Chiller system using cda

Abstract

To solve the above-described problem, a chiller system using CDA, according to various embodiments of the present invention, is disclosed. The chiller system comprises: a supply pipe which is supplied with clean dry air (CDA) to perform heat exchange for cooling, and supplies the cooled CDA to a cooling target; and a cooling unit which cools the CDA through heat exchange with the CDA, wherein the supply pipe performs heat exchanges of the CDA, corresponding to two or more regions of the cooling unit.

Description

Chiller system using CDA

[0001] The present invention relates to a cooling device for cooling the heat load of industrial equipment (e.g., semiconductor manufacturing equipment, lasers, injection molding machines, medical devices, and chemical process services), and more specifically, to a cooling system that enables low-temperature implementation through air in a gaseous state rather than a liquid fluid.

[0002]

[0003] In general, a chiller system is a cooling or freezing device that supplies chilled water or refrigerant to a cooling demand source such as an air conditioner or refrigerator, and may include a cooling unit, a fluid circulation device, a cooling target, and a fluid transfer pipe. For example, the cooling unit, the fluid circulation device, and the cooling target may be interconnected through a fluid transfer pipe, and a cooling fluid with high heat transfer efficiency may be circulated through the connected fluid transfer pipes to supply a low temperature to the cooling target, thereby cooling it. In other words, the cooling target can be maintained at a low temperature through heat exchange utilizing the cooling fluid.

[0004] Meanwhile, in cooling systems, deionized water (DI) or coolant is typically used as a cooling fluid. However, due to limitations in freezing point and electrical conductivity, DI water is not suitable for advanced processes or sub-zero temperature control, limiting its use. Consequently, while coolants are widely utilized in cooling systems, the limitations of their freezing and boiling point ranges make them difficult to use across a wide range of cooling targets. For example, in semiconductor processes, the process temperature may be -40°C to -50°C, but the typical temperature range is 120°C to 150°C, making the temperature range very wide. Therefore, when a coolant with a limited temperature range is used as a cooling fluid, heat exchange efficiency rapidly deteriorates as the coolant freezes or evaporates at certain temperatures. In other words, the process temperature range is -40°C to 150°C, limiting the coolant usability, necessitating the use of separate, isolated channels.

[0005] In particular, some fluorochemicals (PFAS) contained in coolants pose potential environmental problems and are therefore globally regulated, restricting their use. Furthermore, their use requires the establishment of separate treatment systems to prevent coolant spills and dispose of them. This can lead to environmental pollution and reduced system operational efficiency.

[0006] Therefore, there may be a demand in the industry for a cooling solution that utilizes CDA (Clean Dry Air), which is harmless to the human body, rather than a cooling fluid such as coolant or DI water.

[0007] [Prior Art Literature]

[0008] [Patent Document]

[0009] (Patent Document 1) Republic of Korea Publication No. 10-2018-0121606

[0010]

[0011] The problem to be solved by the present invention is to solve the above-described problem, and relates to a cooling system that enables low-temperature implementation through air in a gaseous state rather than a liquid fluid.

[0012] The problems to be solved by the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

[0013]

[0014] A chiller system utilizing a CDA according to various embodiments of the present invention for solving the above-described problems is disclosed. The chiller system receives CDA (Clean Dry Air) and performs heat exchange for cooling, and includes a supply pipe for supplying the cooled CDA to a cooling target and a cooling unit for cooling the CDA through heat exchange with the CDA, wherein the supply pipe may be characterized in that it performs heat exchange with the CDA corresponding to two or more areas of the cooling unit.

[0015] In an alternative embodiment, the cooling unit may include a compression unit, a condensation unit, an expansion valve, an evaporation unit, and a transfer pipe, and the supply pipe may be characterized in that it performs heat exchange with the CDA in a first region corresponding to a section connected from the evaporation unit to the compression unit and a second region corresponding to the evaporation unit.

[0016] In an alternative embodiment, the supply pipe may include a first supply pipe that delivers the supplied CDA to the cooling target and a second supply pipe through which the heat-exchanged CDA from the cooling target is recovered.

[0017] In an alternative embodiment, the first supply pipe may include a first supply area and a second supply area respectively corresponding to the first area and the second area, and heat exchange for the supplied CDA may be sequentially performed in each of the first supply area and the second supply area.

[0018] In an alternative embodiment, the temperature of the refrigerant delivered to the compression section may be increased through heat exchange between the first region and the first supply region.

[0019] In an alternative embodiment, the first supply pipe may further include a third supply zone located between the first supply zone and the second supply zone, and the second supply pipe may include a recovery heat exchange zone provided to correspond to the third supply zone, and heat exchange between the CDA that has undergone primary heat exchange and the recovered CDA may be performed in the third supply zone and the recovery heat exchange zone.

[0020] In an alternative embodiment, when the cooling target is configured as a utility having a volume space, the second supply pipe may be characterized in that it is provided to supply the CDA heat-exchanged in the recovery heat exchange area to a peripheral area of ​​the cooling target.

[0021] In an alternative embodiment, when the cooling target does not have a volume space, the second supply pipe may be provided so as to be connected to a separate utility so that the CDA heat-exchanged in the recovery heat exchange area is supplied to the input terminal of the first supply pipe.

[0022] In an alternative embodiment, the separate utility may include an air compressor connected to one end of the second supply pipe to recover the CDA supplied to the cooling target and supply it to the input end of the first supply pipe.

[0023] In an alternative embodiment, the separate utility may further include a dehumidifying device that dehumidifies the CDA recovered from the cooling target.

[0024] Other specific details of the present invention are included in the detailed description and drawings.

[0025]

[0026] According to various embodiments of the present invention, a cooling target can be cooled using air, rather than a cooling fluid. This provides a wide range of temperature control and low-temperature cooling solutions using air, without the limitations of DI water and without the use of PFAS fluids, which are subject to various regulatory requirements.

[0027] In addition, it can provide the effect of providing low-temperature cooling through improved energy efficiency by supporting heat exchange in the air circulation path.

[0028] Additionally, by using the CDA directly injected into the cooling target primarily for air heat exchange and then using the recovered CDA as CDA for dew point management around the cooling target, it is possible to provide an environment for cooling and preventing condensation without changing the total amount of CDA used.

[0029] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

[0030]

[0031] Various aspects are described with reference to the drawings, wherein like reference numerals are used to refer to similar components generally. In the following examples, for purposes of explanation, numerous specific details are set forth to provide a comprehensive understanding of one or more aspects. However, it will be apparent that such aspects may be practiced without these specific details.

[0032] Figure 1 is an exemplary diagram schematically showing a conventional cooling system.

[0033] Figure 2 is an exemplary diagram for explaining a conventional chiller system.

[0034] FIG. 3 illustrates an exemplary block diagram of a chiller system according to one embodiment of the present invention.

[0035] Fig. 4 is an exemplary diagram illustrating a cooling cycle of a cooling unit related to one embodiment of the present invention.

[0036] FIG. 5 is an exemplary diagram illustrating a process of cooling a cooling target using a chiller system related to one embodiment of the present invention.

[0037] FIG. 6 is an exemplary diagram for explaining a process of heat exchange with each of a cooling unit and a cooling target related to one embodiment of the present invention.

[0038] FIG. 7 is an exemplary diagram for explaining a process of heat exchange corresponding to multiple areas of a cooling unit through structural features of a heat exchange unit related to one embodiment of the present invention.

[0039] FIG. 8 is an exemplary diagram for explaining a process of heat exchange corresponding to multiple areas of a cooling unit through structural features of a heat exchange unit related to another embodiment of the present invention.

[0040]

[0041] Various embodiments and / or aspects are now disclosed with reference to the drawings. In the following description, for purposes of explanation, numerous specific details are set forth to provide a thorough understanding of one or more aspects. However, it will be apparent to one skilled in the art that the aspect(s) may be practiced without these specific details. The following description and the accompanying drawings detail specific exemplary aspects of one or more aspects. However, these aspects are exemplary, and any of the various methods within the principles of the various aspects may be utilized, and the description is intended to encompass all such aspects and their equivalents. Specifically, the terms "embodiment," "example," "aspect," and "example" as used herein are not intended to imply that any aspect or design described therein is preferred or advantageous over other aspects or designs.

[0042] Hereinafter, regardless of the drawing numbers, identical or similar components are assigned the same reference numerals, and redundant descriptions thereof are omitted. Furthermore, when describing the embodiments disclosed in this specification, if a detailed description of a related known technology is judged to obscure the gist of the embodiments disclosed in this specification, the detailed description thereof will be omitted. Furthermore, the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and the technical concepts disclosed in this specification are not limited by the attached drawings.

[0043] Although the terms "first," "second," etc. are used to describe various elements or components, these elements or components are not limited by these terms. These terms are merely used to distinguish one element or component from another. Accordingly, it should be understood that a "first element or component" referred to below may also be a "second element or component" within the technical scope of the present invention.

[0044] Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used in their common sense to those of ordinary skill in the art to which the present invention pertains. Furthermore, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise.

[0045] Furthermore, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or." That is, unless otherwise specified or clear from context, "X employs A or B" is intended to mean either of the natural inclusive permutations. That is, if X employs A; X employs B; or X employs both A and B, "X employs A or B" can apply to any of these cases. Furthermore, the term "and / or" as used herein should be understood to refer to and include all possible combinations of one or more of the associated items listed.

[0046] Additionally, it should be understood that the terms "comprises" and / or "comprising" imply the presence of a given feature and / or component, but do not preclude the presence or addition of one or more other features, components, and / or groups thereof. Furthermore, unless otherwise specified or clear from context to refer to the singular form, the singular form in the specification and claims should generally be construed to mean "one or more."

[0047] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0048] When an element or layer is referred to as being "on" or "on" another element or layer, this includes not only directly on the other element or layer, but also whether or not there are other intervening elements or layers. Conversely, when an element is referred to as being "directly on" or "directly on" the other element or layer, this means that there are no intervening elements or layers.

[0049] Spatially relative terms such as "below," "beneath," "lower," "above," and "upper" may be used to easily describe the relationship between one component or another as depicted in the drawings. Spatially relative terms should be understood to include different orientations of the component during use or operation in addition to the orientation depicted in the drawings.

[0050] The purposes and effects of the present invention, as well as the technical configurations for achieving them, will become clearer with reference to the embodiments described in detail below, along with the accompanying drawings. In describing the present invention, detailed descriptions of known functions or configurations will be omitted if they are deemed to unnecessarily obscure the gist of the invention. Furthermore, the terms described below are defined based on their functions in the present invention and may vary depending on the intentions or practices of the user or operator.

[0051] However, the present invention is not limited to the embodiments disclosed below and can be implemented in various other forms. These embodiments are provided solely to ensure the completeness of the present invention and to fully inform those skilled in the art of the scope of the disclosure. The present invention is defined solely by the scope of the claims. Therefore, such definitions should be based on the contents of this specification.

[0052]

[0053] Fig. 1 is an exemplary diagram schematically illustrating a conventional cooling system. Fig. 2 is an exemplary diagram illustrating a conventional chiller system.

[0054] In general, a chiller system may refer to a cooling device or refrigeration device that supplies cold water or refrigerant to a cooling target, such as an air conditioner or refrigerator, to cool the cooling target.

[0055] Here, the cooling target may refer to industrial equipment requiring low temperatures, including, for example, semiconductor manufacturing equipment, lasers, injection molding machines, medical devices, and chemical processing equipment. The specific description of the industrial equipment related to the aforementioned cooling target is merely an example, and the present invention is not limited thereto.

[0056] A conventional chiller system may include a cooling device (100a) and a cooling demand source (200a-1) to be cooled by utilizing the cooling device (100a), as illustrated in FIG. 1.

[0057] Specifically, referring to FIG. 2, the cooling device (100a) can cool a fluid based on a fluid cycle and supply the cooled fluid to a cooling demand source (200a-1) to maintain the cooling target (200a) at a low temperature. In the embodiment, the cooling demand source (200a-1) forms a volume space in which the cooling target (200a) is provided, and may include, for example, a chamber, an equipment room, a chuck, etc., but is not limited thereto.

[0058] The cooling device can maintain the temperature of a fluid at a low temperature based on a cooling cycle involving compression, condensation, expansion, and evaporation. In other words, the cooling fluid, which has been changed to a low temperature through the cooling cycle of the cooling device, is delivered to a cooling demand source (200a-1) via a pump, and maintains the cooling target (200a) at a low temperature through heat exchange with the cooling target (200a) of the cooling demand source (200a-1).

[0059] In the case of a general chiller system, as described above, cooling and temperature control are performed for the cooling target (200a) by circulating the cooled fluid through a heat exchange process with the cooling unit to the cooling demand source (200a-1) via a pump.

[0060] Meanwhile, coolants and deionized (DI) water are generally used as fluids to maintain a cooling target (200a) at a low temperature through circulation. However, due to limitations in freezing point and electrical conductivity, DI water is not suitable for advanced processes or sub-zero temperature control, and thus has limited utility. Accordingly, although coolants are widely utilized in cooling systems, the problem is that coolants have limited freezing point and boiling point ranges, making it difficult to cover a wide range of cooling targets. For example, in semiconductor processes, the process temperature may be -40°C to -50°C, but the typical temperature is 120°C to 150°C, so the temperature range is very wide. Therefore, if a coolant with a limited temperature range is used as a cooling fluid, the heat exchange efficiency rapidly deteriorates as the coolant freezes or evaporates at a specific temperature. In other words, since the process temperature range is -40°C to 150°C, which limits the coolant usability, a separate, isolated channel must be utilized.

[0061] In particular, some fluorine compounds contained in coolants pose potential environmental problems and are therefore globally regulated, restricting their use. Furthermore, their use requires the establishment of separate treatment systems to prevent coolant spills and dispose of them. This can contribute to environmental pollution and reduce system operational efficiency.

[0062] That is, when maintaining a cooling target at a low temperature through heat exchange using a fluid, such as a conventional chiller system (or cooling system), there is a problem in that it cannot cover a wide temperature range of the cooling target and causes environmental problems.

[0063] In addition, a separate driving device (e.g., pump) must be provided to circulate the fluid, and in the case of the fluid, losses occur during the circulation process, so there is a disadvantage in that continuous replenishment is required.

[0064] The present invention aims to resolve problems arising when implementing a cooling system utilizing fluids, and may be characterized by performing temperature control on a cooling target using gaseous air. In an embodiment, the present invention may provide a cooling solution utilizing CDA, which is harmless to the human body. In an embodiment, when building a cooling system utilizing gaseous air, a separate driving device for circulating the air is not required, which may be advantageous in terms of energy efficiency and device size.

[0065] However, when implementing a cooling system by cooling air in a gaseous state, there is a problem that it is not easy to implement low temperatures through simple heat exchange because the heat transfer efficiency is relatively low compared to fluid, and thus energy efficiency is reduced.

[0066] The present invention may be characterized by supporting heat exchange in the air circulation structure, thereby increasing energy efficiency and enabling low-temperature implementation through air. Here, heat exchange in the air circulation structure may refer to a structure for increasing cooling efficiency by allowing supplied air to be cooled multiple times.

[0067] In an embodiment, the present invention is characterized in that the energy of a moving pipe that is sucked into a compression section through an evaporation section in a refrigeration cycle and the energy returned from a cooling target are heat-exchanged in an air circulation structure to improve energy efficiency and enable low-temperature implementation through air.

[0068] Additionally, the chiller system of the present invention has a structural feature that the air supplied to the cooling target transfers cold heat to the cooling target, and then heat exchanges between the recovered air and the air injected into the cooling target, and the recovered and heat-exchanged air is supplied to the periphery of the cooling target as a CDA for the purpose of lowering the dew point around the cooling target. This has the advantage of supporting cooling and condensation prevention simultaneously without changing the total amount of CDA used, by first using the CDA directly injected into the cooling target for air heat exchange, and then utilizing the recovered air as a CDA for dew point management around the cooling target.

[0069] Hereinafter, the structural features of the chiller system utilizing the CDA of the present invention and the specific effects thereof will be described in detail with reference to FIGS. 3 and 8.

[0070]

[0071] FIG. 3 is an exemplary block diagram of a chiller system according to an embodiment of the present invention. FIG. 4 is an exemplary diagram illustrating a cooling cycle of a cooling unit according to an embodiment of the present invention. FIG. 5 is an exemplary diagram illustrating a process of cooling a cooling target using a chiller system according to an embodiment of the present invention. FIG. 6 is an exemplary diagram illustrating a process of heat exchanging with each of a cooling unit and a cooling target according to an embodiment of the present invention. FIG. 7 is an exemplary diagram illustrating a process of heat exchanging corresponding to a plurality of regions of a cooling unit through structural features of a heat exchange unit according to an embodiment of the present invention. FIG. 8 is an exemplary diagram illustrating a process of heat exchanging corresponding to a plurality of regions of a cooling unit through structural features of a heat exchange unit according to another embodiment of the present invention.

[0072] As illustrated in FIG. 3, the chiller system (1000) of the present invention may include a cooling unit (100) and a supply pipe (210). The components illustrated in FIG. 3 are exemplary, and additional components may be present or some of the components illustrated in FIG. 3 may be omitted.

[0073] The cooling unit (100), supply pipe (210), and cooling target (2000) according to an embodiment of the present invention may be interconnected through a moving pipe for moving air, or may be provided to have a predetermined distance from the moving pipe.

[0074] The cooling unit (100) included in the chiller system (1000) can cool the air circulating through the supply pipe (210), i.e., CDA, to a low temperature through heat exchange with the supply pipe (210). In an embodiment, the CDA relates to air from which contaminants have been removed for use in a precision production process, and may be clean and dry air with contaminants and moisture in the air minimized. In an embodiment, the CDA can be supplied into the interior of the chiller system (1000) of the present invention through a CDA supply device. The CDA supply device includes a compressor filter and can remove contaminants contained in the air. The CDA supply device removes particles, oil, water, etc. generated during air compression, creates a constant temperature of the compressed air, and supplies the CDA to the supply pipe (210). According to the embodiment, since CDA is supplied through the CDA supply device and circulated inside the chiller system (1000), heat exchange through air circulation is possible even if a separate circulation device is not provided inside the chiller system (1000).

[0075] According to one embodiment of the present invention, the chiller system (1000) may include a supply pipe (210) that receives CDA and performs heat exchange for cooling, and supplies the cooled CDA to a cooling target (2000).

[0076] Additionally, the chiller system (1000) may include a cooling unit (100) that cools the CDA through heat exchange with the CDA. The cooling unit (100) may be provided adjacent to the supply pipe (210), and may maintain the CDA passing through the transfer pipe (150) of the supply pipe (210) at a low temperature based on the heat of vaporization generated in the cooling unit (100).

[0077] In an embodiment, the cooling unit (100) may include a compression unit (110), a condensation unit (120), an expansion valve (130), an evaporation unit (140), and a transfer pipe (150), as illustrated in FIG. 4. In an embodiment, the transfer pipe (150) may be a pipe for transferring cooling fluid between each component.

[0078] The cooling unit (100) may include a compression unit that compresses a cooling fluid. The compression unit may pressurize a low-temperature, low-pressure cooling fluid to maintain the cooling fluid at a high temperature and high pressure. For example, the compression unit may include an impeller that compresses the cooling fluid, a rotating shaft connected to the impeller, and a motor that rotates the rotating shaft.

[0079] In addition, the cooling unit (100) may include a condensing unit (120) that discharges heat from the cooling fluid compressed in the compression unit to condense the cooling fluid. The condensing unit (120) may include a condensation space in which the cooling fluid can be condensed therein, and may condense (or liquefy) the high-temperature, high-pressure cooling fluid delivered from the compression unit (110). For example, the condensing unit (120) may liquefy the high-temperature, high-pressure gas delivered from the compression unit (110) by supplying air sucked in from the outside. In this case, as heat is generated, hot air may be discharged.

[0080] In various embodiments, the condenser may be provided using various condensation methods. In one embodiment, the condenser may be a water-cooled condenser. In the case of a water-cooled condenser, the refrigerant gas is cooled / liquefied using the sensible heat of the cooling water, for example, by forcing water to flow, thereby enhancing the cooling effect. In the case of a water-cooled condenser, it may be used in conjunction with a cooling tower, which is a heat exchange device that cools water.

[0081] Furthermore, in the embodiment, the condenser may be an air-cooled condenser. In the case of an air-cooled condenser, cooling can be performed by utilizing natural convection of air, which cools / liquefies using the sensible heat of the atmosphere. In addition, a blower may be provided to change the phase of the high-temperature, high-pressure refrigerant gas inside the condenser into a refrigerant liquid using outside air. In the case of the air-cooled condenser, compared to the water-cooled condenser, there are advantages such as less maintenance work and a simple structure, making maintenance easy. Meanwhile, since air has a poor heat transfer rate, a method of attaching fins to the outside of the tube to condense the heat transfer area may be utilized. The description of the water-cooled and air-cooled condenser types described above are merely examples, and the present invention is not limited thereto. For example, in addition to the water-cooled and air-cooled types described above, the condenser may also be implemented using an evaporative method. In the embodiment, the evaporative method may be a method of spraying cooling water outside the refrigerant gas to change the high-temperature refrigerant vapor inside the condenser into a refrigerant liquid using the latent heat of vaporization of the cooling water.

[0082] In addition, the cooling unit (100) may include an expansion valve (130) configured to expand the refrigerant condensed through the condenser (120). The volume of the cooling fluid changes as it circulates through the cooling unit (100), and the expansion valve (130) may be provided to absorb this volume change so that the cooling action can be smoothly performed. The cooling fluid may increase in speed and decrease in pressure due to the capillary phenomenon as it passes through the narrow expansion valve. This expansion valve (130) may be formed, for example, of a heat-resistant synthetic resin so as to enable contraction and expansion.

[0083] In various embodiments, the expansion valve may include a thermal expansion valve and an electronic expansion valve. The thermal expansion valve may be opened and closed while maintaining a constant superheat of the suction vapor refrigerant at the outlet of the evaporator. For example, the thermal expansion valve may open when the superheat of the suction vapor refrigerant at the outlet of the evaporator increases, and may close when the superheat decreases as the load decreases. That is, the thermal expansion valve may control the flow rate of the refrigerant according to changes in pressure and temperature when the refrigerant compressed in the compression unit flows to the evaporator, thereby maintaining the pressure and temperature of the refrigerant in the evaporator and securing an appropriate flow rate of the refrigerant. For example, the thermal expansion valve may include, but is not limited to, a cylinder for controlling the flow rate of the refrigerant, an evaporator connecting pipe for receiving the refrigerant from the evaporator, a temperature sensor for detecting the temperature of the refrigerant in the evaporator, and a control unit for controlling the operation of the cylinder according to the results measured by the temperature sensor. A thermostatic expansion valve enables stable refrigerant flow control in response to changes in temperature and pressure. This allows for efficient evaporation and compression of the refrigerant, maximizing cooling efficiency.

[0084] An electronic expansion valve may refer to an expansion valve that precisely controls the flow rate of refrigerant based on an electrical signal. In the case of an electronic expansion valve, when current flows through an electronic coil, an armature (plunger) rises, opening the valve, and when the current is cut off, the valve closes due to the armature's own weight, thereby controlling the flow rate of refrigerant. For example, an electronic expansion valve may include, but is not limited to, an electronic control unit that calculates an appropriate refrigerant flow rate based on the measurement results of a temperature sensor and a preset algorithm and generates an electric signal based on the calculated amount, a temperature sensor that detects the temperature of the refrigerant, a pressure sensor that detects the pressure of the refrigerant, and an electric valve that opens and closes based on the electric signal generated by the electronic control unit. Since an electronic expansion valve is designed to maintain optimal performance by dynamically adjusting the flow rate of the refrigerant based on information obtained from each sensor, it is capable of more precise control than a thermal expansion valve and can have a wider range of refrigerant flow rate adjustments. This has the advantage of quickly responding to various conditions that change in real time, thereby increasing cooling efficiency and saving energy.

[0085] In addition, the cooling unit (100) may include an evaporator (140) that evaporates the low-pressure liquid-state cooling fluid delivered from the expansion valve (130). The evaporator (140) may supply hot air to the low-pressure liquid-state cooling fluid to vaporize it. The cooling fluid becomes a low-pressure liquid-state in the process of passing through the expansion valve (130), and the low-pressure cooling fluid can be easily vaporized by the heat generated by the evaporator (140). The surrounding air may be cooled by the heat of vaporization that absorbs the heat. The completely evaporated gas-state cooling fluid may enter the compression unit (110) again, so that the circulation of the cooling system of the cooling unit (100) may continue.

[0086] The portion corresponding to the evaporator (140) of the cooling unit (100) may be arranged adjacent to the first supply pipe (211) of the supply pipe (210), as illustrated in FIG. 6. That is, by indirectly contacting the evaporator (140) region, through which the low-temperature refrigerant generated in the cooling unit (100) flows, with the supply pipe (e.g., the first supply pipe) through which the CDA is supplied, the CDA circulating in the supply pipe (210) can be cooled to a low temperature below a certain temperature. In other words, the CDA supplied into the supply pipe (210) can be changed to a low temperature through heat exchange with the cooling unit (100).

[0087] In an embodiment, the CDA may be supplied to a supply pipe (210) and moved toward a cooling target (2000), and may be characterized in that it is cooled through heat exchange with a cooling unit (100) during the movement process. After heat exchange with the cooling target (2000), the CDA is recovered through a second supply pipe (212).

[0088] According to a specific embodiment, the chiller system (1000) of the present invention can receive a CDA as illustrated in FIG. 5, and cool the supplied CDA to a low temperature through heat exchange with the cooling unit (100). In addition, the chiller system (1000) can supply the CDA cooled to a low temperature to a cooling target (2000) located at a cooling demand location. In an embodiment, the cooling demand location forms a volume space in which the cooling target (2000) is provided, and may include, for example, a chamber, an equipment room, a chuck, etc., but is not limited thereto. The cooling target (2000) for cooling may be located within the volume space formed by the cooling demand location. In various embodiments, the cooled CDA of the present invention may be supplied directly to the cooling target itself, rather than to the cooling demand location forming a specific volume space. In this case, the cooling target may be, for example, an open substrate or board itself, but is not limited thereto.

[0089] According to one embodiment, in order to prevent condensation from occurring during the process of cooling the cooling target (2000), the cooling demand source must be maintained at a low temperature. Specifically, when ultra-low temperature air is supplied to the cooling target (2000), condensation may occur due to a temperature difference in the periphery of the cooling target (2000), and to prevent this, the cooling demand source must be maintained at a low temperature. For example, when the operating temperature of the cooling target (2000) is about 10°C and a chiller system is to be operated to cool the temperature of the cooling target (2000) to -20°C, the CDA is cooled to -70°C through heat exchange with the cooling unit (100), and the cooled -70°C CDA is supplied to the cooling target (2000) to induce heat exchange with the cooling target (2000). However, when the real-time temperature of the cooling target (2000) is 10°C and an extremely low-temperature CDA (i.e., -70°C CDA) is supplied to the equipped area of ​​the cooling target (2000), condensation occurs due to the difference between the indoor temperature and the supplied temperature. The specific numerical description of the temperature described above is only an example to help understanding of the invention, and the present invention is not limited thereto.

[0090] In order to prevent such condensation, it is important to minimize the temperature difference between the temperature of the cooling demand source and the temperature of the supplied CDA, so that low-temperature CDA can be supplied to the periphery of the cooling target (2000). For example, by supplying CDA corresponding to approximately -10℃ to the periphery of the cooling target, i.e., the cooling demand source, the dew point of the cooling demand source can be lowered, thereby preventing condensation from occurring. In other words, in addition to the air or cooling fluid for cooling the cooling target (2000), a separate CDA must be additionally supplied to the periphery of the cooling target (2000) to prevent condensation.

[0091] In the case of the chiller system (1000) of the present invention, it may be characterized by recycling the CDA recovered after cooling the cooling target (2000) rather than supplying a separate CDA for preventing condensation.

[0092] Referring to FIGS. 5 and 6, the CDA supplied to the chiller system (1000) can be cooled through heat exchange with the cooling unit (100), and the cooled CDA is supplied to the cooling target (2000) located at the cooling demand location. The cooling target (2000) can be maintained at a low temperature through heat exchange with the cooled CDA, and the CDA that has completed heat exchange with the cooling target (2000) can be recovered (or returned). The CDA that has completed heat exchange with the cooling target (2000) is recovered through the second supply pipe (212).

[0093] In this case, the recovered CDA has a temperature higher than that of the initially supplied CDA since it has undergone heat exchange with the cooling target (2000). The chiller system (1000) can prevent condensation from occurring at the cooling demand by resupplying the recovered CDA to the cooling demand. In the case of the recovered CDA, although it has a temperature higher than that of the initially supplied CDA in order to maintain the cooling target (2000) at a low temperature, it can be utilized to prevent condensation at the cooling target (2000) since it is lower than the temperature of the cooling demand.

[0094] That is, the chiller system (1000) of the present invention primarily uses the CDA directly injected into the cooling target (2000) for air heat exchange, and then recycles the recovered (or returned) CDA as CDA for dew point management around the cooling target (2000), thereby creating an environment for cooling and preventing condensation without changing the total amount of CDA used.

[0095] In one embodiment of the present invention, the supply pipe (210) may be provided so that the air forms a circulation path. In a specific embodiment, the supply pipe (210) may be characterized by performing heat exchange for the CDA supplied corresponding to two or more regions of the cooling unit (100). In the case of air, due to its physical properties that have lower heat transfer efficiency than cooling fluids utilized in general cooling systems, it is not easy to achieve low temperatures through simple heat exchange alone. Accordingly, the present invention configures the supply pipe (210) so that heat exchange can be performed multiple times, thereby cooling the air to a low temperature.

[0096] More specifically, the supply pipe (210) may be characterized in that it performs heat exchange for the CDA in each of the first region (140a) corresponding to the section connecting the evaporator (140) to the compression region (110) and the second region (140b) corresponding to the evaporator (140).

[0097] Referring to Fig. 6, in the case of the evaporation section (140) within the cooling section (100), the temperature of the cooling fluid may be the lowest due to the influence of the heat of vaporization. That is, the temperature of the second region (140b) corresponding to the evaporation section (140) within the cooling section (100) corresponds to the lowest temperature. In this case, the temperature of the first region (140a) between the evaporation section (140) and the compression section (110) may be relatively higher than the temperature of the second region (140b). Since the supply pipes (210) of the supply pipes (210) are provided corresponding to each of the plurality of regions of the cooling section (100), sequential heat exchange for the supplied CDA can be performed, and since the supply pipes (210) themselves are provided in multiple numbers to enable circulation of the CDA, additional heat exchange between the supply pipes can be performed.

[0098] Referring to FIG. 7, the supply pipe (210) may include a first supply pipe (211) that transfers the supplied CDA to the cooling target (2000) and a second supply pipe (212) that recovers the CDA heat-exchanged in the cooling target (2000). The first supply pipe (211) may refer to a pipe that transports the supplied CDA to the cooling target (2000). Since the first supply pipe (211) is provided so as to be capable of heat exchange with each of the plurality of regions of the cooling unit (100), the CDA transferred to the cooling target (2000) through the first supply pipe (211) is sequentially cooled during the movement process.

[0099] In the embodiment, the first supply pipe (211) may include a first supply region (211a) and a second supply region (211b) which are respectively provided to correspond to the first region (140a) and the second region (140b) of the cooling unit (100). Here, the first region (140a) of the cooling unit (100) may be a region between the evaporation unit (140) and the compression unit (110), and the second region (140b) may be a region corresponding to the evaporation unit (140). In this case, the second region (140b) may be a region corresponding to the evaporation unit (140) where cold air is generated due to the influence of the heat of vaporization, and thus may be a region corresponding to the lowest temperature within the cooling unit (100), and the first region (140a) may be a region that moves to the compression unit (110), and thus may be a region whose temperature is higher by a predetermined amount than that of the second region (140b).

[0100] According to an embodiment, heat exchange for the CDA supplied from each of the first supply region (211a) and the second supply region (211b) may be sequentially performed. The CDA supplied through the first supply pipe (211) may be sequentially heat exchanged with each of the first region (140a) and the second region (140b) of the cooling unit (100) due to the structural characteristics of the first supply pipe (211) which are arranged adjacent to each of the first region (140a) and the second region (140b) of the cooling unit (100) so as to be capable of heat exchange during the process of being supplied to the cooling target (2000). That is, the CDA supplied through the first supply pipe (211) may be cooled again in the second supply region (211b) after being primarily cooled in the first supply region (211a).

[0101] According to one embodiment, the temperature of the refrigerant delivered to the compression unit (110) may be increased through heat exchange between the first region (140a) and the first supply region (211a). The temperature of the refrigerant delivered to the compression unit (110) may be increased through heat exchange between the first supply region (211a) of the first supply pipe (211) and the first region (140a) of the cooling unit (100).

[0102] When low-temperature fluid is delivered to the compression unit (110), overcooling may occur, causing the compression unit to freeze and be damaged. However, through heat exchange with the first supply area (211a) of the first supply pipe (211), a refrigerant with a relatively elevated temperature is supplied to the compression unit (110). This can provide the effect of preventing overcooling from occurring in the compression unit (110).

[0103] That is, the heat exchange between the first region (140a) of the cooling unit (100) and the first supply region (211a) of the first supply pipe (211) primarily cools the CDA passing through the first supply pipe (211), and prevents overcooling by raising the temperature of the cooling fluid transferred from the evaporation unit (140) to the compression unit (110) in the cooling unit (100).

[0104] In addition, the CDA that is primarily cooled in the first supply area (211a) of the first supply pipe (211) is cooled again in the second supply area (211b) that is provided to correspond to the second area (140b) of the cooling unit (100).

[0105] According to an embodiment, additional heat exchange with the second supply pipe (212) may be performed before re-cooling is performed in the second supply area (211b).

[0106] According to a specific embodiment, the first supply pipe (211) may further include a third supply area (211c) located between the first supply area (211a) and the second supply area (211b). The third supply area (211c) may be an area provided corresponding to the recovery heat exchange area (212a) of the second supply pipe (212).

[0107] The second supply pipe (212) may refer to a pipe that transports CDA recovered after heat exchange at the cooling target. Since the second supply pipe (212) is a pipe that transports CDA recovered after heat exchange to maintain the cooling target (2000) at a low temperature, CDA at a relatively higher temperature (e.g., -10 to -30°C) than CDA at an extremely low temperature (e.g., -70°C) supplied to the cooling target (2000) may be transported.

[0108] The second supply pipe (212) may include a recovery heat exchange area (212a) provided to correspond to the third supply area (211c). In this case, heat exchange may be performed between the CDA that has undergone primary heat exchange passing through the third supply area (211c) and the CDA recovered from the cooling target (2000) passing through the recovery heat exchange area (212a).

[0109] That is, the CDA supplied through the first supply pipe (211) can be cooled through heat exchange three times in the process of being supplied to the cooling target (2000) through the first supply pipe (211a) corresponding to the first area (140a) of the cooling unit (100), through heat exchange in the third supply area (211c) corresponding to the recovery heat exchange area (212a) of the second supply pipe (212), and through heat exchange in the second supply area (211b) corresponding to the second area (140b). As described above, the CDA can be cooled through heat exchange three times due to the arrangement between the supply pipe and the cooling unit and the arrangement between the supply pipes during the process of being supplied to the cooling target (2000) through the first supply pipe (211). This structural feature has the advantage of making cooling of the air easier. That is, the chiller system (1000) of the present invention can gradually cool air (i.e., CDA), which is difficult to cool immediately due to its low heat transfer efficiency compared to a cooling fluid, through multiple heat exchanges. This enables the implementation of a cooling system using air, while increasing energy efficiency through heat exchange due to the air circulation structure.

[0110] In one embodiment, when the cooling target (2000) is configured as a utility having a volume space, the second supply pipe (212) may be provided to supply the CDA heat-exchanged in the recovery heat exchange area (212a) to the surrounding area of ​​the cooling target.

[0111] In an embodiment, a utility having a volume space relates to a space in which a cooling target (2000) is provided, and may include, but is not limited to, a chamber, an equipment room, a chuck, etc.

[0112] In various embodiments, the cooling target (2000) may be configured to be included in a utility having a volumetric space, or may be provided without being included within the utility. Cooling the cooling target (2000) without being included within the utility may mean, for example, cooling an open substrate or board itself.

[0113] According to an embodiment, the CDA that has completed heat exchange with the cooling target (2000) can be returned through the second supply pipe (212), and can be used as a CDA to prevent condensation in the periphery of the cooling target (2000). The second supply pipe (212) can connect the cooling target (2000) and the utility (2000a) that accommodates the cooling target (2000). The CDA that has performed heat exchange with the cooling target (2000) through the second supply pipe (212) is recovered, and supplied to the periphery of the cooling target (2000), i.e., to the utility (2000a) that accommodates the cooling target (2000).

[0114] For example, when an ultra-low temperature CDA is supplied to a cooling target (2000), condensation may occur due to a temperature difference with respect to the periphery of the cooling target (2000), and for this purpose, the periphery of the cooling target (2000) must be maintained at a low temperature.

[0115] In a typical cooling system, in addition to supplying cooling fluid to cool the cooling target (2000), CDA with moisture removed and low temperature is additionally supplied to keep the dew point around the cooling target (2000) lower, thereby preventing condensation from occurring on the cooling target.

[0116] In the case of the chiller system (1000) of the present invention, it can be characterized by using the returned CDA to cool the surrounding area (e.g., chamber, chiller, equipment room, device, etc.) of the cooling target (2000) to manage the dew point and prevent condensation. That is, rather than supplying a separate CDA for condensation prevention, since the CDA recovered through the second supply pipe (212) after cooling the cooling target (2000) is recycled, there is an advantage in that there is no need to use the CDA twice.

[0117] In this case, the recovered CDA has a higher temperature than the CDA initially supplied to the cooling target (2000) because it has undergone heat exchange with the cooling target (2000) to maintain the cooling target (2000) at a low temperature. In the case of the recovered CDA, although it has a higher temperature than the CDA initially supplied to maintain the cooling target (2000) at a low temperature, it is lower than the temperature of the cooling demand source, so it can be utilized to prevent condensation.

[0118] That is, the chiller system (1000) of the present invention primarily uses the CDA directly injected into the cooling target (2000) for air heat exchange, and then recycles the recovered (or returned) CDA as CDA for dew point management around the cooling target (2000), thereby creating an environment for cooling and preventing condensation without changing the total amount of CDA used (i.e., without increasing the amount of CDA supplied).

[0119] Referring to FIG. 7, for a more detailed example, the chiller system (1000) of the present invention can be operated to maintain the cooling target (2000) at -40°C. In this case, CDA is supplied from a CDA supply device to the first supply pipe. The temperature of the CDA initially supplied to the first supply pipe (211) through the CDA supply device can be about 25°C. The supply pipe (210) can cool the relatively high temperature CDA supplied from the CDA supply device to a low temperature, and maintain the cooling target (2000) at the target low temperature (i.e., -40°C) by utilizing the cooled CDA. For example, in order to maintain the cooling target (2000) at -40°C, a CDA cooled to -70°C may be required.

[0120] However, in the case of air (or CDA), it may be difficult to cool the temperature from 25℃ to -70℃ in one go. In the case of cooling fluids (DI water or coolant) generally used in cooling systems, they can be quickly cooled with just one heat exchange due to their properties of good heat transfer efficiency. However, in the case of gaseous air, it is not easy to achieve low temperatures with just simple heat exchange. Accordingly, the chiller system (1000) of the present invention supports heat exchange in a circulatory structure in which heat exchange is performed multiple times for the supplied CDA.

[0121] The initially supplied CDA of 25°C is primarily cooled through heat exchange with the first region (140a) of the cooling unit (100) in the first supply region (211a). That is, the primary heat exchange is performed in the region corresponding to the first supply region (211a) of the first supply pipe (211) and the first region (140a) of the cooling unit (100) (i.e., the first heat exchange region).

[0122] The first region (140a) is a region where the refrigerant moves from the evaporator (140) to the compression region (110), and therefore may have a temperature of -20°C, which is somewhat lower than that of the region corresponding to the evaporator (140). The evaporator (140) is a region corresponding to the lowest temperature in the cooling region (100), and may be maintained at -70 to -80°C to cool the CDA to -70°C.

[0123] According to various embodiments, it may be difficult to obtain a low temperature of -70℃ or lower with only one cooling unit (100), and thus, as illustrated in FIG. 7, a dual cooling method may be utilized. The dual cooling method may be a method of performing a cooling operation using two independent refrigerators by thermally separating each independent refrigeration cycle into two stages. The dual cooling method may include a main cooling unit (100) and an auxiliary cooling unit (100-1). In this case, the auxiliary cooling unit (100-1) performs the role of transferring or supplementing heat through gas heat exchange. The cold air generated in the auxiliary cooling unit (100-1) may be heat-exchanged with the main cooling unit (100). That is, the cold air generated in the auxiliary cooling unit (100-1) may be transferred to the main refrigerator to supplement the freezing operation. In this way, when the dual cooling method is utilized, the efficiency and stability of the freezing operation are improved, low temperatures are achieved, and the energy consumption of the entire system is minimized.

[0124] The 25°C CDA supplied through the first supply pipe (211) is cooled to 0 to 5°C by first exchanging heat with the first area (140a) corresponding to -20°C as it passes through the first supply area (211a).

[0125] In this case, as heat exchange is performed in the second region (140b) of the cooling unit (100) and the region corresponding to the second supply region (211b) of the first supply pipe (211) (i.e., the second heat exchange region), the temperature of the refrigerant (i.e., the cooling fluid) transferred from the evaporator (140) to the compression unit (110) increases. For example, the cold air provided by the evaporator (140) may be -70 to -80°C, but as heat exchange is performed in the CDA passing through the second supply region (211b) and the second heat exchange region, the temperature of the refrigerant transferred to the compression unit (110) may be approximately -20°C. However, if a refrigerant at -20°C is directly supplied to the compression unit, supercooling may occur through the low-temperature refrigerant, which may cause damage to the compression unit. The chiller system (1000) of the present invention has a structure that allows heat exchange between the first supply area (211a) of the first supply pipe (211) and the first area (140a), thereby preventing overcooling by increasing the temperature of the refrigerant delivered to the compression unit (110).

[0126] In addition, the CDA that has been first cooled can be secondarily cooled through heat exchange with the second supply pipe (212) in the third supply area (211c) located between the first supply area (211a) and the second supply area (211b). That is, heat exchange is performed in an area (i.e., a third heat exchange area) corresponding to the third supply area (211c) of the first supply pipe (211) and the recovery heat exchange area (212a) of the second supply pipe (212). For example, after the first cooling, the CDA at 0 to 5°C is secondarily cooled through heat exchange with the recovery heat exchange area (212a) of the second supply pipe (212) in the third supply area (211c).

[0127] In the case of CDA recovered through the second supply pipe (212), in order to maintain the cooling target (2000) at -40°C, it is supplied at -70°C and discharged after heat exchange with the cooling target (2000), so that the temperature may be around -10 to -30°C. That is, the CDA passing through the recovery heat exchange area (212a) of the second supply pipe (212) may be -10 to -30°C, and accordingly, the first-cooled CDA (e.g., 0 to -5°C) passing through the third supply area (211c) of the first supply pipe (211) is secondarily cooled to -5 to -10°C through heat exchange with the second supply pipe (212).

[0128] In addition, the secondarily cooled CDA can be tertiarily cooled through heat exchange (i.e., heat exchange in the second heat exchange area) with the second area (140b) of the cooling unit (100) in the second supply area (211b). In this case, the second supply area (211b) is provided corresponding to the second area (140b) related to the evaporator corresponding to the lowest temperature in the cooling unit (100), and thus, it is cooled to an extremely low temperature in the process of passing through the second supply area (211b). For example, the second area (140b) of the cooling unit (100) is -70 to -80°C, and accordingly, the secondarily cooled CDA (i.e., the CDA of -5 to -10°C) is tertiarily cooled in the process of passing through the second supply area (211b) to be cooled to a temperature of -70°C, and then supplied to the cooling target (2000).

[0129] In summary, the CDA initially supplied at 25°C through the first supply pipe (211) is first cooled to 0 to 5°C in the first heat exchange area, second cooled to 5 to -10°C in the third heat exchange area, and third cooled to -70°C in the second heat exchange area. In other words, the CDA can be cooled to an extremely low temperature as the cooling is sequentially performed three times. Since this is a cooling method using gradual heat exchange rather than a single-circulation heat exchange method, it has the advantage of enabling easy cooling of air with poor heat transfer efficiency.

[0130] Also, the CDA cooled to -70℃ is supplied to the cooling target (2000) and can maintain the cooling target (2000) at a low temperature (e.g., -40℃) through heat exchange with the cooling target (2000), and is recovered through the second supply pipe (212) in a state where the temperature has increased (e.g., -20℃) after heat exchange with the cooling target (2000). The -20℃ CDA recovered through the second supply pipe (212) is changed to a temperature of about -10℃ as it undergoes heat exchange with the CDA (i.e., 0 to 5℃) passing through the third supply area (211c) of the first supply pipe (211) in the recovery heat exchange area (212a), and the -10℃ CDA is utilized as a CDA for lowering the dew point around the cooling target (2000).

[0131] That is, the chiller system (1000) of the present invention can gradually cool air (i.e., CDA), which is difficult to cool immediately due to its low heat transfer efficiency compared to a cooling fluid, through multiple heat exchanges. This enables the implementation of a cooling system using air and increases energy efficiency through heat exchange due to the air circulation structure. Since the chiller system of the present invention utilizes air rather than a cooling fluid, it can be used to cool a wide range of cooling targets without limitations in the range of freezing point and boiling point, etc.

[0132] In addition, the chiller system (1000) of the present invention primarily uses the CDA directly injected into the cooling target (2000) for air heat exchange, and then recycles the recovered (or returned) CDA as CDA for dew point management around the cooling target (2000), thereby creating an environment for cooling and preventing condensation without changing the total amount of CDA used (i.e., without increasing the amount of CDA supplied).

[0133] According to another embodiment, as illustrated in FIG. 8, when the cooling target does not have a volume space, the second supply pipe (212) may be connected to a separate utility so that the CDA heat-exchanged in the recovery heat exchange area (212a) is supplied to the input terminal of the first supply pipe (211).

[0134] In various embodiments, the cooling target (2000) may be provided without being contained within a utility having a volumetric space. Cooling the cooling target (2000) without being contained within a utility may mean, for example, cooling an open substrate or board itself.

[0135] For example, if the cooling target (2000) is an open board and you want to cool it using a chiller system (1000), you can return and use the CDA used for cooling through a separate utility.

[0136] Here, a separate utility (300) may include an air compression device that is connected to one end of the second supply pipe (212) to recover the CDA supplied to the cooling target (2000) and supply it to the input end of the first supply pipe (211). The air compression device refers to a device that sucks in air, compresses it, and discharges the compressed air in one direction to circulate it, and may include, for example, an air compressor.

[0137] In this case, the line for recovering and supplying air based on the entire utility base is connected to each other so that the CDA can be continuously circulated without loss, and the CDA can be continuously cooled during the circulation process.

[0138] In addition, in the embodiment, the separate utility (300) may further include a dehumidifying device that dehumidifies the CDA recovered from the cooling target (2000). By utilizing the dehumidifying device, moisture can be removed from the recovered CDA, thereby obtaining dehumidified CDA, which can be returned through an air compression device to enable internal circulation.

[0139]

[0140] The description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments without departing from the scope of the present invention. Therefore, the present invention is not intended to be limited to the embodiments disclosed herein, but is to be construed in the broadest scope consistent with the principles and novel features disclosed herein.

[0141] [Explanation of symbols]

[0142] 100a: Conventional cooling device 200a: Conventional cooling target

[0143] 200a-1: Conventional cooling demand source 1000: Chiller system

[0144] 100: Cooling section 110: Compression section

[0145] 120: Condenser 130: Expansion valve

[0146] 140: Evaporation section 140a: First area

[0147] 140b: Area 2 150: Moving Hall

[0148] 210: Supply pipe 211: First supply pipe

[0149] 211a: First supply area 211b: Second supply area

[0150] 211c: Third supply area 212: Second supply line

[0151] 212a: Recovery heat exchange area 300: Separate utility

[0152] 2000: Cooling Target

[0153]

[0154] The best mode for carrying out the invention as described above has been described.

[0155]

[0156] The present invention can be utilized in the field of cooling systems for cooling the heat load of industrial facilities.

Claims

1. In a chiller system that performs cooling using air, A supply pipe that receives CDA (Clean Dry Air) and performs heat exchange for cooling, and supplies the cooled CDA to the cooling target; and A cooling unit that cools the CDA through heat exchange with the CDA; Includes, The above supply pipe is, Characterized in that heat exchange is performed for the CDA corresponding to two or more areas of the cooling unit. Chiller system using CDA.

2. In paragraph 1, The above cooling unit, It includes a compression section, a condensation section, an expansion valve, an evaporation section and a transfer pipe. The above supply pipe is, Characterized in that heat exchange for the CDA is performed in each of the first region corresponding to the section connected from the evaporator to the compression region and the second region corresponding to the evaporator. Chiller system using CDA.

3. In paragraph 2, The above supply pipe is, A first supply pipe that delivers the supplied CDA to the cooling target; and A second supply pipe through which CDA heat-exchanged in the above cooling target is recovered; including, Chiller system using CDA.

4. In paragraph 3, The above first supply pipe is, Includes a first supply area and a second supply area respectively corresponding to the first area and the second area, Characterized in that heat exchange for the supplied CDA is sequentially performed in each of the first supply area and the second supply area. Chiller system using CDA.

5. In paragraph 4, Characterized in that the temperature of the refrigerant delivered to the compression section is increased through heat exchange between the first region and the first supply region. Chiller system using CDA.

6. In paragraph 4, The above first supply pipe is, Further comprising a third supply area located between the first supply area and the second supply area, The above second supply pipe is, Includes a recovery heat exchange area that is equipped to correspond to the third supply area, Characterized in that heat exchange is performed between the CDA that has undergone primary heat exchange and the recovered CDA in the third supply area and the recovery heat exchange area. Chiller system using CDA.

7. In paragraph 6, In the case where the cooling target is configured as a utility having a volume space, the second supply pipe is characterized in that it is provided to supply the CDA heat-exchanged in the recovery heat exchange area to the surrounding area of ​​the cooling target. Chiller system using CDA.

8. In paragraph 6, In the case where the cooling target does not have a volume space, the second supply pipe is characterized in that it is connected to a separate utility so that the CDA heat-exchanged in the recovery heat exchange area is supplied to the input terminal of the first supply pipe. Chiller system using CDA.

9. In paragraph 8, The above separate utility is, Including an air compression device connected to one end of the second supply pipe to recover the CDA supplied to the cooling target and supply it to the input end of the first supply pipe. Chiller system using CDA.

10. In paragraph 8, The above separate utility is, Further comprising a dehumidifying device for performing dehumidification on the CDA recovered from the above cooling target. Chiller system using CDA.

Images