CMP (chemical mechanical planarization) retaining ring
Patent Information
- Application Number
- US29/894971
- Authority / Receiving Office
- US · United States
- Patent Type
- Designs(United States)
- Current Assignee / Owner
- Priority Date
- 2023-03-30
- Filing Date
- 2023-06-15
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2040-02-25
Smart Images

Figure USD1063595-D00000_ABST
Description
[0001] FIG. 1 is a front perspective view of a CMP (chemical mechanical planarization) retaining ring showing our new design;
[0002] FIG. 2 is a front view thereof;
[0003] FIG. 3 is a rear view thereof;
[0004] FIG. 4 is a left-side view thereof;
[0005] FIG. 5 is a right-side view thereof;
[0006] FIG. 6 is a top plan view thereof;
[0007] FIG. 7 is a bottom plan view thereof;
[0008] FIG. 8 is a bottom rear perspective view thereof;
[0009] FIG. 9 is an enlarged view of the delineated portion 9 in FIG. 1;
[0010] FIG. 10 is an enlarged view of the delineated portion 10 in FIG. 2;
[0011] FIG. 11 is an enlarged view of the delineated portion 11 in FIG. 8;
[0012] FIG. 12 is a cross sectional view taken through the line 12-12′ of FIG. 6; and,
[0013] FIG. 13 is an enlarged view of the delineated portion 13 in FIG. 12.
[0014] The evenly dashed broken lines in the figures depict portions of the CMP (chemical mechanical planarization) retaining ring and form no part of the claimed design. The dot-dash broken lines delineating portions of the claimed design that are illustrated in enlargements form no part of the claimed design.
Claims
The ornamental design for a CMP (chemical mechanical planarization) retaining ring as shown and described.
Citation Information
Patent Citations
Substrate holding ring
JP1494712S
Substrate Retaining Ring
JP1639752S
Substrate retaining ring for semiconductor wafers
KR300524148S
Retainer ring for chemical mechanical polishing equipment
KR300667864S
Method and apparatus for two-part CMP retaining ring
US20030070757A1
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