Method for manufacturing bonded substrate, bonded substrate, liquid ejection head, liquid ejection unit, and liquid ejection device

Abstract

To suppress occurrence of contact failure of a contact terminal when manufacturing a laminated substrate which comprises the contact terminal contacting an external terminal at a substrate end part.SOLUTION: A method for manufacturing a laminated substrate, which comprises a contact terminal 115 contacting an external terminal at a substrate end part, includes: a laminating process in which a first base substrate 100' and a second base substrate 200' are laminated; a chipping process in which a part of the first base substrate on a division line of the laminated base substrate is chipped; and a process in which the laminated base substrate is divided along the division line. In the method, an application process, in which a protective layer material for forming a protective layer is applied, is performed after the chipping process. The method has a structure formation process in which a structure 250, which prevents passage of the protective layer material, is formed in a communication passage, in which a chipped portion of the first base substrate and the contact terminal communicate with each other, via a gap between the first base substrate and the second base substrate on the division line.SELECTED DRAWING: Figure 13

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