Substrate processing apparatus, substrate processing method, and article manufacturing method

Abstract

To provide a technique advantageous for reducing processing time of processing of drying a structure around a substrate.SOLUTION: A substrate processing apparatus comprises: an airtight container; a substrate holding unit that is arranged inside the airtight container, and can hold a substrate applied with a solution including a solvent; a pressure reduction unit that reduces the pressure inside the airtight container; a defining member that defines a space surrounding the substrate inside the airtight container; a sensor unit that faces the space defined by the defining member; and a measurement unit that outputs a different measurement result depending on whether the solvent is attached to the sensor unit.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing apparatus, a substrate processing method, and a method for manufacturing an article. [Background technology]

[0002] When manufacturing articles such as panels (organic EL panels) having OLEDs (organic light emitting diodes), which are organic EL (electroluminescence) elements, there is a known method of applying a solution film to a desired location on a substrate using an inkjet device. A solution film is a film made of a solution containing a solute and a solvent. A film (layer) is formed on the substrate by drying the substrate, i.e., by evaporating the solvent contained in the solution film applied onto the substrate. A reduced pressure drying device, which is a substrate processing device, is used to dry the substrate.

[0003] Patent Document 1 discloses a method for manufacturing a liquid crystal display using a solvent collector disposed between a top plate and a substrate, the thermal capacity of which is set to 850 J / K·m 2 The following reduced pressure drying apparatus is disclosed. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2019-35527 A Summary of the Invention [Problem to be solved by the invention]

[0005] Most of the solvent evaporated from the substrate placed inside the airtight container of the substrate processing apparatus is exhausted to the outside of the airtight container by a pump, but some of the evaporated solvent adheres to the structures around the substrate inside the airtight container. If the substrate drying process in the next process is performed with the solvent from the previous process still adhering to the structures around the substrate, it will affect the film thickness distribution of the film formed on the substrate in the next process. Therefore, after the substrate drying process is completed, a drying process must be performed to dry the structures inside the airtight container.

[0006] When drying a structure, the treatment time is determined to be a predetermined time with a certain margin in advance so as to ensure that the solvent attached to the structure is sufficiently evaporated. Therefore, a situation may arise in which the drying treatment of the structure is continued even though the structure is sufficiently dry, so it is desired to shorten the drying treatment time.

[0007] The present disclosure provides an advantageous technique for shortening the processing time for drying a structure around a substrate. [Means for solving the problem]

[0008] One aspect of the present disclosure is a substrate processing apparatus comprising: an airtight container; a substrate holding section disposed inside the airtight container and capable of holding a substrate coated with a solution containing a solvent; a pressure reducing section that reduces the pressure inside the airtight container; a defining member that defines a space surrounding the substrate inside the airtight container; a sensor section facing the space defined by the defining member; and a measurement section that outputs a measurement result that differs depending on whether or not a solvent has adhered to the sensor section. Effect of the Invention

[0009] According to the present disclosure, an advantageous technique is provided for shortening the processing time of a process for drying a structure around a substrate. [Brief description of the drawings]

[0010] [Figure 1] 1 is a schematic cross-sectional view showing a configuration of a reduced-pressure drying apparatus as an example of a substrate processing apparatus according to a first embodiment. [Diagram 2] 1A is a top view of a part of the configuration of the reduced pressure drying apparatus according to the first embodiment, and FIG. 1B is a side view of the sensor unit according to the first embodiment. [Diagram 3] FIG. 1 is an explanatory diagram of a measurement system according to a first embodiment. [Figure 4] 4 is a flowchart of a substrate processing method according to the first embodiment. [Diagram 5] FIG. 4 is an explanatory diagram of a drying step according to the first embodiment. [Figure 6] FIG. 4 is an explanatory view of a first drying process according to the first embodiment. [Figure 7] 4 is a graph showing a schematic current value measured by the measurement device according to the first embodiment. [Figure 8] 10 is a graph showing a schematic diagram of an electric resistance value measured by a measuring device according to a first modified example. [Figure 9] 10 is a schematic cross-sectional view showing a configuration of a reduced-pressure drying apparatus as an example of a substrate processing apparatus according to a second embodiment. [Figure 10] 10 is a graph showing a schematic natural frequency of a quartz crystal resonator measured by a measuring device according to a second embodiment. [Figure 11] 11 is a schematic cross-sectional view showing a configuration of a reduced-pressure drying apparatus as an example of a substrate processing apparatus according to a third embodiment. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the drawings. In each drawing, the same components are given the same reference numbers, and duplicated descriptions will be omitted. In the following embodiments, directions are indicated by an XYZ coordinate system, which is an orthogonal coordinate system. The X, Y, and Z directions are mutually orthogonal. In the XYZ coordinate system, the XY plane is a horizontal plane, and the XZ and YZ planes are vertical planes. The X and Y directions are horizontal directions. The negative direction of the Z axis is the vertical direction (gravity direction), in other words, the downward direction. The positive direction of the Z axis is the upward direction.

[0012] First Embodiment Fig. 1 is a schematic cross-sectional view showing the configuration of a reduced-pressure drying apparatus 100, which is an example of a substrate processing apparatus according to the first embodiment. Fig. 2(a) is a top view of a portion of the configuration of the reduced-pressure drying apparatus 100 according to the first embodiment. The reduced-pressure drying apparatus 100 is used in a portion of a process for manufacturing an organic EL panel having an OLED, which is an organic EL element. The reduced-pressure drying apparatus 100 evaporates a solution film F applied to a substrate S, i.e., performs a drying process for drying the substrate S, thereby forming a functional film, such as an organic film, on the substrate S.

[0013] The solution film F is composed of, for example, a solution containing a solute and a solvent for forming an organic film. The solvent contained in the solution film F preferably has a property that evaporation is promoted in a reduced pressure environment lower than atmospheric pressure. The evaporation of the solvent is preferably promoted, for example, at a temperature higher than room temperature (25° C.).

[0014] The solute may be a functional material for forming a functional thin film such as an electrode or an optical filter, or a functional element such as an OLED.

[0015] The solvent is preferably an organic solvent. The solvent contains at least one kind of organic solvent. Examples of the organic solvent include N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone, diethylene glycol monomethyl ether, cyclohexanone, N,N-dimethylisobutyramide, N-methylformamide, N-methylacetamide, N-diethylformamide, cyclohexanol, ethylene glycol, ethylene glycol diglycidyl ether, 1,3-octylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, tripropylene glycol, 1,3-butanediol, 1,4-butanediol, and the like. Examples of the monomer units include propylene glycol, hexylene glycol, propylene glycol monomethyl ether, ethylene glycol monobutyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether, diacetone alcohol, γ-butyrolactone, ethyl lactate, N-hexyl acetate, and ethyl cellosolve acetate.

[0016] The organic film is an organic layer, and is, for example, any one of a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer of an OLED. The manufacture of an organic EL element includes a process of forming each of the organic films, ie, the hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer, and the electron injection layer, on a substrate S. The solution film F is applied to a required location on the substrate S by a coating device before the substrate S is carried into the reduced pressure drying device 100.

[0017] The reduced pressure drying apparatus 100 includes an airtight container 10, a decompression mechanism 30 that reduces the pressure inside the airtight container 10, and a substrate holding unit 20 that is disposed inside the airtight container 10 and capable of holding a substrate S. The decompression mechanism 30 is an example of a decompression unit. The reduced pressure drying apparatus 100 also includes a cover unit 40 that is disposed inside the airtight container 10 at a position that surrounds the substrate S held by the substrate holding unit 20, and a lifting mechanism 80 that lifts and lowers the cover unit 40 in the vertical direction. The cover unit 40 is an example of a partitioning member. The cover unit 40 is disposed at a position that does not contact the substrate S held by the substrate holding unit 20.

[0018] The pressure of the external environment of the airtight container 10 is atmospheric pressure. The airtight container 10 is a member that defines an internal space SP0. The internal space SP0 is a space inside the airtight container 10. The internal space SP0 includes a space SP1 and a space SP2. The cover unit 40 is placed on the substrate holding part 20 to define a space SP2 that surrounds the substrate S inside the airtight container 10. The space SP2 is specifically a space surrounded by an inner wall surface 401 of the cover unit 40 and the upper surface of the substrate holding part 20. The space SP1 is a space other than the space SP2 in the internal space SP0. The inner wall surface 401 is a wall surface of the cover unit 40 that faces the space SP2. By surrounding the substrate S on the substrate holding part 20 with the cover unit 40, the pressure distribution in the space SP2 is adjusted to be as uniform as possible.

[0019] The reduced pressure drying apparatus 100 includes a gate valve 12 provided in an airtight container 10. A substrate S coated with a solution film F to be dried is carried from the external space of the airtight container 10 into the internal space SP0 through the gate valve 12. The substrate S that has been dried is carried out from the internal space SP0 to the external space through the gate valve 12. The substrate S is carried in and out by a transport device (not shown) placed outside the airtight container 10.

[0020] The lifting mechanism 80 is used to lift the cover unit 40 when the substrate S is loaded into the substrate holding portion 20 and when the substrate S is unloaded from the substrate holding portion 20.

[0021] The decompression mechanism 30 includes at least one pump, for example, a plurality of pumps. The plurality of pumps includes at least one of, for example, a dry pump and a diaphragm vacuum pump. The plurality of pumps may also include at least one of, for example, a turbo molecular pump, a cryopump, a sorption pump, an oil diffusion pump, a mechanical booster pump, an ejector pump, and an oil rotary vacuum pump.

[0022] The reduced pressure drying apparatus 100 further includes a temperature control unit 70. The temperature control unit 70 controls the temperature of the substrate S or the solution film F on the substrate S by controlling the temperature of the substrate holding unit 20. The temperature control unit 70 preferably includes a heater that heats the substrate holding unit 20.

[0023] Furthermore, the temperature control unit 70 may include a cooler that cools the substrate holding unit 20. The temperature control unit 70 controls the temperature of the substrate holding unit 20 by performing at least one of heating and cooling on the substrate holding unit 20.

[0024] The temperature control unit 70 controls the multiple regions of the substrate holding unit 20 to be at the same temperature or at different temperatures so that the substrate S has a uniform temperature distribution. Preferably, the temperature control unit 70 controls the temperature difference between the multiple regions of the substrate S held by the substrate holding unit 20 to be within 10° C. More preferably, the temperature control unit 70 controls the temperature difference between the multiple regions of the substrate S held by the substrate holding unit 20 to be within 5° C. The temperature control unit 70 controls the temperature of the substrate holding unit 20 so that the temperature of the substrate S becomes a predetermined temperature within a range from 0° C. to 100° C. By heating the substrate holding unit 20, the drying speed of the solution film F applied on the substrate S can be improved.

[0025] The reduced pressure drying apparatus 100 further includes a gas introduction part 50 that introduces an inert gas into the internal space SP0. The gas introduction part 50 is preferably, for example, a flexible tube. A valve 53 is disposed in the gas introduction part 50. The gas introduction part 50 is provided so as to penetrate the airtight container 10, and is configured to be able to supply the inert gas to the internal space SP0.

[0026] The inert gas is, for example, nitrogen. In the first embodiment, the gas supplied from the gas introduction part 50 to the inside of the airtight container 10 is preferably an inert gas, but may be a gas other than the inert gas as long as it has a composition different from that of the solvent of the solution film F, for example, clean dry air.

[0027] The pressure in the internal space SP0 of the airtight container 10 is adjusted by supplying gas to the internal space SP0 via the gas introduction part 50. The pressure in the internal space SP0 during the drying process is adjusted by a balance between exhaust of gas such as solvent vapor or inert gas by the pressure reduction mechanism 30 and supply of gas such as inert gas from the gas introduction part 50.

[0028] Moreover, the reduced pressure drying apparatus 100 further includes a pressure gauge 57 that detects the pressure in the internal space SP0 of the airtight container 10. The pressure gauge 57 is disposed in the airtight container 10, for example.

[0029] The cover unit 40 is disposed on the substrate holder 20. The main material of the cover unit 40 is preferably a metal, such as stainless steel. The stainless steel is preferably an austenitic stainless steel containing, for example, 0.045% or less phosphorus and 0.030% or less sulfur (i.e., stainless steel designated as SUS304 in the Japanese Industrial Standards: JIS).

[0030] The cover unit 40 includes an enclosing wall 41 and a cover member 42. The cover member 42 may be integral with the enclosing wall 41 or may be separate from the enclosing wall 41. In the first embodiment, the cover member 42 is integral with the enclosing wall 41. The cover unit 40 is movable by a lifting mechanism 80 in the up and down directions relative to the substrate holding part 20, i.e., in the positive direction of the Z axis and the negative direction of the Z axis.

[0031] When the cover member 42 is separate from the surrounding wall 41, the cover member 42 may be movable by a lifting mechanism 80 in the positive direction of the Z axis and the negative direction of the Z axis, which are vertical directions relative to the surrounding wall 41, i.e., the substrate holding part 20. Also, instead of the lifting mechanism 80, an opening through which the substrate can be loaded and unloaded may be provided in the surrounding wall 41 of the cover unit 40, and a shutter for opening and closing the opening may be provided.

[0032] The surrounding wall 41 is a wall member extending in the Z direction. The surrounding wall 41 is placed on the substrate holding part 20 and disposed at a position where it can face a side surface of the substrate S placed on the substrate holding part 20. Note that the surrounding wall 41 may be placed on another member.

[0033] The cover member 42 is disposed at a position facing the main surface of the substrate S in a direction perpendicular to the upper surface of the substrate holding part 20, i.e., in the Z direction. Specifically, the cover member 42 is disposed at a position facing the solution film F applied on the main surface of the substrate S in the Z direction.

[0034] The cover member 42 has a plurality of openings 43. Each opening 43 is a through hole. The shape of the openings 43 may be a round shape or a linear shape such as a slit. The arrangement and dimensions of the openings 43 are determined so that the solution film F applied on the substrate S is dried uniformly. For example, by making the area of ​​the openings 43 facing the part of the solution film F on the substrate S where the drying speed is high smaller than the area of ​​the other openings 43, the drying speed of the solution film F can be adjusted to eliminate unevenness in the drying speed.

[0035] The opening area per unit area in the cover unit 40 is referred to as the aperture ratio. In the cover unit 40, the area of ​​each opening 43 is adjusted so that the aperture ratio near the periphery of the substrate S is smaller than the aperture ratio near the center of the substrate S. For example, in the cover unit 40, the aperture ratio of the portion facing the center of the substrate S may be set to 40 to 70%, and the aperture ratio of the portion facing the periphery of the substrate S may be set to 20 to 50%. Note that the cover unit 40 does not necessarily have to have the opening 43, as long as it has a configuration that can communicate the space SP2 and the space SP1.

[0036] The reduced pressure drying apparatus 100 further includes a control device 90 that controls each part of the entire apparatus. The control device 90 is an example of a control unit. The control device 90 is configured, for example, by a computer. The control device 90 includes a CPU, which is an example of a processor, a RAM, which is a temporary storage device, a ROM and an SSD, which are non-temporary storage devices (recording media), and an I / O, which is an interface. The non-temporary storage device stores a control program that causes the CPU of the control device 90 to control each part of the entire apparatus in a manufacturing process described later. The control device 90 controls the pressure inside the airtight container 10 by controlling the decompression mechanism 30. The control device 90 also controls the valve 53 to control the supply and stop of gas to the inside of the airtight container 10 and the flow rate of gas.

[0037] In addition to the above-mentioned configuration, the control device 90 may be configured, for example, by a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), an ASIC (abbreviation for Application Specific Integrated Circuit), a general-purpose or dedicated computer with a program embedded therein, or a combination of all or part of these.

[0038] The reduced pressure drying apparatus 100 includes a measurement system 60 for detecting a solvent attached to the inner wall surface 401 of the cover unit 40. The measurement system 60 includes a measurement device 650 and a sensor unit 600.

[0039] The measuring device 650 is an example of a measuring section, and the sensor unit 600 is an example of a sensor section. The sensor unit 600 outputs a sensor signal to the measuring device 650 according to whether or not a solvent is attached to the sensor unit 600, and if a solvent is attached to the sensor unit 600, according to the amount of the solvent attached to the sensor unit 600. The measuring device 650 is electrically connected to the sensor unit 600 via wiring 61, 62 for passing electricity to the sensor unit 600. Each of the wiring 61, 62 includes a conductor and an insulating coating material that covers the conductor. The measuring device 650 obtains a sensor signal from the sensor unit 600 by passing electricity to the sensor unit 600. Then, the measuring device 650 processes the sensor signal and outputs a measurement value (data) according to the sensor signal as a measurement result to the control device 90. That is, the measuring device 650 outputs a measurement result that differs depending on whether or not a solvent is attached to the sensor unit 600. When the solvent adheres to the sensor unit 600, the measuring device 650 outputs a measurement result that differs depending on the amount of the solvent adhered to the sensor unit 600 as the measurement result.

[0040] The sensor unit 600 is disposed so as to face the space SP2. Fig. 2(b) is a side view of the sensor unit 600 according to the first embodiment, as viewed in the Y direction.

[0041] The sensor unit 600 has two electrodes 601 and 602 and an insulator 603. The insulator 603 is an example of a target object. The insulator 603 is disposed in a through hole formed in the surrounding wall 41 of the cover unit 40, and is provided integrally with the cover unit 40.

[0042] The electrode 601 is electrically connected to the wiring 61, and the electrode 602 is electrically connected to the wiring 62. The electrodes 601 and 602 are provided on the insulator 603 with a gap between them. In the first embodiment, the electrodes 601 and 602 are provided penetrating the insulator 603. The tip of the electrode 601 and the tip of the electrode 602 protrude from the insulator 603 to the space SP2 side. The insulator 603 is a material having a higher electrical resistance than a conductor and a semiconductor, and an example of the insulator 603 is quartz. The electrodes 601 and 602 are provided on the insulator 603 so as not to come into contact (short circuit) with the cover unit 40. The electrodes 601 and 602 are, for example, conductive plates.

[0043] When the solvent evaporated from the solution film F adheres to the inner wall surface 401 of the cover unit 40, the solvent evaporated from the solution film F may also adhere to the sensor unit 600. The measuring device 650 measures the electrical characteristics (conductive characteristics) between the two electrodes 601, 602. The electrical characteristics between the electrodes 601 and 602 change depending on whether or not the solvent adheres to the insulator 603. When the solvent adheres to the insulator 603, the electrical characteristics between the electrodes 601, 602 change from a state in which the solvent is not adhered to the insulator 603. In addition, when the solvent adheres to the insulator 603, the electrical characteristics between the electrodes 601, 602 also change depending on the amount of the solvent adhered to the insulator 603. The measuring device 650 acquires a sensor signal indicating the electrical characteristics from the sensor unit 600 and outputs a measurement result according to the sensor signal to the control device 90. That is, the measuring device 650 outputs a measurement result that differs depending on whether or not the solvent adheres to the sensor unit 600 to the control device 90. Furthermore, the measurement results differ depending on the amount of solvent attached to the sensor unit 600 .

[0044] 3 is an explanatory diagram of the measurement system 60 according to the first embodiment. The measurement device 650 includes an ammeter 651 capable of measuring a current, and a DC power supply 652 connected in series to the ammeter 651. When a DC voltage is applied between the electrodes 601 and 602 by the DC power supply 652, a current corresponding to the electrical resistance R10 between the electrodes 601 and 602 flows through the ammeter 651. The ammeter 651 outputs a current value (current data) corresponding to the current. With the above configuration, the measurement device 650 measures the current between the electrodes 601 and 602 as an electrical characteristic, and outputs the current value as an example of a measurement value that is a measurement result to the control device 90 at a predetermined cycle.

[0045] The electrical resistance of the insulator 603 between the electrodes 601 and 602 is R11. The electrical resistance of the solvent adhering to the insulator 603 is R12. The insulator 603 and the solvent are in a parallel connection relationship with respect to the electrodes 601 and 602 in the equivalent circuit. Therefore, the electrical resistance R10 is the combined resistance of the electrical resistances R11 and R12.

[0046] The volume resistivity of the insulator 603 is preferably higher than that of the solvent. This increases the change in electrical resistance R10 when the solvent adheres to the insulator 603, and increases the change in the current value. This improves the measurement accuracy of the measuring device 650. It is more preferable that the volume resistivity of the insulator 603 is 1000 times or more the volume resistivity of the solvent. Note that the measuring device 650 may use an AC power source instead of the DC power source 652. In this case, the ammeter 651 measures the current waveform.

[0047] A suitable position for the sensor unit 600 will be described. In Fig. 1, the solvent evaporated from the solution film F tends to rise and adheres to the portion of the inner wall surface 401 of the cover unit 40 facing the lower half region R1 in the vertical direction of the space SP2 more than to the portion facing the upper half region R2 in the vertical direction of the space SP2. That is, more solvent adheres to the portion of the inner wall surface 401 facing the lower half region R1. Therefore, it is preferable that the sensor unit 600 is arranged at a position facing the lower half region R1.

[0048] Hereinafter, some steps including a drying step (drying process) among a plurality of steps in a method for manufacturing an organic EL panel, which is an example of an article, will be described. A solution film F is applied to a necessary portion on a main surface of a substrate S by a coating device such as an inkjet device. Then, the substrate S on which the solution film F has been applied is carried onto the substrate holding unit 20 by a transport device (not shown). Then, under the control of the control device 90, a first drying process for evaporating the solvent contained in the solution film F on the substrate S and a second drying process for evaporating the solvent attached to the inner wall surface 401 of the cover unit 40 are performed. The first drying process is an example of a first process, and is a process for drying the substrate S. The second drying process is an example of a second process, and is a process for drying the inner wall surface 401 of the cover unit 40.

[0049] Fig. 4 is a flowchart of the substrate processing method according to the first embodiment. Fig. 5 is an explanatory diagram of the drying process according to the first embodiment. The horizontal axis in Fig. 5 represents time, and the vertical axis represents the pressure in the internal space SP0 and the current value. Before the substrate S is carried into the airtight container 10, the cover unit 40 is moved upward with respect to the substrate holding part 20.

[0050] 5, i.e., before the first drying process A1 and the second drying process A2, the control device 90 acquires a current value B0, which is a measurement value, from the measurement device 650 in step S1, and sets a threshold value TH1 based on the current value B0 in step S2. For example, the control device 90 sets the threshold value TH1 to the current value B0 or ​​a value that is a predetermined value greater than the current value B0. In the first embodiment, the threshold value TH1 is the upper limit value of the determination range.

[0051] In step S3, the control device 90 controls a transport device (not shown) to transport the substrate S coated with the solution film F into the airtight container 10 and place it on the substrate holder 20.

[0052] Next, in step S4, the control device 90 controls the lifting mechanism 80 to lower the cover unit 40 so that the substrate S is enclosed by the cover unit 40.

[0053] Next, in step S5, the control device 90 executes the first drying process A1. The first drying process A1 in step S5 will be specifically described below. The control device 90 controls the decompression mechanism 30 so that the pressure value detected by the pressure gauge 57 approaches the pressure command value.

[0054] First, the control device 90 controls the decompression mechanism 30 so that the pressure of the internal space SP0 of the airtight container 10, i.e., the pressure indicated by the pressure gauge 57, drops from atmospheric pressure to the first pressure P1 (period D1). As a result, the inside of the airtight container 10 is decompressed to the first pressure P1. The period D1 is a process of decompressing from atmospheric pressure to the first pressure P1. The first pressure P1 is a pressure lower than atmospheric pressure and higher than the vapor pressure of the solvent. The first pressure P1 depends on the vapor pressure of the solvent, but is, for example, 10 Pa. Then, after the pressure indicated by the pressure gauge 57 reaches the first pressure P1, the control device 90 controls the decompression mechanism 30 so that the pressure of the internal space SP0, i.e., the pressure indicated by the pressure gauge 57, is maintained at the first pressure P1 for a first time (period D2). In the periods D1 and D2, the first drying process A1 is performed. The period D2 is a predetermined time set in advance.

[0055] In the period D2, the control device 90 operates the pressure reducing mechanism 30 and controls the supply of inert gas from the gas introducing part 50 to the internal space SP0 so that the pressure indicated by the pressure gauge 57 exceeds the vapor pressure of the solvent, i.e., becomes the first pressure P1. Note that the supply of inert gas from the gas introducing part 50 to the internal space SP0 may be made not only in the period D2 but also in any of the other periods D1, D3, and D4, for example, the period D4.

[0056] During the period D2, the pressure in the internal space SP0 is maintained at the first pressure P1, so that the solution film F is dried uniformly. That is, the solution film F can be dried so that the thickness of the solution film F is uniform. Therefore, the surface of the solution film F can be made flat. In addition, a plurality of openings 43 are formed in the cover unit 40. During the period D2, the size and number of the openings 43 are adjusted so that the pressure distribution in the space SP2 is uniform while the pressure in the internal space SP0 is maintained at a predetermined pressure. Therefore, the pressure in the space SP2 is finely adjusted, so that the solution film F can be dried uniformly more effectively. The shape of the solution film F is roughly determined by the period D2. Furthermore, in the first drying process A1, the pressure in the internal space SP0 is maintained at the first pressure P1, which is lower than atmospheric pressure and higher than the pressure of the solvent, so that the substrate S can be dried stably.

[0057] In this way, in order to uniformly adjust the pressure distribution around the substrate S, that is, to uniformly adjust the evaporation rate of the solvent contained in the solution film F on the substrate S, in the first embodiment, the substrate S is surrounded by the cover unit 40. When the solvent evaporates from the solution film F, the solvent vapor temporarily stays in the space SP2 surrounded by the cover unit 40. Then, the solvent vapor flows from the space SP2 to the space SP1 through the opening 43. In the space SP2, a part of the solvent vapor adheres to the inner wall surface 401 of the cover unit 40.

[0058] Fig. 6 is an explanatory diagram of the first drying process A1 according to the first embodiment. Fig. 6 shows a schematic diagram of the flow of the solvent evaporated from the solution film F on the substrate S arranged in the space SP2.

[0059] A portion of the solvent evaporated from the solution film F moves to the space SP1 through the multiple openings 43 of the cover member 42 and is exhausted to the outside of the airtight container 10 by the pressure reduction mechanism 30, while another portion of the solvent evaporated from the solution film F condenses on the inner wall surface 401 of the cover unit 40 and adheres to the inner wall surface 401.

[0060] While the solvent is evaporating from the solution film F, the solvent continues to adhere to the inner wall surface 401 of the cover unit 40, so that even when most of the solvent has evaporated from the solution film F, the solvent may still remain on the inner wall surface 401 of the cover unit 40. Therefore, it is necessary to continue drying the cover unit 40 even after the substrate S is dried.

[0061] After the period D2 has elapsed, i.e., after the first drying process A1, in step S6, the control device 90 controls the decompression mechanism 30 so that the pressure in the internal space SP0 of the airtight container 10, i.e., the pressure indicated by the pressure gauge 57, decreases from the first pressure P1 to the second pressure P2 (period D3). That is, in step S6, the control device 90 starts executing the second drying process A2. As a result, the inside of the airtight container 10 is decompressed to the second pressure P2. The period D3 is the process of decompressing from the first pressure P1 to the second pressure P2. The second pressure P2 is a pressure lower than the first pressure P1 and a pressure lower than the vapor pressure of the solvent. The second pressure P2 depends on the vapor pressure of the solvent, but is, for example, 10 -3 Pa. After the pressure indicated by the pressure gauge 57 reaches the second pressure P2, the control device 90 controls the pressure reducing mechanism 30 so that the pressure in the internal space SP0, i.e., the pressure indicated by the pressure gauge 57, is maintained at the second pressure P2 (period D4). Since the substrate S is in a substantially dry state, even if the pressure in the internal space SP0 of the airtight container 10 is set to a pressure lower than the vapor pressure of the solvent, there is little risk of unevenness in the film thickness occurring. By setting the pressure in the internal space SP0 of the airtight container 10 to a pressure lower than the vapor pressure of the solvent, evaporation of the solvent attached to the inner wall surface 401 of the cover unit 40 is promoted. Therefore, the time required for the second drying process A2 can be shortened.

[0062] In the first embodiment, the pressure inside the airtight container 10 is reduced to the second pressure P2 in the period D3, and in the period D4, the inner wall surface 401 of the cover unit 40 is dried while further drying the substrate S. In step S7, the control device 90 acquires a current value B2, which is a measured value, from the measurement device 650, and in step S8, compares the acquired current value B2 with a threshold value TH1.

[0063] In the judgment process of step S9, the control device 90 determines whether or not to end the execution of the second drying process A2 based on the result of the comparison. Whether or not to end the second drying process A2 is determined based on whether or not the current value B2 is within the judgment range, that is, whether or not the current value B2 is equal to or less than the threshold value TH1.

[0064] If step S9 is NO, in the first embodiment, if B2>TH1, the control device 90 continues the second drying process A2 and proceeds to step S7. If step S9 is YES, in the first embodiment, if B2≦TH1, in step S10, the control device 90 ends the execution of the second drying process A2.

[0065] In this way, in the second drying process A2, the control device 90 acquires the current value B2 as a measurement result from the measuring device 650, and determines whether or not to terminate the execution of the second drying process A2 based on the acquired current value B2.

[0066] In step S11, the control device 90 controls the lifting mechanism 80 to cause the lifting mechanism 80 to raise the cover unit 40, and in step S12, controls a transport device (not shown) to cause the transport device to transport the substrate S held by the substrate holding portion 20 to the outside of the airtight container 10.

[0067] In the first embodiment, the measuring device 650 measures the current between the two electrodes 601, 602 as the electrical characteristic. Fig. 7 is a graph showing a schematic current value of the current measured by the measuring device 650 according to the first embodiment. In Fig. 7, the horizontal axis represents time, and the vertical axis represents the current value.

[0068] 7, period t1 corresponds to period D0 shown in FIG. 5, period t2 corresponds to periods D1 to D4 shown in FIG. 5, and timing t3 corresponds to the end timing of period D4 shown in FIG.

[0069] In the period t1, the control device 90 sets the threshold value TH1 based on the result of measuring the current value. In the period t21 in the period t2, the evaporation of the solvent from the solution film F on the substrate S becomes active, and the amount of the solvent attached to the inner wall surface 401 of the cover unit 40 exceeds the amount of the solvent evaporated from the inner wall surface 401, so that the solvent accumulates on the inner wall surface 401. Therefore, the solvent accumulates on the insulator 603, so that the electrical resistance R12 shown in FIG. 3 decreases, and as a result, the electrical resistance R10 decreases, and the current value of the measured current increases. Then, as the drying of the substrate S progresses, in the period t22 in the period t2, the amount of the solvent attached to the inner wall surface 401 and the amount of the solvent evaporated from the inner wall surface 401 are balanced, and the current value of the measured current becomes almost constant. The periods t21 and t22 are the periods of the first drying process A1.

[0070] Next, when the second drying process A2 is performed in period t23 of period t2, the amount of solvent evaporated from inner wall surface 401 exceeds the amount of solvent attached to inner wall surface 401, causing an increase in electrical resistance R12 shown in Fig. 3, which in turn causes an increase in electrical resistance R10 and a decrease in the measured current value. Then, when inner wall surface 401 dries, the measured current value becomes substantially constant after timing t3.

[0071] In the first embodiment, as shown in FIG. 5, the current value B2 becomes equal to or less than the threshold value TH1, the determination in step S9 shown in FIG. 4 is YES, and the second drying process A2 is ended in step S10.

[0072] According to the first embodiment, the timing for ending the second drying process A2 for drying the cover unit 40, which is a structure, is determined according to the state of solvent adhesion on the inner wall surface 401 of the cover unit 40. Therefore, the processing time of the second drying process A2 can be shortened compared to the case where the processing time of the second drying process is set to a predetermined time with a margin in advance.

[0073] Although the setting process of the threshold value TH1 has been described as being performed before step S3, it may be performed between steps S3 and S4, or between steps S4 and S5.

[0074] Furthermore, the process of setting the threshold value TH1 may be performed before the second drying process A2. For example, the process of setting the threshold value TH1 may be performed in a period D1 immediately after the start of the first drying process A1 when almost no solvent adheres to the sensor unit 600.

[0075] As described above, it is more preferable to set the threshold value TH1 before the first drying process A1. In this case, it is preferable to set the threshold value TH1 after the second drying process A2 when the previous substrate is processed and before the first drying process A1 when the next substrate is processed.

[0076] [Modification 1 of the first embodiment] In the above-described first embodiment, the measurement device 650 measures the current as the electrical characteristic between the electrode 601 and the electrode 602, but the present invention is not limited to this. The measurement device 650 may measure the electrical resistance R10 between the electrode 601 and the electrode 602 shown in FIG. 3 as the electrical characteristic between the electrode 601 and the electrode 602. That is, the measurement device 650 may measure the current between the electrode 601 and the electrode 602 to obtain the current value, and divide the voltage value of the applied voltage by the current value to obtain the electrical resistance value of the electrical resistance R10. FIG. 8 is a graph that illustrates the electrical resistance value of the electrical resistance R10 measured by the measurement device 650 according to the first modification.

[0077] In time period t1, the control device 90 sets a threshold value TH1 based on the electric resistance value obtained by measuring the electric resistance R10. The threshold value TH1 in the first modification is the lower limit value of the determination range.

[0078] In period t21 of period t2, the solvent evaporates actively from the solution film F on the substrate S, and the amount of solvent adhering to the inner wall surface 401 of the cover unit 40 exceeds the amount of solvent evaporated from the inner wall surface 401, so that the solvent accumulates on the inner wall surface 401. Therefore, the solvent also accumulates on the insulator 603, so that the electrical resistance R12 shown in FIG. 3 decreases, and as a result, the electrical resistance R10 decreases, and the measured electrical resistance value of the electrical resistance R10 decreases. Then, as the drying of the substrate S progresses, in period t22 of period t2, the amount of solvent adhering to the inner wall surface 401 and the amount of solvent evaporated from the inner wall surface 401 are balanced, and the measured electrical resistance value of the electrical resistance R10 becomes almost constant. Periods t21 and t22 are periods of the first drying process A1.

[0079] Next, when the second drying process A2 is performed in period t23 within period t2, the amount of solvent evaporated from inner wall surface 401 exceeds the amount of solvent attached to inner wall surface 401, causing an increase in electrical resistance R12 shown in Fig. 3, which in turn causes an increase in electrical resistance R10 and an increase in the measured electrical resistance value of electrical resistance R10. Then, when inner wall surface 401 dries, the measured electrical resistance value of electrical resistance R10 becomes substantially constant after timing t3.

[0080] In the first modification, in step S1, the electrical resistance value is measured instead of the current value B0, and in step S2, a threshold value TH1 is set based on the electrical resistance value. In step S7, the electrical resistance value is measured instead of the current value B2, and in step S8, the threshold value TH1 and the electrical resistance value are compared. Then, in step S9, the control device 90 determines whether or not to end the second drying process A2 by determining whether or not the electrical resistance value is within a determination range, i.e., whether or not the electrical resistance value is equal to or greater than the threshold value TH1.

[0081] If the electrical resistance value is smaller than the threshold value TH1, the result is NO and the second drying process A2 is continued; if the electrical resistance value is equal to or greater than the threshold value TH1, the result is YES and in step S10, the second drying process A2 is terminated.

[0082] Therefore, even in variant example 1, the timing for ending the second drying process A2 for drying the structure, the cover unit 40, is determined according to the state of solvent adhesion on the inner wall surface 401 of the cover unit 40, so that the processing time of the second drying process A2 can be shortened compared to the case where the processing time of the second drying process is set to a predetermined time with some leeway in advance.

[0083] [Modification 2 of the First Embodiment] In the first variant example, the case of measuring the electrical resistance R10 has been described. However, since the capacitance between the electrodes 601 and 602 changes when a solvent adheres to the insulator 603, the measuring device 650 may measure the capacitance between the electrodes 601 and 602 as an electrical characteristic.

[0084] [Third Modification of the First Embodiment] In the first embodiment, a DC voltage is applied between the electrodes 601 and 602 by the DC power supply 652, but the present invention is not limited to this. An AC voltage may be applied between the electrodes 601 and 602, and the impedance or current waveform between the electrodes 601 and 602 may be measured as the electrical characteristics.

[0085] [Fourth Modification of the First Embodiment] In the first embodiment, the sensor unit 600 is disposed in a through hole formed in the surrounding wall 41 of the cover unit 40, but the present invention is not limited to this. The sensor unit 600 may be disposed in the space SP2 inside the cover unit 40. For example, the sensor unit 600 may be disposed on the inner wall surface 401 of the cover unit 40.

[0086] [Fifth Modification of the First Embodiment] In the first embodiment, a case has been described in which the threshold value TH1 is set by the processes of steps S1 and S2, but the present invention is not limited to this, and the threshold value TH1 may be a preset value.

[0087] <Second embodiment> A second embodiment of the present disclosure will be described. In the following, elements with the same reference symbols as those in the first embodiment will have substantially the same configurations and functions as those described in the first embodiment unless otherwise specified, and differences from the first embodiment will be mainly described.

[0088] FIG. 9 is a schematic cross-sectional view showing the configuration of a reduced-pressure drying apparatus 100A, which is an example of a substrate processing apparatus in accordance with the second embodiment.

[0089] The reduced pressure drying apparatus 100A includes a measurement system 60A for detecting a solvent attached to the inner wall surface 401 of the cover unit 40. The measurement system 60A includes a measurement device 650A and a sensor unit 600A.

[0090] The measuring device 650A is an example of a measuring section, and the sensor unit 600A is an example of a sensor section. The sensor unit 600A outputs a sensor signal to the measuring device 650A, indicating whether or not a solvent is attached to the sensor unit 600A, and if a solvent is attached to the sensor unit 600A, indicating the amount of the solvent attached to the sensor unit 600A. The measuring device 650A is electrically connected to the sensor unit 600A via wiring 61, 62 for passing electricity to the sensor unit 600A. The measuring device 650A obtains a sensor signal from the sensor unit 600A according to the electrical characteristics by passing electricity to the sensor unit 600A. The measuring device 650A processes the sensor signal, and outputs a measurement value (data) according to the sensor signal as a measurement result to the control device 90.

[0091] The sensor unit 600A is disposed so as to face the space SP2. The sensor unit 600A includes a quartz crystal oscillator 603A.

[0092] When the solvent evaporated from the solution film F adheres to the inner wall surface 401 of the cover unit 40, the solvent evaporated from the solution film F may also adhere to the surface of the sensor unit 600A, i.e., the quartz oscillator 603A. When solvent particles accumulate on the surface of the quartz oscillator 603A, the natural frequency of the quartz oscillator 603A changes. The measuring device 650A measures the natural frequency of the quartz oscillator 603A.

[0093] FIG. 10 is a graph showing a schematic diagram of the natural frequency of crystal resonator 603A measured by measuring apparatus 650A according to the second embodiment.

[0094] In time period t1, the control device 90 sets a threshold value TH1 based on the measurement result of the natural frequency of the crystal oscillator 603A. As in the first modification, the threshold value TH1 is the lower limit of the determination range.

[0095] In period t21 of period t2, the evaporation of the solvent from the solution film F on the substrate S becomes active, and the amount of the solvent adhering to the inner wall surface 401 of the cover unit 40 exceeds the amount of the solvent evaporating from the inner wall surface 401, so that the solvent accumulates on the inner wall surface 401. Therefore, the solvent also accumulates on the quartz oscillator 603A, and the natural frequency of the quartz oscillator 603A decreases. Then, as the drying of the substrate S progresses, in period t22 of period t2, the amount of the solvent adhering to the inner wall surface 401 and the amount of the solvent evaporating from the inner wall surface 401 balance each other, and the natural frequency of the quartz oscillator 603A becomes almost constant. Periods t21 and t22 are periods of the first drying process A1.

[0096] Next, when the second drying process A2 is performed in period t23 of period t2, the natural frequency of quartz crystal oscillator 603A increases because the amount of solvent evaporated from inner wall surface 401 exceeds the amount of solvent attached to inner wall surface 401. Then, when inner wall surface 401 dries, the natural frequency of quartz crystal oscillator 603A becomes approximately constant after timing t3.

[0097] In the second embodiment, the same control as in Modification 1 is performed. Therefore, in the second embodiment as well, the end timing of the second drying process A2 for drying the cover unit 40, which is a structure, is determined according to the state of solvent adhesion on the inner wall surface 401 of the cover unit 40, so that the processing time of the second drying process A2 can be shortened compared to the case where the processing time of the second drying process is set to a predetermined time with a margin in advance.

[0098] Furthermore, in the second embodiment, even if the solvent has an extremely high volume resistivity, the control device 90 can obtain a measurement result according to the presence or absence of adhesion of the solvent and the amount of the adhesion of the solvent by the quartz crystal oscillator 603A.

[0099] The second embodiment may be combined with at least one of the first embodiment and the modified examples of the first embodiment.

[0100] <Third embodiment> A third embodiment of the present disclosure will be described. In the following, elements with the same reference symbols as those in the first or second embodiment will have substantially the same configurations and functions as those described in the first or second embodiment unless otherwise specified, and differences from the first and second embodiments will be mainly described.

[0101] FIG. 11 is a schematic cross-sectional view showing the configuration of a reduced-pressure drying apparatus 100B, which is an example of a substrate processing apparatus in accordance with the third embodiment.

[0102] The reduced pressure drying apparatus 100B includes a cover unit 40B and a measurement system 60B for detecting a solvent attached to an inner wall surface 401B of the cover unit 40B. The cover unit 40B has an enclosure wall 41, a cover member 42, and a protruding member 44 protruding from the cover member 42 toward the space SP2. Note that the cover unit 40B may include a structure other than the protruding member 44 that faces the space SP2.

[0103] The measurement system 60B includes two measurement devices 650 as a plurality of measurement sections, and two sensor units 600 as a plurality of sensor sections. Each of the two measurement devices 650 is connected to a corresponding one of the two sensor units 600. The number of sensor units 600 is not limited to two, and may be three or more.

[0104] The protruding member 44 faces the space SP2. Therefore, the surface of the protruding member 44 is a part of the inner wall surface 401B of the cover unit 40B. One of the two sensor units 600 is provided on the surrounding wall 41, and the other is provided on the protruding member 44. In this way, the two sensor units 600 are disposed at different positions from each other.

[0105] The protruding members 44 function as partition members that divide the space SP2. When the substrate S is a large substrate, by dividing the space SP2 into a plurality of partial spaces with the protruding members 44, it is possible to dry a corresponding portion of the substrate S for each partial space, and therefore it is possible to efficiently and uniformly dry the substrate S even if the substrate S is a large substrate.

[0106] In the first drying process A1, when the solvent evaporates from the solution film F, the solvent may also adhere to the protruding member 44. Therefore, the other sensor unit 600 is preferably disposed on the protruding member 44. In addition, the two sensor units 600 are preferably disposed in the lower half region R1.

[0107] The substrate processing method, i.e., the method for manufacturing an article, is as described in the first embodiment using the flowchart shown in FIG. 4. However, since there are multiple (two) sensor units 600, the determination process in step S9 differs from that in the first embodiment.

[0108] In step S9, the control device 90 determines whether or not to end the second drying process A2 by determining whether or not all of the current values ​​B2 corresponding to the multiple sensor units 600 are within the determination range, i.e., whether or not all of the current values ​​B2 are equal to or greater than the threshold value TH1. If any one of the multiple current values ​​B2 is outside the determination range, i.e., is smaller than the threshold value TH1, the control device 90 returns to the process of step S7 with a NO result in step S9. If all of the multiple current values ​​B2 are within the determination range, i.e., are equal to or greater than the threshold value TH1, the control device 90 returns to the process of step S10 with a YES result in step S9. Then, the control device 90 ends the execution of the second drying process A2.

[0109] As described above, according to the third embodiment, the end timing of the second drying process A2 for drying the cover unit 40B, which is a structure, is determined according to the state of adhesion of the solvent to the inner wall surface 401B of the cover unit 40B, so that the processing time of the second drying process A2 can be shortened compared to the case where the processing time of the second drying process is set to a predetermined time with a margin in advance. Also, since the dryness of the inner wall surface 401B of the cover unit 40B is determined using the multiple sensor units 600, the cover unit 40B can be dried more effectively.

[0110] When the substrate S is large, it is preferable to arrange the multiple sensor units 600 in the space SP2 inside the cover unit 40B even if the cover unit 40B does not have the protruding member 44 that functions as a partition member.

[0111] The third embodiment may be combined with at least one of the first embodiment, the modified example of the first embodiment, the second embodiment, and the modified example of the second embodiment.

[0112] <Embodiments of the method for manufacturing an article> The method for manufacturing an article according to an embodiment of the present disclosure is suitable for manufacturing an article such as an organic electroluminescence (OLED) panel using an inkjet printing device. The method for manufacturing an article according to the present embodiment includes a step (coating step) of arranging or coating a solution film (a solution containing a solute and a solvent for forming an organic film) on a substrate by a printing method using an inkjet printing device or the like to obtain a coated substrate. The method also includes a step (drying step) of drying the solution film on the coated substrate by the above-mentioned reduced pressure drying device to obtain a dry substrate on which a dry film is formed. Furthermore, the manufacturing method includes other well-known steps (firing, cooling, dehumidification, dry cleaning, formation of electrodes, formation of a sealing film, etc.). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

[0113] Although the preferred embodiments of the present disclosure have been described above, it goes without saying that the present disclosure is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present disclosure.

[0114] In the above embodiment, a case has been described in which the inner wall surface of the cover unit is dried in the second drying process, but if a structure is placed in the space inside the cover unit, the structure is also dried in the second drying process.

[0115] The disclosure of the above embodiments includes the following sections.

[0116] (Section 1) An airtight container; a substrate holder arranged inside the airtight container and capable of holding a substrate on which a solution containing a solvent has been applied; A pressure reducing unit that reduces the pressure inside the airtight container; A defining member defining a space surrounding the substrate within the airtight container; A sensor portion facing the space defined by the defining member; A measurement unit that outputs a measurement result that differs depending on whether a solvent is attached to the sensor unit. The substrate processing apparatus according to claim 1,

[0117] (Section 2) When the solvent adheres to the sensor part, the measurement part outputs the measurement result which differs depending on the amount of the solvent adhered to the sensor part. 2. The substrate processing apparatus according to item 1,

[0118] (Section 3) a control unit that executes a first process of controlling the pressure reducing unit so that the pressure inside the airtight container is reduced to a first pressure lower than atmospheric pressure, and a second process of controlling the pressure reducing unit so that the pressure inside the airtight container is reduced to a second pressure lower than the first pressure, The control unit, in the second process, acquires the measurement result from the measurement unit, and determines whether or not to terminate execution of the second process based on the acquired measurement result. 3. The substrate processing apparatus according to item 1 or 2,

[0119] (Section 4) The first pressure is higher than the vapor pressure of the solvent. 4. The substrate processing apparatus according to item 3,

[0120] (Section 5) The second pressure is lower than the vapor pressure of the solvent. 5. The substrate processing apparatus according to item 3 or 4,

[0121] (Section 6) The control unit executes the second process after executing the first process. 6. The substrate processing apparatus according to any one of items 3 to 5,

[0122] (Section 7) The control unit determines whether or not to terminate execution of the second process by comparing the measurement result, which is the measurement result, with a threshold value. 7. The substrate processing apparatus according to any one of items 3 to 6,

[0123] (Section 8) The threshold value is a preset value. 8. The substrate processing apparatus according to item 7,

[0124] (Section 9) The control unit sets the threshold value based on the measurement value acquired from the measurement unit before executing the second process. 8. The substrate processing apparatus according to item 7,

[0125] (Section 10) The control unit sets the threshold value based on the measurement value acquired from the measurement unit before executing the first process. 10. The substrate processing apparatus according to item 9,

[0126] (Section 11) The sensor unit includes: The object, two electrodes spaced apart on the object; The measurement unit measures an electrical characteristic between the two electrodes. 11. The substrate processing apparatus according to any one of items 1 to 10,

[0127] (Section 12) The measurement unit measures a current between the two electrodes as the electrical characteristic. Item 12. The substrate processing apparatus according to item 11,

[0128] (Section 13) The measurement unit measures the electrical resistance between the two electrodes as the electrical characteristic. Item 12. The substrate processing apparatus according to item 11,

[0129] (Section 14) The object is an insulator. 14. The substrate processing apparatus according to any one of items 11 to 13,

[0130] (Section 15) The object is integral with the defining member. 15. The substrate processing apparatus according to any one of items 11 to 14,

[0131] (Section 16) The sensor unit has a quartz crystal oscillator, The measurement unit measures the natural frequency of the quartz crystal resonator. 11. The substrate processing apparatus according to any one of items 1 to 10,

[0132] (Section 17) The sensor unit is disposed at a position facing a lower half region in the vertical direction of the space defined by the defining member. 17. The substrate processing apparatus according to any one of items 1 to 16,

[0133] (Section 18) A plurality of the sensor units are arranged at different positions from each other. Item 18. The substrate processing apparatus according to any one of items 1 to 17,

[0134] (Section 19) A method for processing a substrate, comprising: Item 19. Using the substrate processing apparatus according to any one of items 1 to 18, a process is performed to evaporate a solvent contained in a solution applied onto a substrate. A substrate processing method comprising:

[0135] (Section 20) 1. A method for manufacturing an article, comprising: Using the substrate processing apparatus according to any one of items 1 to 18, a process is performed to evaporate a solvent contained in a solution containing a functional material of a functional thin film or a functional element applied on a substrate. A method for producing an article. [Explanation of symbols]

[0136] F... solution (solution film), S... substrate, SP2... space, 10... airtight container, 20... substrate holder, 30... pressure reduction mechanism (pressure reduction section), 40... cover unit (partitioning member), 60... measurement system, 90... control device (control section), 100... reduced pressure drying device (substrate processing device), 401... inner wall surface, 600... sensor unit (sensor section), 650... measurement device (measurement section)

Claims

1. An airtight container; a substrate holder arranged inside the airtight container and capable of holding a substrate on which a solution containing a solvent has been applied; A pressure reducing unit that reduces the pressure inside the airtight container; A defining member defining a space surrounding the substrate within the airtight container; A sensor portion facing the space defined by the defining member; A measurement unit that outputs a measurement result that differs depending on whether a solvent is attached to the sensor unit. The substrate processing apparatus according to claim 1,

2. When the solvent adheres to the sensor part, the measurement part outputs the measurement result which differs depending on the amount of the solvent adhered to the sensor part. The substrate processing apparatus according to claim 1 .

3. a control unit that executes a first process of controlling the pressure reducing unit so that the pressure inside the airtight container is reduced to a first pressure lower than atmospheric pressure, and a second process of controlling the pressure reducing unit so that the pressure inside the airtight container is reduced to a second pressure lower than the first pressure, The control unit, in the second process, acquires the measurement result from the measurement unit, and determines whether or not to terminate execution of the second process based on the acquired measurement result. The substrate processing apparatus according to claim 1 .

4. The first pressure is higher than the vapor pressure of the solvent. The substrate processing apparatus according to claim 3 .

5. The second pressure is lower than the vapor pressure of the solvent. The substrate processing apparatus according to claim 3 .

6. The control unit executes the second process after executing the first process. The substrate processing apparatus according to claim 3 .

7. the control unit determines whether or not to terminate execution of the second process by comparing the measurement result, which is the measurement result, with a threshold value. The substrate processing apparatus according to claim 3 .

8. The threshold value is a preset value. The substrate processing apparatus according to claim 7 .

9. The control unit sets the threshold value based on the measurement value acquired from the measurement unit before executing the second process. The substrate processing apparatus according to claim 7 .

10. The control unit sets the threshold value based on the measurement value acquired from the measurement unit before executing the first process. The substrate processing apparatus according to claim 9 .

11. The sensor unit includes: The object, two electrodes spaced apart from each other on the object; The measurement unit measures an electrical characteristic between the two electrodes. The substrate processing apparatus according to claim 1 .

12. The measurement unit measures a current between the two electrodes as the electrical characteristic. The substrate processing apparatus according to claim 11 .

13. The measurement unit measures an electrical resistance between the two electrodes as the electrical characteristic. The substrate processing apparatus according to claim 11 .

14. The object is an insulator. The substrate processing apparatus according to claim 11 .

15. The object is integral with the defining member. The substrate processing apparatus according to claim 11 .

16. The sensor unit has a quartz crystal oscillator, The measurement unit measures the natural frequency of the quartz crystal resonator. The substrate processing apparatus according to claim 1 .

17. The sensor unit is disposed at a position facing a lower half region in the vertical direction of the space defined by the defining member. The substrate processing apparatus according to claim 1 .

18. A plurality of the sensor units are arranged at different positions from each other. The substrate processing apparatus according to claim 1 .

19. A method for processing a substrate, comprising: A process for evaporating a solvent contained in a solution applied onto a substrate is performed using the substrate processing apparatus according to any one of claims 1 to 18. A substrate processing method comprising:

20. 1. A method for manufacturing an article, comprising:

19. A process for evaporating a solvent contained in a solution containing a functional material of a functional thin film or a functional element coated on a substrate, using the substrate processing apparatus according to claim 1. A method for producing an article comprising the steps of:

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