The invention relates to the technical field of conductive double-sided
adhesive tapes, in particular to a heat dissipation type conductive double-sided
adhesive tape and a production process thereof.The heat dissipation type conductive double-sided
adhesive tape comprises a bearing layer, a
colloid layer and a release layer which are sequentially arranged from bottom to top, wherein the colloidlayer comprises a conductive adhesive layer and a heat dissipation adhesive
layer group, the heat dissipation adhesive
layer group comprises an upper adhesive layer, a
graphite flake and a lower adhesive layer which are sequentially bonded from top to bottom, the thickness of the conductive adhesive layer is the same as the
total thickness of the heat dissipation adhesive
layer group, a heat conduction gap is formed between the conductive adhesive layer and the heat dissipation adhesive layer group at intervals, and the width of the heat conduction gap is 0.5-0.8mm; the conductive adhesive layer is used for matching with a
copper exposure area of a flexible
printed circuit board; the upper adhesive layer and the lower adhesive layer are matched with the
graphite flake in shape, side edgesof the upper adhesive layer and the lower adhesive layer protrude out of the outer contour of the
graphite flake, and the upper adhesive layer and the lower adhesive layer are mutually bonded to forma
coating adhesive for
coating the graphite flake. The heat dissipation type conductive double-sided adhesive tape is high in overall heat dissipation efficiency.