1results about How to "Improve post-processing effect" patented technology

The application relates to the technical field of chemical mechanical polishing post-processing, and discloses a wafer post-processing system and method. The system comprises a cleaning tank used for containing cleaning liquid for cleaning wafers; and a wafer lifting device used for lifting a wafer immersed in the cleaning liquid from the cleaning liquid. The wafer lifting device comprises a first moving mechanism used for lifting a lower side position of the wafer in the cleaning liquid; and a second moving mechanism used for, when the wafer is lifted to a preset position by the first moving mechanism, continuously lifting an upper side position of the wafer above the liquid surface of the cleaning liquid until the wafer is separated from the cleaning liquid.