally conductive contact with the chip (2) and / or the printed circuit board (4) and the heat sink (5). [7] Cooling system according to claim 6, wherein the chip (2) and / or the circuit board (4), the cooling device (1) and the heat sink (5) are connected such that at least one heat conduction unit (3) of the cooling device (1) is compressed along a compression direction (9) between the chip (2) and / or the circuit board (4) and the heat sink (5). [8] Cooling system according to claim 6 or 7, comprising at least one cooling unit (12) for cooling the chip (2), which is arranged on a side of the chip (2) and / or the circuit board (4) facing away from the cooling device (1). [9] Control unit, in particular for an automated vehicle (14), comprising at least one cooling system (11) according to any one of claims 6 to 8. [10] Automated vehicle comprising at least one cooling system (11) according to any one of claims 6 to 8 or at least one control unit (13) according to claim 9.

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