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Circuit substrate bearing apparatus and circuit substrate bearing pin

A technology for circuit boards and supporting devices, which is applied in the direction of electrical components, electrical components, etc., and can solve the problems of reduced degree of freedom of supporting positions, inability to use supporting pins, etc.

Active Publication Date: 2009-04-22
FUJI MASCH MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, for example, a substantially inverted Y-shaped support pin as shown in Patent Document 1 cannot be used.
Therefore, the degree of freedom of the supporting position with respect to the lower surface of the circuit board is reduced

Method used

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  • Circuit substrate bearing apparatus and circuit substrate bearing pin
  • Circuit substrate bearing apparatus and circuit substrate bearing pin
  • Circuit substrate bearing apparatus and circuit substrate bearing pin

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0065] Structure of Electronic Component Mounting Machine Equipped with Circuit Board Support Device

[0066] First, the structure of the electronic component mounting machine in which the circuit board support apparatus of this embodiment is arrange|positioned is briefly demonstrated. exist figure 1 , the circuit board is viewed from the rear side (upstream side of the paper. It will be described later Figure 22 The left side in the azimuth) is moved to the paper surface side (downstream side. Will be described later Figure 22 The right side in the orientation) to transport. in addition, figure 1 The front in the azimuth corresponds to the operation side (the operation panel side for operating the electronic component mounting machine).

[0067] exist figure 1 A schematic diagram of an electronic component mounting machine in which the circuit board supporting device according to this embodiment is disposed is shown in the middle. This diagram is viewed from the fro...

no. 2 approach

[0146] The circuit board support device and circuit board support pins of this embodiment differ from the circuit board support device and circuit board support pins of the first embodiment only in the shape of the support pins and the thickness of the pin mounting plate. Therefore, only the differences are described here.

[0147] In FIG. 23( a ), the state before the installation operation of the circuit board support pin of this embodiment is shown by the cross-sectional view seen from the front. In FIG. 23( b ), a state in the middle of the installation work of the circuit board support pin of this embodiment is shown by the cross-sectional view seen from the front. In FIG. 23( c ), the state of the stage after the mounting work of the circuit board support pin of this embodiment is shown by the cross-sectional view seen from the front.

[0148] As shown in FIGS. 23( a ) to 23 ( c ), the support pin 3 d has a mounting portion 30 d and a protruding portion 31 d. The suppo...

no. 3 approach

[0157] The difference between the circuit board supporting device of the present embodiment and the circuit board supporting device of the first embodiment is only the shape of the pin attachment hole. Therefore, only the differences are described here. exist Figure 24 An enlarged cross-sectional view of the vicinity of the pin mounting hole of the pin mounting plate according to the present embodiment is shown in . In addition, with the same reference numerals as the above-mentioned Figure 18 , Figure 19 corresponding parts.

[0158] Such as Figure 24As shown, the pin mounting hole 200e of the pin mounting plate 2e of this embodiment has chamfered parts 201e, 203e and a neck 202e. The minimum aperture diameter of neck 202e is D1. In addition, the length in the hole axis direction of the neck is L1.

[0159] The common portion of the structure of the circuit board supporting device of the present embodiment has the same effect as that of the circuit board supporting...

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PUM

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Abstract

The invention provides a circuit substrate support device and circuit substrate support pins with simple installation, and high degree of freedom relative to the support position on the lower surface of the circuit substrate. The circuit substrate support device (1) comprises a pin installing board (2a) having pin installing holes (200a) from the surface to the back; and support pins (3a) having installing parts (30a) installed in the pin installing holes (200a) and bumps (31a) bumped from the installing parts (30) to the surface and supporting the circuit substrate B. When installed in the pin installing holes (200a), the support pins (3a) are inserted in the pin installing holes (200a) from the back to the surface. The bumps (31a) are carried out at least one of the actions of rotation, inclination and eccentricity relative to axial direction of the pin installing holes (200a) to pass through the pin installing holes (200a). When installed in the pin installing holes (200a), at least one part on the tops of the bumps (31a) is arranged at the radial outside of the pin installing holes (200a).

Description

technical field [0001] The present invention relates to a circuit board support device and a circuit board support pin, for example, in circuit board processing devices such as electronic component mounting machines and solder screen printers, the circuit board support device and the circuit board support pin are used to implement regulations on circuit boards. When handling, support the circuit board from below. Background technique [0002] The circuit board supporting device has a pin mounting plate and a plurality of supporting pins. When mounting the electronic component on the circuit board, the circuit board supporting device is arranged below the circuit board. A plurality of pin mounting holes are regularly arranged on the pin mounting plate. The support pin is in the shape of a round bar. The lower ends of the support pins are fitted into the pin mounting holes. The upper ends of the support pins support the lower surface of the circuit board from below. The e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04
Inventor 近藤毅
Owner FUJI MASCH MFG CO LTD