Machining tool

Abstract

To provide a machining tool that is resistant to the adhesion of machining debris.SOLUTION: The present invention provides a machining tool for machining a workpiece, where the machining tool includes: a base; and machining part that is fixed to the base and makes contact with workpiece to machine the workpiece. The base includes a water-repellent area that has been treated to be water-repellent. It is preferable that the water-repellent area is a region with a plurality of recesses.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a processing tool for processing a workpiece. [Background technology]

[0002] A wafer on which a plurality of devices are formed is divided and diced to produce device chips each including a device. A package substrate is formed by mounting a plurality of device chips on a predetermined substrate and covering and sealing the mounted device chips with a resin layer (mold resin). A package device including a plurality of packaged device chips is manufactured by dividing and dicing the package substrate. The device chips and package devices are incorporated into various electronic devices such as mobile phones and personal computers.

[0003] For example, a cutting device is used to divide a workpiece such as a wafer or a package substrate. The cutting device includes a chuck table that holds the workpiece, and a processing unit (cutting unit) that performs cutting processing on the workpiece. The cutting unit is equipped with an annular cutting blade that comes into contact with the workpiece and cuts it. The workpiece is held on the chuck table, and the cutting blade is rotated while cutting into the workpiece, cutting and dividing the workpiece.

[0004] In recent years, with the miniaturization of electronic devices, there is a demand for thinner device chips and package devices. Therefore, a grinding device may be used to grind and thin wafers and package substrates before division. The grinding device includes a chuck table for holding the workpiece and a processing unit (grinding unit) for grinding the workpiece. The grinding unit is equipped with an annular grinding wheel having a plurality of grinding stones that come into contact with the workpiece and grind it. The workpiece is held by the chuck table, and the grinding stones are brought into contact with the workpiece while rotating the chuck table and the grinding wheel, thereby grinding and thinning the workpiece (see Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2000-288881 A Summary of the Invention [Problem to be solved by the invention]

[0006] As described above, when processing a workpiece using a processing device such as a cutting device or a grinding device, a processing tool such as a cutting blade or a grinding wheel is attached to a processing unit mounted on the processing device. The processing tool is rotated at high speed and brought into contact with the workpiece, thereby performing a predetermined processing on the workpiece. In addition, a liquid (processing liquid) such as pure water is supplied to the workpiece and the processing tool during processing of the workpiece. This cools the workpiece and the processing tool, and washes away chips (processing chips) generated by processing the workpiece.

[0007] However, when the machining fluid is supplied to the contact area between the workpiece and the machining tool, the machining fluid flows while absorbing machining debris, and comes into contact with the rotating workpiece and the machining tool and is scattered. As a result, the machining fluid mixed with the machining debris adheres to the machining tool, and the machining debris contained in the machining fluid adheres to the machining tool. Then, when the machining of the workpiece with the machining tool continues, the machining debris accumulates on the machining tool.

[0008] The machining chips accumulated on the machining tool cause a decrease in machining quality and efficiency. For example, the machining chips may fall from the machining tool due to vibrations during operation of the machining device and adhere to the chuck table that holds the workpiece. As a result, when the workpiece is held on the chuck table, the machining chips may also adhere to the workpiece, causing problems such as contamination of the workpiece and prolonged cleaning of the workpiece. In addition, when an attempt is made to clean or replace a machining tool on which machining chips have accumulated, the machining of the workpiece by the machining tool is interrupted, and the operating efficiency of the machining device is reduced.

[0009] The present invention has been made in view of the above problems, and has an object to provide a machining tool capable of suppressing adhesion of machining debris. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided a machining tool for processing a workpiece, comprising a base and a processing part fixed to the base and contacting the workpiece to process the workpiece, the base including a water-repellent area that has been treated to repel water.

[0011] Preferably, the water-repellent region is a region in which a plurality of recesses are provided. Also, preferably, the depth of the recesses is 5 μm or more and 30 μm or less. Furthermore, preferably, the base is an annular member having an outer peripheral surface, the processing part is a grinding wheel that grinds the workpiece, and the water-repellent region is provided on the outer peripheral surface of the base. Effect of the Invention

[0012] A machining tool according to one aspect of the present invention includes a water-repellent region that has been subjected to a water-repellent treatment, which makes it difficult for machining fluid containing machining debris to adhere to the machining tool during machining of a workpiece, thereby suppressing adhesion and accumulation of machining debris on the machining tool. [Brief description of the drawings]

[0013] [Figure 1] FIG. [Diagram 2] FIG. [Diagram 3] 1 is a partial cross-sectional side view showing a grinding device for grinding a workpiece. [Figure 4] FIG. 4(A) is a cross-sectional view showing a part of the processing tool, and FIG. 4(B) is a cross-sectional view showing a part of the base. [Diagram 5] FIG. 4 is a partial cross-sectional side view showing the water repellent treatment unit. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. First, a configuration example of a processing device capable of processing a workpiece by a processing tool according to this embodiment will be described. FIG. 1 is a perspective view showing a grinding device 2 that grinds a workpiece 11. In FIG. 1, the X-axis direction (first horizontal direction, front-back direction) and the Y-axis direction (second horizontal direction, left-right direction) are perpendicular to each other. Also, the Z-axis direction (height direction, up-down direction, vertical direction) is perpendicular to the X-axis direction and the Y-axis direction.

[0015] For example, the workpiece 11 is a disk-shaped wafer made of a semiconductor material such as single crystal silicon, and has a front surface (first surface) 11a and a back surface (second surface) 11b that are generally parallel to each other. The workpiece 11 is divided into a plurality of rectangular regions by a plurality of streets (planned division lines) arranged in a lattice shape so as to intersect with each other. In addition, devices (not shown), such as ICs (Integrated Circuits), LSIs (Large Scale Integration), LEDs (Light Emitting Diodes), and MEMS (Micro Electro Mechanical Systems) devices, are formed on the front surface 11a side of each of the plurality of regions divided by the streets.

[0016] By dividing the workpiece 11 along the streets, a plurality of device chips each equipped with a device are manufactured. The workpiece 11 can be divided using a cutting device that cuts the workpiece 11 with an annular cutting blade or the like. Furthermore, if the back surface 11b side of the workpiece 11 is ground by a grinding device 2 to thin the workpiece 11 before dividing the workpiece 11, a thinned device chip can be obtained.

[0017] However, there are no limitations on the type, material, size, shape, structure, etc. of the workpiece 11. For example, the workpiece 11 may be a wafer (substrate) made of a semiconductor other than silicon (GaAs, InP, GaN, SiC, etc.), sapphire, glass, ceramics, resin, metal, etc. In addition, there are no limitations on the type, number, shape, structure, size, arrangement, etc. of devices, and the workpiece 11 does not necessarily have to have devices formed thereon.

[0018] Furthermore, the workpiece 11 may be a package substrate such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate. For example, a package substrate is formed by mounting a plurality of device chips on a predetermined substrate and covering and sealing the mounted device chips with a resin layer (molding resin). By dividing the package substrate using a cutting device or the like, a plurality of package devices each including a plurality of packaged device chips are manufactured. In addition, before dividing the package substrate, the resin layer of the package substrate is ground by a grinding device 2 to thin the package substrate, thereby obtaining a thin package device.

[0019] The grinding device 2 includes a base 4 that supports or houses each of the components that make up the grinding device 2. A rectangular opening 4a is provided on the upper surface side of the base 4, with its longitudinal direction aligned with the X-axis direction. In addition, a rectangular parallelepiped support structure 6 is provided on the upper surface side of the rear end portion of the base 4, aligned with the Z-axis direction.

[0020] A chuck table (holding table) 8 is provided inside the opening 4a to hold the workpiece 11. The upper surface of the chuck table 8 is a flat surface that is roughly parallel to the horizontal plane (XY plane) and constitutes a holding surface 8a that holds the workpiece 11. The holding surface 8a is connected to a suction source (not shown) such as an ejector via a flow path (not shown), a valve (not shown), and the like formed inside the chuck table 8.

[0021] An X-axis moving unit 10 that moves the chuck table 8 along the X-axis direction is connected to the chuck table 8. For example, the X-axis moving unit 10 is a ball screw type moving mechanism, and is provided inside the opening 4a. Specifically, the X-axis moving unit 10 includes an X-axis ball screw (not shown) arranged along the X-axis direction, and an X-axis pulse motor (not shown) that rotates the X-axis ball screw.

[0022] The X-axis moving unit 10 also includes a flat table cover 12 provided to surround the chuck table 8. A bellows-shaped dust-proof and drip-proof cover 14 that is expandable and contractible along the X-axis direction is provided in front and behind the table cover 12. The table cover 12 and the dust-proof and drip-proof cover 14 are installed so as to cover the components of the X-axis moving unit 10 (X-axis ball screw, X-axis pulse motor, etc.) housed inside the opening 4a.

[0023] When the X-axis moving unit 10 is operated, the chuck table 8 moves along the X-axis direction together with the table cover 12 and is positioned at the front end (transport position) or rear end (grinding position) of the opening 4a. In addition, the chuck table 8 is connected to a rotation drive source (not shown) such as a motor that rotates the chuck table 8 around a rotation axis roughly parallel to the Z-axis direction.

[0024] A Z-axis moving unit 16 is provided on the surface side (front side) of the support structure 6. For example, the Z-axis moving unit 16 is configured with a ball screw type moving mechanism. Specifically, the Z-axis moving unit 16 includes a pair of Z-axis guide rails 18 arranged along the Z-axis direction. A flat Z-axis moving plate 20 is attached to the pair of Z-axis guide rails 18 so as to be slidable along the Z-axis guide rails 18.

[0025] A nut portion (not shown) is provided on the back surface (rear surface) side of the Z-axis moving plate 20. A Z-axis ball screw 22 disposed along the Z-axis direction between a pair of Z-axis guide rails 18 is screwed into this nut portion. A Z-axis pulse motor 24 is connected to an end of the Z-axis ball screw 22. When the Z-axis pulse motor 24 rotates the Z-axis ball screw 22, the Z-axis moving plate 20 moves (rises and falls) along the Z-axis guide rails 18 in the Z-axis direction.

[0026] A support member 26 is fixed to the surface side (front side) of the Z-axis moving plate 20. The support member 26 supports a processing unit (grinding unit) 28 that performs grinding on the workpiece 11.

[0027] The machining unit 28 includes a cylindrical housing 30 supported by the support member 26. A cylindrical spindle 32 arranged along the Z-axis direction is accommodated in the housing 30. A tip end (lower end) of the spindle 32 protrudes downward from the lower surface of the housing 30. A rotation drive source (not shown), such as a motor, that rotates the spindle 32 is coupled to a base end (upper end) of the spindle 32.

[0028] A disk-shaped wheel mount 34 made of metal or the like is fixed to the tip of the spindle 32. A processing tool (grinding wheel) 36 for grinding the workpiece 11 is detachably attached to the underside of the wheel mount 34. The processing tool 36 includes an annular base 38 and a plurality of processing parts (grinding wheels) 40 fixed to the base 38. The processing tool 36 rotates around a rotation axis roughly parallel to the Z-axis direction by power transmitted from a rotation drive source via the spindle 32 and the wheel mount 34. The configuration and function of the processing tool 36 will be described in detail later (see FIG. 2).

[0029] A machining fluid supply source 42 is connected to the machining unit 28, which supplies a liquid (machining fluid) such as pure water to the machining unit 28. When the workpiece 11 is ground by the grinding device 2, the machining fluid that flows into the machining unit 28 from the machining fluid supply source 42 via a valve (not shown) or the like is supplied to the workpiece 11 and the machining tool 36.

[0030] The grinding device 2 also includes a controller (control unit, control section, control device) 44 that controls the grinding device 2. The controller 44 is connected to the components of the grinding device 2 (the chuck table 8, the X-axis moving unit 10, the Z-axis moving unit 16, the processing unit 28, etc.), and controls the operation of the grinding device 2 by outputting control signals to each component.

[0031] For example, the controller 44 is configured by a computer. Specifically, the controller 44 includes a processing unit that performs calculations and the like for operating the grinding device 2, and a storage unit that stores various information (data, programs, etc.) used for operating the grinding device 2. The processing unit includes a processor such as a CPU (Central Processing Unit). The storage unit includes memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory).

[0032] Next, a description will be given of the processing tool 36 attached to the processing unit 28. Fig. 2 is a perspective view showing the processing tool 36. The processing tool 36 is a grinding wheel that grinds the workpiece 11, and includes a base 38 and a plurality of processing parts 40.

[0033] For example, the base 38 is an annular member made of a metal such as an aluminum alloy (Al-Si alloy, etc.) or stainless steel, a hard resin, ceramics, etc., and is formed to have approximately the same diameter as the wheel mount 34 (see FIG. 1). The base 38 has a first surface 38a and a second surface 38b that are approximately parallel to each other, and an outer circumferential surface (side surface) 38c connected to the first surface 38a and the second surface 38b. The first surface 38a corresponds to a fixed end surface that is fixed to the wheel mount 34 (see FIG. 1), and the second surface 38b corresponds to a free end surface that is not fixed to the wheel mount 34. The outer circumferential surface 38c corresponds to an annular curved surface that is exposed toward the radially outward side of the base 38.

[0034] An opening 38d is provided in the center of the base 38, penetrating the base 38 in the thickness direction from the first surface 38a to the second surface 38b. For example, the opening 38d is formed in a truncated cone shape whose diameter increases from the first surface 38a toward the second surface 38b. The inner peripheral surface (side surface) of the base 38 is exposed inside the opening 38d. In addition, an annular groove 38e is provided along the outer peripheral edge of the base 38 on the second surface 38b side of the base 38. The opening 38d and the groove 38e are formed concentrically with the base 38.

[0035] A plurality of processing parts 40 are inserted and fixed inside the groove 38e. The processing parts 40 are grinding stones that come into contact with the workpiece 11 to grind the workpiece 11. Specifically, the processing parts 40 include abrasive grains made of diamond, cBN (cubic boron nitride), or the like, and a bonding material (bond material) that bonds the abrasive grains. As the bonding material, a vitrified bond made of glass, mainly composed of SiO2, or a resin bond, mainly composed of resin, can be used. However, there are no limitations on the materials of the abrasive grains and the bonding material, the particle size of the abrasive grains, or the like.

[0036] The processing parts 40 are formed, for example, in a rectangular parallelepiped shape, and are arranged in a ring shape at approximately equal intervals along the groove 38e. The width of the processing parts 40 and the width of the groove 38e are approximately equal, and the processing parts 40 are arranged so that their length direction (longitudinal direction) is along the tangential direction (circumferential direction) of the groove 38e. The processing parts 40 are provided with a rectangular grinding surface 40a exposed toward the opposite side to the base 38. The grinding surface 40a is a surface that comes into contact with the workpiece 11 during grinding, and the workpiece 11 is ground by the grinding surface 40a.

[0037] The base 38 also has a plurality of machining liquid supply paths 38f that extend from the first surface 38a to the second surface 38b and penetrate the base 38. The machining liquid supply paths 38f are formed so that one end opens at the first surface 38a and the other end opens at the second surface 38b, and are arranged at approximately equal intervals along the circumferential direction of the base 38.

[0038] 3 is a partial cross-sectional side view showing the grinding device 2 that grinds the workpiece 11. When the grinding device 2 grinds the workpiece 11, a processing tool 36 is attached to the wheel mount 34. For example, the processing tool 36 is detachably fixed to the wheel mount 34 by a fastener (not shown) such as a fastening bolt. As a result, the processing tool 36 is attached to the tip of the spindle 32 via the wheel mount 34.

[0039] A machining liquid supply path 32a is formed inside the spindle 32 along the height direction (Z-axis direction) of the spindle 32. A machining liquid supply source 42 that supplies machining liquid 46 is connected to the machining liquid supply path 32a. A lower end of the machining liquid supply path 32a opens at the lower surface of the spindle 32.

[0040] A machining liquid supply path 34a is formed inside the wheel mount 34. The upper end of the machining liquid supply path 34a opens at the upper surface of the wheel mount 34, and is connected to the machining liquid supply path 32a of the spindle 32. The lower end of the machining liquid supply path 34a opens in an annular shape at the lower surface of the wheel mount 34.

[0041] When the machining tool 36 is attached to the wheel mount 34, the multiple machining fluid supply paths 38f are each connected to the machining fluid supply path 34a on the underside of the wheel mount 34. This forms a flow path for machining fluid 46 from the machining fluid supply source 42 to the machining unit 40 via the machining fluid supply paths 32a, 34a, and 38f.

[0042] When the spindle 32 is rotated with the machining tool 36 attached to the wheel mount 34, the machining tool 36 rotates around a rotation axis that is approximately parallel to the Z-axis direction. As a result, each of the multiple machining parts 40 rotates (turns) along a circular orbit (rotation path) centered on the rotation axis of the machining tool 36.

[0043] The workpiece 11 carried into the grinding device 2 is held by the chuck table 8 positioned at the transfer position. For example, the workpiece 11 is placed on the chuck table 8 so that the front surface 11a faces the holding surface 8a and the back surface 11b (surface to be ground) is exposed upward. In this state, when the suction force (negative pressure) of the suction source is applied to the holding surface 8a, the front surface 11a of the workpiece 11 is sucked and held by the holding surface 8a.

[0044] A sheet (protective sheet) for protecting the workpiece 11 may be attached to the front surface 11a side of the workpiece 11. For example, a tape including a film-like base material and an adhesive layer (glue) provided on the base material is used as the protective sheet. The protective sheet may also be a thermocompression sheet that does not include an adhesive layer and can be thermocompression bonded to the workpiece 11. When the protective sheet is attached to the front surface 11a side of the workpiece 11, the workpiece 11 is suction-held by the chuck table 8 via the protective sheet.

[0045] Next, the positional relationship between the chuck table 8 and the processing tool 36 is adjusted. Specifically, the chuck table 8 is moved along the X-axis direction by the X-axis moving unit 10 (see FIG. 1) and positioned at the grinding position. As a result, the chuck table 8 is positioned so that the rotation path of the processing unit 40 overlaps with the center of the workpiece 11 in the Z-axis direction. Note that the diameter of the rotation path of the processing unit 40 is at least greater than the radius of the workpiece 11. Therefore, the processing unit 40 is positioned so as to overlap with an arc-shaped region extending from the center of the workpiece 11 to the outer periphery.

[0046] Next, while rotating the chuck table 8 and the machining tool 36, the machining unit 28 is lowered along the Z-axis direction by the Z-axis moving unit 16 (see FIG. 1). As a result, the chuck table 8 and the machining tool 36 move relatively along the Z-axis direction, and the machining part 40 approaches and contacts the workpiece 11 while rotating.

[0047] When the processing part 40 comes into contact with the back surface 11b of the workpiece 11, the back surface 11b of the workpiece 11 is scraped off, and the workpiece 11 is ground and thinned. Then, when the thickness of the workpiece 11 reaches a predetermined target value (finishing thickness), the processing unit 28 rises and the processing part 40 moves away from the workpiece 11, and grinding of the workpiece 11 stops.

[0048] During grinding of the workpiece 11, a machining fluid 46 is supplied from the machining fluid supply source 42 to the machining fluid supply path 32a of the spindle 32. For example, pure water is used as the machining fluid 46. The machining fluid 46 flows through the machining fluid supply path 32a, the machining fluid supply path 34a, and the multiple machining fluid supply paths 38f in this order, and flows out from the second surface 38b side of the base 38, and is supplied to the workpiece 11 and the machining portion 40. This cools the workpiece 11 and the machining portion 40, and washes away chips (machining chips) generated by machining the workpiece 11.

[0049] Here, when the machining liquid 46 is supplied to the contact area between the workpiece 11 and the machining part 40, the machining liquid 46 flows while taking in machining debris, and comes into contact with the rotating workpiece 11 and the machining tool 36 and scatters. As a result, the machining liquid 46 mixed with the machining debris adheres to the machining tool 36, and the machining debris contained in the machining liquid 46 adheres to the machining tool 36. In particular, the machining debris is likely to adhere to the outer peripheral surface 38c of the base 38 exposed toward the outside of the machining tool 36. Then, when the machining of the workpiece 11 by the machining tool 36 continues, the machining debris accumulates on the machining tool 36. The machining debris accumulated on the machining tool 36 causes a decrease in machining quality and machining efficiency.

[0050] Therefore, in the machining tool 36 according to this embodiment, a water-repellent region that is water-repellent to the machining fluid 46 is formed on the base 38. As a result, the machining fluid 46 mixed with machining debris is repelled by the water-repellent region, making it difficult for the machining debris to adhere to the machining tool 36, and adhesion and accumulation of the machining debris on the machining tool 36 is suppressed.

[0051] Fig. 4(A) is a cross-sectional view showing a part of the processing tool 36. A water-repellent treatment is applied to the base 38 of the processing tool 36, and a water-repellent region 50 is formed. Fig. 4(A) shows an example in which the water-repellent region 50 is formed on the outer peripheral surface 38c of the base 38 to which the processing liquid 46 (see Fig. 3) is particularly likely to adhere.

[0052] The water-repellent region 50 has water repellency to the processing liquid 46. Specifically, the water-repellent region 50 corresponds to a region having higher water repellency (lower wettability) to the processing liquid 46 than a region of the base 38 where the water-repellent region 50 is not provided. More specifically, the contact angle between the water-repellent region 50 and the processing liquid 46 is larger than 90°, preferably 110° or more, and more preferably 150° or more.

[0053] There is no limitation on the type of water-repellent treatment for forming the water-repellent region 50. For example, the water-repellent region 50 is constituted by a plurality of recesses (grooves) 52. Specifically, a plurality of recesses 52 are formed at predetermined intervals or randomly on the outer peripheral surface 38c of the base 38. By forming the plurality of recesses 52, a lotus effect is exhibited on the outer peripheral surface 38c of the base 38, and the water-repellent region 50 is formed. In this case, the base 38 has a water-repellent region 50 on the outer peripheral surface 38c that repels the processing liquid 46 by the lotus effect.

[0054] FIG. 4(B) is a cross-sectional view showing a part of the base 38. When a plurality of recesses 52 are formed on the outer peripheral surface 38c of the base 38, a protrusion (convex portion) 54 remains between a pair of adjacent recesses 52. As a result, the recesses 52 (air layers) and the protrusions 54 are exposed on the outer peripheral surface 38c of the base 38. Then, when the processing liquid 46 (see FIG. 3) mixed with processing chips scatters on the outer peripheral surface 38c, the droplets of the processing liquid 46 adhere to the tip of the protrusion 54 without entering the inside of the recess 52. Thereby, a lotus effect is exhibited, and the processing liquid 46 is repelled in the water-repellent region 50.

[0055] The shape, dimensions, number, interval, etc. of the recesses 52 are appropriately set so that a lotus effect is exhibited in the water-repellent region 50. For example, the depth D of the recess 52 is set to 5 μm or more and 30 μm or less, preferably 10 μm or more and 20 μm or less. Further, the width W1 of the recess 52 is set to a value smaller than the depth D of the recess 52 (W1 < D), preferably 1 / 2 or less of the depth D of the recess 52. Furthermore, the width W2 of the protrusion 54 is set to a value smaller than the width W1 of the recess 52 (W2 < W1), preferably 1 / 2 or less of the width W1 of the recess 52. However, as long as the water-repellent action by the lotus effect can be obtained, the recesses 52 outside the above dimension range may be included in the water-repellent region 50.

[0056] There is also no limitation on the range of the base 38 on which the water-repellent region 50 is formed. For example, an annular water-repellent region 50 may be formed over the entire outer peripheral surface 38c, or a plurality of water-repellent regions 50 may be formed at predetermined intervals along the circumferential direction of the outer peripheral surface 38c. Furthermore, in addition to the outer peripheral surface 38c, the water-repellent region 50 may be formed on the second surface 38b of the base 38 and / or on the inside (inner peripheral surface) of the opening 38d.

[0057] 5 is a partial cross-sectional side view showing a water-repellent treatment unit 60 that performs water-repellent treatment on the base 38 to form the water-repellent region 50. For example, the multiple recesses 52 are formed by shot peening. In this case, a shot peening device that processes an object by shot peening is used as the water-repellent treatment unit 60.

[0058] Specifically, the water-repellent treatment unit 60 includes a cylindrical cover 62 that houses a plurality of particles 64. The particles 64 are spherical hard particles called projection material, shot material, media, etc., and are made of materials such as ferrous or non-ferrous metals, glass, ceramics, resin, etc. The water-repellent treatment unit 60 applies cold working to the surface of the object by colliding the particles 64 with the object.

[0059] The specific material of the particles 64 is appropriately selected depending on the material of the base 38 of the processing tool 36. For example, when the base 38 is made of an Al-Si alloy (silumin), zirconia particles or the like can be used as the particles 64. Furthermore, the particle size of the particles 64 is selected depending on the dimensions of the recesses 52 to be formed in the base 38. To form the water-repellent region 50, for example, particles 64 with an average particle size of about 0.1 to 1 mm can be used.

[0060] A vibration imparting unit 66 is connected to the cover 62. The vibration imparting unit 66 includes a transducer 68 that vibrates along the height direction of the cover 62, and vibrates the transducer 68 at a frequency that belongs to the ultrasonic band, for example.

[0061] When forming the water-repellent region 50 on the outer peripheral surface 38c of the base 38, first, the tip of the cover 62 is brought into contact with the outer peripheral surface 38c. When the vibration imparting unit 66 is operated in this state, vibrations (ultrasonic vibrations) at a frequency belonging to the ultrasonic band are imparted to the vibrator 68. Then, the particles 64 that come into contact with the vibrating vibrator 68 are scattered at high speed toward the tip of the cover 62. As a result, the particles 64 collide with the outer peripheral surface 38c, and recesses 52 are formed on the outer peripheral surface 38c.

[0062] The processing of the base 38 by the water repellent processing unit 60 can be completed in a short time since it is sufficient if the recesses 52 can be formed on the outer peripheral surface 38c of the base 38. For example, when the vibration frequency of the vibrator 68 is set to 20 kHz, the recesses 52 can be formed on the outer peripheral surface 38c by processing the outer peripheral surface 38c of the base 38 with the particles 64 for about 10 to 30 seconds.

[0063] Thereafter, the processing of the base 38 is continued while the water-repellent processing unit 60 is moved, and a plurality of recesses 52 are formed in desired regions of the outer peripheral surface 38c of the base 38. As a result, the water-repellent region 50 is formed on the outer peripheral surface 38c of the base 38.

[0064] Although the above describes the case where the recesses 52 are formed in the base 38 by shot peening, there is no limitation on the method of forming the recesses 52. For example, the recesses 52 may be formed by a crushing process such as cutting or laser processing. However, shot peening is a suitable method of forming the recesses 52 in the base 38 because it can easily form the recesses 52 even on a curved surface or a surface with a complex shape.

[0065] As described above, the machining tool 36 according to the present embodiment includes the water-repellent region 50 that has been subjected to a water-repellent treatment. This makes it difficult for machining fluid containing machining debris to adhere to the machining tool 36 during machining of the workpiece 11, thereby suppressing adhesion and accumulation of machining debris on the machining tool 36.

[0066] In the present embodiment, the water-repellent region 50 is configured by a plurality of recesses 52. However, there are no limitations on the configuration of the water-repellent region 50 as long as the water-repellent region 50 is water-repellent to the processing fluid 46. For example, the water-repellent region 50 may be formed by subjecting the base 38 to an anodizing treatment, or may be formed by subjecting the base 38 to a coating of resin such as fluororesin.

[0067] Furthermore, in the present embodiment, the processing tool (grinding wheel) 36 for grinding the workpiece 11 has been described as a specific example of the processing tool, but the processing tool according to the present invention is not limited to the grinding wheel. For example, the processing tool according to the present invention may be a cutting blade attached to a cutting device for cutting the workpiece 11, or a polishing pad attached to a polishing device for polishing the workpiece 11.

[0068] The cutting device includes a chuck table that holds the workpiece 11, and a processing unit (cutting unit) that performs cutting processing on the workpiece 11. The cutting unit includes a spindle, and an annular cutting blade that cuts the workpiece 11 is attached to the tip of the spindle. The workpiece 11 is held by the chuck table, and the cutting blade is rotated while cutting into the workpiece 11, thereby cutting the workpiece 11.

[0069] The cutting blade includes an annular base and an annular cutting edge formed along the outer periphery of the base. When cutting the workpiece 11, the cutting edge of the cutting blade is brought into contact with the workpiece 11 while supplying machining fluid to the workpiece 11 and the cutting blade. At this time, by forming a water-repellent area on the base of the cutting blade, adhesion and accumulation of machining chips on the base of the cutting blade is suppressed.

[0070] The polishing device includes a chuck table that holds the workpiece 11, and a processing unit (polishing unit) that performs polishing on the workpiece 11. The polishing unit includes a spindle, and a disk-shaped polishing pad that polishes the workpiece 11 is attached to the tip of the spindle. The workpiece 11 is held by the chuck table, and the polishing pad is brought into contact with the workpiece 11 while rotating the chuck table and the polishing pad, thereby polishing the workpiece 11.

[0071] The polishing pad includes a disk-shaped base and a polishing layer fixed to the base. When polishing the workpiece 11, the polishing layer is brought into contact with the workpiece 11 while a processing liquid is supplied to the workpiece 11 and the polishing layer. At this time, by forming a water-repellent area on the base of the polishing pad, adhesion and accumulation of processing waste on the base of the polishing pad is suppressed.

[0072] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of symbols]

[0073] 11 Workpiece 11a Surface (first side) 11b Back side (2nd side) 2 Grinding equipment 4. Bass 4a aperture 6 Support structure 8 Chuck table (holding table) 8a Holding surface 10 X-axis moving unit 12 Table Cover 14 Dust-proof / water-proof cover 16 Z-axis movement unit 18 Z-axis guide rail 20 Z-axis moving plate 22 Z-axis ball screw 24 Z-axis pulse motor 26 Support member 28 Processing unit (grinding unit) 30 Housing 32 Spindle 32a Machining fluid supply path 34 Wheel mount 34a Machining fluid supply path 36 Machining tools (grinding wheels) 38 Foundation 38a 1st page 38b 2nd side 38c Outer surface (side) 38d aperture 38e groove 38f Machining fluid supply path 40 Processing section (grinding wheel) 40a Grinding surface 42 Processing fluid supply source 44 Controller (control unit, control section, control device) 46 Processing fluid 50 Water-repellent area 52 Recess (groove) 54 Protrusion (convex part) 60 Water repellent treatment unit 62 Cover 64 particles 66 Vibration unit 68 Transducer

Claims

1. A processing tool for processing a workpiece, The base and a processing unit fixed to the base and contacting the workpiece to process the workpiece, The processing tool is characterized in that the base includes a water-repellent area that has been subjected to a water-repellent treatment.

2. 2. The machining tool according to claim 1, wherein the water-repellent area is an area in which a plurality of recesses are provided.

3. 3. The machining tool according to claim 2, wherein the depth of the recess is 5 μm or more and 30 μm or less.

4. The base is an annular member having an outer circumferential surface, The processing part is a grinding wheel that grinds the workpiece, 4. The processing tool according to claim 1, wherein the water-repellent area is provided on the outer circumferential surface of the base.

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