Circuit boards, printed circuit boards and sub-boards

Abstract

To provide a circuit board, a printed board, and a sub-board that do not require redesign of the printed board when mounting an alternative part different from a preselected part. [Solution] The circuit board S1 is a circuit board in which components are mounted on a printed circuit board 10, and the components have a plurality of first leads 148a-c provided in a first portion and a plurality of second leads 162a-c provided in a second portion different from the first portion, and the printed circuit board has a plurality of electrodes including a plurality of first electrodes 128a-c to which the plurality of first leads are soldered, a plurality of second electrodes 142a-c to which the plurality of second leads are soldered, a plurality of first auxiliary electrodes provided adjacent to the plurality of first electrodes, and a plurality of second auxiliary electrodes provided adjacent to the plurality of second electrodes.

Description

[Technical Field]

[0001] The present invention relates to circuit boards, printed circuit boards, and sub-boards. [Background technology]

[0002] In the manufacture of circuit boards, it may become difficult to obtain pre-selected electronic components (hereinafter simply referred to as "components") due to product shortages, inventory shortages, end of production, etc., and it may become necessary to use substitute components that differ from the pre-selected components in at least one of the following: dimensions, number of terminals, mounting type (surface mounting or through-hole mounting), and layout. Summary of the Invention [Problem to be solved by the invention]

[0003] In order to mount an alternative component different from the pre-selected component in this way, it is necessary to redesign the printed circuit board, for example by changing the wiring.

[0004] In view of the above-mentioned problems, the present invention aims to provide a circuit board, a printed circuit board, and a sub-board that do not require redesign of the printed circuit board in order to mount an alternative component different from a pre-selected component. [Means for solving the problem]

[0005] The circuit board of the present invention has a component mounted on a printed circuit board, the component having a plurality of first leads provided in a first portion and a plurality of second leads provided in a second portion different from the first portion, and the printed circuit board having a plurality of electrodes including a plurality of first electrodes to which the plurality of first leads are soldered, a plurality of second electrodes to which the plurality of second leads are soldered, a plurality of first auxiliary electrodes provided adjacent to the plurality of first electrodes, and a plurality of second auxiliary electrodes provided adjacent to the plurality of second electrodes. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 2 is a plan view of the circuit board according to the embodiment. [Figure 2] FIG. 2 is a plan view of a sub-board according to the embodiment. [Figure 3] FIG. 2 is a cross-sectional view showing a cross section taken along the line III-III in FIG. [Figure 4] FIG. 4 is a cross-sectional view showing a cross section taken along the line IV-IV in FIG. [Figure 5] FIG. 2 is a plan view of a circuit board on which components different from those in FIG. 1 are mounted. [Figure 6] 6 is a cross-sectional view showing a cross section taken along the line VI-VI in FIG. 5. [Figure 7] 2 is a plan view of a circuit board in which a sub-board is mounted on a main board different from the main board in FIG. 1. [Figure 8] 8 is a cross-sectional view showing a cross section taken along the line VIII-VIII in FIG. 7. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, this embodiment will be described in detail with reference to the drawings.

[0008] FIG. 1 is a plan view of a circuit board S1 according to this embodiment. FIG. 2 is a plan view of a sub-board 14 according to this embodiment. FIG. 3 is a cross-sectional view showing a cut surface taken along the III-III cutting line in FIG. 1. FIG. 4 is a cross-sectional view showing a cut surface taken along the IV-IV cutting line in FIG. 1. As shown in FIGS. 1 and 3, the circuit board S1 includes a printed circuit board 10 including a main board 12 and a sub-board 14, and a component 16. In this embodiment, the component 16, as well as initial components and components 26 described below, are DC / DC converters, but the present invention is not limited to this example, and these components may also have other functions.

[0009] As mentioned above, in the manufacture of circuit boards, situations may arise where pre-selected initial parts become difficult to obtain due to product shortages, inventory shortages, end of production, etc., forcing the use of substitute parts. However, if the substitute parts differ from the initial parts in at least one of the dimensions, lead arrangement, mounting type, and number, the substitute parts cannot be mounted in the mounting target portion of the printed circuit board (the portion where the initial parts were intended to be mounted).

[0010] 1 and 3, in this embodiment, a sub-board 14 is mounted on the mounting target portion of the main board 12, and a component 16, which is a replacement for the initial component, is mounted on the sub-board 14. In this way, the component 16 can be indirectly mounted on the main board 12. That is, in this embodiment, the sub-board 14 is used as a conversion board for indirectly mounting the component 16 on the main board 12.

[0011] For example, if an initial part cannot be procured, it can be substituted with a part 16 that can be mounted on the sub-board 14, eliminating the need to redesign the main board 12 and allowing for flexible response to the parts procurement situation. Also, even if it becomes necessary to replace an initial part due to a malfunction or other reason, a substitute part (part 16 in this embodiment) can be mounted on the sub-board 14, and the sub-board 14 with this part 16 mounted can be mounted on the main board 12, thereby expanding the options for substitute parts that can be replaced.

[0012] The sub-substrate 14 has a plurality of sub-leads 148a, 148b, 148c on its back side, and the arrangement, mounting type, and number of the plurality of sub-leads (first right sub-lead 148a, first left sub-lead 148b, and first lower sub-lead 148c) are the same as the arrangement, mounting type, and number (i.e., the arrangement, mounting type, and number of the leads of the initial component) of the plurality of main electrodes (plurality of right main electrodes 128a, plural left main electrodes 128b, and lower main electrode 128c) provided on the mounting target portion. This allows each of the plurality of sub-leads of the sub-substrate 14 to be soldered to each of the plurality of main electrodes of the main substrate 12, as shown in Figures 1 and 4.

[0013] Incidentally, there may be cases where two types of components differing in size, lead arrangement, and number are available as replacement candidates for the initial component. In this embodiment, a configuration is adopted that allows either of the two types of components differing in size, lead arrangement, and number to be mounted on a single sub-board. This configuration will be described in detail below with reference to Figures 1 to 3, 5, and 6.

[0014] 1 and 3 show a state in which a component 16 is mounted on a sub-board 14. As shown in FIG. 1, in a plan view, the component 16 has a rectangular shape with multiple edges, including a right edge 160a (first portion), a left edge 160b (second portion), a bottom edge 160c (third portion), and a top edge 160d (fourth portion). Note that the term "rectangular shape" includes a shape in which at least one corner of the rectangle is rounded (chamfered). The component 16 has multiple (three) right leads 162a provided on the right edge 160a, multiple (three) left leads 162b provided on the left edge 160b, and a single bottom lead 162c provided on the bottom edge 160c.

[0015] The sub-substrate 14 includes a plurality of (three) right electrodes 142a, a plurality of (three) left electrodes 142b, and a single lower electrode 142c. As shown in FIGS. 1 and 3, a plurality of right leads 162a are soldered to each of the right electrodes 142a. A plurality of left leads 162b are soldered to each of the left electrodes 142b. Furthermore, a lower lead 162c is soldered to the lower electrode 142c.

[0016] Fig. 5 is a plan view of a circuit board S2 on which a component 26 different from the component 16 in Fig. 1 is mounted. Fig. 6 is a cross-sectional view showing a cut surface taken along the cutting line VI-VI in Fig. 5. Like the circuit board S1 shown in Fig. 1, the circuit board S2 includes a printed circuit board 10 including a main board 12 and a sub-board 14, but the dimensions and lead arrangement of the component 26 mounted on the sub-board 14 are different from the dimensions and lead arrangement of the component 16 in Fig. 1.

[0017] As shown in FIG. 5, the component 26 includes a plurality of (four) right leads 262a provided on the right edge 260a, and a plurality of (three) left leads 262b provided on the left edge 260b.

[0018] Here, electrodes are arranged on the sub-substrate 14 so that not only components 16 but also components 26 can be mounted. Specifically, as shown in FIG. 2, the sub-substrate 14 includes a plurality of right auxiliary electrodes 143a provided adjacent to a plurality of right electrodes 142a and a plurality of left auxiliary electrodes 143b provided adjacent to a plurality of left electrodes 142b. The plurality of right electrodes 142a and the plurality of left electrodes 142b are intended to mount a single component 16, while the plurality of right auxiliary electrodes 143a and the plurality of left electrodes 142b are intended to mount a component 26 having the same function as the component 16 that the plurality of right electrodes 142a and the plurality of left electrodes 142b are intended to mount. At least one of the plurality of right electrodes 142a is electrically connected to at least one of the plurality of right auxiliary electrodes 143a, and at least one of the plurality of left electrodes 142b is electrically connected to at least one of the plurality of left auxiliary electrodes 143b. Also, as shown in FIG. 2, the plurality of right electrodes 142a and the plurality of right auxiliary electrodes 143a are spaced apart from each other on the surface of the sub-substrate 14. Similarly, the multiple left electrodes 142b and the multiple left auxiliary electrodes 143b are spaced apart from each other on the surface of the sub-substrate 14. As shown in Fig. 2, the multiple right electrodes 142a and the multiple right auxiliary electrodes 143a are aligned in a direction along the right edge 160a. Furthermore, the multiple left electrodes 142b and the multiple left auxiliary electrodes 143b are aligned in a direction along the left edge 160b.

[0019] As shown in FIGS. 5 and 6, the right leads 262a of the component 26 are soldered to the right auxiliary electrodes 143a, and the left leads 262b are soldered to the left auxiliary electrodes 143b.

[0020] As described above, when mounting component 16, as shown in FIGS. 1 and 4, the multiple (three) right leads 162a, multiple (three) left leads 162b, and single bottom lead 162c of component 16 are soldered to the multiple (three) right electrodes 142a, multiple (three) left electrodes 142b, and single bottom electrode 142c of sub-substrate 14, respectively. On the other hand, when mounting component 26, as shown in FIGS. 5 and 6, the multiple (four) right leads 262a and multiple (three) left leads 262b of component 26 are soldered to the multiple (four) right auxiliary electrodes 143a and multiple (three) left auxiliary electrodes 143b of sub-substrate 14, respectively. In this manner, in this embodiment, components 16 and 26 having different dimensions and lead arrangements can be mounted on a single sub-substrate 14.

[0021] As a reference technique, Japanese Patent Application Laid-Open Publication No. 2001-308503 describes a printed circuit board having a first land staircase portion having a width substantially equal to that of a first component and a second land staircase portion having a width substantially equal to that of a second component, the width of which is greater than that of the first component, so that chip components of different sizes can be mounted on the same mounting target portion of a single printed circuit board. However, this printed circuit board is intended for rectangular chip components, not leaded components, and does not allow leaded components of different sizes to be mounted on the same mounting target portion of a single printed circuit board. In this regard, according to this embodiment, leaded components of different sizes can be mounted on the same mounting target portion of a printed circuit board.

[0022] Incidentally, it is also conceivable that two types of main boards may be prepared, each having the same electrode arrangement and number but different mounting methods (surface mounting or through-hole mounting) for the mounting target parts. In this embodiment, a configuration is adopted in which the same sub-board can be mounted on either of two types of main boards, each having the same electrode arrangement and number but different mounting methods for the mounting target parts. This configuration will be described in detail below with reference to Figures 1, 2, 4, 7, and 8.

[0023] 1 and 4, the mounting method for the mounting target portion of the main substrate 12 is surface mounting. As shown in Fig. 1, the mounting target portion of the main substrate 12 is provided with a plurality of (three) right main electrodes 128a, a plurality of (three) left main electrodes 128b, and a single lower main electrode 128c. The plurality of right main electrodes 128a, the plurality of left main electrodes 128b, and the lower main electrode 128c are each rectangular electrodes. Note that electrodes compatible with surface mounting such as these are sometimes called pads.

[0024] On the other hand, the sub-substrate 14 shown in FIGS. 1 and 4 has leads for surface mounting. Specifically, as shown in FIGS. 1 and 4, the sub-substrate 14 has a plurality (three) of first right through-holes 144a, a plurality (three) of first left through-holes 144b, and a single first bottom through-hole 144c. A first right sub-lead 148a for surface mounting is soldered to each of the plurality of first right through-holes 144a, a first left sub-lead 148b for surface mounting is soldered to each of the plurality of first left through-holes 144b, and a first bottom sub-lead 148c for surface mounting is soldered to the first bottom through-hole 144c. As shown in FIGS. 1 and 4, the first right sub-lead 148a extends from the back surface of the sub-substrate 14 and bends outward toward the right edge 140a of the sub-substrate 14. Similarly, the first left sub-lead 148b extends from the back surface of the sub-substrate 14 and has a shape that bends outward toward the left edge 140a of the sub-substrate 14. The first bottom sub-lead 148c extends from the back surface of the sub-substrate 14 and has a shape that bends outward toward the bottom edge 140c of the sub-substrate 14.

[0025] 1 and 4, each of the multiple first right sub-leads 148a is soldered to each of the multiple right main electrodes 128a of the main substrate 12. Similarly, each of the multiple first left sub-leads 148b is soldered to each of the multiple left main electrodes 128b of the main substrate 12. Furthermore, the first bottom sub-lead 148c is soldered to the bottom main electrode 128c of the main substrate 12.

[0026] FIG. 7 is a plan view of a circuit board S3 in which a sub-board 14 is mounted on a main board 22 different from the main board 12 of FIG. 1. FIG. 8 is a cross-sectional view showing a cross section taken along the VIII-VIII cutting line in FIG. 7. In the main board 22, the mounting method for the mounting target portion is through-hole mounting. In the mounting target portion of the main board 22, a plurality of right main electrodes 229a, a plurality of left main electrodes 229b, and a lower main electrode (not shown) are provided. The plurality of right main electrodes 229a, a plurality of left main electrodes 229b, and a lower main electrode are each electrodes provided around a through-hole. Note that electrodes that support through-hole mounting in this manner are sometimes called lands.

[0027] Here, as shown in FIGS. 1, 2, 4, 7, and 8, the sub-substrate 14 further includes second through holes 146a, 146b, and 146c provided adjacent to the first through holes 144a, 144b, and 144c. Specifically, the sub-substrate 14 includes a plurality (three) of second right through holes 146a, a plurality (three) of second left through holes 146b, and a single second bottom through hole 146c. As shown in FIGS. 1, 2, 4, 7, and 8, the plurality of second right through holes 146a, the plurality of second left through holes 146b, and the second bottom through hole 146c are aligned along the edge of the sub-substrate 14. Furthermore, the plurality of second right through holes 146a are provided adjacent to the plurality of first right through holes 144a and closer to the edge of the sub-substrate 14 than the plurality of first right through holes 144a. Similarly, the second left through holes 146b are provided adjacent to the first left through holes 144b and closer to the edge of the sub-substrate 14 than the first left through holes 144b. Furthermore, the second lower through hole 146c is provided adjacent to the first lower through hole 144c and closer to the edge of the sub-substrate 14 than the first lower through hole 144c.

[0028] The sub-substrate has a wiring pattern (not shown) that electrically connects the plurality of first through-holes 144a, 144b, 144c, the plurality of second through-holes 146a, 146b, 146c, and the plurality of electrodes (the plurality of right electrodes 142a, the plurality of left electrodes 142b, the lower electrode 142c, the plurality of right auxiliary electrodes 143a, the plurality of left auxiliary electrodes 143b, and the lower auxiliary electrode 143c).

[0029] 7 and 8, a second right sub-lead 149a for through-hole mounting is soldered to each of the multiple second right through-holes 146a, a second left sub-lead 149b for through-hole mounting is soldered to each of the multiple second left through-holes 146b, and a second bottom sub-lead 149c for through-hole mounting is soldered to the second bottom sub-lead 149c. As shown in Fig. 8, the second right sub-lead 149a and the second left sub-lead 149b extend linearly from the back surface of the sub-substrate 14. The second bottom sub-lead 149c also extends linearly from the back surface of the sub-substrate 14 (not shown).

[0030] 7 and 8, each of the multiple second right sub-leads 149a is soldered to each of the multiple right main electrodes 229a of the main substrate 12. Similarly, each of the multiple second left sub-leads 149b is soldered to each of the multiple left main electrodes 229b of the main substrate 12. In addition, the second bottom sub-lead 149c is also soldered to the bottom main electrode of the main substrate (not shown).

[0031] As explained above, when the mounting method of the mounting target portion is the surface mounting method as shown in Figures 1 and 4, surface mounting leads (plurality of first right sub-leads 148a, plural first left sub-leads 148b and first lower sub-lead 148c) are soldered to the first through holes 144a, 144b and 144c of the sub-substrate 14, and the leads are soldered to the electrodes of the mounting target portion of the main substrate 12 (plurality of right main electrodes 128a, plural left main electrodes 128b and lower main electrode 128c). On the other hand, when the mounting method of the mounting target part is a through-hole mounting method as shown in Figures 7 and 8, leads for through-hole mounting (plurality of second right sub-leads 149a, plural second left sub-leads 149b and second lower sub-lead 149c) are soldered to the second through holes 146a, 146b and 146c of the sub-substrate 14, and the leads are soldered to the electrodes of the mounting target part of the main substrate 22 (plurality of right main electrodes 229a, plural left main electrodes 229b and lower main electrode).

[0032] In this way, in this embodiment, the type of lead of the sub-board can be selected depending on the mounting method of the part to be mounted on the main board, so the same sub-board can be mounted on either of two types of main boards that have the same dimensions, electrode arrangement and number but different mounting methods for the part to be mounted.

[0033] In this embodiment, the components 16 and 26, which are DC / DC converters, have control terminals, and the main board 12 has control electrodes electrically connected to the control terminals. As shown in Figures 1, 5, and 7, the control electrodes are electrically connected to ground GND by detachable jumper pins JMP provided between the control electrodes and ground GND. This allows either component 16 or 26 to be mounted on the printed circuit board 10, even if the polarities (on / off conditions) of the control terminals of the components 16 and 26 are different. By attaching or detaching the jumper pins JMP, the polarity of the signal input to the control terminal can be changed, allowing an appropriate signal corresponding to the polarity of the control terminal to be input.

[0034] According to the present embodiment described above, there is no need to redesign the printed circuit board in order to mount an alternative component different from the preselected component.

[0035] The present invention is not limited to the above-described embodiment, and various modifications are possible.

[0036] For example, the number and arrangement of leads provided on a component may be changed arbitrarily, for example, leads may be provided only on the right and left edges of the component.

[0037] Also, only one type of component may be provided on the sub-substrate, i.e., the sub-substrate may not include multiple right auxiliary electrodes (first auxiliary electrodes), multiple left auxiliary electrodes (second auxiliary electrodes), and a bottom auxiliary electrode (third auxiliary electrode).

[0038] Alternatively, a circuit board may be constructed by directly mounting components on a main board without using a sub-board. That is, a plurality of first electrodes, a plurality of second electrodes, a plurality of first auxiliary electrodes, and a plurality of second auxiliary electrodes may be provided on the mounting target portion of the main board (printed circuit board). Furthermore, if these electrodes on the main board are surface-mount pads, a conversion board including a plurality of lands for through-hole mounting and lands to which leads for connecting to the main board are soldered can be used to mount through-hole-mounted components instead of the surface-mounted components that are the initial components to be mounted. Conversely, if the electrodes on the main board are lands for through-hole mounting, a conversion board including a plurality of surface-mount pads and lands to which leads for connecting to the main board are soldered can be used to mount surface-mounted components instead of the through-hole-mounted components that are the initial components to be mounted. [Explanation of symbols]

[0039] S1, S2, S3 circuit board 10 Printed circuit board 12,22 Main board 14 Sub-board 16,26 parts 128a Right main electrode 128b Left main electrode 128c Lower main electrode 142a Right electrode 142b Left electrode 142c lower electrode 143a Right auxiliary electrode 143b Left auxiliary electrode 143c Lower auxiliary electrode 144a 1st right through hole 144b 1st left through hole 144c 1st lower through hole 146a Second right through hole 146b 2nd left through hole 146c Second lower through hole 148a 1st Right Sub-Lead 148b 1st left sub-lead 148c 1st Lower Sublead 149a 2nd Right Sub-Lead 149b 2nd left sub-lead 149c 2nd Lower Sublead 160a Right edge 160b left edge 160c lower edge 160d Upper edge 162a Right Lead 162b left lead 162c lower lead 229a Right main electrode 229b Left main electrode 260a Right edge 260b left edge 260c lower edge 262a Right Lead 262b left lead 262c Lower Lead GND Ground JMP jumper pin

Claims

1. A circuit board in which components are mounted on a printed circuit board, The component includes a plurality of first leads provided in a first portion and a plurality of second leads provided in a second portion different from the first portion, The printed circuit board includes a plurality of electrodes including a plurality of first electrodes to which the plurality of first leads are soldered, a plurality of second electrodes to which the plurality of second leads are soldered, a plurality of first auxiliary electrodes provided adjacent to the plurality of first electrodes, and a plurality of second auxiliary electrodes provided adjacent to the plurality of second electrodes. Circuit board.

2. At least one of the plurality of first electrodes and at least one of the plurality of first auxiliary electrodes are electrically connected to each other, At least one of the plurality of second electrodes and at least one of the plurality of second auxiliary electrodes are electrically connected to each other. The circuit board according to claim 1 .

3. the plurality of first electrodes and the plurality of first auxiliary electrodes are spaced apart from each other, the plurality of second electrodes and the plurality of second auxiliary electrodes are spaced apart from each other; The circuit board according to claim 1 or 2.

4. the component has a rectangular shape having a plurality of edges in a plan view, the first portion is one of the plurality of edges; the second portion is another one of the plurality of edges; The circuit board according to claim 1 or 2.

5. the plurality of first electrodes and the plurality of first auxiliary electrodes are aligned in a first direction along the first portion, the plurality of second electrodes and the plurality of second auxiliary electrodes are aligned in a second direction along the second portion; The circuit board according to claim 4 .

6. the first electrodes and the first auxiliary electrodes are provided at positions offset from each other in the first direction; The second electrodes and the second auxiliary electrodes are provided at positions shifted from each other in the second direction. The circuit board according to claim 5 .

7. the component further includes a third lead provided on a third portion, which is the edge portion different from the first portion and the second portion; the plurality of electrodes further includes a third electrode to which the third lead is soldered; The circuit board according to claim 4 .

8. The printed circuit board includes a sub-board having the plurality of electrodes and a main board on which the sub-board is mounted on a mounting target portion. The circuit board according to claim 1 or 2.

9. a first-type electrode for a first-type mounting, which is either a surface mounting or a through-hole mounting, is provided on the mounting target portion of the main board; The sub-substrate is a plurality of first through holes to which the first type leads for the first type mounting are respectively soldered; a plurality of second through holes into which second type leads for a second type mounting different from the first type mounting, which is either surface mounting or through-hole mounting, can be inserted; a wiring pattern that electrically connects the plurality of first through holes, the plurality of second through holes, and the plurality of electrodes; Equipped with the first type leads soldered to the plurality of first through holes are soldered to the first type electrodes of the main substrate; The circuit board according to claim 8 .

10. the plurality of first through holes and the plurality of second through holes are aligned along an edge of the sub-substrate; The circuit board according to claim 9.

11. The first type mounting is a surface mounting, the second through holes are provided adjacent to the first through holes and closer to the edge of the sub-board than the first through holes; The circuit board according to claim 10.

12. The component has a control terminal; The printed circuit board is a control electrode electrically connected to the control terminal; the control electrode is electrically connected to the ground by a detachable jumper pin provided between the control electrode and the ground; The circuit board according to claim 1 or 2.

13. a plurality of first electrodes; a plurality of second electrodes different from the plurality of first electrodes; a plurality of first auxiliary electrodes provided adjacent to the plurality of first electrodes; a plurality of second auxiliary electrodes provided adjacent to the plurality of second electrodes; Equipped with the plurality of first electrodes and the plurality of second electrodes are intended to mount a single component; A printed circuit board, wherein the plurality of first auxiliary electrodes and the plurality of second auxiliary electrodes are intended to mount components having the same functions as components that are intended to be mounted on the plurality of first electrodes and the plurality of second electrodes.

14. A sub-board mounted on a main board, A plurality of electrodes; a first through hole to which a first type lead for a first type mounting, which is either a surface mounting or a through-hole mounting, is soldered; a second through hole into which a second type lead for a second type mounting different from the first type mounting can be inserted, the second through hole being surface mounting or through hole mounting; a wiring pattern that electrically connects the first through-hole, the second through-hole, and the plurality of electrodes; A sub-board comprising:

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