Component mounting device and paste transfer method

Abstract

To provide a component mounting device which can suppress the deterioration in transfer quality.SOLUTION: A component mounting device 1 includes: a mounting head 10A having a pin or a suction nozzle which transfers a paste to a work; a paste transfer part formed with a film-like paste to be transferred to a pin tip part or a component electrode; a recognition camera 11A which images a transfer area of the paste transfer part; a recognition processing unit 300 which determines whether the paste can be transferred to the pin tip part or the component electrode at a transfer set position in the transfer area set for transferring the paste to the pin tip part or the component electrode, based on an image obtained by imaging the transfer area; and a control unit 100 which controls the mounting head 10A to transfer the paste to the pin tip part or the component electrode at the transfer set position, when determined that the paste can be transferred to the pin tip part or the component electrode at the transfer set position.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting device that mounts components on a workpiece, and a pin that transfers paste to a workpiece or a paste transfer method that transfers paste to a component. [Background technology]

[0002] A technology has been disclosed in which the presence or absence of untransferred sections on the paste transfer stage is determined by referring to component information indicating the size of the component to be mounted and transfer information indicating sections that have already been used to transfer paste on the paste transfer stage for transferring paste to the component, and film formation operation is performed only if it is determined that there are no untransferred sections (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-182983 Summary of the Invention [Problem to be solved by the invention]

[0004] However, with the technology disclosed in Patent Document 1, even in an untransferred section, if there are chips or bubbles, the transfer cannot be performed normally, and there is a risk of the transfer quality being reduced.

[0005] Therefore, the present disclosure provides a component mounting device and the like that can suppress deterioration in transfer quality. [Means for solving the problem]

[0006] A component mounting device according to one aspect of the present disclosure is a component mounting device that mounts components on a workpiece, and includes: a mounting unit having a pin that transfers paste to the workpiece or a suction nozzle that adsorbs the component; a paste transfer unit in which the paste to be transferred to the tip of the pin or the electrode of the component is formed in the form of a film; an imaging unit that images the paste transfer area of ​​the paste transfer unit; a determination unit that determines whether or not paste can be transferred to the tip or the electrode at a transfer setting position in the transfer area, based on an image obtained by imaging the transfer area, which is set so that paste can be transferred to the tip or the electrode; and a control unit that controls the mounting unit to transfer paste to the tip or the electrode at the transfer setting position when it is determined that paste can be transferred to the tip or the electrode at the transfer setting position.

[0007] These comprehensive or specific aspects may be realized by a system, an apparatus, a method, a recording medium, or a computer program, or may be realized by any combination of a system, an apparatus, a method, a recording medium, and a computer program. [Effects of the Invention]

[0008] According to the component mounting device and the like according to the present disclosure, deterioration in transfer quality can be suppressed. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a plan view of a component mounting device according to an embodiment; [Figure 2] FIG. 2 is a perspective view of a mounting head according to an embodiment. [Figure 3] FIG. 2 is a perspective view of a paste transfer unit according to the embodiment. [Figure 4] 3A and 3B are explanatory diagrams illustrating the structure of a paste transfer unit according to an embodiment. [Figure 5] 10A to 10C are diagrams for explaining the operation of the paste transfer unit according to the embodiment. [Figure 6]FIG. 2 is a functional configuration diagram of the component mounting device according to the embodiment. [Figure 7] 4 is a flowchart illustrating a first example of the operation of the component mounting device according to the embodiment. [Figure 8] FIG. 10 is a diagram showing an example of a transfer-prohibited area. [Figure 9] FIG. 10 is a diagram illustrating an example of a transferable area. [Figure 10] FIG. 2 is a diagram for explaining a first size of a component and a second size of a pin. [Figure 11] 10A to 10C are diagrams for explaining a procedure for placing components on a board using a mounting head having pins and nozzles. [Figure 12] 10 is a flowchart illustrating a second example of the operation of the component mounting device according to the embodiment. [Figure 13] 10A and 10B are diagrams for explaining normal and abnormal paste transferred to a substrate. [Figure 14] FIG. 10 shows a component mounted on normal paste transferred to a substrate. [Figure 15] 10 is a flowchart illustrating a third example of the operation of the component mounting device according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] The component mounting device disclosed herein is a component mounting device that mounts components on a workpiece, and includes: a mounting unit having a pin that transfers paste to the workpiece or a suction nozzle that adsorbs the component; a paste transfer unit in which the paste to be transferred to the tip of the pin or the electrode of the component is formed in the form of a film; an imaging unit that images the paste transfer area of ​​the paste transfer unit; a determination unit that determines whether or not paste can be transferred to the tip or the electrode at a transfer setting position in the transfer area, based on an image obtained by imaging the transfer area, which is set so that paste can be transferred to the tip or the electrode; and a control unit that controls the mounting unit to transfer paste to the tip or the electrode at the transfer setting position when it is determined that paste can be transferred to the tip or the electrode at the transfer setting position.

[0011] According to this, when determining whether or not the paste can be transferred to the tip of the pin or the electrode of the component, the image obtained by imaging the transfer area is used, so it is possible to determine whether or not the paste in the transfer area has chips, air bubbles, etc. If chips, air bubbles, etc. have occurred, the transfer can be prevented, thereby preventing a decrease in transfer quality.

[0012] In addition, when the determination unit determines that paste cannot be transferred to the tip or the electrode at the transfer setting position, it may determine whether or not there is an area in the transfer area excluding the transfer setting position where paste can be transferred to the tip or the electrode, and when it is determined that there is such an area, the control unit may control the attachment unit to transfer paste to the tip or the electrode in that area.

[0013] With this, even if the paste cannot be transferred to the tip of the pin or the electrode of the component at the transfer position, if there is an area in the transfer area excluding the transfer position where the paste can be transferred, the paste can be transferred to the tip of the pin or the electrode of the component in that area. This reduces the number of film formation operations and increases productivity.

[0014] The determination unit may determine whether or not the area exists based on the image and a first size of the component or a second size of the pin. For example, the determination unit may determine whether or not the area exists that is larger than the first size or the second size.

[0015] This allows the paste to be transferred to the tip of the pin or the electrode of the component in an area larger than the first size of the component or the second size of the pin.

[0016] The device may further include an alarm unit and a film-forming possibility determination unit, and the film-forming possibility determination unit may determine whether a film of paste can be formed in the paste transfer unit when it is determined that the area does not exist, and the alarm unit may report an error when it is determined that a film of paste cannot be formed in the paste transfer unit.

[0017] According to this, when there is no area available for transfer in the transfer area and it is not possible to form a paste film in the paste transfer unit, it is possible to notify the manager or the like of this fact. For example, it is possible to add the paste necessary for film formation to the paste transfer unit, thereby making it possible to form a film.

[0018] The paste transfer section may further include a film forming section that forms a film of paste, and the control section may control the film forming section to perform a film forming operation when it is determined that the paste transfer section can form a film of paste.

[0019] According to this, when it is possible to form a paste film in the paste transfer section, the paste film can be formed.

[0020] The paste transfer method disclosed herein is a paste transfer method for transferring paste to a pin or component that transfers paste to a workpiece, and includes imaging a paste transfer area of ​​a paste transfer section where the paste to be transferred to the tip of the pin or the electrode of the component is formed in a film form, determining whether or not paste can be transferred to the tip or electrode at a transfer setting position in the transfer area set so that paste can be transferred to the tip or electrode based on an image obtained by imaging the transfer area, and if it is determined that paste can be transferred to the tip or electrode at the transfer setting position, transferring paste to the tip or electrode at the transfer setting position.

[0021] This makes it possible to provide a paste transfer method that can suppress deterioration in transfer quality.

[0022] The embodiments described below are all comprehensive or specific examples, and the numerical values, shapes, materials, components, arrangement and connection of the components, steps, and order of steps shown in the following embodiments are merely examples and are not intended to limit the present disclosure.

[0023] (Embodiment) Hereinafter, the embodiment will be described with reference to FIGS.

[0024] First, the structures of the component mounting device 1, the mounting head 10A, and the paste transfer unit 7 will be described with reference to FIGS.

[0025] FIG. 1 is a plan view of a component mounting apparatus 1 according to an embodiment.

[0026] FIG. 2 is a perspective view of the mounting head 10A according to the embodiment.

[0027] FIG. 3 is a perspective view of the paste transfer unit 7 according to the embodiment.

[0028] FIG. 4 is a structural explanatory diagram of the paste transfer unit 7 according to the embodiment.

[0029] FIG. 5 is a diagram for explaining the operation of the paste transfer unit 7 according to the embodiment.

[0030] As shown in FIG. 1, a board transport mechanism 2 is disposed on a base 1a of the component mounting device 1 in the board transport direction (X direction). The board transport mechanism 2 transports a board 3 to be subjected to a component mounting operation (e.g., component mounting using solder or component attachment using adhesive). The board 3 is an example of a workpiece. The workpiece may also be a component. For example, the component mounting device 1 may mount additional components on the components mounted on the board 3. Hereinafter, the term "board 3" may be substituted with "component" (e.g., a component mounted on the board 3). Component supply units that supply components are disposed on both sides of the board transport mechanism 2. The front-side component supply unit 4A is provided with multiple tape feeders 6A that supply electronic components held on tape, and a paste transfer unit 7 that is compatible with other part feeders such as the tape feeder 6A, and is detachably mounted in parallel with the tape feeder 6A. The paste transfer unit 7 (specifically, the film-forming stage 24 (see FIG. 3) described later) forms a film of paste 25 (see FIG. 3) to be transferred and supplied (applied) to components sucked by pins 51 or nozzles 52 of the mounting head 10A described below. The pins 51 are transfer pins that transfer the paste to the substrate 3, and the nozzles 52 are suction nozzles that suck components to be mounted on the substrate 3. The rear-side component supply unit 4B is also detachably equipped with, for example, multiple tape feeders 6B. Note that the component supply unit 4B is not provided with a paste transfer unit 7, but may be provided with one. Also, a tray feeder may be provided instead of the tape feeder 6B.

[0031] As shown in FIG. 2, the mounting head 10A has a plurality of tool mounting portions 53 at its bottom that can be protruded and retracted downward. The tool mounting portions 53 are arranged in a matrix of six by two rows, with two pins 51 and four nozzles 52 detachably attached to one row (six) of the tool mounting portions 53, and six pins 51 detachably attached to the other row (six) of the tool mounting portions 53. Although not shown, the mounting head 10B has a six by one row of tool mounting portions 53 at its bottom, with six nozzles 52 detachably attached to the six tool mounting portions 53. The mounting heads 10A and 10B are examples of mounting portions having pins 51 that transfer paste to the substrate 3 or nozzles 52 that suck components. The mounting head 10A is also an example of a mounting portion having pins 51 that transfer paste to the substrate 3 and nozzles 52 that suck components. The separate mounting heads 10A and 10B may be collectively called the mounting unit.

[0032] At one end of the base 1a in the X direction, a Y-axis table 8 is disposed in the Y direction perpendicular to the substrate transport mechanism 2. Two X-axis tables 9A and 9B are coupled to the Y-axis table 8 so that they can move freely in the Y direction. Mounting head 10A is mounted on X-axis table 9A, and mounting head 10B is mounted on X-axis table 9B. By driving X-axis table 9A and Y-axis table 8, pins 51 and nozzles 52 mounted on the lower part of mounting head 10A are moved in the XY plane. Furthermore, by controlling tool mounting portion 53 of mounting head 10A, pins 51 and nozzles 52 are moved up and down (moved in the Z direction (see FIG. 4)) and rotated about the Z axis) relative to mounting head 10A. By driving X-axis table 9B and Y-axis table 8, mounting head 10B is moved in the XY plane so that nozzles 52 mounted on the lower part of mounting head 10B are moved. Furthermore, by controlling the tool mounting portion 53 of the mounting head 10B, the nozzle 52 is moved up and down relative to the mounting head 10B and rotated about the Z axis.

[0033] The X-axis table 9A is equipped with a recognition camera 11A that moves integrally with the mounting head 10A, and the X-axis table 9B is equipped with a recognition camera 11B that moves integrally with the mounting head 10B. As the mounting heads 10A and 10B move above the substrate 3, the recognition cameras 11A and 11B also move together to capture an image of the substrate 3. As the mounting heads 10A and 10B move above the paste transfer unit 7, the recognition cameras 11A and 11B also move together to capture an image of the paste transfer unit 7 (the paste transfer area 26 of the film formation stage 24 (see FIG. 3)). The recognition cameras 11A and 11B are an example of an imaging unit that captures an image of the transfer area 26. The recognition camera 11A is an example of an imaging unit that captures an image of the paste transferred to the substrate 3.

[0034] Component recognition cameras 12A and 12B and nozzle stockers 13A and 13B are disposed on base 1a between component supply units 4A and 4B and board transport mechanism 2. Nozzle stocker 13A stores nozzles 52 for multiple component types to be attached to mount head 10A, and by having mount head 10A access nozzle stocker 13A and perform a predetermined nozzle replacement operation, the nozzles 52 of mount head 10A can be replaced according to the component type. Similarly, nozzle stocker 13B stores nozzles 52 for multiple component types to be attached to mount head 10B, and by having mount head 10B access nozzle stocker 13B and perform a predetermined nozzle replacement operation, the nozzles 52 of mount head 10B can be replaced according to the component type.

[0035] By moving mount head 10A holding a component relative to component recognition camera 12A in the X direction above mount head 10A, component recognition camera 12A reads an image of the component from below, thereby recognizing the type and shape of the component held by mount head 10A. Note that component recognition camera 12A may also read an image of pins 51 from below, thereby recognizing the state of paste transferred to the tips of pins 51. During component mounting by mount head 10A, the mounting position on board 3 is corrected based on the board recognition results from recognition camera 11A and component recognition camera 12A. Similarly, by moving mount head 10B holding a component relative to component recognition camera 12B in the X direction above component recognition camera 12B, component recognition camera 12B reads an image of the component from below, thereby recognizing the type and shape of the component held by mount head 10B. During component mounting by mount head 10B, the mounting position on board 3 is corrected based on the board recognition results from recognition camera 11B and component recognition camera 12B.

[0036] 3 and 4, the paste transfer unit 7 has a configuration in which the various components described below are provided on a long base portion 20, and the base portion 20 is detachably attached to a feeder base 16 (see FIG. 4(a)) provided in the component supply section 4A with its longitudinal direction aligned in the Y direction. The front side shown in FIG. 3 corresponds to the right side in FIG. 4(a), and the rear side shown in FIG. 3 corresponds to the left side in FIG. 4(a). Note that, although an example in which mounting head 10A accesses the paste transfer unit 7 will be described here, mounting head 10B may also access the paste transfer unit 7.

[0037] The paste transfer unit 7 is provided with an engagement portion 20a for engaging with the feeder base 16 to fix the base portion 20, and furthermore, a handle 21 is provided protruding rearward from the engagement portion 20a. When attaching the paste transfer unit 7 to the feeder base 16, the underside of the base portion 20 is aligned with the upper surface of the feeder base 16, and the handle 21 is grasped and pushed forward, whereby the engagement portion 20a engages with the rear end portion of the feeder base 16, and the base portion 20 is attached in the specified position.

[0038] A guide rail 22 is disposed in the longitudinal direction on the upper surface of the base part 20, and a slider 23 slidably fitted on the guide rail 22 is fixed to the underside of the film formation stage 24. As shown in Fig. 4, a feed screw 32 is threadedly engaged with a nut 34 connected to the underside of the film formation stage 24, and the feed screw 32 is driven to rotate by a motor 31 disposed on the rear end side of the base part 20. Therefore, by driving the motor 31, the film formation stage 24 reciprocates in the longitudinal direction on the upper surface of the base part 20.

[0039] That is, the guide rail 22, slider 23, nut 34, feed screw 32, and motor 31 constitute a stage driving means that reciprocates the film formation stage 24 in the longitudinal direction relative to the base part 20. This stage driving means is covered with a safety cover 33 to ensure the safety of the operator. Here, the motor 31, which serves as the driving source for the stage driving means, is arranged on the opposite side of the access direction of the mounting head 10A (the left side of FIG. 4(a)), so that access of the mounting head 10A to the paste transfer unit 7 is not obstructed. Note that the mounting head 10A accesses the paste transfer unit 7 from the right side of FIG. 4(a), for example.

[0040] The film-forming stage 24 has a structure in which a recess with a smooth bottom is formed on the upper surface of a rectangular member, and the bottom surface of this recess serves as a film-forming surface 24a for forming (depositing) a film of paste 25. The film-forming stage 24 is an example of a paste transfer unit in which a film of paste 25 is formed to be transferred to the tips of the pins 51 or to the electrodes of the components. The film-forming stage 24 is also an example of a paste supply unit for supplying paste to the tips of the pins 51. The paste may be, for example, solder, adhesive, or flux. A transfer area 26 is defined on the film-forming surface 24a for transferring paste to components adsorbed on the pins 51 or nozzles 52 provided on the mounting head 10A. The size of the transfer area 26 is set so that paste can be transferred simultaneously to multiple components adsorbed on the multiple pins 51 and / or multiple nozzles 52 of the mounting head 10A. At this time, since the film formation stage 24 has a rectangular shape, it is possible to set the transfer area 26 as large as possible relative to the width dimension of the film formation stage 24, and it is possible to make the overall width of the paste transfer unit 7 as small as possible.

[0041] The paste transfer unit 7 includes a film-forming squeegee unit 28 and a scraping unit 29, which are disposed behind the transfer area 26 and at a position where they do not interfere with the mounting head 10A. The film-forming squeegee unit 28 and the scraping unit 29 are an example of a film-forming section that forms a film of paste on the film-forming stage 24. A needle 30a of a paste supply syringe 30 is inserted between the film-forming squeegee unit 28 and the scraping unit 29. The film-forming squeegee unit 28 is held by a bracket 27 that is erected on the base 20, and this fixes its horizontal position relative to the base 20.

[0042] The detailed structure of the film forming squeegee unit 28 will be described with reference to (a) and (b) of Figure 4. Note that (b) of Figure 4 shows a cross section taken along line A in (a) of Figure 4.

[0043] 4(a), the film-forming squeegee unit 28 includes a squeegee 28a that extends downward and whose lower end maintains a film-forming gap g (see FIG. 5(a)) between itself and the film-forming surface 24a, and the squeegee 28a is connected to a connecting member 35. The connecting member 35 is attached to the bracket 27 via a slide unit 37, so that the squeegee 28a is movable up and down relative to the bracket 27.

[0044] By moving the film formation stage 24, with the paste 25 supplied to the film formation surface 24a, horizontally in the Y direction by the stage driving means described above, the squeegee 28a spreads the paste 25 on the film formation surface 24a to form a film with a thickness corresponding to the film formation gap g. Then, by moving the film formation stage 24 after film formation toward the access direction of the mounting head 10A (to the right in FIG. 4(a)), the transfer area 26 on which the film-like paste 25 has been formed can be positioned at the paste transfer operation position by the mounting head 10A, as shown in FIG. 4(a).

[0045] The scraping unit 29 has a scraper 29a extending downward. The scraper 29a is biased downward and is always in contact with the film formation surface 24a regardless of the height position of the film formation stage 24. The scraper 29a scrapes the paste 25 on the film formation stage 24 by reciprocating the film formation stage 24 in the Y direction using a stage driving means.

[0046] A reflective optical sensor 14 is disposed above the film-forming stage 24, between the squeegee 28a and the scraper 29a. The detection direction of the inspection optical axis 14a of the reflective optical sensor 14 is directed toward the film-forming surface 24a. The optical sensor 14 irradiates the film-forming surface 24a with inspection light and receives the reflected light. This received light signal is detected and processed by the detection processing unit 15, thereby detecting the remaining amount of paste 25 on the film-forming surface 24a. The control and drive unit 45 receives this detection result and determines whether or not paste needs to be replenished.

[0047] Therefore, the optical sensor 14, the detection processing unit 15, and the control and drive unit 45 constitute a paste remaining amount detection means that detects the remaining amount of paste 25 using the optical sensor 14, which is disposed between the squeegee 28a and the scraper 29a with its detection direction facing the film formation surface 24a, and determines whether or not replenishment is required. This paste remaining amount detection means is configured to detect the paste 25 using the optical sensor 14 after the film formation stage 24 starts moving when the scraper 29a scrapes off the paste 25. If the paste remaining amount detection means determines that replenishment of paste is required, the paste is supplied to the film formation stage 24 by the paste supply means consisting of the paste supply syringe 30 and the needle 30a. The detection processing unit 15 is an example of a film formation possibility determination unit.

[0048] A vertically disposed lifting member 36 is connected to the connecting member 35, and a cam follower 38 is connected to the lower end of the lifting member 36 that penetrates into the base portion 20. A motor 40 is disposed horizontally inside the base portion 20, and a disk cam 39 connected to the rotary shaft of the motor 40 abuts against the cam follower 38. When the motor 40 is driven to rotate in this state, the lifting member 36 rises and falls in accordance with the cam characteristics of the disk cam 39, and as a result, the squeegee 28a rises and falls relative to the film formation surface 24a.

[0049] That is, the lifting member 36, cam follower 38, disc cam 39, and motor 40 constitute a squeegee position adjusting means for adjusting the vertical position of the squeegee 28a, and in the film forming operation described below, the vertical position of the squeegee 28a can be adjusted to change the film formation gap g between the lower end of the squeegee 28a and the film formation surface 24a, thereby making it possible to vary the thickness of the film of paste 25 on the film formation surface 24a. Note that, although a cam mechanism combining the cam follower 38 and disc cam 39 is used as the squeegee position adjusting means here, any drive system other than a cam mechanism can be used as long as it is a linear motion mechanism that can raise and lower the lifting member 36 as desired.

[0050] 4(a), an air coupler 41a and an electric connector 41b that constitute a unit-side connection part 41 are provided on an engagement part 20a provided on the underside of the base part 20, and the air coupler 41a and the electric connector 41b are connected to a control and drive unit 45 built into the paste transfer unit 7 by air piping and electric wiring, respectively. The control and drive unit 45 has the functions of controlling and driving the motor 31 that is the drive source of the stage drive means and the motor 40 that is the drive source of the film formation squeegee unit 28, supplying and controlling compressed air for discharging paste from the paste supply syringe 30, and further determining whether or not paste needs to be replenished on the film formation surface 24a by the optical sensor 14 and the detection processing part 15.

[0051] The rear end of the feeder base 16 is provided with a base-side connection part 42 consisting of an air coupler 42a and an electric connector 42b, and the air coupler 42a and the electric connector 42b are connected to a control and power supply part 43 and a compressed air supply source 44 by air piping and electric wiring, respectively. When the paste transfer unit 7 is slid forward along the feeder base 16 and attached, the unit-side connection part 41 fits into the base-side connection part 42. This electrically connects the control and power supply part 43 to the control and drive unit 45, and further enables compressed air to be supplied to the control and drive unit 45 from the compressed air supply source 44. These connections are then broken by sliding the paste transfer unit 7 rearward.

[0052] That is, the paste transfer unit 7 is connected to a base-side connection part 42 provided on the feeder base 16, and is configured to include a unit-side connection part 41 that transmits control signals and supplies power. As a result, by simply mounting the paste transfer unit 7 on the feeder base 16, control signals are transmitted and driving power is supplied from the control and power supply part 43 to the control and drive unit 45, without any additional connection work, and compressed air for driving is supplied to the control and drive unit 45 from the compressed air supply source 44.

[0053] Next, the film formation operation and scraping operation performed by the paste transfer unit 7 will be described with reference to Figure 5. First, Figure 5(a) shows a state in which the film formation stage 24 is in the retracted position, the squeegee 28a and the scraper 29a are positioned at the end of the film formation surface 24a on the film formation start side (the right end in this example) before the film formation operation starts, and the paste 25 is supplied between the squeegee 28a and the scraper 29a via the needle 30a. When the film formation operation starts, the film formation gap g between the lower end of the squeegee 28a and the film formation surface 24a is set to a film thickness t appropriate for transferring the paste to the electrode of the component.

[0054] Next, the stage moving means is driven to advance the film formation stage 24 (arrow b), as shown in Fig. 5(b). As a result, the paste 25 is spread on the film formation surface 24a by the squeegee 28a, and the paste 25 is formed on the film formation surface 24a to a thickness of t. Then, as shown in Fig. 5(c), the mounting head 10A moves above the film formation stage 24, and the pins 51 and / or the nozzles 52 holding the components by suction are raised and lowered (arrow c) to perform a transfer operation, thereby transferring (supplying) the paste to the tips of the pins 51 and / or the electrodes of the components.

[0055] Thereafter, the paste 25 is scraped. That is, as shown in FIG. 5(d), the film-forming stage 24 is retracted (arrow e) while the squeegee 28a is raised (arrow d). As a result, the paste 25 present on the film-forming surface 24a is scraped to one side by the scraper 29a and accumulated between the squeegee 28a and the scraper 29a, returning to the state shown in FIG. 5(a). Thereafter, the film-forming operation and the scraping operation are repeated in the same manner.

[0056] Next, the configuration of a control system of the component mounting apparatus 1 will be described with reference to FIG.

[0057] FIG. 6 is a functional configuration diagram of the component mounting apparatus 1 according to the embodiment.

[0058] The control unit 100 includes a mounting control unit 101 and a transfer control unit 102. The mounting control unit 101 controls the operations of the X-axis tables 9A and 9B, the Y-axis table 8, and the mounting heads 10A and 10B via a mechanism drive unit 200. The transfer control unit 102 controls the transfer operation of transferring paste to electrodes of components sucked onto the pins 51 and / or nozzles 52, as well as the film formation operation in the paste transfer unit 7, by lowering the pins 51 and / or nozzles 52 of the mounting head 10A toward the paste 25 in the transfer area 26 of the film formation stage 24 via the mechanism drive unit 200. The control and drive unit 45 shown in FIG. 4(a) is an example of the control unit 100.

[0059] Recognition processing unit 300 performs recognition processing on images obtained by imaging with recognition cameras 11A and 11B and component recognition cameras 12A and 12B. Recognition processing unit 300 is an example of a determination unit that determines, based on an image obtained by imaging transfer area 26, whether paste can be transferred to the tip ends of pins 51 or the electrodes of a component sucked onto nozzle 52 at a transfer setting position (transfer setting area) in transfer area 26 that is set so that paste can be transferred to the tip ends of pins 51 or the electrodes of a component sucked onto nozzle 52. Recognition processing unit 300 is also an example of a determination unit that determines, based on an image obtained by imaging the paste transferred to substrate 3, whether there is an abnormality in the paste transferred to substrate 3.

[0060] The operation / input unit 400 accepts operations or inputs by an operator to the component mounting apparatus 1. The operation / input unit 400 is, for example, a keyboard, a mouse, or a touch panel.

[0061] The display unit 500 is a display or the like that displays information to an operator. The display contents of the display unit 500 are not particularly limited, and may display, for example, the status of the component mounting apparatus 1, the work to be performed by the operator, errors, etc. For example, when the display unit 500 notifies an error, the display unit 500 is an example of a notification unit.

[0062] The storage unit 600 includes a component information storage unit 601 and a transfer information storage unit 602. The component information storage unit 601 stores component information about components to be mounted by the component mounting device 1. The component information includes data about the size of the components. The transfer information storage unit 602 stores transfer setting positions according to the size of the components (first size) or the size of the pins 51 (second size). The transfer setting positions are positions in the transfer area 26 of the film formation stage 24 where paste is transferred to the electrodes of the components or the tips of the pins 51, and are set according to the size of the components or the size of the pins 51 and the positions in the transfer area 26 where transfer has already been performed after film formation. In other words, the transfer setting positions are set according to the size of the components or pins to which paste is to be transferred, from positions in the transfer area 26 where transfer has not yet been performed after film formation.

[0063] Next, a first example of the operation of the component mounting apparatus 1 will be described with reference to FIG.

[0064] FIG. 7 is a flowchart showing a first example of the operation of the component mounting apparatus 1 according to the embodiment.

[0065] First, the control unit 100 controls the mounting head 10A so that the mounting head 10A picks up the component to be mounted in the component mounting device 1 (step S101).

[0066] Next, the component recognition camera 12A captures an image of the component picked up by the nozzle 52 of the mounting head 10A, and the recognition processing unit 300 performs a component recognition process to determine whether the component is correctly picked up by the nozzle 52, based on the image obtained by capturing the component (step S102). For example, if an error occurs in the component recognition process, such as the component not being correctly picked up by the nozzle 52, an error notification may be issued to indicate this. The error notification is issued by emitting a buzzer sound, turning on or blinking a lamp, displaying a message on the display unit 500, or the like.

[0067] Next, the recognition camera 11A captures an image of the transfer area 26 of the film-forming stage 24 where the paste 25 is formed in a film shape (step S103).

[0068] Next, the recognition processing unit 300 determines whether or not the paste can be transferred to the electrodes of the component attracted to the nozzle 52 at the transfer setting position based on the image obtained by capturing the image of the transfer area 26 (step S104). Here, an example of a transfer-prohibited area where the paste cannot be transferred and a transfer-possible area where the paste can be transferred will be described with reference to FIGS. 8 and 9.

[0069] FIG. 8 is a diagram showing an example of a transfer-prohibited area.

[0070] FIG. 9 is a diagram showing an example of a transferable area.

[0071] For example, as shown in FIG. 8, a transfer-prohibited area is an area where chips or bubbles have occurred in the paste 25. The occurrence of chips or bubbles can be recognized based on an image obtained by capturing the transfer area 26. In this case, the recognition processing unit 300 can determine that the paste cannot be transferred to the electrodes of the component at the transfer setting position. As shown in the upper part of FIG. 9, the transfer-possible area may be an area surrounded by depressions corresponding to the electrodes of a QFP (Quad Flat Package) component that are formed in the transfer area 26 of the deposition stage 24 after transfer to the electrodes of the QFP component. This is because, for example, when transferring paste to electrodes of a BGA (Ball Grid Array) component, it may be possible to transfer the paste to the electrodes of the BGA component in such a transfer-possible area, as shown in the lower part of FIG. 9.

[0072] Components to be mounted by the component mounting apparatus 1, and having paste transferred to electrodes, include various types such as lead components and surface-mount components. Lead components further include axial components, DIP (Dual Inline Package) components, SIP (Single Inline Package) components, and PGA (Pin Grid Array) components. Surface-mount components include the above-mentioned QFP components and BGA components, as well as SOP (Small Outline Package) components, SSOP (Shrink Small Outline Package) components, SOJ (Small Outline J-leaded) components, chip components, QFN (Quad Flat No-Leads) components, and CSP (Chip Size Package) components. The size of a component varies depending on the type of component, but component size information is stored in the component information storage unit 601, and the recognition processing unit 300 acquires the component size information from the component information storage unit 601 and determines whether or not the paste can be transferred to the electrode of the component at the transfer setting position, based on the size of the component to which the paste is to be transferred.

[0073] Here, the size of the component (first size) will be described with reference to Fig. 10. Note that Fig. 10 also shows the size of the pin 51 (second size).

[0074] FIG. 10 is a diagram for explaining the first size of the component and the second size of the pin 51. In FIG.

[0075] If the component is a lead component, the first size of the component may be an area that extends beyond the outer periphery of the component body (package) and surrounds all of the component's electrodes, as shown in (a) of Figure 10. Furthermore, although not shown, if the component is a surface-mount component, the first size of the component may be an area that is smaller than the outer periphery of the component body (package) and surrounds all of the component's electrodes.

[0076] The second size of the pin 51 may be the size of a cross section of the pin 51 perpendicular to the axial direction of the pin 51, or may be a square with one side equal to the diameter of the pin that surrounds the cross section, as shown in (b) of Figure 10.

[0077] Returning to the explanation in Figure 7, if it is determined that paste can be transferred to the electrodes of the component adsorbed to the nozzle 52 at the transfer setting position (Yes in step S104), the control unit 100 controls the mounting head 10A to transfer paste to the electrodes of the component adsorbed to the nozzle 52 at the transfer setting position (step S105).

[0078] Next, component recognition camera 12A captures an image of the component that has been adsorbed onto nozzle 52 of mounting head 10A and has paste transferred to its electrode, and recognition processing unit 300 performs a component recognition process based on the image obtained by capturing the component, determining whether the component has been properly adsorbed onto nozzle 52, whether the component has fallen, whether the paste has been properly transferred to the electrode, etc. (Step S106). For example, if an error occurs in the component recognition process, such as the component not being properly adsorbed onto nozzle 52 or the paste not being properly transferred to the electrode, an error notification indicating this may be issued.

[0079] Then, the control unit 100 controls the mounting head 10A to mount the component on the board 3 (step S107).

[0080] On the other hand, if the recognition processing unit 300 determines that the paste cannot be transferred to the electrodes of the component attracted to the nozzle 52 at the transfer setting position (No in step S104), it determines whether there is an area in the transfer area 26 excluding the transfer setting position where the paste can be transferred to the electrodes of the component (step S108). That is, the recognition processing unit 300 determines whether the paste can be transferred to the electrodes of the component in an area other than the transfer setting position in the transfer area 26. For example, the recognition processing unit 300 determines whether there is an area where the paste can be transferred to the electrodes of the component based on an image obtained by capturing the image of the transfer area 26 and the first size of the component. Specifically, the recognition processing unit 300 determines whether there is an area where the paste can be transferred to the electrodes of the component that is larger than the first size of the component. The area where the paste can be transferred to the electrodes of the component is, for example, not a transfer-prohibited area as shown in FIG. 8 but a transfer-permitted area as shown in FIG. 9.

[0081] If it is determined that there is an area where paste can be transferred to the electrodes of the component (Yes in step S108), the control unit 100 controls the mounting head 10A to transfer paste to the electrodes of the component adsorbed by the nozzle 52 in that area (step S105).

[0082] If it is determined that there is no area on the electrode of the component to which the paste can be transferred (No in step S108), the detection processing unit 15 determines whether or not it is possible to form a film of the paste 25 on the film-forming stage 24 (step S109). For example, if the remaining amount of the paste 25 is less than a predetermined amount, it is determined that it is not possible to form a film of the paste 25. The predetermined amount is set as appropriate.

[0083] The method for determining whether or not a film of paste 25 can be formed on film-forming stage 24 is not limited to the method based on the remaining amount of paste 25. For example, whether or not a film of paste 25 can be formed on film-forming stage 24 may be determined based on whether or not the number of film-forming operations performed since the previous supply of paste to film-forming stage 24 is equal to or less than a predetermined number. In this case, component mounting apparatus 1 does not need to be equipped with optical sensor 14.

[0084] If it is determined that the paste 25 can be deposited on the deposition stage 24 (Yes in step S109), the control unit 100 controls the deposition squeegee unit 28 and the scraping unit 29 to perform a deposition operation (step S110). As a result, the paste 25 is deposited on the deposition stage 24, as shown in FIG. 5(b).

[0085] If it is determined that it is not possible to form a film of the paste 25 on the film-forming stage 24 (No in step S109), the display unit 500 notifies (displays) an error indicating that it is not possible to form a film of the paste 25 on the film-forming stage 24 (step S111). Note that the error notification is not limited to the display unit 500, and may be made by voice from a buzzer or speaker as an example of a notification unit, or by lighting or flashing a lamp as an example of a notification unit.

[0086] Note that paste may be transferred to the electrodes of the component sucked by the nozzle 52 of the mounting head 10B, and the mounting head 10A described in the first example may be replaced by the mounting head 10B, the recognition camera 11A by the recognition camera 11B, and the component recognition camera 12A by the component recognition camera 12B. In this case, the mounting head 10B is an example of a mounting unit.

[0087] In the first example above, paste is transferred to the electrodes of a component sucked onto nozzle 52, and the component with the paste transferred to the electrodes is mounted on substrate 3, but this is not limiting. For example, as shown in Fig. 11, paste may be transferred to the tip of pin 51, and pin 51 with the paste transferred to its tip may then transfer the paste to the location on substrate 3 where the component will be mounted, and the component sucked onto nozzle 52 may be mounted on top of the paste transferred to substrate 3.

[0088] FIG. 11 is a diagram for explaining the procedure for placing components on the board 3 by the placement head 10A having the pins 51 and the nozzles 52. In FIG.

[0089] The control unit 100 moves the mounting head 10A, which has pins 51 with paste transferred to their tips and nozzles 52 that have sucked components, above the board 3, and positions the tips of the pins 51 directly above the component mounting position R on the board 3 ((a) of FIG. 11). The control unit 100 then causes the pins 51 to protrude and retract downward relative to the mounting head 10A, thereby transferring the paste Bd attached to the tips of the pins 51 to the component mounting position R on the board 3. Specifically, this transfer of the paste Bd is performed by lowering the pins 51 relative to the mounting head 10A (arrow C1 shown in (b) of FIG. 11), and then raising the pins 51 when the paste Bd attached to the tips of the pins 51 comes into contact with the board 3 (arrow C2 shown in (c) of FIG. 11).

[0090] After the pins 51 have applied the paste Bd to the component mounting position R on the board 3, the control unit 100 slides the mounting head 10A horizontally (arrow D1 shown in FIG. 11(d)) until the lower end of the nozzle 52 is positioned directly above the component mounting position R (FIG. 11(d)). The control unit 100 then causes the nozzle 52 to protrude and retract downward relative to the mounting head 10A, thereby mounting the component Cp that has been sucked onto the nozzle 52 at the component mounting position R on the board 3 where the paste Bd has been transferred. Specifically, the nozzle 52 is lowered relative to the mounting head 10A (arrow E1 shown in FIG. 11(e)), and when the component Cp sucked onto the lower end of the nozzle 52 comes into contact with the board 3, the nozzle 52 releases the component Cp from its suction, and then the nozzle 52 is raised (arrow E2 shown in FIG. 11(f)). When mounting the component Cp at the component mounting position R on the board 3, a position correction (including a rotation correction) of the nozzle 52 relative to the board 3 may be performed so as to correct the previously determined positional deviation of the board 3 and the adsorption deviation of the component Cp.

[0091] Next, a second example of the operation of the component mounting apparatus 1 will be specifically described with reference to FIG.

[0092] FIG. 12 is a flowchart showing a second example of the operation of the component mounting apparatus 1 according to the embodiment.

[0093] The processing from step S201 to step S203 is the same as the processing from step S101 to step S103 in the first example described with reference to FIG. 7, and therefore a description thereof will be omitted.

[0094] The recognition processing unit 300 determines whether or not the paste can be transferred to the tip portions of the pins 51 at the transfer setting position based on the image obtained by capturing the image of the transfer area 26 (step S204). For example, the recognition processing unit 300 acquires information on the size of the pins 51 from the storage unit 600 or the like, and determines whether or not the paste can be transferred to the tip portions of the pins 51 at the transfer setting position based on the size of the pins 51 to which the paste is to be transferred.

[0095] If it is determined that the paste can be transferred to the tip of the pin 51 at the transfer setting position (Yes in step S204), the control unit 100 controls the mounting head 10A to transfer the paste to the tip of the pin 51 at the transfer setting position (step S205).

[0096] Next, component recognition camera 12A captures images of the components and pins 51 picked up by nozzles 52 of mounting head 10A, and recognition processing unit 300 performs a component and pin 51 recognition process based on the captured images of the components and pins 51 to determine whether the components are properly picked up by nozzles 52, whether the components have fallen off due to the transfer operation, and whether paste has been properly transferred to the tips of pins 51 (step S206). For example, if an error occurs in the component recognition process, such as if the components are not properly picked up by nozzles 52, an error notification indicating this may be issued. Furthermore, if an error occurs in the pin recognition process, such as if the paste is not properly transferred to the tips of pins 51, an error notification indicating this may be issued.

[0097] Next, the control unit 100 controls the mounting head 10A so that the paste transferred (supplied) to the tip of the pin 51 is transferred to the substrate 3, as shown in (a) to (c) of Figure 11 (step S207).

[0098] Next, the recognition camera 11A captures an image of the paste transferred to the substrate 3 (step S208).

[0099] Next, the recognition processing unit 300 determines whether or not there is an abnormality in the paste transferred to the substrate 3 based on the image obtained by imaging the paste transferred to the substrate 3 (step S209). For example, the recognition processing unit 300 may determine whether or not there is an abnormality based on the size or position of the paste transferred to the substrate 3 in the image obtained by imaging the paste transferred to the substrate 3.

[0100] For example, the recognition processing unit 300 can determine the edge of the paste in an image captured by a black-and-white camera or the like, thereby determining the size (area) of the paste. Alternatively, the recognition processing unit 300 can determine the size (volume) of the paste by acquiring three-dimensional information using any method, such as a stereo method, a ToF (Time of Flight) method, or a method using structured illumination. For example, the recognition processing unit 300 can determine that there is no abnormality when the outer diameter of the paste is equal to or greater than a first predetermined value and equal to or less than a second predetermined value. That is, it can determine that there is no abnormality when the outer diameter of the paste is neither too small nor too large relative to the target outer diameter. Furthermore, for example, the recognition processing unit 300 can determine that there is no abnormality when the volume of the paste is equal to or greater than a third predetermined value and equal to or less than a fourth predetermined value. That is, it can determine that there is no abnormality when the volume of the paste is neither too small nor too large relative to the target volume.

[0101] Furthermore, for example, the recognition processing unit 300 may determine that there is no abnormality when the distance between the transfer setting position of the paste to be transferred to the substrate 3 (for example, the central coordinates of a land on which an electrode of a component is mounted) and the position of the paste transferred to the substrate 3 (for example, the central coordinates of the paste) is equal to or less than a fifth predetermined value. In other words, it can be determined that there is no abnormality when the position of the paste is not too far away from the land or the like by more than a predetermined value. The first, second, third, fourth, and fifth predetermined values ​​are not particularly limited and are set as appropriate depending on, for example, the size of the pin 51 or the size of the component.

[0102] Here, normal and abnormal paste transferred to the substrate 3 will be described with reference to FIGS.

[0103] FIG. 13 is a diagram for explaining normal and abnormal paste transferred to substrate 3. In FIG.

[0104] FIG. 14 shows a component mounted on normal paste transferred to the substrate 3.

[0105] FIG. 13(a) shows normal paste transferred to the substrate 3, and FIGS. 13(b) and 13(c) show abnormal paste transferred to the substrate 3. For example, as shown in FIG. 13(a), if the paste does not overflow from the lands on which the component electrodes are mounted and is not too small, it is determined that there is no abnormality in the paste transferred to the substrate 3. For example, as shown in FIG. 13(b), if the paste size is too small for the lands on which the component electrodes are mounted, it is determined that there is an abnormality in the paste transferred to the substrate 3. For example, as shown in FIG. 13(c), if the center of the paste is too far from the center of the lands on which the component electrodes are mounted, it is determined that there is an abnormality in the paste transferred to the substrate 3. As shown in FIG. 14, if there is no abnormality in the paste transferred to the substrate 3, the component is mounted on normal paste, which prevents a decrease in component mounting quality.

[0106] Returning to the explanation in Figure 12, if it is determined that there is no abnormality in the paste transferred to the substrate 3 (No in step S209), the control unit 100 controls the mounting head 10A to mount a component on the paste transferred to the substrate 3 (step S210).

[0107] If it is determined that there is an abnormality in the paste transferred to the substrate 3 (Yes in step S209), the display unit 500 notifies (displays) an error indicating that there is an abnormality in the paste transferred to the substrate 3 (step S211). Note that the error notification is not limited to the display unit 500, and may be made by voice from a buzzer or speaker as an example of a notification unit, or by lighting or flashing a lamp as an example of a notification unit.

[0108] On the other hand, if the recognition processing unit 300 determines that the paste cannot be transferred to the tip of the pin 51 at the transfer setting position (No in step S204), it determines whether or not there is an area in the transfer area 26 excluding the transfer setting position where the paste can be transferred to the tip of the pin 51 (step S212). That is, the recognition processing unit 300 determines whether or not the paste can be transferred to the tip of the pin 51 in an area other than the transfer setting position in the transfer area 26. For example, the recognition processing unit 300 determines whether or not there is an area where the paste can be transferred to the tip of the pin 51 based on an image obtained by capturing an image of the transfer area 26 and the second size of the pin 51. Specifically, the recognition processing unit 300 determines whether or not there is an area larger than the second size of the pin 51 where the paste can be transferred to the tip of the pin 51.

[0109] If it is determined that there is an area where paste can be transferred to the tip of the pin 51 (Yes in step S212), the control unit 100 controls the mounting head 10A to transfer paste to the tip of the pin 51 in that area (step S205).

[0110] The processing from step S212 to step S214 is the same as the processing from step S108 to step S110 in the first example described with reference to FIG. 7, and therefore a description thereof will be omitted.

[0111] In the second example described above, the transfer of paste from the pins 51 to the board 3 and the placement of components from the nozzles 52 on the board 3 are performed by a single mounting head 10A having both the pins 51 and the nozzles 52, but this is not limiting. For example, the transfer of paste from the pins 51 to the board 3 and the placement of components from the nozzles 52 on the board 3 may each be performed by different mounting heads. This will be described with reference to FIG. 15. For example, in a third example described with reference to FIG. 15, the pins 51 of the mounting head 10A and the nozzles 52 of the mounting head 10B are used. In this case, the mounting head 10A does not have to have the nozzles 52.

[0112] FIG. 15 is a flowchart showing a third example of the operation of the component mounting apparatus 1 according to the embodiment.

[0113] First, the control unit 100 controls the rear mounting head 10B to pick up the component to be mounted in the component mounting device 1 (step S301).

[0114] Next, the rear-side component recognition camera 12B captures an image of the component picked up by the nozzle 52 of the mounting head 10B, and the recognition processing unit 300 performs component recognition processing based on the image obtained by capturing the component (step S302).

[0115] Next, the front-side recognition camera 11A captures an image of the transfer area 26 where the paste 25 is formed in a film shape (step S303).

[0116] Next, the recognition processing unit 300 determines whether or not the paste can be transferred to the tip portions of the pins 51 of the mounting head 10A at the transfer setting position, based on the image obtained by capturing the image of the transfer area 26 (step S304).

[0117] If it is determined that the paste can be transferred to the tip of the pin 51 of the mounting head 10A at the transfer setting position (Yes in step S304), the control unit 100 controls the mounting head 10A to transfer the paste to the tip of the pin 51 of the front side mounting head 10A at the transfer setting position (step S305).

[0118] Next, the front-side component recognition camera 12A captures an image of the pin 51 held by the mounting head 10A, and the recognition processing unit 300 performs a recognition process for the pin 51 to determine whether the paste has been correctly transferred to the tip of the pin 51, based on the image obtained by capturing the image of the pin 51 (step S306).

[0119] Next, the control unit 100 controls the mounting head 10A so that the paste transferred (supplied) to the tip of the pin 51 is transferred onto the substrate 3 (step S307).

[0120] Next, the rear-side recognition camera 11B captures an image of the paste transferred to the board 3 (step S308). The recognition camera 11B is provided on the mounting head 10B having the nozzle 52 that adsorbs the component, and an image is captured by the recognition camera 11B when the mounting head 10B moves above the board 3 and mounts the component on the board 3.

[0121] Next, the recognition processing unit 300 determines whether or not there is an abnormality in the paste transferred to the substrate 3 based on the image obtained by capturing the image of the paste transferred to the substrate 3 (step S309).

[0122] If it is determined that there is no abnormality in the paste transferred to the substrate 3 (No in step S309), the control unit 100 controls the mounting head 10B to mount a component on the paste transferred to the substrate 3 (step S310).

[0123] The processing in step S311 is the same as the processing in step S211 in the second example described using FIG. 12, and the processing from step S312 to step S314 is the same as the processing from step S212 to step S214 in the second example described using FIG. 12, so explanations of each will be omitted.

[0124] In the first and second examples, the mounting head 10A has been described as an example of a mounting unit, but in the third example, the mounting heads 10A and 10B are collectively referred to as a mounting unit. Specifically, in the third example, the mounting unit has a first mounting unit (mounting head 10A) provided with pins 51 and a second mounting unit (mounting head 10B) provided separately from the first mounting unit and provided with nozzles 52. The control unit 100 controls the first mounting unit (mounting head 10A) so that paste supplied to the tips of the pins 51 is transferred to the substrate 3, and if it is determined that there is no abnormality in the paste transferred to the substrate 3, controls the second mounting unit (mounting head 10B) so that a component is placed on the paste transferred to the substrate 3.

[0125] 2, mounting head 10A may have a plurality of pins 51 and nozzles 52, and mounting head 10B may have a plurality of nozzles 52. In this case, paste may be transferred to a plurality of locations on substrate 3 by each of the plurality of pins. Then, recognition processing unit 300 may determine whether or not there is an abnormality in the paste transferred to substrate 3 by each of the plurality of pins 51 based on images obtained by capturing images of the paste transferred to substrate 3 at a plurality of locations, and control unit 100 may control mounting head 10A or 10B to mount components on each of the pastes transferred to substrate 3 by each of the plurality of pins 51, excluding the paste determined to have an abnormality.

[0126] As described above, when determining whether or not paste can be transferred to the tip of pin 51 or to the electrode of a component sucked onto nozzle 52, the image obtained by imaging transfer area 26 is used, so it is possible to determine whether or not chips, air bubbles, etc. have occurred in the paste in transfer area 26. If chips, air bubbles, etc. have occurred, transfer can be prevented, thereby preventing a decrease in transfer quality.

[0127] (Other embodiments) While the component mounting apparatus 1 of the present disclosure has been described above based on the embodiments, the present disclosure is not limited to the above-described embodiments. As long as they do not deviate from the spirit of the present disclosure, various modifications conceivable by those skilled in the art to the present embodiments and configurations constructed by combining components of different embodiments are also included within the scope of the present disclosure.

[0128] For example, the present disclosure can be realized not only as the component mounting apparatus 1 but also as a paste transfer method including steps (processes) performed by each of the constituent elements of the component mounting apparatus 1.

[0129] The paste transfer method is a method for transferring paste to a pin or a component that transfers paste to a workpiece, and includes the steps of: capturing an image of a paste transfer section in which the paste to be transferred to the tip of the pin or the electrode of the component is formed in a film form (step S103 of FIG. 7, step S203 of FIG. 12, or step S303 of FIG. 15); determining whether or not the paste can be transferred to the tip of the pin or the electrode of the component at a transfer setting position in the paste transfer section that is set so that the paste can be transferred to the tip of the pin or the electrode of the component based on the image obtained by capturing the paste transfer section (step S104 of FIG. 7, step S204 of FIG. 12, or step S304 of FIG. 15); and if it is determined that the paste can be transferred to the tip of the pin or the electrode of the component at the transfer setting position, transferring the paste to the tip of the pin or the electrode of the component at the transfer setting position (step S105 of FIG. 7, step S205 of FIG. 12, or step S305 of FIG. 15).

[0130] For example, the steps in the paste transfer method may be executed by a computer (computer system). The present disclosure can be realized as a program for causing a computer to execute the steps included in the paste transfer method. Furthermore, the present disclosure can be realized as a non-transitory computer-readable recording medium, such as a CD-ROM, on which the program is recorded.

[0131] For example, when the present disclosure is realized as a program (software), each step is performed by running the program using hardware resources such as a computer's CPU, memory, input / output circuits, etc. In other words, each step is performed by the CPU acquiring data from memory or input / output circuits, etc., performing calculations, and outputting the calculation results to memory or input / output circuits, etc.

[0132] Furthermore, each of the components included in the component mounting apparatus 1 of the above-described embodiment may be realized as a dedicated or general-purpose circuit.

[0133] Furthermore, each of the components included in the component mounting apparatus 1 of the above-described embodiment may be realized as an LSI (Large Scale Integration) which is an integrated circuit (IC).

[0134] Furthermore, the integrated circuit is not limited to an LSI, but may be realized by a dedicated circuit or a general-purpose processor. A programmable FPGA (Field Programmable Gate Array) or a reconfigurable processor, in which the connections and settings of circuit cells within the LSI can be reconfigured, may also be used.

[0135] Furthermore, if an integrated circuit technology that can replace LSI emerges due to advances in semiconductor technology or other derivative technologies, that technology may naturally be used to integrate the components included in the worker support system into integrated circuits.

[0136] In addition, this disclosure also includes forms obtained by making various modifications to the embodiments that a person skilled in the art would think of, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope of the present disclosure. [Industrial Applicability]

[0137] The present disclosure is useful in the field of mounting components onto a circuit board or the like using a component mounting apparatus. [Explanation of symbols]

[0138] 1. Component placement device 1a Base 2. Substrate transport mechanism 3. Circuit Board 4A, 4B Parts supply section 6A, 6B tape feeder 7 Paste transfer unit 8 Y-axis table 9A, 9B X-axis table 10A, 10B mounted head 11A, 11B Recognition Camera 12A, 12B Part Recognition Camera 13A, 13B Nozzle Stocker 14 Optical Sensor 14a Inspection optical axis 15 Detection processing section 16 Feeder Base 20 Base 20a Engagement part 21 Handle 22 Guide rail 23 Slider 24 Film formation stage 24a Film forming surface 25 Paste 26 Transfer area 27 Bracket 28 Coating squeegee unit 28a Squeegee 29 Scraper unit 29a Scraper 30 Paste Supply Syringe 30a needle 31, 40 Motor 32 Lead screw 33 Safety Cover 34 Nut 35 Connecting member 36 Lifting member 37 Slide unit 38 Cam follower 39 Disc Cam 41 Unit side connection part 41a, 42a Air Coupler 41b, 42b Electrical connectors 42 Base side connection part 43 Control and power supply section 44 Compressed air supply source 45 Control and drive unit 51 pin 52 nozzles 53 Tool mounting part 100 control section 101 Onboard control unit 102 Transcriptional control section 200 Mechanism drive unit 300 Recognition processing unit 400 Operation and input section 500 Display 600 Storage section 601 Part information storage unit 602 Transcription information storage unit

Claims

1. A component mounting device that mounts components on a workpiece, a mounting unit having a pin for transferring paste to the workpiece or a suction nozzle for suctioning the component; a paste transfer section in which a paste to be transferred to the tip of the pin or the electrode of the component is formed in a film form; an imaging unit that images a paste transfer area of ​​the paste transfer unit; a determination unit that determines whether or not the paste can be transferred to the tip portion or the electrode at a transfer setting position in the transfer area that is set so that the paste can be transferred to the tip portion or the electrode, based on an image obtained by imaging the transfer area; a control unit that controls the attachment unit to transfer the paste to the tip portion or the electrode at the transfer setting position when it is determined that the paste can be transferred to the tip portion or the electrode at the transfer setting position, when it is determined that the paste cannot be transferred to the tip portion or the electrode at the transfer setting position, the determination unit determines, based on the image and the first size of the component or the second size of the pin, whether or not there is an area in the transfer area excluding the transfer setting position that is larger than the first size or the second size and that can transfer the paste to the tip portion or the electrode; When it is determined that the area exists, the control unit controls the attachment unit to transfer paste to the tip portion or the electrode in the area. Component placement device.

2. The notification department, a film formation possibility determination unit, the film-forming possibility determination unit determines whether or not a paste film can be formed in the paste transfer unit when it is determined that the area does not exist; the notification unit notifies an error when it is determined that the paste cannot be deposited in the paste transfer unit.

2. The component mounting device according to claim 1.

3. The paste transfer unit further includes a film forming unit that forms a film of the paste, the control unit controls the film forming unit to perform a film forming operation when it is determined that the paste can be formed in the paste transfer unit.

3. The component mounting device according to claim 2.

4. A pin for transferring paste to a workpiece or a paste transfer method for transferring paste to a component, comprising: taking an image of a paste transfer area of ​​a paste transfer portion where the paste to be transferred to the tip of the pin or the electrode of the component is formed in a film form; determining whether or not the paste can be transferred to the tip portion or the electrode at a transfer setting position in the transfer area that is set so that the paste can be transferred to the tip portion or the electrode based on an image obtained by imaging the transfer area; When it is determined that the paste can be transferred to the tip portion or the electrode at the transfer setting position, the paste is transferred to the tip portion or the electrode at the transfer setting position; when it is determined that the paste cannot be transferred to the tip portion or the electrode at the transfer setting position, based on the image and the first size of the component or the second size of the pin, determine whether or not there is an area in the transfer area excluding the transfer setting position that is larger than the first size or the second size and that can transfer the paste to the tip portion or the electrode; When it is determined that the area exists, a paste is transferred to the tip portion or the electrode in the area. Paste transfer method.

Images