Substrate arrangement for a semiconductor system, and semiconductor system

Abstract

The invention relates to a substrate arrangement for a semiconductor system (1), said arrangement comprising a substrate (10) for accommodating a plurality of integrated circuits (20), wherein the substrate (10) is an organic substrate (10).

Description

[0001] R.415218

[0002] - 1 -

[0003] Description

[0004] title

[0005] Substrate arrangement for a semiconductor system and semiconductor system

[0006] The invention relates to a substrate arrangement for a semiconductor system and to a semiconductor system itself. The substrate serves to accommodate a plurality of integrated circuits, wherein the substrate is designed as an organic substrate.

[0007] State of the art

[0008] It is known that semiconductors are usually applied to a substrate and sealed with a "lid". This component is later conventionally soldered onto a PCB (Printed Circuit Board).

[0009] Disclosure of the invention

[0010] The invention relates to a substrate arrangement with the features of claim 1 and a semiconductor system with the features of claim 7. Further features and details of the invention will become apparent from the respective dependent claims, the description, and the drawings. Features and details described in connection with the substrate arrangement according to the invention naturally also apply in connection with the semiconductor system according to the invention, and vice versa, so that a reciprocal reference is always possible with regard to the disclosure of the invention.

[0011] The invention relates in particular to a substrate arrangement for a semiconductor system. The substrate arrangement can accordingly be a substrate R.415218

[0012] - 2 - which serves to accommodate a plurality of integrated circuits.

[0013] The substrate can also be an organic substrate. This means, in particular, that the substrate is made from an organic material. Using an organic substrate instead of, for example, a silicon interposer reduces manufacturing complexity and thus production costs. This leads to improved durability and cost savings in the production of chiplet-based semiconductor systems, especially for automotive applications.

[0014] Preferably, the substrate is not a single piece but rather a multi-part substrate. In other words, the substrate can be divided into at least two partitions, with at least three or at least four partitions being preferred. Each of the partitions can also be made of an organic material as the substrate material.

[0015] To connect these partitions, an interconnection structure can be provided. This interconnection structure is preferably located between the partitions and is at least partially elastic / flexible to allow for a flexible connection between them. In other words, the interconnection structure can provide an elastic connection between the partitions. This allows the thermal expansion of the substrate or semiconductor system to be absorbed and minimizes stresses at the system's interconnection points.

[0016] In other words, the connecting structure can be made of an elastic material and / or have an elastic structure, be firmly connected to the partitions, and thus provide a reliable yet flexible connection between the partitions. This also includes the possibility that the connecting structure has multiple connectors, which may be partially or completely separate from one another, and which incorporate the elastic material or structure. This allows for a flexible / elastic connection between the partitions with respect to movement and / or expansion. R.415218

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[0018] Accordingly, the connection structure can mechanically connect the partitions by ensuring that each connector is always connected to at least two partitions of the substrate. The material can be designed to be elastic in terms of its material properties. The structure can also be designed to be elastic, for example, by reducing the thickness of a connector material. The connectors can also be referred to as partial connectors.

[0019] The semiconductor system can be configured as a chiplet-based system. Accordingly, it can have integrated circuits, preferably in the form of chiplets. The chiplets can be interconnected via an interface, preferably a die-to-die interface.

[0020] Furthermore, the substrate may enable at least one electrical connection between the integrated circuits by providing one or more electrical connections to a printed circuit board of an electronic control unit. The control unit is, for example, an electronic control unit (ECU), particularly for a vehicle. An electronic control unit is, in particular, an electronic component used in vehicles, machines, and other technical devices to control and / or regulate various functions. For example, the electronic control unit receives signals from various sensors, processes these signals, and outputs corresponding control signals to actuators and other components. The electronic control unit can be programmable and, depending on the application, can perform various functions, such as...The control of the engine, brakes, steering, lighting, and air conditioning of a vehicle. This can therefore be part of an automotive application, i.e., an application in the automotive sector, preferably in a vehicle.

[0021] The integrated circuits can each be designed as a chiplet. A chiplet is, in particular, a small, self-contained semiconductor chip that can be used as part of a larger system or circuit. Chiplets can be designed, tested, and manufactured independently and then assembled in a larger application. R.415218

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[0023] The substrate can be designed to provide at least one electrical connection for the integrated circuits and / or to enable electrical connections between the circuits. The at least one electrical connection between the circuits can be a connection between two or more of the circuits, allowing them to communicate and exchange data. The integrated circuits can also be referred to as semiconductor chips, chiplets, or "dies." The at least one electrical connection according to the present invention is preferably wired, but can also be wireless.

[0024] The substrate arrangement according to the invention can be part of a semiconductor system according to the invention, and the substrate of the substrate arrangement according to the invention can preferably be designed as the substrate of the semiconductor system according to the invention.

[0025] Furthermore, the invention may provide that the connection structure comprises the same material, preferably substrate material, as the partitions. The structure, and in particular the thickness, of the connection structure and the partitions may differ such that the connection structure exhibits greater elasticity compared to the partitions (i.e., compared to the substrate). The material properties and / or compositions, however, may be identical. This has the advantage that using the same substrate material for both the connection structure and the substrate or partitions simplifies integration and reduces manufacturing costs. The connection structure may also comprise and / or consist of an organic material. The differing material thicknesses ensure optimal flexibility of the connection, leading to increased system strength.

[0026] Advantageously, within the scope of the invention, it can be provided that the material of the connection structure and the partitions differs from each other in order to give the connection structure higher elasticity than the partitions R.415218

[0027] - 5 - to form, and / or to make the interconnect structure elastic and the partitions rigid. This results in the interconnect structure having greater flexibility than the substrate itself. This allows for more efficient absorption of thermal expansion and thus reduces stresses at the interconnect points. The different properties of the substrate and the interconnect structure can help to improve the lifetime of the chiplet-based semiconductor system while simultaneously reducing costs through the use of a low-cost organic substrate.

[0028] It is also conceivable, as an option, that the connection structure comprises several sub-connectors, which are designed separately from one another and are preferably spaced apart by at least one gap. In this way, greater flexibility of the substrate can be achieved, since the individual sub-connectors can act independently of each other.

[0029] It can be advantageous if, within the scope of the invention, the partitions are predominantly or completely elastically connected to one another, particularly exclusively, via the interconnection structure. In other words, the connection between the partitions can be provided entirely or predominantly elastically. Due to the at least nearly complete elasticity of the connection between the partitions, the system can adapt more flexibly to thermal changes and avoid stresses at the connection points. This thus improves the lifetime of the semiconductor system, especially in demanding environments such as in the automotive sector.

[0030] Therefore, it is conceivable that the connection structure is designed, and in particular specifically adapted, to absorb thermal expansion of the substrate.

[0031] The invention also relates to a semiconductor system, in particular a chiplet-based system, comprising:

[0032] - an organic substrate, preferably a substrate arrangement according to the invention, R.415218

[0033] - 6 -

[0034] - a plurality of integrated circuits that can be applied / arranged on the organic substrate, wherein the substrate is divided into at least two partitions.

[0035] It can be provided that a connecting structure is arranged between the partitions, which is at least partially elastic / flexible in order to connect the partitions flexibly / elastically to one another. Thus, the semiconductor system according to the invention offers the same advantages as those described in detail with reference to a substrate arrangement according to the invention. The substrate arrangement according to the invention can also be part of the semiconductor system according to the invention. The flexible connecting structure particularly enables better adaptation to temperature fluctuations, which leads to more stable operation of the system.

[0036] Optionally, the semiconductor system can be implemented as a chiplet system, with each integrated circuit being implemented as a chiplet. This flexible interconnect structure can thus contribute to the efficient integration of multiple chiplets within a chiplet-based semiconductor system.

[0037] Furthermore, it is conceivable that the organic substrate is designed to provide at least one electrical connection for, and in particular between, the integrated circuits, and thus to functionally integrate the integrated circuits. The substrate can also be designed to provide at least one electrical connection to a printed circuit board.

[0038] Furthermore, the connection structure can be designed to reduce mechanical stresses at contact points, preferably solder and / or connection points, between the substrate and the printed circuit board. This is made possible in particular by the elastic design of the connection structure.

[0039] According to another possibility, it can be provided that the thickness of the material of the substrate on which the integrated circuits are arranged is at least 1.1 times or 1.2 times or 1.5 times or 2 times or R.415218

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[0041] The thickness of the interconnect material can be 3 or 10 times greater than that of the interconnect material. The integrated circuits can be arranged in a common substrate plane that extends across the various partitions. Furthermore, the thickness can refer to the (especially maximum) extent of the respective material in a direction perpendicular to the substrate plane. Thus, the material of the flexible interconnect (between the partitions) can be thinner / weaker than the material of the partitions themselves. This can contribute to increased reliability of the semiconductor system. The choice of material thickness can vary depending on the application and system requirements.

[0042] Within the scope of the invention, the semiconductor system can be a chiplet system for automotive applications and / or the integrated circuits can provide different functions that are combined for automotive applications, preferably for at least partially autonomous driving and / or for a driver assistance system. This allows the semiconductor system to be used in vehicles to enable functions such as autonomous driving or driver assistance systems. Combining different functions in a chiplet system offers an efficient solution for complex automotive requirements and enables the integration of advanced technologies into vehicles.

[0043] Further advantages, features, and details of the invention will become apparent from the following description, in which exemplary embodiments of the invention are described in detail with reference to the drawings. The features mentioned in the claims and in the description can each be essential to the invention individually or in any combination. The drawings show:

[0044] Fig. 1 is a schematic visualization of a package.

[0045] Fig. 2 shows a schematic representation of an exemplary chiplet system. R.415218

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[0047] Fig. 3 shows a schematic comparison of different substrate arrangements.

[0048] Fig. 4 shows a schematic representation of a substrate arrangement.

[0049] Fig. 5 shows a simulation result for a thermal load on a chiplet system.

[0050] Fig. 6 is a schematic representation of embodiment variants of the invention.

[0051] Fig. 7 is a schematic representation of embodiment variants of the invention.

[0052] The following figures describe embodiments of the invention, illustrate them with optional details, and compare them to conventional solutions.

[0053] Figure 1 shows an exemplary semiconductor system. The package 101 shown in Figure 1 contains a single, monolithic die 102. However, due to the ever-increasing surface area of ​​chips / dies, driven, for example, by artificial intelligence (AI) and domain fusion of in-vehicle infotainment and driver assistance systems in the automotive sector, the manufacturing yield of semiconductors is decreasing.

[0054] As shown in Fig. 2, chiplet-based systems comprise 1 smaller individual dies 201 which can be interconnected via a standardized interface 202 (e.g. UCIe) and thus can represent the overall functionality of monolithic system-on-chips.

[0055] Figure 3 shows an example of a substrate arrangement 301, which is compared to other possible arrangements for substrates (302, 303). In a chiplet-based system, several chips (chiplets 20) are deposited on a substrate 10 (see 301 and 302 in Figure 3) or interposer 15 (see 303 in Figure 3). While an organic substrate is most advantageous, a silicon substrate offers benefits, for example, in terms of signal speed and thermal expansion difference between the chip and the interposer or substrate. R.415218

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[0057] Automotive applications are significantly influenced by environmental conditions in the field, which include vibrations and a wide temperature range. Meeting corresponding requirements is necessary to ensure the vehicle's computer systems have the necessary durability throughout their product lifecycle (keyword: Design for Reliability). This means that electronic components must withstand stress conditions, such as thermal expansion due to temperature cycling.

[0058] As shown in Fig. 4, the substrate 10 and the semiconductor dies 20 will expand differently due to their differing temperature constants (see arrows) when the temperature changes. This creates stresses at the solder joints and connections between the substrate 10 and a control unit circuit board, as well as between the substrate 10 and the chiplets / dies 20, which can negatively affect durability.

[0059] The larger such a system becomes in area (width x length), the greater the stresses become. Figure 5 shows the result of a simulation of what this thermal stress can do to the geometry.

[0060] Therefore, embodiments of the invention provide for dividing an organic substrate, which is much cheaper than silicon, into smaller partitions 30. These smaller partitions 30 are connected by a connection structure 40 comprising a flexible, i.e., elastic, connector (see Fig. 6). The arrangement and size of the partitions can be flexibly adapted to the application.

[0061] Figures 6 and 7 illustrate, according to exemplary embodiments of the invention, a substrate arrangement for a semiconductor system 1 with a substrate 10 for receiving a plurality of integrated circuits 20, wherein the substrate 10 is designed as an organic substrate 10. The substrate 10 is divided into at least two partitions 30. It is provided that a connecting structure 40 is arranged between the partitions 30, which R.415218

[0062] - 10 - is at least partially elastic in order to flexibly connect the partitions 30 together.

[0063] As shown in Fig. 7, it is possible that the connection structure 40 has several partial connectors 41 which are designed separately from each other and are preferably spaced apart by at least one gap B.

[0064] The flexible substrate layer for the connecting structure 40 can be applied, for example, on the outside (see Fig. 6) or in intermediate layers. To enable a flexible (i.e., elastic) structure, the thickness of the substrate layer can be reduced, for example.

[0065] Suitable manufacturing processes include, for example, milling or laser processing.

[0066] Likewise, the substrate can be completely decoupled by cutting through it completely, as in the middle (Fig. 6, B).

[0067] It is clearly evident in Fig. 6 that the thickness D1 of the substrate 10 material, on which the integrated circuits 20 are arranged, is significantly greater than the thickness D2 of the interconnect structure 40 material. Furthermore, it is evident that the integrated circuits 20 are arranged in a common substrate plane E that extends over the various partitions 30, where the thickness D1 and D2 each denote an extension of the respective material in a direction perpendicular to the substrate plane E.

[0068] Fig. 7 shows another example of the arrangement. The cut at “B” in Fig. 6 and in Fig. 7 is optional.

[0069] The measures described result in the overall system 1 being significantly more robust against thermal expansion due to the smaller sub-substrates and the flexible connection technology. This also avoids the need for an expensive silicon interposer.

[0070] The preceding explanation of the embodiments describes the present invention solely by way of examples. Of course, individual features of the embodiments may be described, provided that R.415218

[0071] - 11 - technically meaningful, can be freely combined with each other without leaving the scope of the present invention.

Claims

R.415218 - 12 - Claims 1. Substrate arrangement for a semiconductor system (1) with a substrate (10) for receiving a plurality of integrated circuits (20), wherein the substrate (10) is designed as an organic substrate (10), characterized in that the substrate (10) is divided into at least two partitions (30), and that a connecting structure (40) is arranged between the partitions (30), which is at least partially elastic in order to flexibly connect the partitions (30) together.

2. Substrate arrangement according to claim 1, characterized in that the connecting structure (40) has the same material as the partitions (30), wherein the structure and in particular the thickness of the connecting structure (40) and the partitions (30) differ from each other in such a way that the connecting structure (40) is designed with higher elasticity compared to the partitions (30).

3. Substrate arrangement according to one of the preceding claims, characterized in that the material of the connection structure (40) and the partitions (30) differs from each other in order to form the connection structure (40) with higher elasticity than the partitions (30), and in particular to form the connection structure (10) elastic and the partitions (30) rigid.

4. Substrate arrangement according to one of the preceding claims, characterized in that R.415218 - 13 - that the connecting structure (40) has several partial connectors (41) which are designed separately from each other and are preferably spaced apart by at least one gap (B).

5. Substrate arrangement according to one of the preceding claims, characterized in that the partitions (30) are predominantly or completely elastically connected to each other, in particular exclusively, via the connection structure (40).

6. Substrate arrangement according to one of the preceding claims, characterized in that the connection structure (40) is designed to absorb a thermal expansion of the substrate (10).

7. Semiconductor system (1) comprising: an organic substrate (10), a plurality of integrated circuits (20) applied to the organic substrate (10), characterized in that the substrate (10) is divided into at least two partitions (30), and that a connecting structure (40) is arranged between the partitions (30), which is at least partially elastic in order to flexibly connect the partitions (30) to each other.

8. Semiconductor system (1) according to claim 7, characterized in that the semiconductor system (1) is designed as a chiplet system (1), wherein the integrated circuits (20) are each designed as a chiplet (20). R.415218 - 14 - 9. Semiconductor system (1) according to claim 7 or 8, characterized in that the organic substrate (10) is configured to provide at least one electrical connection for and in particular between the integrated circuits (20) and thus to functionally integrate the integrated circuits (20), wherein the substrate (10) is further configured to provide the at least one electrical connection to a printed circuit board, wherein the connection structure (40) is configured to reduce mechanical stresses at contact points, preferably solder and / or connection points, between the substrate (10) and the printed circuit board.

10. Semiconductor system (1) according to one of claims 7 to 9, characterized in that a thickness (D1) of the material of the substrate (10) on which the integrated circuits (20) are arranged is at least 1.1 times or 1.2 times or 1.5 times or 2 times or 3 times or 10 times a thickness (D2) of the material of the interconnect structure (40), wherein the integrated circuits (20) are arranged in a common substrate plane (E) which extends over the different partitions (30), wherein the thickness (D1 , D2) each denotes an extent of the respective material in a direction that is perpendicular to the substrate plane (E).

11. Semiconductor system (1) according to one of claims 7 to 10, characterized in that the semiconductor system (1) is a chiplet system for an application in the automotive sector and / or the integrated circuits (20) provide different functions which are combined for the application in the automotive sector, preferably for at least partially autonomous driving and / or for a driver assistance system.

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